JP2009223998A - Method of manufacturing magnetic recording medium and manufacturing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To simultaneously perform imprint on front and back surfaces of a substrate while pressing stamp parts against the front and back surfaces with uniform force. <P>SOLUTION: A method includes a step of vertically holding a glass substrate 28 in which resin parts 38 are formed on both surfaces, i.e. the front and back surfaces of the glass substrate, a step of pressing the stamp parts 48 having a uneven pattern on both surfaces of the vertically held glass substrate 28, and a step of transferring the uneven pattern to the resin parts 38 formed on both surfaces of the glass substrate 28 while pressing the stamp parts 48 against the glass substrate 28. By pressing the stamp parts 48 against both surfaces of the vertically held glass substrate 28, the effect of gravity is reduced and the stamp parts 48 are pressed against both surfaces of the glass substrate 28 with uniform force. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method and apparatus for manufacturing a magnetic recording medium, and more particularly to a method and apparatus for manufacturing a magnetic recording medium having a fine pattern.

  With the progress of the advanced information society in recent years, magnetic recording / reproducing apparatuses such as hard disk drives (HDD) have been rapidly reduced in size and capacity. For this reason, an improvement in the recording density of the magnetic recording medium is required, and at present the recording density is improved by making the magnetic particles finer. However, miniaturization of magnetic particles is approaching its limit, and as a breakthrough, magnetic recording media called discrete track media and patterned media have been proposed. The discrete track media has a structure in which data tracks are artificially patterned to physically and magnetically separate the data tracks. Patterned media has a structure in which patterning is performed in units of data bits, and each bit is physically and magnetically separated.

  One of the methods for forming these patterns is a method called an imprint method. The imprint method is a method of transferring a concavo-convex pattern onto a resin part by pressing a mold part (mold) on which a concavo-convex pattern has been formed in advance against a substrate on which a resin part is formed. Typical imprinting methods include a thermal imprinting method using a thermosetting resin and a photoimprinting method using an ultraviolet curable resin.

  In the thermal imprinting method, heat is applied to cure the resin, so that the substrate, the mold part, or the like may be deformed by thermal expansion and affect the pattern formed on the resin part. On the other hand, in the optical imprint method, since the resin is cured by irradiating ultraviolet rays, deformation of the substrate, the mold part, and the like due to thermal expansion hardly occurs. For this reason, the optical imprint method is suitable for forming a fine pattern.

For example, Patent Literature 1 and Patent Literature 2 disclose a technique in which a mold portion is pressed against a front surface and a back surface of a substrate arranged in parallel to the ground to simultaneously imprint the front surface and the back surface of the substrate.
JP 2007-95162 A Japanese Patent No. 3618057

  In a magnetic recording medium, it is necessary to perform imprinting on the front surface and the back surface of the substrate. Of course, it is possible to perform imprinting for each side, but it is preferable to perform imprinting on both sides simultaneously in consideration of mass productivity.

  For example, as in Patent Document 1 and Patent Document 2, a method of imprinting by placing a substrate parallel to the ground and pressing a mold portion against the front and back surfaces of the substrate pushes the mold portion against the front and back surfaces. There is a drawback that the force applied is difficult to be uniform due to the influence of gravity.

  In particular, since discrete track media and patterned media perform pattern formation in units of data tracks and data bits, the pattern becomes very fine. In addition, when these discrete track media and patterned media are mounted on an HDD, high-precision pattern formation is required so that the position of the magnetic head and the position of the pattern can be accurately matched. For this reason, in discrete track media and patterned media, a slight distortion in the magnitude of the force pressing the mold portion against the front and back surfaces of the substrate has a great influence on pattern formation.

  Accordingly, the present invention has been made in view of the above problems, and manufacture of a magnetic recording medium capable of simultaneously imprinting the front and back surfaces while pressing the mold portion with a uniform force on the front and back surfaces of the substrate. It is an object to provide a method and a manufacturing apparatus.

  In order to solve the above-described problems, a method of manufacturing a magnetic recording medium disclosed in the specification includes a step of vertically holding a substrate having a resin portion formed on a front surface and a back surface, and a surface of the substrate held vertically. And a step of pressing a mold part having a concavo-convex pattern on the back surface, and a step of transferring the concavo-convex pattern to the resin part formed on the front and back surfaces of the substrate while pressing the mold part against the substrate; It is what has.

