JP5427389B2 - Manufacturing method and manufacturing apparatus of resin stamper and imprint method - Google Patents

Description

The present invention relates to a method and equipment for producing a resin stamper having holes for alignment in the center or end the like are formed together with the pattern is transferred.

In recent years, the application range of magnetic recording devices such as magnetic disk devices, flexible disk devices, and magnetic tape devices has been remarkably increased and their importance has increased, and the recording density of magnetic recording media used in these devices has been significantly improved. It is being planned. In particular, since the introduction of MR heads and PRML technology, the increase in surface recording density has become more intense. In recent years, GMR heads, TMR heads, etc. have been further introduced and have been increasing at a rate of about 100% per year. For these magnetic recording media, it is required to achieve higher recording density in the future. For this purpose, it is required to achieve higher coercivity, high signal-to-noise ratio (SNR), and higher resolution of the magnetic recording layer. Has been. In recent years, efforts have been made to increase the surface recording density by increasing the track density as well as improving the linear recording density.
In the latest magnetic recording apparatus, the track density has reached 110 kTPI. However, as the track density is increased, magnetic recording information between adjacent tracks interfere with each other, and the problem that the magnetization transition region in the boundary region becomes a noise source and the SNR is easily lost. This directly leads to a decrease in bit error rate, which is an obstacle to improvement in recording density.
In order to increase the surface recording density, it is necessary to make the size of each recording bit on the magnetic recording medium finer and ensure as much saturation magnetization and magnetic film thickness as possible for each recording bit. However, when the recording bits are miniaturized, the minimum magnetization volume per bit becomes small, and there arises a problem that the recording data is lost due to magnetization reversal due to thermal fluctuation.

  In addition, since the distance between tracks is getting closer, magnetic recording devices are required to have extremely high precision track servo technology. At the same time, recording is performed widely, and playback is performed more than when recording to eliminate the influence of adjacent tracks as much as possible. In general, a method of narrowly executing is used. Although this method can minimize the influence between tracks, there is a problem that it is difficult to obtain a sufficient reproduction output, and it is difficult to secure a sufficient SNR.

As one of the methods to achieve such a problem of thermal fluctuation, SNR, or sufficient output, unevenness along the track is formed on the surface of the recording medium, or a nonmagnetic part is formed between adjacent tracks. Attempts have been made to increase the track density by physically separating the recording tracks. Such a technique is hereinafter referred to as a discrete track method.
As an example of a discrete track type magnetic recording medium, there is a magnetic recording medium in which a magnetic recording medium is formed on a nonmagnetic substrate having a concavo-convex pattern formed on a surface, and a physically separated magnetic recording track and a servo signal pattern are formed. It is known (for example, refer to Patent Document 1). In this magnetic recording medium, a ferromagnetic layer is formed on a surface of a substrate having a plurality of irregularities on the surface via a soft magnetic layer, and a protective film is formed on the surface. In this magnetic recording medium, a magnetic recording area magnetically separated from the surroundings is formed in the convex area.
According to this magnetic recording medium, the occurrence of a domain wall in the soft magnetic layer can be suppressed, so that the influence of thermal fluctuation is difficult to occur, and there is no interference between adjacent signals. ing.

  The discrete track method includes a method in which a track is formed after a magnetic recording medium consisting of several thin films is formed, and a magnetic pattern is formed after a concave / convex pattern is formed directly on the substrate surface in advance or on a thin film layer for track formation. There is a method of forming a thin film of a recording medium (see, for example, Patent Document 2 and Patent Document 3). Of these, the latter method is often called a pre-embossing method or a substrate processing mold. The pre-embossing method has an advantage that the physical processing on the medium surface is completed before the medium is formed, so that the manufacturing process can be simplified and the medium is not easily contaminated in the manufacturing process. Since the film having the irregular shape is inherited, there is a problem in that the flying posture and flying height of the recording / reproducing head that performs recording / reproducing while floating on the medium are not stable.

On the other hand, semiconductor devices are required to have high-speed operation and low power consumption operation due to further acceleration of miniaturization, and high technology such as integration of functions called system LSIs is required. Against this background, the lithography technology, which is the core technology of the semiconductor device process, is becoming more expensive as the miniaturization progresses.
Currently, a shift from KrF laser lithography, which has a minimum line width of 130 nm, to higher-resolution ArF laser lithography is being started in light exposure lithography.
The minimum line width at the mass production level of ArF laser lithography is 100 nm, whereas the manufacture of devices is about 90 nm in 2003, 65 nm in 2005, and 45 nm in 2007.
In this situation, finer technologies are expected as F ₂ laser (F ₂ excimer laser) lithography, extreme ultraviolet exposure lithography (EUVL), electron beam reduced transfer exposure lithography (EPL), and electron beam lithography. Projection Lithography), X-ray lithography. These lithography techniques have succeeded in producing patterns of 40 nm to 70 nm.
However, as the miniaturization progresses, the initial cost of the exposure apparatus itself increases exponentially, and there is a problem that the price of a mask for obtaining a resolution comparable to the light wavelength used has soared. However, nanoimprint lithography is attracting attention as a processing technique that is inexpensive and has a resolution of about 10 nm (see Patent Document 4).
JP 2004-164692 A JP 2004-178793 A JP 2004-178794 A JP-T-2004-504718

A discrete track type magnetic recording medium has a structure in which a magnetic layer for recording is formed on a nonmagnetic substrate having a concavo-convex pattern formed on the surface, and the surface is further covered with a protective film layer and a lubricating layer is formed. Yes. In the magnetic recording medium having such a structure, the thinner the protective film layer, the shorter the distance between the head and the magnetic layer, so that the input / output of signals at the head increases and the recording density can be increased. The pit density in the track is determined by the flying height of the head running on the surface of the uneven protective film layer. Therefore, how to maintain stable head flying is an important issue for achieving high recording density.
According to the method of forming a magnetic recording medium by a normal sputtering film forming method, the uneven shape of the substrate is directly inherited by the magnetic layer and the protective film layer. When a protective film layer is formed on the surface of the magnetic layer formed on the concavo-convex substrate by a sputtering film formation method, the protective film layer is deposited on the convex part thickly by the concave part while following the concave-convex shape of the substrate.
Therefore, there is a need for a concavo-convex pattern that keeps the head flying as close as possible and makes the head as close as possible to the magnetic layer and prevents mutual interference of signals with adjacent tracks.

  In order to manufacture such a concavo-convex pattern having a precise shape on a nonmagnetic substrate, a Ni alloy stamper in which a pattern having a desired shape is formed on a substrate such as a Ni alloy by precision processing is usually used. With this Ni alloy stamper, the transfer accuracy of fine irregularities is good, and even when applied for a long period of time for the production of a large number of nonmagnetic substrates, the stamper is not easily worn or damaged.

  However, while the Ni alloy stamper has a long life, it has a problem that the unit price is high, and since it has a long life, it can process as many substrates (several thousands to tens of thousands) as a stamp. When dust or soot is generated in the atmosphere and stamped with the stamp device sandwiched between them, there is a problem in that dust or soot is transferred to the substrate as it is, resulting in pattern defects. If the pattern defect is caused due to dust or wrinkles during inspection, several thousand to several tens of thousands of substrates may not be used until the Ni alloy stamper is replaced. There was a problem that made it non-defective.

In order to solve such problems, the inventor of the present application considers using a resin stamper for forming a concavo-convex pattern of a magnetic recording medium instead of a Ni alloy stamper. If it is a resin stamper, it is considered that it can be manufactured at a much lower cost than a Ni alloy stamper. Even if pattern defects occur due to this, it is possible to avoid the problem that the replacement time of the resin stamper is short and a large number of defective magnetic recording media are manufactured.
Further, in the semiconductor field, a large-area stamper corresponding to a large-area wafer, which is currently the mainstream of starting materials for semiconductor devices, is made of Ni alloy, which is widely used as an imprint stamper, as a material. There was a problem that it was very difficult in terms of productivity and cost.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a technique capable of inexpensively manufacturing a resin stamper that can be provided at a low cost without using a stamper of a Ni alloy substrate. In addition, resin stampers are less expensive than Ni alloy stampers but have a shorter life, so resin stampers are replaced more frequently than conventional Ni alloy stampers, so they can be replaced without accidentally creating a large number of defective products. It is difficult to produce a large number of defects in products such as magnetic recording media that transfer patterns.
Another object of the present invention is to provide an apparatus that can manufacture the above-mentioned resin stamper at low cost.

In order to achieve the above object, the present invention employs the following configuration.
1) The method for producing a resin stamper according to the present invention is a method of forming a composite base material by forming at least one curable resin layer on a resin base material and then forming a pattern on the surface of the mother stamper. On the other hand, a step (1) of pressing and compressing the layer side of the curable resin of the composite substrate to transfer the mother stamper pattern onto the composite substrate, irradiation with active energy rays or heating curing the portion of the composite substrate Te (2), and said to have a step (3) for punching the substrate and / or composite base material, inside punched portion of the pattern forming portion After punching the base material or the composite base material so as to form, the mother stamper and the composite base material are aligned using the punched portion, and then the composite base material is aligned with the mother stamper. Compression molding by pressing the material The process to transfer the pattern of the mother stamper to the composite substrate (1), and characterized by performing the step (2) to cure a portion of the composite substrate.

2) In the method for producing a resin stamper of the present invention, the curable resin is an active energy ray curable resin, and the step (2) irradiates the active energy ray to cure a part of the composite substrate. It is a process.
3) A method of manufacturing a resin stamper of the present invention, in the step (3), characterized in that punching the previous SL the composite base material to form a peripheral edge on the outside of the pattern forming portion.
4) The method for producing a resin stamper according to the present invention is such that the base material has a glass transition temperature (Tg) higher than the base material temperature during compression molding, or a film or sheet of a cured product of a thermoplastic resin or a thermosetting resin It is characterized by being.
5) The method for producing a resin stamper according to the present invention includes a step of obtaining a composite substrate by applying or printing the curable resin in a liquid state on a film or sheet of the thermoplastic resin or a cured product of the thermosetting resin. A step of pressing the composite base material against the mother stamper, compression molding and transferring the pattern of the mother stamper to the composite base material, and irradiating an active energy ray to cure a part of the composite base material The step and the step of punching the composite base material during or after the curing are continuously performed in this order .

