JP2008044289A - Mold for transfer and transfer method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold which is capable of performing accurate transfer with no residual film in a product, in a mold which is used in a transfer method for transferring a fine transfer pattern formed in the mold to the product to be molded. <P>SOLUTION: The mold 3 for the transfer is manufactured by the formation into a flat plate shape by a material in which an electromagnetic wave with a specific wavelength permeates, and by forming the fine transfer pattern 5 by providing a recess part 23 on one thickness-directional surface 21, wherein a film 25 which blocks the electromagnetic wave with the specific wavelength is formed in a flat surface other than the recess part 23 among one surface 21. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a transfer mold and a transfer method, and more particularly to a transfer mold provided with a light shielding film.

  In recent years, a mold (template, stamper) is produced by forming an ultra-fine transfer pattern on a quartz substrate or the like by an electron beam drawing method, etc., which is formed on the surface of the substrate to be transferred (molded product) as a product to be molded (substrate). Research and development has been made on a nanoimprint technique in which the mold is pressed against the resist film with a predetermined pressure to transfer a transfer pattern formed on the mold (see Non-Patent Document 1).

  Further, as a device for executing the nanoimprint, for example, a transfer device described in Patent Document 1 is known. In this transfer device, an X stage and a Y stage are provided at the lower horizontal portion of an L-shaped frame, and a substrate table as a support portion for a molded product is mounted thereon, and an upper and lower direction is placed above the vertical portion of the frame. A mold support (mold holder) is provided via a moving mechanism. The mold holding body includes a flat portion, and the flat portion holds a mold on which an ultra fine transfer pattern for transfer is formed.

For example, as shown in FIG. 8 (showing a conventional transfer), as the molded product 100, a substrate 102 provided with an ultraviolet curable resin 104 on one surface is used, and the molded product 100 is used as a mold 106. While being pressed, transfer is performed by irradiating the molded product 100 (ultraviolet curable resin 104) with ultraviolet rays through the mold 106.
JP 2004-34300 A Precision Engineering Journal of the International Societies for Precision Engineering and Nanotechnology

  By the way, in the conventional transfer, a thin film (residual film) 110 of the ultraviolet curable resin 104 exists between the top surface 108 of the fine transfer pattern of the mold 106 and the base material 102.

  Although the thin film 110 is extremely thin, completely removing the thin film 110 (pressing the molded product 100 with the mold 106 so that the top flat surface 108 and the base material 102 are in contact with each other) It is difficult to make the pressure very large.

  In this way, when the residual film 110 is present and irradiated with ultraviolet rays as shown in FIG. 8, not only the ultraviolet curable resin 114 entering the recess 112 of the mold 106 but also the residual film 110 is cured. Therefore, there is a problem that transfer cannot be performed accurately.

  The ultraviolet curable resin 114 is a necessary part after the transfer, but the remaining film 110 is an unnecessary part after the transfer and is desirably not present. For example, the molded article 100 after the transfer may be etched to form a recess 116 as indicated by a broken line on the base material 102. However, not only the necessary portion 114 but also the remaining film 110 is formed on the base material 102. This is because it is difficult to provide the recess 116 as shown by the two-dot chain line if it remains.

  Further, in the conventional transfer, when the ultraviolet ray is irradiated, the ultraviolet ray leaks from the side surface of the mold 106 and the portion 118 of the ultraviolet curable resin 114 existing near the die 106 is also cured.

  Then, after performing the first transfer, the mold 106 is moved relative to the molded product 100, and the next transfer is applied to the site of the molded product 100 adjacent to the site where the first transfer is performed. Even if it tries to do, since the said hardened | cured part 118 exists, there exists a problem that the said next transfer cannot be performed. This problem also occurs when a transfer is performed a plurality of times adjacent to each other.

  It is also conceivable to perform the next transfer at a position sufficiently away from the site where the first transfer has been performed. However, there are cases where it is desired to form continuous transfer patterns (transfer patterns adjacent to each other) on the molded product 100, and it is difficult to deal with such cases.