  In addition, the magnetic recording medium manufacturing apparatus disclosed in the specification includes a substrate holding mechanism for vertically holding a substrate having a resin portion formed on the front surface and the back surface, and the front and back surfaces of the substrate held vertically. A mold part operating mechanism that presses a mold part having a concavo-convex pattern onto the substrate, and a transfer unit that transfers the concavo-convex pattern to the resin part formed on the front and back surfaces of the substrate while pressing the mold part against the substrate. Are provided.

  According to these, when the mold part is pressed against the front surface and the back surface of the substrate, it becomes difficult to be affected by gravity, and the mold part can be pressed against the front surface and the back surface of the substrate with a uniform force. That is, the front surface and the back surface can be simultaneously imprinted while pressing the mold portion with a uniform force on the front surface and the back surface of the substrate. For this reason, it becomes possible to form a fine pattern with high accuracy and excellent mass productivity.

  According to the method and apparatus for manufacturing a magnetic recording medium disclosed in the specification, the front and back surfaces can be simultaneously imprinted while pressing the mold portion with a uniform force against the front and back surfaces of the substrate. For this reason, it becomes possible to form a fine pattern with high accuracy and excellent mass productivity.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a block diagram of a magnetic recording medium manufacturing apparatus according to the first embodiment. FIG. 2 is a flowchart illustrating the manufacturing process of the magnetic recording medium according to the first embodiment. A method and apparatus for manufacturing a magnetic recording medium according to Example 1 will be described with reference to FIGS. In FIG. 1, a magnetic recording medium manufacturing apparatus 10 according to the first embodiment includes a cleaning unit 12, an inspection unit 14, an adhesion layer forming unit 16, a resin unit forming unit 18, an imprint unit 20, and a control unit. 22. The cleaning unit 12 cleans the substrate that becomes the magnetic recording medium. The inspection unit 14 inspects particles attached to the front surface and the back surface of the substrate (hereinafter referred to as both surfaces of the substrate). The adhesion layer forming unit 16 forms adhesion layers for improving the adhesion between the substrate and the resin on both surfaces of the substrate. The resin part forming part 18 forms the resin part on both surfaces of the substrate. The imprint unit 20 performs pattern formation on the resin portions formed on both sides of the substrate. The control unit 22 controls the conveyance of the substrate between the cleaning unit 12, the inspection unit 14, the adhesion layer forming unit 16, the resin unit forming unit 18, and the imprint unit 20, and the respective processes. The substrate is transported by a so-called cassette-to-cassette from the cassette 24 to the cassette 24, and each process is continuously executed. The reason why the substrate is transported by the cassette-to-cassette and the respective processes are continuously executed is to suppress particles adhering to the substrate as much as possible.

  In FIG. 2, first, a glass substrate having a base layer, an intermediate layer, and a magnetic layer sequentially formed on both sides is prepared (step S10). The glass substrate has a thickness of 0.7 mm and an outer diameter of 65 mm, for example, and a hole having a diameter of 20 mm (hereinafter referred to as an inner diameter) is formed in the center. These underlayer, intermediate layer, and magnetic layer can each be formed by sputtering, for example. Then, as shown in FIG. 1, the glass substrate on which the underlayer, the intermediate layer, and the magnetic layer are formed is stored in the cassette 24, and the entire cassette 24 is set in the magnetic recording medium manufacturing apparatus 10.

  1 and 2, the cassette 24 storing the glass substrate is first transported to the cleaning unit 12. The cleaning unit 12 performs scrub cleaning while pouring pure water on both surfaces of the glass substrate to remove particles adhering to both surfaces of the glass substrate (step S12). Thereafter, rinsing and drying are performed. In addition, when using a chemical | medical solution in the case of washing | cleaning, it is preferable to select the chemical | medical solution which does not affect the film | membrane (for example, magnetic layer) of the outermost surface formed into a film on both surfaces.

  Next, the cassette 24 is conveyed to the inspection unit 14. The inspection unit 14 inspects particles attached to both surfaces of the glass substrate (step S14). For the particle inspection, for example, an optical measuring method such as a laser can be used. Here, particles having a size of 0.1 μm or more were detected. In addition, it is preferable to change the size of the particle to detect at any time according to the refinement | miniaturization of the pattern to form. In the particle inspection, if the number of particles adhering to both surfaces of the glass substrate is zero, the process proceeds to the next step. If the number of particles is not zero, the process returns to the substrate cleaning process (step S16).

