JP2007165679A - Method of manufacturing pattern-forming object - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a pattern-forming object which can obtain a pattern-forming object such as a substrate with a micro-lens or the like by a simple method compared with a conventional one. <P>SOLUTION: The manufacturing method of pattern-forming object uses the substrate, and an imprinted substrate equipped with photosensitive resin layer formed on the substrate, and furthermore a template having uneven pattern on a front surface. The method comprises an adhesion lamination forming process of forming an adhesion lamination, by making the photosensitive resin layer of the imprinted substrate and the uneven pattern of the template stick firmly; an exposure process of irradiating with light from a template side of the adhesion lamination; and a development process of developing the uneven imprinted substrate with a developer, by forming the uneven imprinted substrate by lifting the template of the adhesion lamination after the exposure process. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for producing a pattern-formed body using an imprint method, and more particularly to a method for producing a pattern-formed body capable of obtaining a pattern-formed body by a simpler method than conventional methods.

  For example, when a semiconductor integrated circuit or a microlens is manufactured, a photolithography method is currently widely used. On the other hand, an imprint method is known as a method for forming a concavo-convex pattern at a lower cost than such photolithography. The imprint method uses a template having a desired concavo-convex pattern on the surface in close contact with the substrate to be transferred and applies an external stimulus such as heat or light to form the concavo-convex pattern on the surface of the substrate to be transferred. Is the method.

  However, when manufacturing a substrate with a microlens, for example, using such an imprint method, there are the following problems. That is, in the imprint method, for example, as shown in FIG. 5A, a transferred substrate 53 having a substrate 51 and a photosensitive resin layer 52 and a template 55 having an uneven pattern 54 on the surface are used. As shown in FIG. 5B, the concavo-convex transfer substrate 57 as shown in FIG. 5C is obtained by irradiating the light 56 in a state where the transfer substrate 53 and the template 55 are in close contact, and then peeling the template 55. Get. In such a case, a thick film layer 58 is generated on the uneven transfer substrate 57.

  When the photosensitive resin layer 52 of the uneven transfer substrate 57 is used as a microlens, the thick film layer 58 can cause a reduction in light collection rate. Therefore, usually, as shown in FIG. 5D, the thick film layer 58 is removed by performing dry etching 59 such as oxygen plasma, and the substrate with a microlens (pattern formation as shown in FIG. Body) 60 is obtained.

  In order to perform the dry etching as described above, it is necessary to place the concavo-convex transfer substrate in a vacuum system, and as a result, there is a problem that the process for manufacturing the substrate with microlenses and the like becomes complicated. Therefore, a method capable of producing a substrate with a microlens and the like by a simpler method has been desired. As for the imprint apparatus and the imprint method, for example, those disclosed in Patent Document 1 are available.

JP 2002-93748 A

  This invention is made | formed in view of the said situation, for example, providing the manufacturing method of the pattern formation body which can obtain pattern formation bodies, such as a board | substrate with a microlens, by a simpler method compared with the former. This is the main purpose.

  In order to solve the above problems, in the present invention, a substrate, a substrate to be transferred provided with a photosensitive resin layer formed on the substrate, and a template having a concavo-convex pattern on the surface are used. An adhesive laminate forming step in which the photosensitive resin layer and the concave / convex pattern of the template are in close contact to form an adhesive laminate, an exposure step of irradiating light from the template side of the adhesive laminate, and after the exposure step, A pattern forming body comprising: a step of forming a concavo-convex transfer substrate by peeling the template of the adhesion laminate, and developing the concavo-convex transfer substrate with a developer. To do.

  According to the present invention, it is possible to obtain a pattern-formed body by a simpler method than in the past by removing the thick film layer generated by the imprint method by a development process using a developer.

  Moreover, in the said invention, it is preferable that the said template has the transmittance | permeability adjustment layer which adjusts the transmittance | permeability of light in the convex part or recessed part of the said uneven | corrugated pattern. If the template has a transmittance adjusting layer in the convex part or concave part of the concavo-convex pattern, the light irradiated to the photosensitive resin layer of the adhesion laminate can be partially reduced during the exposure process. it can. Thereby, for example, when a negative photosensitive resin layer is used for the photosensitive resin layer, the area of the negative photosensitive resin layer in which the light irradiated by the transmittance adjusting layer is reduced is reduced. The above-described thick film layer is easily removed because the crosslink density is lower than the area of the negative photosensitive resin layer that has not been reduced (the area where normal exposure has been performed) and is easily removed in the development process. be able to.