Method for producing a resin stamper obtained composite substrate according to 4), the film or sheet of the thermoplastic resin or cured thermosetting resin, the step of applying or printing the curable resin in liquid form It is characterized by being able to.
The method for producing a resin stamper is to use a film or sheet that transmits 20% or more of ultraviolet rays having a wavelength of 200 nm or more and 400 nm or less as a film or sheet of a thermoplastic resin or a cured product of a thermosetting resin described in 4 ). Features.
The method for producing a resin stamper is characterized in that a resin having at least one selected from a (meth) acryloyl group, an oxetanyl group, a cyclohexene oxide group, and a vinyl ether group is used as the curable resin described above.

6) In the method for producing a resin stamper of the present invention, the base material has a glass transition temperature (Tg) higher than the base material temperature at the time of compression molding, or a film or sheet of a cured product of a thermoplastic resin or a thermosetting resin. Further, the present invention relates to a method for producing a resin stamper according to any one of 1) to 5), which is a composite substrate obtained by applying or printing a curable resin in a liquid state.
The method for producing a resin stamper is characterized in that the thermoplastic resin film or sheet described above is a polyethylene terephthalate film having a thickness of 5 to 188 μm and subjected to an easy adhesion treatment on one side.
The resin stamper manufacturing method is characterized in that the mother stamper described above is made of glass, quartz, or nickel electroformed product.

The method for producing a resin stamper is characterized in that the mother stamper described above is a nickel electroformed product, and an active energy ray is irradiated from the opposite side of the mother stamper to cure a part of the composite base material. And
The method for producing a resin stamper is characterized in that the active energy rays described above are ultraviolet rays having a wavelength of 200 nm to 400 nm.
7) The method for producing a resin stamper according to the present invention includes a step of obtaining a composite substrate by applying or printing the curable resin in a liquid state on a film or sheet of the thermoplastic resin or a cured product of the thermosetting resin. A step of punching the composite base material so as to form a punching portion inside the pattern forming portion, and after aligning with the mother stamper using the punching portion, with respect to the mother stamper The step of compressing and molding the composite base material, transferring the pattern of the mother stamper to the composite base material, and the step of curing a part of the composite base material are sequentially performed in this order. And

8 ) The apparatus for producing a resin stamper of the present invention presses a composite base material having at least one curable resin layer against a mother stamper having a pattern formed on the surface thereof, and performs compression molding. An apparatus for producing a resin stamper by transferring a pattern of the mother stamper to a composite base material and punching the composite base material, wherein a cutter member is provided movably with respect to the mother stamper. An irradiation device for irradiating light on the front side of the cutter member and a translucent pressing base are installed in the vicinity of the member, and the composite base material is freely inserted between the mother stamper and the cutter member. The composite substrate disposed between a member and the mother stamper is sandwiched between the translucent pressing base and the mother stamper, and a desired pattern on the mother stamper side The composite substrate is transferred to the composite substrate, and the composite substrate is irradiated with light from the irradiation device to cure the curable resin layer. It is characterized in that it can be punched before and after the curing of the curable resin layer or simultaneously with the curing of the curable resin layer.
The resin stamper manufacturing apparatus is characterized in that the irradiation device described above is a UV irradiation device of continuous pulse emission.
The resin stamper manufacturing apparatus is characterized in that the lamp of the UV irradiation apparatus for continuous pulse emission described above is a quartz xenon lamp.
The resin stamper manufacturing apparatus is characterized in that the irradiation apparatus described above is an LED lamp that emits light having a wavelength of 360 to 370 nm.

9 ) The apparatus for producing a resin stamper according to the present invention is formed by pressing a composite base material having at least one curable resin layer against a mother stamper having a pattern formed on the surface thereof, An apparatus for producing a resin stamper by transferring a pattern of the mother stamper to a composite base material and punching the composite base material, wherein a cutter member is provided movably with respect to the mother stamper. A heating member is provided in the vicinity of the member, a pressing base is installed between the outer cutter part and the inner cutter part, and the composite base material is freely inserted between the mother stamper and the cutter member. The composite substrate disposed between the cutter member and the mother stamper is sandwiched between the pressing base and the mother stamper, and a desired stamper side is provided. The pattern is transferred to the composite base material, and the curable resin layer can be cured by heat from the heating device, and the composite base material is made of the curable resin layer by the cutter member. It is characterized in that it can be punched before and after curing or simultaneously with the curing of the curable resin layer.
10 ) The resin stamper manufacturing apparatus according to the present invention includes an inner peripheral cutter portion in which the cutter member according to any of the above includes an inner peripheral cutter blade that punches out a central portion of the resin composite base material. It is characterized by.
11 ) In the resin stamper manufacturing apparatus of the present invention, the cutter member described above includes an outer peripheral cutter portion having an outer peripheral cutter blade and an inner peripheral cutter portion having an inner peripheral cutter blade disposed inside the outer peripheral cutter portion; It is characterized by being comprised.
12 ) The resin stamper manufacturing apparatus of the present invention includes a sliding support member that positions the mother stamper around the mother stamper described above and guides the cutter blade punched out of the resin composite substrate. It is characterized by being provided.

13 ) The imprint method of the present invention uses a resin stamper produced by the above-described manufacturing method, and applies a thin film formed on a substrate or a thin film formed on a mask layer formed on the substrate. On the other hand, the resin stamper pattern is pressed to perform imprinting.
The imprint method is characterized by imprinting at a pressure of 60 MPa or less when imprinting using the resin stamper described above.
The imprint method is characterized in that the thickness of the thin film described above before imprinting is 50 to 500 nm.
The imprint method is characterized in that the thin film described above is a thin film made of a curable resin containing at least one of an aromatic compound, an alicyclic compound, and a silicon compound.
14 ) In the imprint method of the present invention, a magnetic recording medium provided with a magnetic film on the substrate is applied as the substrate described above, and a part of the magnetic film is removed using a pattern formed on the thin film. Or demagnetization.

According to the present invention, a mother stamper pattern can be transferred to a resin composite substrate, and a resin stamper having a pattern can be obtained at low cost. Using this resin stamper, a pattern is formed on a thin film of a magnetic recording medium, for example, by imprinting, so that a part of the magnetic film is removed or made non-magnetic along the pattern using the thin film pattern. And patterning of the magnetic film can be performed. If it is this resin stamper, it will be possible to carry out the imprint method at a much lower cost than a precision metal stamper such as an electroforming Ni alloy stamper used in the conventional imprint method, Patterning of the magnetic film of the magnetic recording medium can be realized at a lower cost than before.
Also, the resin stamper itself is cheaper than precision metal plates such as Ni alloy plates, so when used for applications such as forming a pattern on a thin film of a magnetic recording medium, the stamper itself can be replaced by biting dust. Even if the frequency of the replacement is high, an inexpensive resin stamper can be easily replaced, and even if it is replaced more frequently than the Ni alloy stamper, there is little risk of an increase in manufacturing cost. Therefore, for example, if a magnetic recording medium is manufactured while replacing the resin stamper more frequently than a metal stamper such as a Ni alloy stamper, even if a defect occurs due to the influence of dust or the like during manufacturing, the Ni Compared with the case where a magnetic recording medium is manufactured in large quantities using an alloy plate, the risk of producing defective products in large quantities can be reduced.

  According to the present invention, since the substrate is punched by the cutter member together with the transfer of the pattern, it is possible to easily obtain the resin stamper having the target shape and having the transfer pattern of the target shape. In pattern transfer, the mother stamper pattern is pressed against a resin composite substrate and compression molded, and then the pattern is transferred by curing the curable resin with active energy rays or heat. Even if it exists, it can transfer correctly and the resin stamper which has the precise pattern of the target shape can be obtained.

  In the present invention, if a film or sheet that transmits 20% or more of ultraviolet rays having a wavelength of 200 nm or more and 400 nm or less is used and a curable resin layer having a curable functional group is formed thereon, an active energy ray is applied to the curable resin. Since the active energy rays can be sufficiently irradiated to the curable resin, the curable resin layer can be reliably cured, and even a fine pattern can be transferred reliably. .

According to the apparatus for manufacturing a resin stamper of the present invention, a mother stamper pattern can be transferred to a resin composite substrate, and the resin substrate or composite substrate can be punched into a desired external shape. Thus, a resin stamper having a desired shape can be manufactured.
By forming an inner peripheral cutter blade or an outer peripheral cutter blade as a cutter member provided in the manufacturing apparatus of the present invention, a resin stamper having a desired shape is manufactured by punching the inner side or the outer side of the pattern transferred on the substrate. Can do.
By providing a sliding support member around the mother stamper and guiding the inner cutter blade or the outer cutter blade punched out of the base material, the punching accuracy such as the punching position and punching shape can be improved.

By transferring the pattern to the thin film on the substrate by imprinting using the resin stamper described above, it is possible to transfer the pattern accurately.
When performing the previous imprinting, accurate pattern transfer can be performed by imprinting at a pressure of 60 MPa or less. If the thickness of the thin film of the curable resin is 50 to 500 nm, a pattern transfer with an accurate shape can be performed by imprinting.
If the above-described resin stamper is used to transfer a pattern by imprinting to a thin film of a magnetic recording medium having a magnetic film on the substrate, accurate pattern transfer can be performed on the thin film on the substrate. By removing a part of the magnetic film using a pattern or demagnetizing a part of the magnetic film, the magnetic recording area and magnetic recording on the magnetic film of the magnetic recording medium can be changed according to the previous pattern. It is possible to classify areas that cannot be performed. As a result, if a pattern for separating magnetic recording tracks is used as an example of a pattern to be formed, there is an effect that an accurate track pattern can be obtained as a discrete track type magnetic recording medium.

The best mode for carrying out the present invention will be described in detail below with reference to the drawings. However, the present invention is not limited to the embodiment described below.
1 to 9 show a resin stamper manufacturing apparatus according to a first embodiment of the present invention. The manufacturing apparatus according to this embodiment is supported by a first mounting plate 1 as shown in FIG. The lower die set 5 supported by the die set 2 and the second mounting plate 3 is provided. Here, the first mounting board 1 is supported by a vertically moving actuator device such as a hydraulic cylinder (not shown) and is provided so as to be movable up and down, and the second mounting board 3 is installed on a base (not shown). It is fixed.
A disk-shaped cutter set member 6 is provided above the first mounting plate 1 so as to be movable up and down supported by a vertically moving actuator device such as a hydraulic cylinder (not shown). A cylindrical outer cutter part 7 is provided on the outer peripheral part side, and a round bar-shaped inner peripheral cutter part 8 is provided at the center of the bottom surface of the cutter set member 6. From these outer cutter part 7 and inner peripheral cutter part 8, the cutter A member 9 is configured. Further, a ring-shaped outer cutter blade 7 A is formed downward on the tip end side of the outer cutter portion 7, and an inner cutter blade 8 A is formed on the tip end side of the inner cutter portion 8.

