JP2007173306A5 - - Google Patents

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Publication number
JP2007173306A5
JP2007173306A5 JP2005364921A JP2005364921A JP2007173306A5 JP 2007173306 A5 JP2007173306 A5 JP 2007173306A5 JP 2005364921 A JP2005364921 A JP 2005364921A JP 2005364921 A JP2005364921 A JP 2005364921A JP 2007173306 A5 JP2007173306 A5 JP 2007173306A5
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JP
Japan
Prior art keywords
lid
base
package
plating layer
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2005364921A
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English (en)
Japanese (ja)
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JP4947618B2 (ja
JP2007173306A (ja
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Publication date
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Priority to JP2005364921A priority Critical patent/JP4947618B2/ja
Priority claimed from JP2005364921A external-priority patent/JP4947618B2/ja
Publication of JP2007173306A publication Critical patent/JP2007173306A/ja
Publication of JP2007173306A5 publication Critical patent/JP2007173306A5/ja
Application granted granted Critical
Publication of JP4947618B2 publication Critical patent/JP4947618B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2005364921A 2005-12-19 2005-12-19 電子部品用パッケージ Expired - Lifetime JP4947618B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005364921A JP4947618B2 (ja) 2005-12-19 2005-12-19 電子部品用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005364921A JP4947618B2 (ja) 2005-12-19 2005-12-19 電子部品用パッケージ

Publications (3)

Publication Number Publication Date
JP2007173306A JP2007173306A (ja) 2007-07-05
JP2007173306A5 true JP2007173306A5 (cg-RX-API-DMAC7.html) 2009-01-29
JP4947618B2 JP4947618B2 (ja) 2012-06-06

Family

ID=38299503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005364921A Expired - Lifetime JP4947618B2 (ja) 2005-12-19 2005-12-19 電子部品用パッケージ

Country Status (1)

Country Link
JP (1) JP4947618B2 (cg-RX-API-DMAC7.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100485220B1 (ko) 2003-03-12 2005-04-27 권영준 다양한 끝 점 후도를 가진 침상모가 식모된 칫솔 및 그제조방법
CN1308624C (zh) * 2005-02-01 2007-04-04 深圳百灵达火机电器有限公司 打火机的燃料引流结构
JP5206713B2 (ja) * 2010-03-09 2013-06-12 富士電機株式会社 半導体パッケージの組立方法
JP5568416B2 (ja) * 2010-08-31 2014-08-06 京セラクリスタルデバイス株式会社 電子デバイスの製造方法
JP2015076562A (ja) * 2013-10-11 2015-04-20 三菱電機株式会社 パワーモジュール
FR3065318B1 (fr) * 2017-04-18 2021-09-10 E2V Semiconductors Boitier hermetique de composant electronique, en particulier pour capteur d'image
JP6964734B1 (ja) * 2020-09-08 2021-11-10 三菱電機株式会社 回転電機

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216930A (ja) * 2004-01-27 2005-08-11 Kyocera Corp 電気部品
JP4494849B2 (ja) * 2004-04-12 2010-06-30 シチズンファインテックミヨタ株式会社 パッケージ用ロー材付き封着板およびその製造方法

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