  Moreover, in the said invention, it is preferable that the exposure amount of the light in the case of the said exposure process exists in the range of 50 to 99% with respect to a complete curing exposure amount. By setting the exposure amount of light in the exposure step within the above range, the negative photosensitive resin can be cured to an extent that it can be appropriately dissolved in the developer, and as a result, development processing is performed. This is because the thick film layer described above can be easily removed.

  In the present invention, there is also provided an imprint template comprising a concavo-convex pattern on the surface, and having a transmittance adjusting layer for adjusting light transmittance at a convex portion or a concave portion of the concavo-convex pattern. .

  According to the present invention, the thick film layer produced by the imprint method can be easily removed by using the template having the transmittance adjusting layer.

  In the present invention, by removing the thick film layer generated by the imprint method by a developing process using a developer, there is an effect that a pattern-formed body can be obtained by a simpler method than conventional methods.

  Hereinafter, the manufacturing method of the pattern formation body and imprint template of this invention are demonstrated in detail.

A. First, the manufacturing method of the pattern formation body of this invention is demonstrated. The method for producing a pattern formed body of the present invention uses a substrate, a transfer substrate provided with a photosensitive resin layer formed on the substrate, and a template having a concavo-convex pattern on the surface, and sensitizes the transfer substrate. Adhesive layer forming step of forming an adhesive laminate by bringing the adhesive resin layer and the concavo-convex pattern of the template into close contact, an exposure step of irradiating light from the template side of the adhesive laminate, and the adhesion step after the exposure step A step of forming a concavo-convex transfer substrate by peeling the template of the laminate, and developing the concavo-convex transfer substrate with a developer.

  According to the present invention, it is possible to obtain a pattern-formed body by a simpler method than in the past by removing the thick film layer generated by the imprint method by a development process using a developer. More specifically, in the prior art, a vacuum apparatus or the like is required to remove the thick film layer by performing dry etching such as oxygen plasma, and the process is complicated. Since the thick film layer is removed by development processing using a developer, a pattern-formed body can be obtained more easily.

In addition, as described above, the present invention is characterized in that the development step is performed after the uneven transfer substrate is formed by the imprint method. Accordingly, the method for producing the pattern-formed product of the present invention is not particularly limited as long as the imprint method and the development step are performed. Among them, a specific template is used (first aspect), or It is preferable that the negative photosensitive resin layer is exposed with a specific exposure amount (second embodiment).
Hereinafter, the first aspect and the second aspect will be described.

1. First Aspect First, a method for producing a pattern forming body according to a first aspect will be described. This aspect is characterized by using a specific template. Specifically, the template has a transmittance adjusting layer that adjusts the light transmittance at the convex or concave portion of the concave-convex pattern.

  According to this aspect, since the template has the transmittance adjusting layer in the convex portion or concave portion of the concavo-convex pattern, the light irradiated to the photosensitive resin layer of the close-contact laminate is partially irradiated during the exposure process. Can be reduced. Thereby, for example, when a negative photosensitive resin layer is used for the photosensitive resin layer, the area of the negative photosensitive resin layer in which the light irradiated by the transmittance adjusting layer is reduced is reduced. The above-described thick film layer is easily removed because the crosslink density is lower than the area of the negative photosensitive resin layer that has not been reduced (the area where normal exposure has been performed) and is easily removed in the development process. be able to. Note that “low crosslink density” generally means that the degree of cure of the resin is low and means that the solubility in the developer is high. As will be described later, for example, when producing a substrate with a microlens as a pattern forming body, if the photosensitive resin layer is a negative photosensitive resin layer, a transmittance adjusting layer is usually provided on the convex portion of the template, If the photosensitive resin is a positive photosensitive resin layer, a transmittance adjusting layer is usually provided in the concave portion of the template.