The outer cutter 7 is extended to the lower side of the mounting plate 1 through a through hole 1 a formed in the outer periphery of the mounting plate 1, and the inner cutter 8 is formed in the center of the mounting plate 1. The outer cutter portion 7 and the inner cutter portion 8 are configured to move up and down according to the vertical movement of the cutter set member 6 with respect to the mounting plate 1. ing.
The cross section of the outer cutter blade 7A is formed in a triangular shape, and the cutting edge surface 7b has a shape obtained by extending the inner peripheral surface 7a of the cylindrical outer cutter portion 7 as it is, and faces outward of the outer cutter portion 7. The outer blade surface 7c is inclined. The inner cutter blade 8A has a cutting blade surface 8b formed by extending the outer peripheral surface of the round bar-shaped inner peripheral cutter portion 8 as it is and an inverted V-shaped cross section formed at the tip of the inner cutter portion 8. The cutting edge is formed of a mortar-shaped recess 8c.

A light source support mechanism 10 and an irradiation device 11 are provided on the lower side of the mounting plate 1 and between the outer peripheral cutter portion 7 and the inner peripheral cutter portion 8. Such active energy rays can be irradiated. Examples of active energy rays that can be irradiated include rays (light energy) such as ultraviolet rays, radiation rays such as electron beams, X-rays, α rays, β rays, γ rays, and neutron rays. Particularly, ultraviolet rays having a wavelength of 200 nm to 400 nm. Industrially, it is preferable because there are many types of light sources and the like industrially.
As the ultraviolet light source, a metal halide lamp, a high-pressure mercury lamp, a low-pressure mercury lamp, an LED lamp, a xenon lamp, or the like can be used. In this case, since the resin stamper is manufactured , it is desirable that the temperature of the resin stamper does not rise during UV curing, and LED lamps that do not include long-wavelength active energy rays and quartz xenon lamps that can perform continuous pulse emission are more suitable. preferable.

  A frame-shaped support member 12 is installed below the irradiation device 11, and a translucent pressing base 15 such as a disk-shaped glass plate is provided below the support member 12. The light source support member 10, the irradiation device 11, the support member 12, and the translucent pressing base 15 are integrated with the mounting board 1, and the translucent pressing base 15 moves up and down in accordance with the vertical movement of the first mounting board 1. Is configured to do.

On the other hand, a cylindrical inner sliding support member 16 and a cylindrical outer sliding support member 17 having the same height are provided on the second mounting plate 3, and a disk-shaped cradle is provided between them. 18 is slidably fitted up and down, and the cradle 18 is supported by an elastic member 20 such as a spring member provided on the lower side thereof. A donut disk-shaped mother stamper 21 is installed on the cradle 18 so as to protrude slightly above the sliding support members 16 and 17.
The mother stamper 21 is formed with a pattern to be transferred on the upper surface side thereof. In the embodiment of the present invention, since a resin stamper for forming a concavo-convex pattern on the surface of a discrete track magnetic recording medium is to be manufactured, the surface of the mother stamper 21 is formed on the surface of the discrete track magnetic recording medium. An uneven pattern of a thin film is formed.
A concave portion 16a into which the rod-shaped inner peripheral cutter blade 8A can be inserted is formed at the center of the inner support member 16.

In order to manufacture a resin stamper with the manufacturing apparatus having the configuration shown in FIG. 1, a composite base material in which at least one curable resin layer is formed on a sheet-like base material on which the target resin stamper is based is prepared. To do.
As an example of this composite substrate, a sheet-like composite substrate 25 having a three-layer structure shown in FIG. 5 can be used. In this embodiment, the composite base material 25 includes a film-like hard layer (base material) 25a, a soft resin layer 25b, and a curable resin layer 25c.
The hard layer (base material) 25a is preferably made of a material having a high ultraviolet transmittance and hardly deformed when punched. Aromatic polyesters such as polyethylene terephthalate and polyethylene naphthalate, ZEONOR (trade name, manufactured by ZEON CORPORATION) ), TOPAS (trade name, manufactured by Polyplastics Co., Ltd.), ARTON (trade name, manufactured by JSR Corp.), Apel (trade name, manufactured by Mitsui Chemicals, Inc.), and the like, aromatic polycarbonate, It consists of resin materials, such as hard thermoplastic resins, such as alicyclic polyimide, and polyolefin-type thermoplastic resins, such as a polypropylene, poly 4-methyl pentene, a polystyrene, and PMMA, or thermosetting resin films, such as an epoxy resin and an allyl resin. Moreover, the thickness of the hard layer 25a can be about 10-3000 micrometers.
For the soft resin layer 25b, it is preferable to use a material having a high ultraviolet transmittance and having a flexibility to follow the swell of the substrate to be imprinted when imprinting using the resin stamper of the present invention. , Urethane rubber, polypropylene film "and the like. Moreover, the thickness of the soft resin layer 25b can be about 10-1000 micrometers.
When the undulation of the hard layer 25a is small in the sheet-like composite base material 25 having a three-layer structure, the soft resin layer 25b is abbreviated as a base material having a two-layer structure including the hard layer 25a and the curable resin layer 25c. it is Ru can.

The curable resin layer 25c is made of at least one resin having a curable group such as a (meth) acryloyl group, an allyl group, a vinyl group, an oxetanyl group, a glycidyl group, a cyclohexene oxide group, and a vinyl ether group. ) It is particularly preferable to be made of a resin having a curable group that is rapidly cured by active energy rays, such as an acryloyl group, an oxetanyl group, a cyclohexene oxide group , and a vinyl ether group.
Examples of a resin having a (meth) acryloyl group that can be used here include methyl (meth) acrylate, ethyl (meth) acrylate, (n-propyl) (meth) acrylate, isopropyl (meth) acrylate, (Meth) acrylic acid-n-butyl, (meth) acrylic acid isobutyl, (meth) acrylic acid-sec-butyl, (meth) acrylic acid hexyl, (meth) acrylic acid octyl, (meth) acrylic acid-2-ethylhexyl , Decyl (meth) acrylate, isobornyl (meth) acrylate, cyclohexyl (meth) acrylate, phenyl (meth) acrylate, benzyl (meth) acrylate, (meth) acrylate-2-hydroxyethyl, (meth) 2-hydroxypropyl acrylate, 3-hydroxypropyl (meth) acrylate, (meth Mono (meth) acrylates such as 2-hydroxybutyl acrylate, 2-hydroxyphenylethyl (meth) acrylate, N, N-dimethyl (meth) acrylamide, N, N-diethyl (meth) acrylamide, N- (Meth) acrylamides such as acryloylmorpholine, ethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di Multifunctional (meth) acrylates such as (meth) acrylate, trimethylolpropane di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol penta (meth) acrylate, bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, brominated bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, alicyclic epoxy resin N-glycidyl type epoxy resin, bisphenol A novolak type epoxy resin, chelate type epoxy resin, glyoxal type epoxy resin, amino group-containing epoxy resin, rubber modified epoxy resin, dicyclopentadiene phenolic type epoxy resin, silicone modified epoxy resin, Examples include so-called epoxy (meth) acrylate obtained by adding (meth) acrylic acid to an epoxy resin such as an ε-caprolactone-modified epoxy resin.

  Examples of resins having an allyl group include allyl ethers such as ethylene glycol monoallyl ether and allyl glycidyl ether, monoallyl esters such as allyl acetate and allyl benzoate, diallyl 1,4-cyclohexanedicarboxylate, and diallyl phthalate. Diallyl esters such as diallyl terephthalate and diallyl isophthalate; allyl ester resins obtained by reacting allyl alcohol with oligoesters such as oligopropylene terephthalate; and diallylamine.

Examples of the resin having a vinyl group include monovinyl ethers such as n-propyl vinyl ether, isopropyl vinyl ether, n-butyl vinyl ether, isobutyl vinyl ether, 2-ethylhexyl vinyl ether, octadecyl vinyl ether, cyclohexyl vinyl ether, vinyl acetate, vinyl propionate, Monovinyl esters such as vinyl butyrate and vinyl benzoate, divinyl esters such as divinyl adipate, N-vinyl amides such as N-vinyl pyrrolidone and N-methyl-N-vinyl acetamide, styrene, 2,4-dimethyl-α -Methylstyrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, 2,4-dimethylstyrene, 2,5-dimethylstyrene, 2,6-dimethylstyrene, 3,4- Methylstyrene, 3,5-dimethylstyrene, 2,4,6-trimethylstyrene, 2,4,5-trimethylstyrene, pentamethylstyrene, o-ethylstyrene, m-ethylstyrene, p-ethylstyrene, o-chloro Styrene, m-chlorostyrene, p-chlorostyrene, o-bromostyrene, m-bromostyrene, p-bromostyrene, o-methoxystyrene, m-methoxystyrene, p-methoxystyrene, o-hydroxystyrene, m-hydroxy Styrene, p-hydroxystyrene, 2-vinylbiphenyl, 3-vinylbiphenyl, 4-vinylbiphenyl, 1-vinylnaphthalene, 2-vinylnaphthalene, 4-vinyl-p-terphenyl, 1-vinylanthracene, α-methylstyrene , O-isopropenyltoluene, m-iso Lope sulfonyl toluene, p- isopropenyl toluene, 2, 3-dimethyl -α- methyl styrene, 3,5-dimethyl -α- methyl styrene, p- isopropyl -α- methyl styrene, alpha-ethyl styrene, alpha-chlorostyrene Styrene derivatives such as ethylene glycol divinyl ether, 1,4-butanediol divinyl ether, 1,6-hexanediol divinyl ether, 1,9-nonanediol divinyl ether, cyclohexane dimethanol divinyl ether, diethylene glycol divinyl ether, triethylene glycol Divinyl ethers such as divinyl ether, polyfunctional vinyl ethers such as trimethylolpropane trivinyl ether, pentaerythritol tetravinyl ether, divinylbenzene, divinyl bif And divinylaryls such as enyl.