  The glass substrate that has passed the particle inspection is then transported to the adhesion layer forming unit 16 together with the cassette 24. In the adhesion layer forming unit 16, an adhesion layer for improving the adhesion between the resin formed on both surfaces of the glass substrate and the glass substrate is formed (step S18). Here, the formation process of the adhesion layer will be described in detail with reference to FIGS. In FIG. 3A to FIG. 3C, the number of glass substrates 28 is reduced for the sake of simplicity. In FIG. 3A, for example, 25 glass substrates 28 conveyed to the adhesion layer forming unit 16 are taken out from the cassette 24 by the transfer jig 26. Then, the glass substrate 28 together with the transfer jig 26 is immersed in the bathtub 30. The bath 30 is filled with an adhesion liquid 32 made of a polymer using, for example, propylene glycol monomethyl ether acetate (PGMEA) as a solvent. In FIG. 3B, after the glass substrate 28 is completely immersed in the contact liquid 32 for 4 seconds, for example, the liquid surface of the contact liquid 32 is lowered and the glass substrate 28 is gradually taken out from the contact liquid 32. At this time, the descending speed of the liquid level is, for example, 3 mm / second. In FIG. 3C, the liquid level of the close contact liquid 32 is completely lowered to form the close contact layer 34 on both surfaces of the glass substrate 28. Thereafter, the glass substrate 28 together with the transfer jig 26 is moved to a baking furnace, and the glass substrate 28 is baked, for example, in a nitrogen atmosphere at 150 ° C. for 100 seconds to cure the adhesion layer 34. The adhesion layer 34 is preferably made as thin as possible in consideration of the adhesion between the glass substrate 28 and the resin. Further, depending on the type of resin used, the step of forming the adhesion layer 34 may be omitted.

  Returning to FIG. 1 and FIG. 2, the cassette 24 containing the glass substrate 28 on which the adhesion layer 34 is formed is conveyed to the resin portion forming unit 18. In the resin part forming part 18, the resin part is formed on both surfaces of the glass substrate 28 (step S20). In Example 1, the resin portion is formed using an ultraviolet curable resin. As a method for forming the resin portion, the same method as the method for forming the adhesion layer 34 shown in FIGS. 3A to 3C can be used. A method for forming the resin portion will be described in detail with reference to FIGS. In FIG. 4A to FIG. 4C, the number of glass substrates 28 is reduced for the sake of simplicity. 4A, for example, 25 glass substrates 28 taken out using the transfer jig 26 are immersed in a bath 30 filled with a liquid resin 36 made of, for example, a photopolymerization resin. In FIG. 4B, after the glass substrate 28 is completely immersed in the liquid resin 36 for 5 seconds, for example, the liquid level is lowered at a speed of 10 mm / second, for example. In FIG. 4 (c), the liquid level is completely lowered to form resin portions 38 on both sides of the glass substrate 28. Thereafter, the transfer jig 26 is moved to a baking furnace, and the glass substrate 28 is baked in, for example, a nitrogen atmosphere at 60 ° C. for 20 seconds to cure the resin portion 38. This treatment is performed for the purpose of preventing dripping rather than completely curing the resin portion 38.

  Returning to FIG. 1 and FIG. 2, the cassette 24 in which the glass substrate 28 is accommodated next is conveyed to the imprint unit 20. In the imprint part 20, pattern formation is performed on the resin part 38 formed on both surfaces of the glass substrate 28 (step S22). Here, a method for forming a pattern on the resin portion 38 will be described in detail with reference to FIGS. In FIGS. 5A to 6C, the adhesion layer 34 is not shown for the sake of simplicity. In FIG. 5A, the cassette 24 is conveyed onto the substrate holding mechanism 40. Then, the substrate holding mechanism 40 is raised and the lower part of the glass substrate 28 is held by the substrate holding mechanism 40, whereby one glass substrate 28 stored in the cassette 24 is held vertically. In addition, the substrate holding mechanism 40 is provided with a groove portion (guide) 42, and the glass substrate 28 can be held without falling by fitting the glass substrate 28 into the groove portion 42.