  The present invention has been made in view of the above problems, and in a transfer method for transferring a fine transfer pattern formed on a transfer mold to a molded product and a mold used for the transfer method, It is an object of the present invention to provide a transfer method that can eliminate a residual film formed on a molded product and perform accurate transfer, and a mold used in the transfer method.

  Further, the present invention provides a transfer method for transferring a fine transfer pattern formed on a transfer mold to a molded product and a mold used for the transfer method, after performing the first transfer, It is an object of the present invention to provide a transfer method capable of performing the next transfer on a part of the molded product adjacent to the part where the second transfer is performed, and a mold used in this transfer method.

  The invention according to claim 1 is for transfer, in which a fine transfer pattern is formed by providing a concavo-convex portion on one surface in the thickness direction, which is formed in a flat plate shape with a material that transmits electromagnetic waves of a predetermined wavelength. In the mold, a transfer mold in which a film that shields the electromagnetic wave of the predetermined wavelength is formed on a plane other than the concave portion among the one surface.

  The invention according to claim 2 is for transfer, in which a fine transfer pattern is formed by providing a concavo-convex portion on one surface in the thickness direction, formed of a material that transmits electromagnetic waves of a predetermined wavelength. In this type, the transfer mold is provided with a film that shields the electromagnetic wave having the predetermined wavelength over the entire circumference of the side surface.

  According to a third aspect of the present invention, there is provided a transfer device in which a fine transfer pattern is formed by providing a concavo-convex portion on one surface in the thickness direction, which is formed in a flat plate shape with a material that transmits electromagnetic waves having a predetermined wavelength. In this type, a film for blocking electromagnetic waves of the predetermined wavelength is formed over the entire circumference of the side surface, and the film is formed on the flat surface other than the concave portion of the one surface. It is a type.

  According to a fourth aspect of the present invention, in the transfer mold according to any one of the first to third aspects, the film is a mask used for forming the concave portion by etching. Of the type.

  According to a fifth aspect of the present invention, there is provided a transfer method in which a molding layer is provided on one surface in the thickness direction of a substrate, and a fine transfer pattern formed on a mold is transferred to the molding layer. It is formed in a flat plate shape with a material that transmits electromagnetic waves having a wavelength, and a fine transfer pattern is formed by providing an uneven portion on one surface in the thickness direction. A pressing step for pressing the molding layer, and an irradiation process for irradiating the molding layer with the electromagnetic wave of the predetermined wavelength through the mold. And a removing step of removing the molding layer existing between the base material and the film.

  According to a sixth aspect of the present invention, there is provided a transfer method in which a molding layer is provided on one surface in the thickness direction of a substrate, and a fine transfer pattern formed on a mold is transferred to the molding layer. It is formed in a flat plate shape with a material that transmits electromagnetic waves of wavelength, and a fine transfer pattern is formed by providing an uneven portion on one surface in the thickness direction. A mold in which a film to be shielded is formed, a first pressing process of pressing the molding layer, a first irradiation process of irradiating the molding layer with the electromagnetic wave having the predetermined wavelength through the mold; A positioning step of moving and positioning the base material relative to the mold to press the portion of the molding layer adjacent to the cured portion of the molding layer with the mold; and A second pressing step for pressing the molding layer; A transfer method and a second irradiation step of irradiating an electromagnetic wave of the predetermined wavelength through the mold.

  According to the present invention, a transfer method for transferring a fine transfer pattern formed on a transfer mold to a molded product, and a mold used in the transfer method eliminates a residual film formed on the molded product. There is an effect that it is possible to provide a transfer method capable of performing accurate transfer and a mold used in the transfer method.

  Further, according to the present invention, after performing the first transfer in a transfer method for transferring a fine transfer pattern formed on a transfer mold to a molded product and a mold used in the transfer method, There is an effect that it is possible to provide a transfer method capable of performing the next transfer to a portion of the molded product adjacent to the portion where the first transfer is performed, and a mold used in this transfer method.

  FIG. 1 is a diagram showing a schematic configuration of a transfer apparatus 1 according to an embodiment of the present invention.