Examples of the resin having an oxetanyl group include monooxetanyl compounds such as 3-ethyl-3-hydroxymethyloxetane and 3-ethyl-3-methacryloxymethyloxetane, Aron Oxetane OXT-121 (trade name, manufactured by Toagosei Co., Ltd.) ) , OX-SQ (trade name), polyfunctional oxetane resin such as OXTP (trade name) manufactured by Nippon Steel Chemical Co., Ltd., and the like.
Examples of resins having a glycidyl group include bisphenol A type epoxy resins, hydrogenated bisphenol A type epoxy resins, brominated bisphenol A type epoxy resins, bisphenol F type epoxy resins, novolac type epoxy resins, phenol novolac type epoxy resins, and cresol novolacs. Type epoxy resin, N-glycidyl type epoxy resin, bisphenol A novolak type epoxy resin, chelate type epoxy resin, glyoxal type epoxy resin, amino group-containing epoxy resin, rubber modified epoxy resin, dicyclopentadiene phenolic type epoxy resin, silicone modified Examples thereof include an epoxy resin and an ε-caprolactone-modified epoxy resin.

Examples of the resin having a cyclohexene oxide group include Celoxide 2021P (trade name), Celoxide 3000 (trade name), EHPE 3150 (trade name), and EHPE 3150CE (trade name) manufactured by Daicel Chemical Industries, Ltd.
The thickness of the photocurable resin layer 25c can be about 0.05 to 50 μm, and it is preferable that 20% or more of ultraviolet rays having a wavelength of 400 nm or less are transmitted.

As a second example of the composite base material, a composite base material obtained by applying or printing a curable resin in a liquid state on a part or all of a film or sheet of a thermoplastic resin or a cured product of a thermosetting resin. Can also be mentioned.
As the material of the film or sheet, any material can be used as long as it has excellent smoothness and can transmit active energy rays of 20% or more. Specifically, the material shown as the hard layer 25a can be used. Polyethylene terephthalate is particularly preferable in terms of strength and heat resistance. Moreover, a cycloolefin polymer is preferable from the point of the transmittance | permeability of an active energy ray.
In addition, it is desirable that the surface on which the liquid curable resin is applied is subjected to an easy adhesion treatment. Examples of such an easy adhesion treatment include application of an adhesive resin, plasma treatment, and corona discharge treatment. This method is particularly preferred.

As a film thickness of a film or a sheet | seat, 5-1000 micrometers is good, More preferably, it is 10-300 micrometers. If the film thickness is too thin, there will be a problem in terms of strength, and if it is too thick, the transmittance of the active energy rays will be low, or the flexibility will be lost and problems will easily occur during film transport. The film or sheet can be cut into a predetermined shape, but it is preferable to use a long one in consideration of mass productivity. The long one has a limitation in thickness from the viewpoint of winding on a roll or the like. For example, a PET film having a thickness of 188 μm is commercially available as a thick film. It can also be used.
Further, in order to move the position of these films or sheets, holes for conveyance may be formed at both ends.
As the application or printing method of the curable resin, screen printing, gravure printing, or printing with a bar coater can be employed depending on the printing with a bar coater or the degree of viscosity. In particular, when considering continuous production, screen printing and gravure printing are preferable. The film thickness to be applied is preferably 0.5 to 50 μm, more preferably 2 to 30 μm, and it is preferable to transmit 20% or more of ultraviolet rays having a wavelength of 400 nm or less. When the film thickness is too thin, it is difficult to apply the film thickness uniformly, and when it is too thick, it takes time to cure with active energy rays.

The application or printing shape may be continuously applied or printed in a strip shape, or only the portion to be imprinted may be intermittently performed.
Moreover, as curable resin which can be used, it has a functional group which can be hardened | cured with an ultraviolet-ray, and it is used in the state which melt | dissolved in the solventless or solvent. In the case where it is dissolved in a solvent, after application or printing, heat is applied to remove the solvent, and then active energy ray curing nanoimprinting is performed.
In addition, it is not always necessary to apply or print immediately before the next step, and after applying or printing in advance, a cover film is applied to the application surface and used as a dry film wound in a roll shape in the punching step. I can do it.

As the curable resin, those shown as the curable resin layer 25c can be used.
If such a method is used, a step of obtaining a composite substrate by applying or printing the curable resin in a liquid state on a film or sheet of a cured product of the thermoplastic resin or the thermosetting resin, A step of pressing the composite substrate against the mother stamper, compression molding and transferring the pattern of the mother stamper to the composite substrate, and irradiating active energy rays such as light to cure a part of the composite substrate And the step of punching the composite base material during or after the curing can be continuously performed in this order. In this case, it is efficient to integrally perform the step of curing a part of the composite base material by irradiating light and the step of punching the composite base material during or after the curing. This is preferable.
Various examples of the method of imprinting using the film-like composite base material as the second example as in this example will be described later with reference to FIGS.

As a third example of the composite substrate, a curable resin is applied to a film or sheet of a thermoplastic resin or a cured product of a thermosetting resin having a glass transition temperature (Tg) higher than the substrate temperature at the time of compression molding. Examples of the composite base material obtained by coating or printing in a liquid form are punched in advance so as to form a punched portion inside the pattern forming portion before the transfer step (1). .
Alternatively, as the composite base material in this example, a film or sheet of a thermoplastic resin or a cured product of a thermosetting resin having a glass transition temperature (Tg) higher than the base material temperature at the time of compression molding is used inside the pattern forming portion. It is also possible to exemplify a composite base material obtained by applying or printing a curable resin in a liquid state after punching to form a punched portion.
In the case of applying or printing before punching, after applying or printing in advance, a cover film is pasted on the application surface, and it can be used in the punching process as a dry film wound up in a roll shape.
Moreover, also when apply | coating or printing after stamping, you may affix a cover film on an application | coating surface, wind up in roll shape, and use for a transfer process. When applying or printing, the curable resin may be surrounded from the punched hole, but this can be removed by wiping with a solvent or adhering and peeling the adhesive film and adsorbing the curable resin to the adhesive film. It is preferable.

According to this method, since the compression molding and curing described later are performed after making a hole for alignment in the base material, the pattern position accuracy is good, the pattern transfer rate is good, and the pattern shape is fine. In addition, it is possible to obtain a resin stamper to which an accurate pattern is transferred.
In order to align the composite base material and the mother stamper using the punching portion provided on the base material or the composite base material, for example, a center pin is installed in the receiving portion of the mother stamper, and the center pin is the mother stamper. What is necessary is just to set a mother stamper and a composite base material so that the center hole of a stamper and the punching process part of a base material may be penetrated.
When this method is used, the step of punching the composite base material so as to form a peripheral portion on the outside of the pattern forming portion, which will be described later, is omitted, and the film or sheet shape to which a plurality of patterns are transferred remains. It can also be used as a resin stamper.
Various examples of the method for imprinting using the film-like composite substrate as the third example as in this example will be described later with reference to FIGS.

  The sheet-like composite base material 25 having the above structure is sandwiched between the mother stamper 21 and the translucent pressing base 15 as shown in FIG. 1 with the photo-curable resin layer 25c facing downward, and the first mounting plate 1 is lowered. Then, the composite base material 25 is pressed against the surface of the mother stamper 21 through the translucent pressing base 15 with a prescribed pressure. The pressing pressure is preferably 0.01 to 60 MPa.

The mother stamper 21 is a material that can be precisely processed, such as a Ni alloy, and a metal plate made of a material that can accurately form fine irregularities by the current forming technology can be applied.
By this operation, the fine concavo-convex pattern which is the reverse pattern of the fine concavo-convex formed on the surface of the mother stamper 21 can be transferred to the photocurable resin layer 25 c of the composite substrate 25. (The above is referred to as a transfer step (1).)
Further, while the composite base material 25 is pressed against the surface of the mother stamper 21, ultraviolet light is irradiated from the irradiation device 11 to cure the photocurable resin layer 25c. (The above is referred to as a curing step (2).)

Before or after this curing, or when curing is completed, or when curing is in progress, the cutter set member 6 is lowered to lower the outer cutter part 7 and the inner cutter part 8 as shown in FIG. A disc-shaped resin stamper 30 is punched from the composite base material 25 by the outer cutter blade 7A and the inner cutter blade 8A. (The above is referred to as a punching process (3).)
At the time of this punching, the outer peripheral cutter blade 7 punches the composite base material 25 while sliding along the extended surface of the outer periphery of the cylindrical sliding support member 17, and the inner peripheral cutter blade 8 is disposed inside the sliding support member 16. Since the composite base material 25 is punched while sliding along, the composite base material 25 can be punched at an accurate position, and a donut disk-shaped stamper 30 having the desired inner diameter and outer diameter can be obtained. it can.
Further, as shown in FIG. 6, the central portion 25A of the composite base material 25 punched out by the inner peripheral cutter blade 8A is the center of the sliding support member 16 except for the portion that has been punched out of the composite base material 25 to become the stamper 30. The outer peripheral portion 25B of the composite base material 25 discharged to the concave portion 16a side and punched out by the outer peripheral cutter blade 7A is discharged to the outer peripheral side of the sliding support member 17.
Here, since the inner diameter of the concave portion 16a of the sliding support member 16 is substantially equal to the outer diameter of the inner peripheral cutter blade 8A, when punching the composite base material 25, the composite base along the inner peripheral edge of the concave portion 16a. The material 25 can be punched by the inner cutter blade 8A at an accurate position without difficulty, and the punching accuracy can be improved. In addition, since the outer diameter of the sliding support member 17 is substantially equal to the inner diameter of the outer cutter blade 7A, the composite base material 25 is formed along the outer peripheral edge of the sliding support member 17 when the composite base material 25 is punched. Can be punched by the outer cutter blade 7A at an accurate position without difficulty, and the punching accuracy can be improved. Therefore, the composite base material 25 can be punched into a desired donut disk shape in which the shape and position accuracy of the inner circumference circle and the shape and position accuracy of the outer circumference circle are both high.

  After punching out the composite base material 25 as shown in FIG. 6, when the mounting board 1 and the cutter set member 6 are raised as shown in FIG. 7, it is sandwiched between the outer cutter blade 7A and the inner cutter blade 8A. Since the stamper 30 is lifted, as shown in FIG. 8, the cutter set member 6 is moved up with respect to the mounting plate 1 to move the outer cutter blade 7A and the inner cutter blade 8A away from the stamper 30, and at the tip portion. The stamper 30 can be taken out using a peeling means such as a take-out rod 31 having a bent portion 31a. At this time, the outer cutter blade 7A and the inner cutter blade 8A have already been removed from the stamper 30, and the stamper 30 is in close contact with only the translucent pressing base 15. Can be peeled off.