  In FIG. 5B, the mold part 48 fixed by the mold part fixing ring 46 is vertically held on the front end part of the mold part operation mechanism 44 made of a cylindrical piezo element. Press against. The mold part 48 is made of a material that transmits ultraviolet rays, and for example, glass having a thickness of 200 μm can be used. A concave / convex pattern is formed in the mold portion 48 in advance. For example, a circular concavo-convex pattern is formed when a discrete track media type magnetic recording medium is manufactured, and a dot concavo-convex pattern is formed when a patterned media type magnetic recording medium is manufactured. Further, the inner diameter L of the mold part operating mechanism 44 is, for example, about 70 mm, and the thickness W of the mold part fixing ring 46 is, for example, about 0.3 mm.

  When the mold part 48 is pressed against both surfaces of the glass substrate 28, the expansion and contraction of the piezo element is used. The mold part operation mechanism 44 has an operating range of, for example, about ± 0.4 mm in the Z direction (direction parallel to the perpendicular to both surfaces of the glass substrate 28) due to expansion and contraction of the piezo element. The XY direction, which is a direction perpendicular to the Z direction, has an operating range of about ± 0.6 mm, for example. The mold part 48 is provided with an alignment mark (not shown) in advance. Before the mold part 48 is pressed against both surfaces of the glass substrate 28, the position of the alignment mark is matched with the positions of the inner and outer diameters of the glass substrate 28. Specifically, for example, the end surfaces of the inner and outer diameters of the glass substrate 28 are detected using a laser, and the laser at the position where the end surface is detected is aligned with the alignment mark. This alignment is performed by operating the mold part operation mechanism 44 in the XY directions by using expansion and contraction of the piezo element. Thereby, it is possible to perform alignment with such an accuracy that the positional deviation between the center of the glass substrate 28 and the center of the mold part 48 is, for example, 1 μm or less.

  After the alignment between the glass substrate 28 and the mold part 48 is completed, the mold part operating mechanism 44 is operated in the Z direction by utilizing the expansion and contraction of the piezo element. Push from top to bottom. Then, the substrate holding mechanism 40 is lowered while pressing the mold portion 48 against the glass substrate 28. Thereby, the glass substrate 28 is held so as to be sandwiched between the mold parts 48.

  In FIG. 6A, an ultraviolet irradiation unit 50 for transferring the concavo-convex pattern formed on the mold part 48 to the resin part 38 is formed on both sides of the glass substrate 28 against which the mold part 48 is pressed. Is provided. The ultraviolet irradiation unit 50 is arranged so that the emitted ultraviolet light (UV light) passes through the inside of the mold unit operation mechanism 44. The resin part 38 is irradiated with ultraviolet rays (UV light) for 5 seconds, for example, and the resin part 38 is cured. Thereby, the concavo-convex pattern formed on the mold part 48 is transferred to the resin part 38 formed on both surfaces of the glass substrate 28.

  In FIG. 6B, after transferring the uneven pattern to the resin portion 38, the mold portion 48 is pulled away from the glass substrate 28. At this time, an operation opposite to the case of pressing the mold portion 48 against the glass substrate 28 is performed. Specifically, the mold part operation mechanism 44 is operated in the Z direction by utilizing expansion and contraction of the piezo element, and the mold part 48 is pulled away from the lower part of the glass substrate 28 toward the upper part. Then, the substrate holding mechanism 40 is raised while separating the mold part 48 from both surfaces of the glass substrate 28. As a result, the glass substrate 28 is held again by the substrate holding mechanism 40.

  In FIG. 6C, the substrate holding mechanism 40 is lowered and the glass substrate 28 is stored in the original cassette 24. Thereafter, the cassette 24 for one glass substrate 28 is moved, and the steps shown in FIGS. 5A to 6C are performed on the next glass substrate 28. In this way, the steps shown in FIGS. 5A to 6C are performed on all the glass substrates 28 accommodated in the cassette 24.

  Returning to FIGS. 1 and 2, after the pattern formation on the resin portion 38 is completed for all the glass substrates 28 stored in the cassette 24, the cassette 24 is unloaded from the magnetic recording medium manufacturing apparatus 10. . Thereafter, a pattern inspection is performed to check whether there is a problem with the pattern formed on the resin portion 38. The glass substrate 28 that has passed the pattern inspection then proceeds to the etching process. In the etching step, the magnetic layer is etched using the resin portion 38 as a mask. Thereby, a pattern corresponding to a discrete track medium or a patterned medium is formed on the magnetic layer.