Next, the manufacturing method of the pattern formation body of this aspect is demonstrated using drawing. FIG. 1 is a process diagram showing an example of a method for producing a pattern forming body according to this embodiment, and more specifically shows a method for producing a substrate with a microlens. The “substrate with microlens” is a member including a substrate and a microlens formed on the substrate, and can be a component such as an image sensor, for example.
First, as shown in FIG. 1 (a), a transfer substrate 3 having a substrate 1 and a negative photosensitive resin layer 2 formed on the substrate 1, a concavo-convex pattern 4 on the surface, and Using the template 6 having the transmittance adjusting layer 5 for adjusting the light transmittance on the convex portion of the concavo-convex pattern 4, as shown in FIG. 1B, the photosensitive resin layer 2 of the substrate 3 to be transferred, An adhesion laminate forming process is performed in which the uneven pattern 4 of the template 6 is brought into close contact with each other to form the adhesion laminate 7.

Next, as shown in FIG.1 (c), the exposure process which irradiates the light 8 from the template 6 side of the contact | adherence laminated body 7 is performed. At this time, the negative photosensitive resin layer 2 is cured by increasing the crosslink density by irradiation of the light 8, but the negative photosensitive resin layer 2 in which the light irradiated by the transmittance adjusting layer 5 is reduced. The region has a relatively low crosslink density.
Next, the template 6 of the close-contact laminate 7 is peeled off to obtain an uneven transfer substrate 9 as shown in FIG. At this time, the thick film layer 10 is generated. However, since the negative photosensitive resin layer 2 has the above-described region having a relatively low crosslinking density, the uneven transfer substrate 9 is developed with a developer. Thus, the thick film layer 10 can be easily removed, and a substrate with a microlens (pattern forming body) 11 as shown in FIG. 1E can be obtained.
Hereinafter, the manufacturing method of the pattern formation body of this aspect is demonstrated for every process.

(1) Adhering Laminate Forming Process The adhering laminated body forming process in this aspect will be described. The adhesion laminated body formation process in this aspect is a process in which the photosensitive resin layer of the substrate to be transferred and the concave / convex pattern of the template are adhered to each other to form the adhesion laminated body.

(A) Template First, a template used in this embodiment will be described. The template used in this embodiment has a concavo-convex pattern on the surface, and a transmittance adjusting layer for adjusting the light transmittance at the convex or concave portion of the concavo-convex pattern.

  In this aspect, the transmittance adjusting layer may be formed on the convex portion of the concave-convex pattern or may be formed on the concave portion. Which of the convex portion and the concave portion is formed is appropriately selected in consideration of the type of the photosensitive resin layer to be used and the region of the photosensitive resin layer to be removed in the development process. For example, in the case of producing a substrate with a microlens and the photosensitive resin layer is a negative photosensitive resin layer, as described with reference to FIG. It is preferable to be formed in the part.

  The transmittance adjusting layer is usually used for dimming irradiation light during exposure. Specific examples of such a transmittance adjusting layer include a light shielding layer and a translucent layer. Examples of the material for the light shielding layer include chromium, molybdenum, aluminum, tungsten, tantalum, and metal silicide. Among these, chromium is preferable. It is because it is excellent in light-shielding property and workability. Specifically, the light shielding layer is preferably a chromium-based layer such as chromium, chromium oxide, chromium nitride, chromium oxynitride, or chromium oxynitride carbide. On the other hand, the semi-transparent layer can be obtained by using, for example, the material of the light shielding layer and forming a layer having a thickness smaller than that of the light shielding layer. Further, for example, the material of the light shielding layer may be used to form a semitransparent layer by forming the light shielding layer in a dot shape.

Although it does not specifically limit as the transmittance | permeability of the said transmittance | permeability adjustment layer, For example, it is preferable that it is 50% or less, especially 25% or less. When the transmittance of the transmittance adjusting layer is 0%, the transmittance adjusting layer is a light shielding layer.
The film thickness of the transmittance adjusting layer varies depending on whether the transmittance adjusting layer is a light shielding film or a semi-transparent film, and is not particularly limited. In the case of a light shielding layer made of chromium, it is usually in the range of 0.05 to 2 μm.