  Hereinafter, for convenience of explanation, one horizontal direction is defined as an X-axis direction, another horizontal direction that is perpendicular to the X-axis direction is defined as a Y-axis direction, and the X-axis direction and the Y-axis direction. A direction (vertical direction; vertical direction) perpendicular to Z may be referred to as a Z-axis direction.

  The transfer device 1 is a device that transfers a fine transfer pattern 5 formed on a transfer mold 3 to a molded product 7, and includes a base member 9. Note that the molded product 7 includes a recording medium such as a DVD, a light guide plate of a liquid crystal display device, and the like.

  On the lower side of the base member 9, a table 11 for placing the molded product 7 is provided. The table 11 is an actuator such as a servo motor (not shown) and can be moved and positioned in the X-axis direction and the Y-axis direction. A movable body 13 is provided on the upper side of the base member 9. The movable body 13 can be moved and positioned in the Z-axis direction by an actuator such as a servo motor (not shown). The movable body 13 is provided with an ultraviolet lamp (not shown) which is an example of a generator that generates electromagnetic waves (for example, ultraviolet rays) having a predetermined wavelength.

  A mold 3 is installed below the movable body 13. The mold 3 is made of a member (for example, quartz glass) that transmits ultraviolet rays. A fine transfer pattern 5 is formed on the lower surface of the mold 3.

  In the molded article 7, a thin film 17 of a molded layer (for example, an ultraviolet curable resin) that is cured when irradiated with an electromagnetic wave having a predetermined wavelength is provided on the upper surface of a base material 15 made of glass or the like.

  Then, under the control of a control device (not shown), as shown in FIG. 1, the movable body 13 with the molded product 7 (molded product 7 to which the ultraviolet curable resin 17 is not cured) installed on the table 11. Is lowered, presses the molded product 7 with the mold 3, irradiates the molded product 7 with the ultraviolet rays generated by the ultraviolet lamp, and the fine transfer pattern 5 of the mold 3 is formed on the molded product 7 (ultraviolet curable resin 17). Can be transferred to.

  The ultraviolet rays generated by the ultraviolet lamp pass through the path 19 formed in the movable body 13 and the mold 3 to reach the product 7. The mold 3 is supported by the movable body 13 around the entire periphery. Therefore, the ultraviolet rays that pass through the path 19 do not leak outside the path 19 except when they reach the mold 3.

  Further, when viewed from the Z-axis direction, for example, the molded product 7 is formed larger than the mold 3, and the table 11 is appropriately positioned in the X-axis direction or the Y-axis direction, and the mold is formed on one molded product 7. 3 can be transferred a plurality of times.

  The transfer device 1 is configured such that the movable body 13 (mold 3) is moved and positioned relative to the table 11 (molded product 7) in the X-axis direction, the Y-axis direction, and the Z-axis direction. It only has to be.

  Here, the mold 3 will be described in detail.

  FIG. 2 is a diagram showing the shape of the mold 3. FIG. 2A is a cross-sectional view of the mold 3, and FIG. 2B is a perspective view of the mold 3. In FIG. 2B, the transfer pattern 5 is displayed on the upper side.

  The mold 3 is formed in a rectangular shape, a circular shape, or the like in a flat plate shape, and a fine transfer pattern 5 is formed by providing the concave portion 23. The transfer pattern 5 is formed on almost the entire one surface 21 of the mold 3. Instead of providing the recesses 23, a large number of fine projections may be provided on a planar portion to form a transfer pattern. Thus, you may form the recessed part 23 by providing a convex part.

  Of the one surface 21 of the mold 3, a plane other than the recesses 23 is provided on a plane that blocks ultraviolet rays (light shielding film; for example, a thin film formed by vapor-depositing a metal such as chromium (Cr), or a resin, for example. 25) is provided. A film 25 that blocks ultraviolet rays is also provided on the entire circumference of the side surface 27 of the mold 3.