  According to the method of manufacturing the magnetic recording medium of the first embodiment, as shown in FIG. 5A, the glass substrate 28 on which the resin portions 38 are formed on both sides is held vertically by the substrate holding mechanism 40. As shown in FIG. 5B, a mold part 48 having a concavo-convex pattern on both surfaces of a glass substrate 28 held vertically is pressed using a mold part operation mechanism 44. Then, as shown in FIG. 6A, the resin portion 38 formed on both surfaces of the glass substrate 28 is irradiated with ultraviolet rays while pressing the mold portion 48 against the glass substrate 28, and the uneven pattern is transferred to the resin portion 38. .

  Thus, when pressing the mold part 48 on both surfaces of the glass substrate 28 with the glass substrate 28 held vertically, the mold part 48 is pressed on both surfaces with the glass substrate 28 parallel to the ground. The effect of gravity is smaller than For this reason, it becomes easy to press the mold part 48 to both surfaces of the glass substrate 28 with a uniform force. Thereby, for example, a fine pattern of about 10 nm can be formed with high accuracy. Accordingly, it is possible to easily form a pattern of a discrete track media type magnetic recording medium or a patterned media type magnetic recording medium, and it is possible to easily manufacture a magnetic recording medium corresponding to downsizing and large capacity. In addition, in Example 1, although the case where the glass substrate 28 is made vertical in the state perpendicular | vertical to the ground like FIG. 5A is illustrated, it is not restricted to this. The glass substrate 28 may have an inclination as long as the mold part 48 can be pressed against the both surfaces of the glass substrate 28 with a uniform force without being affected by the gravity.

  Further, as shown in FIG. 6A, by holding the glass substrate 28 so as to be sandwiched between the mold portions 48, both surfaces of the glass substrate 28 can be irradiated with ultraviolet rays simultaneously. For this reason, pattern formation can be performed simultaneously on the resin portions 38 formed on both surfaces of the glass substrate 28. This makes it possible to manufacture a magnetic recording medium with excellent mass productivity.

  Further, as shown in FIG. 5B, when the mold part 48 is pressed against both surfaces of the glass substrate 28, the mold part operating mechanism 44 is operated to move the mold part 48 from the upper part to the lower part of the glass substrate 28. It is pressed. Thereby, bubbles can be prevented from entering between the glass substrate 28 and the mold part 48. Therefore, it is possible to form a pattern with high accuracy on the resin portions 38 formed on both surfaces of the glass substrate 28.

  Further, as shown in FIG. 5A, the glass substrate 28 is held vertically by holding the lower portion of the glass substrate 28 by the substrate holding mechanism 40. Then, as shown in FIG. 5B, the mold holding mechanism 40 is lowered while operating the mold part operating mechanism 44 to press the mold part 48 from the upper part to the lower part of the glass substrate 28. Thus, the glass substrate 28 is held by the mold part 48. At this time, attention should be paid so that the substrate holding mechanism 40 does not contact the mold part 48 and the mold part operation mechanism 44. Thereby, it is possible to easily hold the glass substrate 28 between the mold parts 48 without dropping the glass substrate 28 while suppressing damage to the glass substrate 28 and the mold part 48.

  Further, as shown in FIG. 6B, when the mold part 48 is pulled away from the glass substrate 28, the mold part 48 is pulled away from the lower part of the glass substrate 28 toward the upper part. Then, the glass substrate 28 is held again by the substrate holding mechanism 40 by moving the substrate holding mechanism 40 while operating the mold part operating mechanism 44 and pulling the mold part 48 apart. At this time, attention should be paid so that the substrate holding mechanism 40 does not contact the mold part 48 and the mold part operation mechanism 44. Thereby, it is possible to easily hold the glass substrate 28 again by the substrate holding mechanism 40 without dropping the glass substrate 28 while suppressing damage to the glass substrate 28 and the mold part 48.

  Further, as shown in FIG. 5B, the mold part operation mechanism 44 is composed of a piezo element, and the mold part operation mechanism 44 is operated by using the expansion and contraction of the piezo element to push the mold part 48 against the glass substrate 28. I guess. In this way, by operating the mold part operation mechanism 44 using expansion and contraction of the piezo element, the mold part operation mechanism 44 can be controlled with high accuracy. Therefore, the force for pressing the mold part 48 against both surfaces of the glass substrate 28 can be controlled with high accuracy. For this reason, it becomes possible to form a fine pattern with high accuracy on the resin portion 38 formed on both surfaces of the glass substrate 28.