  The shape of the concavo-convex pattern on the surface of the template is not particularly limited, and can be appropriately selected according to the use of the pattern forming body. For example, when producing a substrate with a microlens by the method for producing a pattern forming body of this aspect, as shown in FIG. 2A, it has a hemispherical concave portion 21 and a planar convex portion 22, Furthermore, the template 24 etc. with which the transmittance | permeability adjustment layer 23 was formed in the convex part 22 can be mentioned. In addition, as the dimension a of the convex part 22, although it does not specifically limit, Usually, it is about 30-350 nm.

  Moreover, FIG.2 (b) is a schematic sectional drawing which shows the other example of the template used for this aspect. As shown in FIG. 2 (b), the template used in this embodiment has a groove-like concave portion 21 and a planar convex portion 22, and a transmittance adjusting layer 23 is formed on the convex portion 22. There may be.

  The material of the template is not particularly limited as long as it has sufficient transparency to the light used in the exposure step, but among them, a material having a low coefficient of thermal expansion is preferable. This is because if the coefficient of thermal expansion is small, deformation of the concavo-convex pattern due to heat can be suppressed. Specific examples include quartz glass and Pyrex (registered trademark) glass. Among these, quartz glass is preferable.

Further, the method for producing the template is not particularly limited as long as it is a method capable of obtaining the template described above, and examples thereof include the following methods.
FIG. 3 is a process diagram showing an example of a template manufacturing method used in this embodiment, and more specifically, a process diagram showing an example of a method of manufacturing a microlens-attached substrate forming template. First, as shown in FIG. 3A, a template manufacturing method used in this embodiment is prepared by preparing a raw material substrate including a substrate 31 and a transmittance adjusting layer 32 formed on one entire surface of the substrate 31. Next, a patterned transmittance adjusting layer 32 is formed as shown in FIG. 3B by using a method similar to the method of manufacturing a normal photomask, and then in FIG. As shown in the figure, a positive resist layer 33 is formed on the substrate 31 and the patterned transmittance adjusting layer 32. Next, as shown in FIG. Modulated exposure is performed, the positive resist layer is developed according to the exposure amount, and finally, dry etching 35 is performed as shown in FIG. 3E, whereby a template 36 as shown in FIG. And how to get That.

(B) Substrate to be transferred Next, the substrate to be transferred used in this embodiment will be described. The substrate to be transferred used in this aspect includes a substrate and a photosensitive resin layer formed on the substrate.
The substrate is not particularly limited and varies depending on the use of the pattern formed body obtained according to this embodiment. For example, when producing a substrate with microlenses, examples of the substrate include transparent glass substrates such as quartz glass, non-alkali glass, and lead glass (blue plate glass).

As the photosensitive resin constituting the photosensitive resin layer, either a positive photosensitive resin or a negative photosensitive resin can be used. In particular, in this embodiment, a negative photosensitive resin is used. It is preferable. It is because it is excellent in handleability. For example, specific examples of the negative photosensitive resin used in producing a substrate with a microlens include acrylic polymers such as PAK-01 (manufactured by Toagosei) and NIP-K (manufactured by Zen Photonics). Can be mentioned.
The thickness of the photosensitive resin layer varies depending on the use of the pattern forming body, but is usually in the range of 0.1 to 100 μm.

(C) Production of Adhering Laminate The adhering laminate used in this embodiment is formed by adhering the photosensitive resin layer of the substrate to be transferred and the concavo-convex pattern of the template at normal temperature.

(2) Exposure process Next, the exposure process in this aspect is demonstrated. The exposure process in this aspect is a process of irradiating light from the template side of the adhesion laminate.

  For example, when the photosensitive resin layer of the adhesion laminate is a negative photosensitive resin layer, the area of the negative photosensitive resin layer in which the light irradiated by the transmittance adjusting layer is not reduced by performing the above exposure step (A region where normal exposure has been performed) is in a cured state that does not dissolve in the developer in the developing step described later, or that can maintain a desired pattern even when dissolved. On the other hand, the area of the negative photosensitive resin layer in which the light irradiated by the transmittance adjusting layer is reduced is cured to such a degree that it can be dissolved and removed in the developer in the developing step described later. When the transmittance adjusting layer is a light shielding layer, the area of the negative photosensitive resin layer in the vicinity of the light shielding layer remains almost uncured.