  In the mold 3 shown in FIG. 2, the recess 23 is formed in an elongated shape, and the portion other than the recess 23 (the protrusion in the transfer pattern 5) is formed in an elongated rectangular parallelepiped shape. A portion other than the concave portion 23 (a convex portion in the transfer pattern 5) is formed in, for example, a quadrangular prism shape or a cylindrical shape, and this quadrangular column shape or the cylindrical convex portion is one surface 21 in the thickness direction. A large number of dots may be scattered. Further, the transfer pattern 5 may be formed by providing a large number of quadrangular columnar or cylindrical recesses on one surface 21 in the thickness direction.

  Next, a method for manufacturing the mold 3 will be described.

  FIG. 3 is a diagram illustrating a manufacturing process of the mold 3.

  First, as shown in FIG. 3A, a plate-shaped mold 3 material (quartz glass material) 29 is prepared. Next, as shown in FIG. 3B, a film 25 is provided on the entire circumference of one surface 21 and the side surface 27 in the thickness direction of the material 29 by vapor deposition or the like. Subsequently, as shown in FIG. 3C, a film 25 provided on one surface 21 is formed in a predetermined form for forming the transfer pattern 5, and then the material 29 is formed by etching or the like. A recess 23 is formed on one surface 21 (portion where the film 25 in FIG. 3C is not formed), and the mold 3 is generated. Therefore, the film 25 is formed by masking used when forming each recess 23 by etching. Thus, since the film | membrane 25 is formed by masking, it is not necessary to provide the film | membrane 25 separately and the manufacturing process of the type | mold 3 can be simplified.

  Next, the operation of the transfer device 1 will be described.

  4 and 6 are diagrams for explaining the operation of the transfer device 1, and FIG. 5 is an enlarged view of FIG. More specifically, FIG. 5 (a) is an enlarged view of the VA portion of FIG. 4 (b), and FIG. 5 (b) is an enlarged view of the VB portion of FIG. 4 (c).

  First, as shown in FIG. 4A, the product 7 is placed on the table 11. The mold 3 is located on the product 7 away from the product 7. In this state, the movable body 13 (mold 3) is lowered and the mold layer 17 (molded article 7) is pressed with the mold 3 (FIG. 4B). During this pressing, the molding layer 17 is irradiated with ultraviolet rays through the mold 3.

  After the molded layer 17 is cured by the pressing and the irradiation of the ultraviolet rays, the non-cured molded layer (residual film) 31 existing between the base material 15 and the film 25 (see FIG. 5A). ) Is removed using a solvent such as isopropyl alcohol (see FIG. 5B).

  Thereafter, the cured molding layer 33 may be used as a mask to perform a process such as etching to form the recess 35 in the base material 15 as shown by a two-dot chain line in FIG.

  After the first transfer, the table 11 is appropriately moved and positioned in the X-axis direction and the Y-axis direction, and the second and subsequent transfers (transfer similar to the first transfer) are performed. A continuous (adjacent) transfer pattern is formed (see FIG. 6). In this case, the removal of the remaining film 31 is performed after all the transfer to the single product 7 is completed.

  As described above, when the transfer is performed using the mold 3 in which the film 25 is present on the one plane 21, the remaining film 31 is formed when the molded article 7 is pressed with the mold 3 and irradiated with ultraviolet rays. Even if it exists, due to the presence of the film 25, the residual film 31 is not irradiated with ultraviolet rays, and the residual film 31 is not cured. The uncured remaining film 31 is removed by dissolving with a solvent such as isopropyl alcohol. Therefore, accurate transfer without the remaining film 31 can be performed, and after the transfer, etching for forming a recess (a recess 35 as shown by a two-dot chain line in FIG. 5B) in the substrate 15 is easily performed. be able to.

  Further, since the remaining film 31 may exist when the molded product 7 is pressed with the mold 3 and irradiated with ultraviolet rays, it is not necessary to increase the pressing force of the mold 3, and the rigidity of the transfer device 1 is increased. There is no need to increase it.

  Further, if transfer is performed using the mold 3 in which the film 25 is present on the side surface 27, ultraviolet rays do not leak from the side surface 27 of the mold 3 during the first transfer. The portion of the molded product 7 (molded layer 17) adjacent to the transferred portion is not cured, and the next transfer is applied to the portion of the molded product 7 adjacent to the first transferred portion. It can be carried out.