  If the stamper 30 is removed from the translucent pressing base 15, another composite base material 25 is set between the translucent pressing base 15 and the mother stamper 21 as shown in FIG. The stamper 30 can be obtained in the same manner as described above by performing the pressing process, the ultraviolet irradiation process, and the punching process in the order described above, and the stamper 30 can be obtained by repeating the above operations. Can be mass produced.

  The stamper 30 manufactured as described above can be used for manufacturing a discrete track type magnetic recording medium. An example of this type of magnetic recording medium is one in which a magnetic layer or a protective layer is formed on the surface of a nonmagnetic substrate.

For example, the magnetic layer formed on the surface of the nonmagnetic substrate as described above may be an in-plane magnetic recording layer or a perpendicular magnetic recording layer. These magnetic recording layers are preferably formed from an alloy mainly containing Co as a main component.
For example, as a magnetic recording layer for an in-plane magnetic recording medium, a laminated structure composed of a nonmagnetic CrMo underlayer and a ferromagnetic CoCrPtTa magnetic layer can be used.
Examples of magnetic recording layers for perpendicular magnetic recording media include soft magnetic FeCo alloys (FeCoB, FeCoSiB, FeCoZr, FeCoZrB, FeCoZrBCu, etc.), FeTa alloys (FeTaN, FeTaC, etc.), Co alloys (CoTaZr, CoZrNB, CoB, etc.). A backing layer made of, etc., an orientation control film such as Pt, Pd, NiCr, NiFeCr, an intermediate film such as Ru, if necessary, and a magnetic layer made of 60Co-15Cr-15Pt alloy or 70Co-5Cr-15Pt-10SiO ₂ alloy Can be used.

The thickness of the magnetic recording layer is 3 nm to 20 nm, preferably 5 nm to 15 nm. The magnetic recording layer may be formed so as to obtain sufficient head input / output according to the type of magnetic alloy used and the laminated structure. The film thickness of the magnetic layer requires a certain thickness of the magnetic layer in order to obtain a certain level of output during playback. On the other hand, parameters indicating recording / playback characteristics usually deteriorate as the output increases. Therefore, it is necessary to set an optimum film thickness.
Normally, the magnetic recording layer is formed as a thin film by a sputtering method. For example, an uneven shape is formed in the magnetic recording layer at this time.
A protective film layer is formed on the surface of the magnetic recording layer. As the protective film layer, carbon (C), hydrogenated carbon (HxC), nitrogenated carbon (CN), amorphous carbon, silicon carbide (SiC) and other carbonaceous layers, SiO ₂ , ZrO ₂ , TiN, etc. are usually used. The protective film layer material to be used can be used. Further, the protective film layer may be composed of two or more layers.
The film thickness of the protective film layer 3 needs to be less than 10 nm. This is because if the thickness of the protective film layer exceeds 10 nm, the distance between the head and the magnetic layer increases, and sufficient input / output signal strength cannot be obtained.
Usually, the protective film layer is formed by a sputtering method. At this time, a protective film layer having irregularities is formed following the aforementioned irregularities. Further, the thickness of the protective film in the concave portion tends to be larger than the thickness of the protective film in the convex portion.

  The stamper 30 obtained in the present invention can be applied for forming fine irregularities on the magnetic recording medium having the above structure. Since the resin stamper 30 obtained in the present invention is cheaper than the conventional Ni alloy stamper, the resin stamper can be replaced more frequently than the conventional Ni alloy stamper. Since it can be exchanged without producing defective media, it has the feature that it is difficult to produce defects.

FIGS. 10A and 10B are configuration diagrams showing an example structure when the resin stamper manufacturing apparatus described above with reference to FIGS. 1 to 9 is incorporated into a specific unitized apparatus. FIG. 11 is an enlarged cross-sectional view of the main part.
In this unit configuration example, an operation panel 40 and a control panel 41 are provided on a main body base 42, four columns 42A are erected on the main body base 42, and a top 45 is provided at the upper end of these columns 42A. A resin that is supported and has a cylinder device 46 facing downward at the center of the bottom surface of the top 45, and having a function equivalent to that of the resin stamper manufacturing device described above between the main body base 42 and the cylinder device 46. The stamper manufacturing apparatus is incorporated.

A lower die set 47 is installed on the main body base 42, and a thick cylindrical punch (sliding support member) 48 is installed on the center of the lower die set 47. A member 49 is provided, and a donut board-like upper die (outer cutter part) 50 is installed on the upper side thereof, and a translucent pressing base 51 and an internal punch (inner cutter part) 52 are provided inside the upper die 50. The irradiation device 53 is provided on the translucent pressing base 51 inside the upper die 50. Further, both the upper die 50 and the internal punch 52 are integrated with the upper die set 54, and this upper die set 54 is connected to the output rod 46a of the previous cylinder device 46 and is supported so as to be movable up and down. The upper die (outer peripheral cutter part) 50 and the internal punch (inner peripheral cutter part) 52 are configured to be moved up and down by a cylinder device 46.
In the apparatus having the configuration shown in FIG. 10B, the inner peripheral edge of the doughnut-shaped upper die 50 is an outer peripheral cutter blade 50A that punches the outer peripheral side of the resin composite base material 25, and the tip of the internal punch 52 is made of resin. The inner peripheral cutter blade 52A for punching out the central portion of the composite base material 25 is formed.
The mother stamper 21 described above is installed on the upper surface side of the punch 48, and a pattern to be transferred is formed on the upper surface side. Further, in a state where the upper die 50 and the translucent pressing base 51 are raised, a resin composite base material 25 can be inserted between them and the punch 48.

  In this example, the irradiation device 53 includes a plurality of light emitting elements such as LEDs, and is configured to irradiate light having a specific wavelength such as ultraviolet rays downward. The translucent pressing base 51 is composed of a translucent member such as an acrylic board, and receives pressure at the time of pattern transfer and transmits light of a specific wavelength from the irradiation device 53 to reach the composite substrate 25 side. Have

FIG. 10B and FIG. 11 show different operating states as a half cross section with a dashed-dotted line drawn in the vertical direction on the center side of these drawings in the resin stamper manufacturing apparatus as a boundary. The upper die 50 and the translucent pressing base 51 are raised on the left side of the alternate long and short dash line, and the composite base material 25 is installed, and the upper die 50 and the translucent pressing base 51 are lowered on the right side of the alternate long and short dash line. In this state, the composite base material 25 is punched out.
As shown in the state shown in FIGS. 10B and 11, the composite base material 25 is sandwiched between the translucent pressing base 51 and the mother stamper 21, the pattern of the mother stamper 21 is transferred, and the composite base material 25 is punched out. The photocuring layer of the composite base material 25 can be cured by molding and further irradiating the irradiation device 53 with ultraviolet light. Thereafter, if the upper die 50 and the translucent pressing base 51 are raised, the resin stamper 30 having the pattern transferred by punching the composite base material 25 can be obtained.
Other functions and effects are the same as those of the resin stamper manufacturing apparatus of the above-described embodiment.

FIG. 12 is a diagram for explaining an example of a manufacturing method of a discrete track type magnetic recording medium in which fine irregularities are formed on a magnetic layer in the order of steps.
As shown in FIG. 12A, a magnetic recording medium material 83 having a structure in which a magnetic layer 81 and a protective film 82 are laminated on both upper and lower surfaces of a substrate 80 made of glass or the like is manufactured. Next, a resist layer 84 is laminated on the upper and lower surfaces of the magnetic recording medium material 83 by a method such as spin coating as shown in FIG. 12B, and the above resin is formed on the surface of the resist layer 84 by imprinting. By press-pressing using the stamper 30, as shown in FIG. 12C, the concavity and convexity portion 84a having a concentric shape in plan view is transferred and formed on the resist layer 84, for example. Then, when the resist layer 84, the protective film 82, and the magnetic layer 81 are sequentially processed by etching through the uneven portion 84a, the discrete having the uneven portion 81a formed on the magnetic layer 81 as shown in FIG. A track-type magnetic recording medium material can be obtained, and a discrete track-type magnetic recording medium 86 shown in FIG. 12E can be obtained by forming protective films 85 on both surfaces of the material.
By using the above-described resin stamper 30 when forming the fine irregularities 84a on the resist layer 84 as in this example, the exact concentric fine irregularities 84a can be formed as described above, and based on the fine irregularities 84a. The magnetic layer 81 can be divided into tracks by forming accurate concentric concave and convex portions 81a in the magnetic layer 81.
In the discrete track type magnetic recording medium shown in FIG. 12D, the protective film 85 may be flattened as necessary.
Moreover, the pressure in the case of performing the above-mentioned imprint can be 60 MPa or less as an example. This pressure can be calculated as compressive force / stamper area, in other words, by dividing the weight detected by the press device by the stamper area.

By the way, in the example described so far, the composite base material 25 has been described as a base material having a larger outer diameter than the resin stamper 30, but the composite base material 25 has an arbitrary shape with respect to the target resin stamper 30. It can be.
As shown in FIG. 13, the base material 55 may be formed in a disk shape in advance, and the resin stamper 55A may be formed by punching so as to form only a circular hole 55a at the center of the base material 55. As shown in FIG. 14, a resin stamper 56A may be formed by punching out both the outer peripheral portion 56b and the inner peripheral portion 56c from a doughnut-like base material 56 having a circular hole portion 56a at the center.
Of course, the hole 55a is not limited to a circle but may be a rectangle or a polygon.
Further, as shown in FIG. 15, a resin stamper 57A may be formed by punching out both the outer peripheral portion 57b and the inner peripheral portion 57c from a square base material 57 having a circular hole portion 57a at the center portion. As shown in FIG. 4, the outer periphery of the rectangular base material 58 (rectangular base material having a width on the short side smaller than the target resin stamper by several millimeters) having a circular hole 58a in the center is The resin stamper 58A may be formed by punching both the part 58b and the inner peripheral part 58c.
In the case of the resin stamper 58A obtained by punching out from the rectangular base material 58 formed by making the width of the short side smaller than the diameter of the target resin stamper by about several millimeters as in this example, the outer peripheral portion 58b is completely formed. Since the straight portion is included in a part of the outer peripheral portion 58b instead of the circular shape, it can be used as a check portion when the resin stamper 58A is chucked and held via the straight portion.
Next, as shown in FIG. 17, a base material 59 having a long tape shape and a plurality of circular hole portions 59 a formed at regular intervals is used. A plurality of resin stampers 59A may be formed by punching both the outer peripheral portion 59b and the inner peripheral portion 59c so as to surround the position. As shown in FIG. 16, by using a long tape-like base material 59, a plurality of resin stampers 59 </ b> A can be manufactured continuously from the base material 59.
In the case of the base material 59 having the structure shown in FIG. 17, slits and cut portions are formed between adjacent resin stampers 59A so that the resin stamper 59A formed on the base material 59 can be easily separated. You can keep it.