  The light used in this embodiment is not particularly limited as long as it can decompose a curing initiator capable of curing the negative photosensitive resin layer, and exposes a general photosensitive resin. Therefore, the same light used for the purpose can be used. For example, g-line (436 nm) and i-line (365 nm) of a mercury lamp, KrF excimer laser (248 nm), ArF excimer laser (193 nm), and the like can be mentioned.

The light exposure amount is not particularly limited, and can be the same exposure amount as in a normal imprint method. In this embodiment, since the template of the close-contact laminate has a transmittance adjusting layer, for example, even when exposure is performed with the same exposure amount as in a normal imprint method, a negative resist layer is crosslinked. The density can be partially reduced, etc., and the thick film layer and the like can be easily removed in the development process described later. The exposure amount of the light, but are not particularly limited, specifically in the range of 100~10000mJ / cm ^2, preferably in the range Of these the 500~2000mJ / cm ^2.

(3) Development Step Next, the development step in this embodiment will be described. The development step in this aspect is a step of forming the uneven transfer substrate by peeling the template of the adhesive laminate after the exposure step, and developing the uneven transfer substrate with a developer.

  For example, when the photosensitive resin layer of the concavo-convex transfer substrate is a negative photosensitive resin layer, the negative photosensitive property in which the light irradiated by the transmittance adjusting layer in the exposure process is reduced by performing the development process. The region of the resin layer has a high cross-linking density and thus has a high solubility in the developer, and is dissolved and removed in the developer. On the other hand, in the above exposure step, the area of the negative photosensitive resin layer in which the light irradiated by the transmittance adjusting layer is not reduced (the area where normal exposure has been performed) has a high crosslinking density, so The solubility is low and the desired pattern is maintained.

  The developer used in this embodiment is not particularly limited, and is preferably selected as appropriate according to the type of the photosensitive resin layer used. Specific examples include an alkali developer and an organic solvent developer.

  In this embodiment, the method for developing the concavo-convex transfer substrate is not particularly limited, and examples thereof include a dipping method, a spray method, and a paddle method, and the paddle method is preferable.

(4) Pattern formation body Next, the pattern formation body obtained by this aspect is demonstrated. The application of the pattern formed body obtained by the present embodiment is not particularly limited. For example, a substrate with a microlens, a semiconductor device, an image sensor, a MEMS (Micro Electro Mechanical Systems), an optical communication device, a hologram, etc. Can be mentioned.

2. Second Aspect Next, a method for producing the pattern forming body according to the second aspect will be described. In this embodiment, the negative photosensitive resin layer is exposed with a specific exposure amount. Specifically, the light exposure amount in the exposure step is in the range of 50 to 99% with respect to the complete curing exposure amount.
The “completely cured exposure amount” is the minimum exposure amount that can be regarded as completely cured of the negative photosensitive resin, and specifically, the remaining film with respect to the developer of the negative photosensitive resin. In the curve showing the relationship between the exposure amount and the exposure amount, it means the minimum exposure amount necessary for the remaining film amount to be constant.

  According to this aspect, by setting the exposure amount of light during the exposure step within the above range, the negative photosensitive resin can be cured to an extent that it can be appropriately dissolved in the developer. By performing the development process, the above-described thick film layer can be easily removed.

Next, the manufacturing method of the pattern formation body of this aspect is demonstrated using drawing. FIG. 4 is a process diagram showing an example of a method for producing a pattern-formed body of this embodiment, and more specifically shows a method for producing a substrate with a microlens.
First, as shown in FIG. 4A, a transfer substrate 43 including a substrate 41 and a negative photosensitive resin layer 42 formed on the substrate 41, a template 45 having a concavo-convex pattern 44 on the surface, As shown in FIG. 4B, a contact laminate forming process is performed in which the photosensitive resin layer 42 of the transferred substrate 43 and the concave / convex pattern 44 of the template 45 are brought into close contact to form a contact laminate 46.