  In the first embodiment, the mold part operation mechanism 44 includes a piezo element, and the case where the mold part operation mechanism 44 is operated using expansion and contraction of the piezo element is described as an example. However, the present invention is not limited thereto. For example, the operation of the mold part operation mechanism 44 may be controlled by mechanical control such as a stepping motor. For example, the operation of the mold part operation mechanism 44 may be controlled using gas pressure or the like. In other words, the mold part operation mechanism 44 may be operated by various methods as long as the operation of the mold part operation mechanism 44 can be controlled with high accuracy. In this case, it is preferable to use a material most suitable for the method to be used for the mold part operation mechanism 44.

  Further, as shown in FIG. 5B, the mold part 48 is provided with an alignment mark in advance, and before the mold part 48 is pressed against the glass substrate 28, the alignment part is used to form the mold part 48 and the glass substrate. Alignment with 28 is performed. Thereby, pattern formation can be performed on the resin portion 38 with high positional accuracy. In particular, in the first embodiment, the mold part 48 and the glass substrate 28 are aligned by operating the mold part operation mechanism 44 by using expansion and contraction of the piezoelectric element. Therefore, the operation of the mold part operation mechanism 44 can be controlled with high accuracy, and fine position adjustment between the mold part 48 and the glass substrate 28 can be performed. Therefore, it is possible to form a pattern on the resin portion 38 with higher accuracy.

  As shown in FIG. 4A, the resin portion 38 is formed by immersing, for example, 25 glass substrates 28 in a bath 30 filled with a liquid resin 36 using the transfer jig 26. As shown in FIG. 4B, the liquid level of the liquid resin 36 is lowered, and the glass substrate 28 is gradually taken out from the liquid resin 36. Then, as shown in FIG. 4C, the glass substrate 28 is completely removed from the liquid resin 36, and the resin portions 38 are formed on both surfaces of the glass substrate 28. By this method, the resin portions 38 can be formed collectively on both surfaces of the plurality of glass substrates 28. That is, the resin part 38 can be formed with excellent mass productivity. Moreover, the film thickness of the resin part 38 formed in both surfaces of the some glass substrate 28 can be formed uniformly. When the film thickness of the resin portion 38 formed on both surfaces of the glass substrate 28 is uniform, the mold portion 48 can be pressed against the both surfaces of the glass substrate 28 with a uniform force. Therefore, a fine pattern can be more easily formed with high accuracy.

  In the first embodiment, the method of lowering the liquid level of the liquid resin 36 and gradually taking out the glass substrate 28 from the liquid resin 36 is described as an example, but the present invention is not limited to this method. For example, the glass substrate 28 may be gradually removed from the liquid resin 36 by raising the transfer jig 26.

  Further, in the first embodiment, the resin portion 38 has been described as an example using an ultraviolet curable resin, but the present invention is not limited thereto, and for example, a thermosetting resin may be used. Even in this case, the pressing force can be made uniform by pressing the mold portion 48 against both surfaces of the glass substrate 28 in a state where the glass substrate 28 is vertical as shown in FIG. Therefore, a fine pattern can be accurately formed on the resin portions 38 formed on both surfaces of the glass substrate 28. When a thermosetting resin is used for the resin part 38, the resin part 38 is heated instead of the ultraviolet irradiation part 50 shown in FIG. A heating device for transferring to the resin part 38 is required.

  Further, as shown in FIG. 1, the magnetic recording medium manufacturing apparatus 10 includes a cleaning unit 12, an inspection unit 14, an adhesion layer forming unit 16, a resin unit forming unit 18, an imprint unit 20, and a control unit 22. ing. Then, the glass substrate 28 is transported in a cassette-to-cassette between the cleaning unit 12, the inspection unit 14, the adhesion layer forming unit 16, the resin unit forming unit 18, and the imprint unit 20 according to an instruction from the control unit 22. , Each process is processed continuously. Thereby, the adhesion of particles to the glass substrate 28 can be suppressed, and the yield can be improved.

  Furthermore, it is preferable that the thickness W of the mold portion fixing ring 46 shown in FIG. 5B is not more than half the thickness of the glass substrate 28. The inner diameter L of the mold part operation mechanism 44 is preferably larger than the outer diameter of the glass substrate 28. Thus, the mold part 48 can be pressed against both surfaces of the glass substrate 28. Further, it is preferable that the working range in the Z direction of the mold part operation mechanism 44 is about twice the thickness of the mold part 48.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and changes can be made within the scope of the gist of the present invention described in the claims. It can be changed.