FIG. 18 is a view for explaining an example in which the resin stamper according to the present invention is applied to a pattern exposure method in a manufacturing process of a semiconductor device. As shown in FIG. Through holes 61 for guide pins of a positioning stepper for a semiconductor exposure apparatus are formed at four corners of a resin-like base material 60, and a target pattern 62 is first described on a part of the base material 60. The resin stamper 63 is formed by transfer transfer using the transfer technology from the master stamper 21.
In this example, for example, a resist layer made of an ultraviolet curable resin or the like is spin-coated on a semiconductor substrate 65 such as a Si wafer for forming a semiconductor device, and the resin stamper according to the present invention is applied when patterning the resist layer. be able to.
When a guide pin of a stepper of a semiconductor exposure apparatus is inserted into the through hole 61 of the base material 60 to form a plurality of patterns in an aligned state at a specified position on the surface of the target semiconductor substrate 65, the base material 60 is positioned. After the pattern 62 formed on the base material 60 is aligned with the target position on the semiconductor substrate 65, the pattern 62 is pressed against the resist layer on the semiconductor substrate 65 by using the method described above. The pattern portion 62a is formed by transferring the first pattern.

When the first pattern transfer is completed, the base material 60 is moved laterally to a specified position with respect to the semiconductor substrate 65 by using a positioning device such as a stepper of the semiconductor device, and the pattern is again formed at that position. The second pattern portion 62 a is formed by performing the second transfer using the second electrode 62. By repeating this operation as many times as necessary on the semiconductor substrate 65, a horizontal line of pattern portions 62a is formed as shown in FIG.
Thereafter, by sequentially performing pattern transfer as shown in FIGS. 18C and 18D, the pattern portion 62a can be transferred to all the resist layers in the target region of the semiconductor substrate 65.
By subjecting the semiconductor substrate 65 having the patterned resist layer to an etching process as a post process, a desired process can be performed on the semiconductor substrate.

  If the patterning process to the resist layer is a conventional general semiconductor manufacturing process, after the stepper of the semiconductor manufacturing apparatus positions the semiconductor substrate, the exposure process using the photomask is performed for each necessary section. In this way, a patterning process such as concavo-convex formation is performed by sequentially performing an exposure process and a developing process. However, a prescribed pattern portion 62a such as a concavo-convex pattern is formed on the resist layer by plate pressing using the resin stamper according to the present invention. As a result, the resist layer can be patterned at a lower cost than before. Thereby, cost reduction of the manufacturing process of a semiconductor device can be achieved.

19 to 22 are for explaining an embodiment in the case of using a base material provided with a resin that is cured by heat when the resin stamper according to the present invention is manufactured.
As the base material used in this embodiment, in the composite base material 25 used in the previous embodiment, the hard layer 25a and the soft resin layer 25b are used as they are, and the photocurable resin described above as the curable resin layer 25c is used. A thermosetting resin may be used.
For thermosetting resins, methyl (meth) acrylate, ethyl (meth) acrylate, (meth) acrylate-n-propyl, isopropyl (meth) acrylate, (meth) acrylate-n-butyl, (meth ) Isobutyl acrylate, (meth) acrylic acid-sec-butyl, (meth) acrylic acid hexyl, (meth) acrylic acid octyl, (meth) acrylic acid-2-ethylhexyl, (meth) acrylic acid decyl, (meth) acrylic Isobornyl acid, cyclohexyl (meth) acrylate, phenyl (meth) acrylate, benzyl (meth) acrylate, (meth) acrylate-2-hydroxyethyl, (meth) acrylate-2-hydroxypropyl, (meth) acryl Acid-3-hydroxypropyl, (meth) acrylic acid-2-hydroxybutyl, (meth) a Mono (meth) acrylates such as 2-hydroxyphenylethyl laurate, (meth) acrylamides such as N, N-dimethyl (meth) acrylamide, N, N-diethyl (meth) acrylamide, N-acryloylmorpholine, Ethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, trimethylolpropane di (meth) ) Multifunctional (meth) acrylates such as acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol penta (meth) acrylate, bisphenol A type epoxy resin, hydrogenated bisphenol A type Xy resin, brominated bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, alicyclic epoxy resin, N-glycidyl type epoxy resin, bisphenol A For epoxy resins such as novolac type epoxy resin, chelate type epoxy resin, glyoxal type epoxy resin, amino group-containing epoxy resin, rubber modified epoxy resin, dicyclopentadiene phenolic type epoxy resin, silicone modified epoxy resin, ε-caprolactone modified epoxy resin (Meth) acrylic resins such as (meth) acrylic acid to which (meth) acrylic acid is added, ethylene glycol monoallyl ether, allyl glycidyl ether, etc. Monoallyl esters such as ril ethers, allyl acetate and allyl benzoate, diallyl esters such as diallyl 1,4-cyclohexanedicarboxylate, diallyl phthalate, diallyl terephthalate and diallyl isophthalate, and oligoesters such as oligopropylene terephthalate Allyl resin such as allyl ester resin obtained by reacting allyl alcohol with diallylamine,
Monovinyl ethers such as n-propyl vinyl ether, isopropyl vinyl ether, n-butyl vinyl ether, isobutyl vinyl ether, 2-ethylhexyl vinyl ether, octadecyl vinyl ether, cyclohexyl vinyl ether, and monovinyl esters such as vinyl acetate, vinyl propionate, vinyl butyrate and vinyl benzoate , Divinyl esters such as divinyl adipate, N-vinyl amides such as N-vinyl pyrrolidone and N-methyl-N-vinyl acetamide, styrene, 2,4-dimethyl-α-methyl styrene, o-methyl styrene, m -Methylstyrene, p-methylstyrene, 2,4-dimethylstyrene, 2,5-dimethylstyrene, 2,6-dimethylstyrene, 3,4-dimethylstyrene, 3,5-dimethyl Styrene, 2,4,6-trimethylstyrene, 2,4,5-trimethylstyrene, pentamethylstyrene, o-ethylstyrene, m-ethylstyrene, p-ethylstyrene, o-chlorostyrene, m-chlorostyrene, p -Chlorostyrene, o-bromostyrene, m-bromostyrene, p-bromostyrene, o-methoxystyrene, m-methoxystyrene, p-methoxystyrene, o-hydroxystyrene, m-hydroxystyrene, p-hydroxystyrene, 2 -Vinylbiphenyl, 3-vinylbiphenyl, 4-vinylbiphenyl, 1-vinylnaphthalene, 2-vinylnaphthalene, 4-vinyl-p-terphenyl, 1-vinylanthracene, α-methylstyrene, o-isopropenyltoluene, m -Isopropenyltoluene, p-isopro Nirutoruen, 2, 3-dimethyl -α- methyl styrene, 3,5-dimethyl -α- methyl styrene, p- isopropyl -α- methyl styrene, alpha-ethyl styrene, styrene derivatives such as alpha-chlorostyrene, ethylene glycol di Divinyl ethers such as vinyl ether, 1,4-butanediol divinyl ether, 1,6-hexanediol divinyl ether, 1,9-nonanediol divinyl ether, cyclohexanedimethanol divinyl ether, diethylene glycol divinyl ether, triethylene glycol divinyl ether, Polyfunctional vinyl ethers such as trimethylolpropane trivinyl ether and pentaerythritol tetravinyl ether, and divinyl aryls such as divinylbenzene and divinylbiphenyl. Which vinyl resin,
Monooxetanyl compounds such as 3-ethyl-3-hydroxymethyloxetane and 3-ethyl-3-methacryloxymethyloxetane, Aron oxetane OXT-121 (trade name) , OX-SQ (trade name) manufactured by Toagosei Co., Ltd. Other functional oxetane resins such as OXTP (trade name) and OXBP (trade name) manufactured by Nippon Steel Chemical Co., Ltd., bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, brominated bisphenol A Type epoxy resin, bisphenol F type epoxy resin, novolak type epoxy resin, phenol novolak type epoxy resin, cresol novolac type epoxy resin, N-glycidyl type epoxy resin, bisphenol A novolak type epoxy resin, chelate type epoxy resin, glyoxal type epoxide Resins, amino group-containing epoxy resins, rubber-modified epoxy resins, dicyclopentadiene phenolic epoxy resins, silicone-modified epoxy resins, ε-caprolactone-modified epoxy resins, alicyclic epoxy resins, and other epoxy resins, polyimide precursors An acid or the like can be applied.

The resin stamper manufacturing apparatus used in this embodiment is configured as an apparatus for transferring and stamping the pattern of the mother stamper 21 onto a base material 70 having a thermosetting curable resin layer.
As in the previous example, sliding support members 16 and 17 are provided, and a mother stamper 21 is installed on the upper side thereof, and a cooling plate is provided below the mother stamper 21 and between the sliding support members 16 and 17. 73 is provided, and an inner peripheral cutter portion 76 including an inner peripheral cutter blade 75 for punching out only the central portion of the base material 70 is provided on the upper side of the mother stamper 21, and is provided in the previous form. The outer peripheral cutter portion is omitted.
Moreover, in this form, the heating board 77 for guiding the inner peripheral cutter part 76 is provided instead of the 1st mounting board 1 provided in the previous form, This heating board 77 and inner periphery are provided. Both of the cutter portions 76 are provided so as to be movable up and down, and are configured to be able to approach and separate from the mother stamper 21. The previous heating panel 77 has a built-in heater, and is configured so that the temperature of the heating panel 77 can be controlled according to whether or not the heater is energized or according to the energization amount.