Next, as shown in FIG. 4C, an exposure step of irradiating light 47 with a specific exposure amount from the template 45 side of the close-contact laminate 46 is performed. At this time, the negative photosensitive resin layer 42 is cured to the extent that it is appropriately dissolved in the developer by irradiation with light 47.
Next, the template 45 of the close-contact laminate 46 is peeled off to obtain the uneven transfer substrate 48 as shown in FIG. At this time, a thick film layer 49 is generated. However, as described above, the negative photosensitive resin layer 42 is cured to an extent that the negative photosensitive resin layer 42 is appropriately dissolved in the developer. By developing with a developing solution, the thick film layer 49 can be easily removed, and a substrate with a microlens (pattern forming body) 50 as shown in FIG. 4E can be obtained.
Next, the manufacturing method of the pattern formation body of this aspect is demonstrated for every process.

(1) Adhering Laminate Forming Step First, the adhering laminate forming step in this embodiment will be described. The adhesion laminated body formation process in this aspect is a process in which the photosensitive resin layer of the substrate to be transferred and the concave / convex pattern of the template are adhered to each other to form the adhesion laminated body.

(A) Template The template used in this embodiment has a concavo-convex pattern on the surface. The template used in this embodiment is usually one that does not have the above-described transmittance adjustment layer, but is the same as that described in “1. First embodiment” except that it does not have a transmittance adjustment layer. Therefore, explanation here is omitted.

(B) Substrate to be transferred The substrate to be transferred used in this aspect includes a substrate and a photosensitive resin layer formed on the substrate. In this embodiment, a negative photosensitive resin is usually used as the photosensitive resin. The transfer substrate used in this embodiment is the same as the contents described in “1. First embodiment”, and thus the description thereof is omitted here. The same applies to the method for manufacturing the adhesion laminate.

(2) Exposure process Next, the exposure process in this aspect is demonstrated. The exposure process in this aspect is a process of irradiating light from the template side of the adhesion laminate.

  In this aspect, as described above, the light exposure amount in the exposure step is in the range of 50 to 99% with respect to the complete curing exposure amount. It is preferable to be in the range of 95%.

The amount of light exposure varies depending on the type of the photosensitive resin layer used and the like. For example, it is within the range of 100 to 10000 mJ / cm ² , and particularly within the range of 500 to 2000 mJ / cm ^2. preferable.

  In addition, the light used in this embodiment is not particularly limited as long as the negative photosensitive resin layer can be appropriately cured, and is used for exposing a general photosensitive resin. The thing similar to light can be used. For example, g-line (436 nm) and i-line (365 nm) of a mercury lamp, KrF excimer laser (248 nm), ArF excimer laser (193 nm), and the like can be mentioned.

(3) Development Step Next, the development step in this embodiment will be described. The development step in this aspect is a step of forming the uneven transfer substrate by peeling the template of the adhesive laminate after the exposure step, and developing the uneven transfer substrate with a developer. About the exposure process in this aspect, since it is the same as that of the content described in "1. 1st aspect", description here is abbreviate | omitted.
Moreover, since the use etc. of the pattern formation body obtained by this aspect are the same as the content described in "1. 1st aspect", description here is abbreviate | omitted.
Further, in this embodiment, in order to completely advance the crosslinking reaction of the photosensitive resin, the exposure is usually further performed after the development step.

B. Next, the imprint template of the present invention will be described. The imprint template of the present invention is characterized by having a concavo-convex pattern on the surface, and having a transmittance adjusting layer for adjusting the light transmittance at the convex or concave portion of the concavo-convex pattern.

According to the present invention, the thick film layer produced by the imprint method can be easily removed by using the template having the transmittance adjusting layer.
Such an imprint template is the same as the template described in the above-mentioned “A. Pattern forming body manufacturing method 1. First aspect”, and thus the description thereof is omitted here.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

Hereinafter, the present invention will be described more specifically with reference to examples.
[Example 1]
(Preparation of transmittance adjustment template for microlenses)
A 200 mm thick chromium film (with a transmittance of 10%) is formed on quartz glass by sputtering, and then an electron beam resist (EB resist) is applied to form a resist pattern with a frame pattern width of 100 nm on the periphery of the lens. It was produced at a pitch of 2 μm. The chromium film was etched with chlorine gas, and the electron beam resist was peeled off.
Next, in order to form a lens shape pattern, an EB resist is applied to the substrate after the resist is peeled off, the amount of electron beam (EB) irradiation is changed according to the resist shape, and development is performed. A resist pattern was formed. Next, the resist pattern was etched by dry etching with CF ₄ , and the concave bowl shape was transferred to quartz glass, that is, etched back to obtain a transmittance adjusting template for microlenses.