  Finally, the magnetic recording medium manufacturing method and the magnetic recording medium manufacturing apparatus disclosed in this specification are summarized as follows.

  (Additional remark 1) The process of hold | maintaining the board | substrate with which the resin part was formed vertically on the surface and the back surface, and the process of pressing the type | mold part which has an uneven | corrugated pattern on the surface and back surface of the said board | substrate held vertically. And a step of transferring a concavo-convex pattern to the resin portion formed on the front surface and the back surface of the substrate while pressing the mold portion against the substrate.

  (Supplementary note 2) The method of manufacturing a magnetic recording medium according to supplementary note 1, wherein the step of pressing the mold part includes a step of pressing the mold part from an upper part to a lower part of the substrate.

  (Supplementary Note 3) The step of holding the substrate vertically includes the step of holding the substrate vertically by holding the lower portion of the substrate with a substrate holding mechanism, and performing the step of pressing the mold part However, the method for manufacturing a magnetic recording medium according to claim 2, further comprising a step of holding the substrate by the mold part by lowering the substrate holding mechanism.

  (Supplementary Note 4) After the step of transferring the concavo-convex pattern, the substrate holding mechanism is raised while performing the step of separating the mold part from the substrate from the bottom to the top of the substrate and the step of separating the mold part. The method for producing a magnetic recording medium according to appendix 3, further comprising: holding the substrate again by the substrate holding mechanism.

  (Additional remark 5) The process of pressing the said mold part includes the process of pressing the said mold part on the said board | substrate using the expansion-contraction of a piezoelectric element, The magnetic in any one of Additional remark 1 to 4 characterized by the above-mentioned. A method for manufacturing a recording medium.

  (Additional remark 6) Before the process of pressing the said mold part, it has the process of aligning the said board | substrate hold | maintained vertically and the said mold part, The additional statement 1 to 5 characterized by the above-mentioned. Manufacturing method of magnetic recording medium.

  (Appendix 7) A step of cleaning the substrate, a step of inspecting particles adhering to the substrate after cleaning, a step of forming the resin portion on the front and back surfaces of the substrate that have passed the particle inspection, The method for manufacturing a magnetic recording medium according to any one of appendices 1 to 6, wherein:

  (Appendix 8) The step of forming the resin portion includes the step of forming the resin portion by immersing the substrate in a bath filled with a liquid resin and then removing the substrate from the liquid resin. The method for manufacturing a magnetic recording medium according to appendix 7, wherein the method includes:

  (Supplementary Note 9) A substrate holding mechanism that holds a substrate having a resin portion formed on the front surface and the back surface in a vertical direction, and a mold portion having an uneven pattern is pressed against the front surface and the back surface of the substrate held in the vertical direction. A magnetic part comprising: a mold part operating mechanism; and a transfer means for transferring the concavo-convex pattern to the resin part formed on the front and back surfaces of the substrate while pressing the mold part against the substrate. Recording medium manufacturing equipment.

  (Additional remark 10) The said mold part operation | movement mechanism presses the said mold part toward the lower part from the upper part of the said board | substrate, The manufacturing apparatus of the magnetic recording medium of Additional remark 9 characterized by the above-mentioned.

  (Additional remark 11) When the said mold part operation | movement mechanism presses the said mold part against the said board | substrate, the said board | substrate holding mechanism descend | falls, The said mold part hold | maintains the said board | substrate. The apparatus for manufacturing a magnetic recording medium according to appendix 10.

  (Additional remark 12) The said mold part operation | movement mechanism pulls the said mold part away from the said board | substrate toward the upper part from the lower part of the said board | substrate, and when the said mold part operation | movement mechanism pulls the said mold part away from the said board | substrate, 12. The apparatus for manufacturing a magnetic recording medium according to claim 11, wherein the substrate holding mechanism is moved upward to hold the substrate again by the substrate holding mechanism.

  (Additional remark 13) The said mold part operation | movement mechanism is formed with the piezo element, The expansion / contraction of the said piezo element is utilized, The said mold part is pressed against the said board | substrate, The any one of Additional remarks 9-12 characterized by the above-mentioned. The manufacturing apparatus of a magnetic recording medium as described.

  (Supplementary note 14) The apparatus for manufacturing a magnetic recording medium according to any one of Supplementary notes 9 to 13, wherein the mold part operating mechanism performs alignment between the mold part and the substrate held vertically. .