  Then, a continuous transfer pattern can be formed on the molded product 7, and the molded product 7 can be transferred over a wide range with a small mold without increasing the size of the expensive mold. Furthermore, if an electric mold is used, for example, by using an object 7 to which a pattern is transferred over a wide range, a large-area mold can be manufactured at a low cost.

  As shown in FIG. 7, the transfer pattern 5 may be formed only at the center of the mold 3. Even in the case of the mold 3 (3a) as shown in FIG. 7 or the mold 3 as shown in FIG. 2 (a), the film 25 is formed on the side surface 27. In this case, it is possible to prevent the molding layer 17 from being cured in the vicinity of the portion where the transfer is performed.

1 is a diagram illustrating a schematic configuration of a transfer device according to an embodiment of the present invention. It is a figure which shows the shape of a type | mold. It is a figure which shows the manufacturing process of a type | mold. It is a figure explaining operation | movement of a transfer apparatus. FIG. 5 is an enlarged view of FIG. 4. It is a figure explaining operation | movement of a transfer apparatus. It is a figure which shows the modification of a type | mold. It is a figure which shows the conventional transcription | transfer.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Transfer device 3, 3a Type 5 Transfer pattern 7 Molded product 15 Base material 17 UV curable resin 25 Film

Claims (6)

In a transfer mold in which a fine transfer pattern is formed by providing a concavo-convex portion on one surface in the thickness direction, formed in a flat plate shape with a material that transmits electromagnetic waves of a predetermined wavelength,
A transfer mold characterized in that a film that blocks the electromagnetic wave having the predetermined wavelength is formed on a plane other than the concave portion among the one surface. In a transfer mold in which a fine transfer pattern is formed by providing a concavo-convex portion on one surface in the thickness direction, formed in a flat plate shape with a material that transmits electromagnetic waves of a predetermined wavelength,
A transfer mold, wherein a film for blocking electromagnetic waves having the predetermined wavelength is formed over the entire circumference of a side surface. In a transfer mold in which a fine transfer pattern is formed by providing a concavo-convex portion on one surface in the thickness direction, formed in a flat plate shape with a material that transmits electromagnetic waves of a predetermined wavelength,
A film for shielding electromagnetic waves of the predetermined wavelength is formed over the entire circumference of the side surface, and the film is formed on a plane other than the concave portion of the one surface. Type. In the transfer mold according to any one of claims 1 to 3,
The transfer mold, wherein the film is masking used when the concave portion is formed by etching. In the transfer method of providing a molding layer on one surface in the thickness direction of the base material and transferring the fine transfer pattern formed on the mold to the molding layer,
It is formed in a flat plate shape with a material that transmits electromagnetic waves of a predetermined wavelength, and a fine transfer pattern is formed by providing an uneven portion on one surface in the thickness direction. A pressing step of pressing the molding layer with the mold in which a film that shields electromagnetic waves of the predetermined wavelength is formed on the plane of the mold;
An irradiation step of irradiating the molding layer with the electromagnetic wave having the predetermined wavelength through the mold;
A removing step of removing the molding layer existing between the base material and the film;
A transfer method characterized by comprising: In the transfer method of providing a molding layer on one surface in the thickness direction of the base material and transferring the fine transfer pattern formed on the mold to the molding layer,
It is formed in a flat plate shape with a material that transmits electromagnetic waves of a predetermined wavelength, and a fine transfer pattern is formed by providing an uneven portion on one surface in the thickness direction. A mold in which a film for shielding electromagnetic waves is formed, and a first pressing step for pressing the molding layer;
A first irradiation step of irradiating the molding layer with the electromagnetic wave having the predetermined wavelength through the mold;
A positioning step of moving and positioning the base material relative to the mold in order to press a portion of the molding layer adjacent to the cured portion of the molding layer with the mold;
A second pressing step of pressing the molding layer with the mold;
A second irradiation step of irradiating the electromagnetic wave of the predetermined wavelength through the mold;
A transfer method characterized by comprising:

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