(Production of microlens array)
A photosensitive resin layer is formed by dropping PAK-01 made by Toagosei Co., Ltd. on a substrate on which a color filter and a planarizing layer are formed on a CMOS sensor. The transmittance adjusting template was brought into close contact with a pressure of 0.4N. Thereafter, the template was peeled off by exposure at 1000 mJ / cm ² with a mercury lamp. Then, the microlens array was formed by developing with propylene glycol monomethyl ether acetate (PGMEA) for 60 seconds, rinsing with isopropyl alcohol (IPA), and then spin drying. In the obtained microlens array, the gap between each microlens was as small as about 100 nm.
In the conventional method, about 100 nm of the thick film layer of PAK-01 that does not contribute to the lens remains, but in this example, the microlens array could be formed without the generation of the thick film layer.

[Example 2]
(Preparation of transmittance adjustment template for microlenses)
An electron beam resist (EB resist) was applied on quartz glass, and then an antistatic film spacer (manufactured by Showa Denko KK) was applied. A resist pattern having a concave bowl shape was formed by changing the dose of electron beam (EB) in accordance with the resist shape and developing. Next, the resist pattern was etched by dry etching with CF ₄ , and the concave bowl shape was transferred to quartz glass, that is, etched back to obtain a transmittance adjusting template for microlenses.

(Production of microlens array)
A photosensitive resin layer is formed by dropping PAK-01 made by Toagosei Co., Ltd. on a substrate on which a color filter and a planarizing layer are formed on a CMOS sensor. The transmittance adjusting template was brought into close contact with a pressure of 0.4N. Thereafter, the template was peeled off by exposure at 1000 mJ / cm ² with a mercury lamp. Thereafter, development was performed with propylene glycol monomethyl ether acetate (PGMEA) for 60 seconds, rinsed with isopropyl alcohol (IPA), and then spin-dried. Then, in order to advance a crosslinking reaction completely, it exposed with 500 mJ / cm < ² > with the mercury lamp further, and formed the micro lens array. In the obtained microlens array, the gap between each microlens was as small as about 100 nm.
In the conventional method, about 100 nm of the thick film layer of PAK-01 that does not contribute to the lens remains, but in this example, the microlens array could be formed without the generation of the thick film layer.

It is process drawing which shows an example of the manufacturing method of the pattern formation body of this invention. It is a schematic sectional drawing which illustrates the template used for this invention. It is process drawing which shows an example of the manufacturing method of the template used for this invention. It is process drawing which shows the other example of the manufacturing method of the pattern formation body of this invention. It is process drawing for demonstrating the imprint method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Negative photosensitive resin layer 3 ... Transfer substrate 4 ... Uneven pattern 5 ... Transmittance adjustment layer 6 ... Template 7 ... Adhering laminate 8 ... Light 9 ... Uneven transfer substrate 10 ... Thick film layer 11 ... Substrate with microlens (patterned body)

Claims (4)

Using a substrate, a transferred substrate provided with a photosensitive resin layer formed on the substrate, and a template having a concavo-convex pattern on the surface, the photosensitive resin layer of the transferred substrate, and the concavo-convex pattern of the template An adhesion laminate forming step of forming an adhesion laminate by adhering
An exposure step of irradiating light from the template side of the adhesive laminate;
After the exposure step, the template of the adhesion laminate is peeled to form a concavo-convex transfer substrate, and the development step of developing the concavo-convex transfer substrate with a developer;
A method for producing a pattern-formed body, comprising:   The method for producing a pattern forming body according to claim 1, wherein the template has a transmittance adjusting layer that adjusts a light transmittance at a convex portion or a concave portion of the concave-convex pattern.   The method for producing a pattern forming body according to claim 1, wherein an exposure amount of light in the exposure step is in a range of 50 to 99% of a complete curing exposure amount. An imprint template comprising a concavo-convex pattern on a surface and a transmittance adjusting layer for adjusting a light transmittance at a convex portion or a concave portion of the concavo-convex pattern.

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