  (Additional remark 15) The resin which forms the said resin part in the washing | cleaning part which wash | cleans the said board | substrate, the test | inspection part which test | inspects the particle adhering to the said board | substrate after washing | cleaning, and the surface and back surface of the said board | substrate which passed the said particle test | inspection A magnetic part according to any one of appendices 9 to 14, further comprising: a part forming part; and a control part that continuously executes the processing of the cleaning part, the inspection part, and the resin part forming part. Recording medium manufacturing equipment.

FIG. 1 is a block diagram of a magnetic recording medium manufacturing apparatus according to the first embodiment. FIG. 2 is a flowchart illustrating the method for manufacturing the magnetic recording medium according to the first embodiment. FIG. 3A to FIG. 3C are schematic cross-sectional views showing a process for forming an adhesion layer. FIG. 4A to FIG. 4C are schematic cross-sectional views showing a process for forming a resin portion. FIG. 5A and FIG. 5B are schematic cross-sectional views (No. 1) showing a process of forming a pattern on a resin portion by imprinting. FIG. 6A to FIG. 6C are schematic cross-sectional views (part 2) showing the process of forming a pattern on the resin portion by imprinting.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Magnetic recording medium manufacturing apparatus 12 Cleaning part 14 Inspection part 16 Adhesion layer formation part 18 Resin part formation part 20 Imprint part 22 Control part 24 Cassette 26 Transfer jig 28 Glass substrate 30 Bathtub 32 Adhesion liquid 34 Adhesion layer 36 Liquid resin 38 Resin part 40 Substrate holding mechanism 42 Groove part 44 Mold part operation mechanism 46 Mold part fixing ring 48 Mold part 50 Ultraviolet irradiation part

Claims (10)

A step of vertically holding a substrate having a resin portion formed on the front surface and the back surface;
Pressing the mold part having a concavo-convex pattern on the front and back surfaces of the substrate held vertically; and
And a step of transferring the concavo-convex pattern to the resin portion formed on the front surface and the back surface of the substrate while pressing the mold portion against the substrate.   The method of manufacturing a magnetic recording medium according to claim 1, wherein the step of pressing the mold portion includes a step of pressing the mold portion from an upper part to a lower part of the substrate. The step of holding the substrate vertically includes the step of holding the substrate vertically by holding the lower portion of the substrate with a substrate holding mechanism,
3. The method of manufacturing a magnetic recording medium according to claim 2, further comprising a step of holding the substrate by the mold part by lowering the substrate holding mechanism while performing the step of pressing the mold part. Method. After the step of transferring the concavo-convex pattern, the step of pulling the mold part away from the substrate from the bottom to the top of the substrate;
4. The magnetic recording method according to claim 3, further comprising the step of holding the substrate again by the substrate holding mechanism by raising the substrate holding mechanism while performing the step of separating the mold part. A method for manufacturing a medium.   5. The magnetic recording medium according to claim 1, wherein the step of pressing the mold portion includes a step of pressing the mold portion against the substrate by using expansion and contraction of a piezo element. Manufacturing method. A substrate holding mechanism for vertically holding a substrate having a resin portion formed on the front surface and the back surface;
A mold part operating mechanism for pressing a mold part having a concavo-convex pattern on the front and back surfaces of the substrate held vertically;
An apparatus for manufacturing a magnetic recording medium, comprising: transfer means for transferring the concavo-convex pattern to the resin portion formed on the front surface and the back surface of the substrate while pressing the mold portion against the substrate.   7. The apparatus for manufacturing a magnetic recording medium according to claim 6, wherein the mold part operating mechanism presses the mold part from the upper part to the lower part of the substrate.   8. The substrate holding mechanism holds the substrate by the mold portion when the mold portion operating mechanism presses the mold portion against the substrate, and the substrate portion is held by the mold portion. Manufacturing apparatus for magnetic recording media.   The mold part operating mechanism pulls the mold part away from the substrate from the bottom to the top of the substrate. When the mold part operating mechanism pulls the mold part away from the substrate, the substrate holding mechanism 9. The apparatus for manufacturing a magnetic recording medium according to claim 8, wherein the substrate is held again by the substrate holding mechanism by being raised.   The said mold part operation | movement mechanism is formed with the piezo element, The said mold part is pressed on the said board | substrate using the expansion / contraction of the said piezo element, The Claim 6 characterized by the above-mentioned. Magnetic recording medium manufacturing equipment.

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