In the apparatus of this embodiment, in order to transfer the pattern of the mother stamper 21 to the base material 70 and punch out the base material 70, the base plate 70 is moved away from the mother stamper 21 by raising the heating plate 77. The base material 70 is sandwiched between 77 and the mother stamper 21, and the base material 70 is pressed against the mother stamper 21 through the heating plate 77 as shown in FIG.
By this operation, the pattern of the mother stamper 21 is transferred to the substrate 70, and the pattern is fixed by thermosetting the substrate 70.
Thereafter, energization of the heater of the heating plate 77 is stopped, the temperature of the base material 70 is lowered, and the temperature of the base material 70 is lowered to the temperature below the glass transition temperature (Tg) of the resin constituting the base material 70 by the cooling plate 73. After the lowering, the inner cutter blade 75 is lowered as shown in FIG. The glass transition temperature (Tg) used in the present invention can be measured by, for example, a method described in JIS K7121 using a differential scanning calorimeter.

  After the punching process, the base material 70 can be taken out by raising the inner cutter blade 75 and the heating plate 77 as shown in FIG. After taking out the base material 70, the heater of the heating panel 77 is energized again, and then the alternative unprocessed base material 70 is set on the mother stamper 21, and the process returns to the process shown in FIG. By passing, the pattern transfer and punching of the base material 70 can be repeatedly performed.

23A to 23C show, as a second example of the composite base material described above, a curable resin on a part of a base material 90 of a film or sheet of a thermoplastic resin or a cured product of a thermosetting resin. It is a figure for illustrating the imprint method using the composite base material 91 obtained by apply | coating or printing in liquid form.
As shown in FIG. 23 (A), a composite base material 91 is a base having a long strip shape like a film for a movie, and a plurality of slit-like holes 92 for positioning at predetermined intervals on both ends in the width direction. A rectangular curable liquid resin layer 93 is intermittently formed in the length direction of the base material 90 on the center side of the base material 90 by a printing method such as screen printing or gravure printing. . In addition, although this printing illustrated the case where it formed intermittently in the length direction, you may print on the whole surface. Then, the mother stamper is pressed using the resin stamper manufacturing apparatus described in the previous embodiment, and the process of curing the liquid resin by irradiating the energy rays is performed. A pattern portion 94 similar to that shown in FIG. Thereafter, it is possible to state that shown in FIG. 23 (C) by forming a saw hole-shaped stamped portion 95 of the central portion of the pattern portion 94, if necessary after this, finally purposes It is possible to obtain a donut disk-shaped product by punching into a disk shape using a dedicated punching device.

FIGS. 24A to 24C show a second modification of the composite base material described above, in which a part of the base material 100 of a film or sheet of a thermoplastic resin or a cured product of a thermosetting resin is cured. It is a figure for exemplifying the composite base material 101 obtained by apply | coating or printing resin in liquid form, and the imprint method using the same.
As shown in FIG. 24 (A), the composite base material 101 is a long strip like a film for a movie, and has a plurality of slit-like holes 102 for positioning at predetermined intervals on both ends in the width direction. A rectangular curable liquid resin layer 103 is intermittently formed in the length direction of the base material 100 on the center side of the base material 100 by a printing method such as screen printing. In addition, although this printing illustrated the case where it formed intermittently in the length direction, you may print on the whole surface. Then, using the resin stamper manufacturing apparatus described in the previous embodiment, the mother stamper is pressed, and the energy resin is irradiated to cure the liquid resin, which is formed in the previous form as shown in FIG. A pattern portion 104 similar to the pattern or uneven portion thus formed is transferred and formed. Thereafter, if necessary, a punching process can be performed in a disc shape. Separately from this, the punched portion 105 is formed only in the central portion of the pattern portion 104 to obtain the state shown in FIG. 24C, and is finally punched and formed into a target disk shape. it can. In addition, it is preferable from the viewpoint of production efficiency that the transfer formation of the pattern portion 104 and the formation of the punching processing portion 105 are integrally performed by the same apparatus using, for example, the method described in FIGS.
In addition, in the method demonstrated based on these FIG. 23, FIG. 24, it carries out by using the polyethylene terephthalate (PET) film which gave the easy-adhesion process to the single side | surface as the base materials 90 and 100, and making the thickness 5-188 micrometers. You can also.

FIGS. 25A to 25C show another example of the case where the above-described composite base material is used, and a part of the base material 110 of a film or sheet of a cured product of a thermoplastic resin or a thermosetting resin is curable. It is a figure for exemplifying the composite base material 111 obtained by apply | coating or printing this resin in liquid form, and the imprint method using the same.
As shown in FIG. 25 (A), the composite substrate 111 has a long strip shape like a film for a movie, and is provided with a plurality of slit-shaped holes 112 for positioning at predetermined intervals on both ends in the width direction. A rectangular curable liquid resin layer 113 is intermittently formed in the length direction of the base material 110 on the center side of the base material 110 by a printing method such as screen printing. In addition, although this printing illustrated the case where it formed intermittently in the length direction, you may print on the whole surface. Next, as shown in FIG. 25B, a punched portion 116 is formed at the center of the pattern portion to be formed, and then the mother stamper is used by using the resin stamper manufacturing apparatus described in the previous embodiment. The pattern portion 115 similar to the pattern or the concavo-convex portion formed in the previous form is transferred and formed as shown in FIG. Can be punched into a disk shape.
As shown in this example, after the punching portion 116 is formed first, alignment with the mother stamper is performed using the punching portion 116, and then the mother stamper is pressed and irradiated with energy rays to form a liquid. By performing the imprint process for curing the resin, the pattern formation position can be accurately positioned.
Note that it is preferable in terms of production efficiency that the formation of the punching portion 116 and the formation of the pattern portion 115 are integrally performed by the same apparatus.

FIGS. 26A to 26C show another example of the case where the above-described composite base material is used, and a part of the base material 120 of a film or sheet of a cured product of a thermoplastic resin or a thermosetting resin is curable. It is a figure for illustrating the imprint method using the composite base material 121 obtained by apply | coating or printing this resin in liquid form.
As shown in FIG. 26 (A), the composite substrate 121 is a long strip like a film for a movie, and includes a plurality of slit-like holes 122 for positioning at predetermined intervals on both ends in the width direction. A punching portion 126 is first formed in the center of the pattern portion to be formed on the material 120 as shown in FIG. 26 (A) or (B), and then shown in FIG. 26 (B) or (C). In this way, the required number of rectangular curable liquid resin layers 123 are formed intermittently in the length direction of the base material 120 by a printing method such as screen printing on the center side of the base material 120 to form the composite base material 121. . In addition, although this printing illustrated the case where it formed intermittently in the length direction, you may print on the whole surface. Then, an imprint method is performed in which the mother stamper is pressed using the resin stamper manufacturing apparatus described in the previous embodiment, and the liquid resin is cured by irradiating the energy ray. As shown in FIG. 26C, a pattern portion 125 similar to the concavo-convex portion is transferred and formed, and if necessary, the final product shape can be punched.
As shown in this example, after the punching portion 126 is formed first, alignment with the mother stamper is performed using this punching portion 126, and then the mother stamper is pressed and irradiated with energy rays to form a liquid. By performing the imprint process for curing the resin, the pattern formation position can be accurately positioned.

<Preparation of laminated film>
Add 100 g of phenol novolac epoxy acrylate solution KAYARAD PNA-170H (trade name, manufactured by Nippon Kayaku Co., Ltd.) with 2.0 g of photo radical polymerization initiator Irgacure 184 (trade name, Ciba Specialty Chemicals Co., Ltd.) and mix well. And after apply | coating on the hard film shown in Table 1, it dried for 60 minutes in 80 degreeC hot-air oven, and produced laminated | multilayer film AE. Table 1 shows the configuration of the film AE.

<Production of resin stamper>
The mother stamper 21 is set in the apparatus shown in FIG. 10 and FIG. 11 with the pattern surface facing up, and the laminated film AE produced as described above is cut with a width of 70 mm and set with the epoxy acrylate solution coating surface facing down. did.
After tightening the mold and pressing the mother stamper 21 against the laminated film at a pressure of 30 MPa for 10 seconds, the illuminance of the irradiation device 11 (LED lamp with a wavelength of 365 nm) is adjusted to 15 mW / cm ² and UV light is applied with pressure applied. Was irradiated for 10 seconds. After UV irradiation was stopped and a circular hole with a diameter of 12 mm was formed in the center of the pattern with the inner cutter blade 52A, and the outer shape was punched into a circular shape with the outer cutter blade 50A, the upper die set 54 was raised. The mold was opened and the sample was taken out to produce resin stampers A1-E1.
Regarding the obtained resin stamper A1-E1, Table 2 shows the results of measuring the pattern transfer rate using a laser microscope, and measuring the deviation from the pattern center and the roundness of the inner perforated portion using a measurement microscope. . As shown in Table 2, it is clear that punching with high accuracy can be performed.
The pattern transfer rate shown in Table 2 refers to (number of locations that were transferred as designed) / (number of observed locations) by observing the pattern at 100 randomly extracted locations. The pattern transfer rate shown in Table 3 described later is also the same.
The roundness is a value obtained by measuring the diameter of the punched portion at five locations at intervals of about 72 ° and calculating the difference between the maximum value and the minimum value.

  The cutter blades 50A and 52A of the apparatus shown in FIG. 10 and FIG. 11 used stainless steel blade tips and the size of the translucent pressing base 51 (made of tempered glass having a width, a depth of 100 mm, and a thickness of 40 mm). The mother stamper 21 is formed by forming a concentric pattern with an uneven height of 80 nm, a protruding portion width of 120 nm, and a recessed portion width of 80 nm on the surface of a Ni electroformed donut board having a thickness of 0.3 mm, an inner diameter of 16 mm, and an outer diameter of 63.5 mm. Was used.

<Preparation of HD substrate with resist film>
A vacuum chamber in which a cleaned glass substrate for HD (hard disk) (manufactured by OHARA INC., Outer diameter 1.89 inches) was set was evacuated to 1.0 × 10 ⁻⁵ Pa or less in advance.
Further, a 65Fe-25Co-10B (at%) layer is formed on the substrate without heating to 50 nm, Ru is 0.8 nm, and then a 65Fe-25Co-10B (at%) layer is formed to a thickness of 50 nm to form a soft magnetic backing layer. did.
Next, an alignment control film made of Ru was formed to 20 nm, an oxide granular recording layer made of 65Co-10Cr-15Pt-10SiO ₂ (mol%) was formed to 12 nm, and a protective film made of carbon was formed to 4 nm.
Next, the medium (HD substrate) formed up to the protective film is taken out from the vacuum chamber, and a resist (PAK-01-60: trade name, manufactured by Toyo Gosei Co., Ltd.) is spun off on the surface using a spin coater. Application was at 2000 rpm. After coating, it was dried on a hot plate at about 80 ° C. for 3 minutes. When the film thickness of the resist was measured with a reflection / transmission film thickness meter, it was about 80 nm.

<Imprint of resist film on HD substrate using resin stamper>
To the die set (with guide pins) of the nanoimprint apparatus ST-200 manufactured by Toshiba Machine Co., Ltd., the HD substrate (on the resist surface) prepared in the previous example and the resin stamper (under the pattern surface) prepared in the previous example They were set in order and set at a predetermined position of the nanoimprint apparatus.
After pressing for 10 seconds at a pressing force of 0.6 MPa, ultraviolet light with an illuminance of 15 mW / cm ² was irradiated with an LED lamp having a wavelength of 365 nm without changing the pressing force, the mold was opened, and the HD substrate was taken out.
The resin stamper was peeled off from the taken-out HD substrate, the pattern transfer rate was measured with a laser microscope, and the shift of the pattern from the center of the HD substrate was measured with a measuring microscope. The center of the HD substrate was determined as a point equidistant from five points at intervals of about 72 ° on the hole of the HD substrate using a measuring microscope. Similarly, the center of the pattern was determined as a point equidistant from five points at intervals of about 72 ° on the innermost circumference of a concentric circle. The distance between the center of the HD substrate thus obtained and the center of the pattern was measured as a pattern deviation.
The results are shown in Table 3. As shown in Table 3, it was found that a pattern can be transferred with a good pattern transfer rate by performing an imprint method on a resist film on an HD substrate using a resin stamper manufactured by the method and apparatus of the present invention. did.

<Reprint imprint test of resist film on HD substrate using resin stamper>
100 resin stampers C1 were produced as resin stampers. Using this resin stamper, UV imprinting on the HD substrate was performed 100 times in the same manner as in the previous example while replacing with a new resin stamper each time, and dust was caught using a surface inspection device, and defects due to scratches were observed. However, the defect rate was 1/100 sheets.

<Example when using a film with low UV transmittance>
A resin stamper was prepared using Kapton 500H (polyimide film trade name, manufactured by Toray DuPont Co., Ltd., thickness 125 μm, tensile elastic modulus 3.4 GPa, ultraviolet transmittance <30%) as a hard film, as in the previous example. Similarly, when UV imprinting on the HD substrate was performed, the transfer rate to the HD substrate was <10%.

<Example of using a film with small tensile elongation>
Meisei Chemical Industry Co., Ltd. UCE-5 10g, Japan Epoxy Resin Co., Ltd. Epicoat YX8000 1.4g, Shikoku Kasei Kogyo Co., Ltd. Curesol 1B2PZ
0.05 g was added and mixed, cast on a polyethylene terephthalate film, heated at 80 ° C. , 60 minutes, 120 ° C. and 180 minutes, and the polyethylene terephthalate film was peeled off to produce a thermosetting resin film F. The film F had a tensile modulus of 3.0 MPa, a tensile elongation of 2%, and a UV transmittance of 30% or more.

A resin stamper was produced in the same manner as in the previous example except that the above-described thermosetting resin film F was used as the hard film, and a crack was generated in the resin stamper.
<Example when using a film with low tensile modulus>
When a resin stamper was produced in the same manner as in the previous example except that a polyethylene film (thickness: 100 μm, tensile modulus: 1.0 Gpa) was used as the hard film, the roundness was 60 μm or more.

<Example using Ni stamper>
Using a washed HD glass substrate (made by OHARA INC., Outer diameter 1.89 inches) that can transmit ultraviolet light instead of the HD medium described above, as a stamper, the same as that prepared in the previous example 100 sheets of Ni electroforming stamper having a pattern of (thickness of 0.3 mm, inner diameter of 12 mm, outer diameter of 63.5 mm), except that the stamper was not replaced, and 100 sheets UV imprinting was performed on the resist film on the HD medium. At this time, the defect rate was 52/100.
This indicates that, as a result of the occurrence of defects due to the inclusion of dust or the like during the production, a large number of defective products were produced in the samples produced by the imprint method thereafter.

Sectional drawing which shows 1st Embodiment of the manufacturing apparatus of the resin stampers which concerns on this invention. Sectional drawing which shows the state which pressed the mother stamper to the resin-made base materials in the manufacturing apparatus of the said 1st Embodiment. The bottom view of the translucent press base | substrate applied to the manufacturing apparatus of the said 1st Embodiment. The top view of the mother stamper part applied to the manufacturing apparatus of the said 1st Embodiment. Sectional drawing of the resin-made base materials punched by the manufacturing apparatus of the said 1st Embodiment. Sectional drawing which shows the state which stamped out the resin-made base materials with the manufacturing apparatus of the said 1st Embodiment. Sectional drawing which shows the state after stamping out the resin-made base materials with the manufacturing apparatus of the said 1st Embodiment. Sectional drawing which shows the state which takes out the resin stampers punched out by the manufacturing apparatus of the said 1st Embodiment. Sectional drawing which shows the state which set another resin-made base material in the manufacturing apparatus of the 1st Embodiment again. The block diagram which shows an example of the apparatus which unitized the manufacturing apparatus of the resin stamper which concerns on this invention. The fragmentary sectional view of the manufacturing apparatus shown in FIG. Process explanatory drawing of an example of the manufacturing method of the discrete track | truck type | mold magnetic recording medium formed by forming fine unevenness | corrugation in a magnetic layer. The top view which shows the 2nd example of the base material used in this invention. The top view which shows the 3rd example of the base material used in this invention. The top view which shows the 4th example of the base material used in this invention. The top view which shows the 5th example of the base material used in this invention. The top view which shows the 6th example of the base material used in this invention. Explanatory drawing which shows the example which applied this invention method to the patterning of the semiconductor substrate for semiconductor device manufacture. The figure which shows the apparatus structure in the case of using the base material of a thermosetting resin in the manufacturing apparatus of the resin stamper of this invention. Explanatory drawing which shows the state which pressed the base material against the mother stamper in the same apparatus. Explanatory drawing which shows the process of punching a base material in the apparatus. Explanatory drawing which shows the state which takes out the resin stamper in the same apparatus. Explanatory drawing which shows the 1st example shown about the imprint method at the time of applying this invention to a elongate film-like base material. Explanatory drawing which shows the 2nd example shown about the imprint method at the time of applying this invention to a elongate film-like base material. Explanatory drawing which shows a 3rd example about the imprint method at the time of applying this invention to a elongate film-like base material. Explanatory drawing which shows a 4th example about the imprint method at the time of applying this invention to a elongate film-like base material.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... 1st mounting board, 3 ... 2nd mounting board, 6 ... Cutter set member, 7 ... Outer peripheral cutter part, 7A ... Outer peripheral cutter blade, 8 ... Inner peripheral cutter part, 8A ... Inner peripheral cutter blade, 9 ... Peripheral cutter part, 10 ... Light source support part, 11 ... Irradiation device, 15 ... Translucent pressing base, 16, 17 ... Sliding support member, 18 ... Receiving part, 20 ... Elastic member, 21 ... Mother stamper, 25 ... Composite base 25a ... hard adhesive layer, 25b ... soft adhesive layer, 25c ... photocurable resin layer, 48 ... punch (sliding support member), 50 ... upper die (outer cutter part), 50A ... outer cutter blade , 51 ... Translucent pressing base, 52 ... Internal punch (inner peripheral cutter part), 52A ... Inner peripheral cutter blade, 53 ... Irradiation device, 55, 56, 57, 58, 59, 60, 70 ... Base material, 71 ... Mother stamper, 75 ... Inner cutter blade 76 ... Inner peripheral cutter part, 77 ... Heating board, 90, 100, 110, 120 ... Base material, 91, 101, 111, 121 ... Composite base material, 93, 105, 115, 125 ... Pattern part, 95, 106, 116, 126 ... punching section,

Claims (14)

A composite substrate is formed by forming at least one curable resin layer on a resin substrate, and then the curable resin of the composite substrate is applied to a mother stamper having a pattern formed on the surface. A step (1) of pressing the resin layer side to compress and molding the mother stamper pattern onto the composite substrate; and a step of curing a part of the composite substrate by irradiating with active energy rays or heating. (2), and, have a step (3) for punching said substrate and / or composite base material,
After punching the base material or the composite base material so as to form a punched portion inside the pattern forming portion, the mother stamper and the composite base material are aligned using the punched portion. Then, the composite base material is pressed against the mother stamper and compression-molded, and the pattern of the mother stamper is transferred to the composite base material (1), and a part of the composite base material is cured ( 2) A method for manufacturing a resin stamper,   The curable resin is an active energy ray curable resin, and the step (2) is a step of irradiating an active energy ray to cure a part of the composite base material. The manufacturing method of the resin stamper of description. In the step (3), the production method of the resin stamper as claimed in claim 1 or 2, wherein said punching the composite base material to form a peripheral edge on the outside of the front Symbol pattern forming portion. Claim 1-3, wherein the substrate is characterized in that it is a film or sheet of the cured product of the thermoplastic resin or thermosetting resin having a compression molded at the substrate temperature higher glass transition temperature than (Tg) The manufacturing method of the resin stamper in any one of. Applying or printing the curable resin in a liquid state on a film or sheet of the thermoplastic resin or a cured product of the thermosetting resin to obtain a composite base material, and applying the composite base material to the mother stamper A step of pressing and compressing and transferring the pattern of the mother stamper to the composite substrate; a step of irradiating an active energy ray to cure a part of the composite substrate; and the composite substrate in the course of the curing or 5. The method for manufacturing a resin stamper according to claim 4 , wherein the subsequent punching process is continuously performed in this order. Applying or printing a curable resin in liquid form on a film or sheet of a thermoplastic resin or a cured product of a thermosetting resin having a glass transition temperature (Tg) higher than the substrate temperature at the time of compression molding. A method for producing a resin stamper according to any one of claims 1 to 5, wherein the resin stamper is a composite base material obtained as described above. A step of obtaining a composite base material by applying or printing the curable resin in a liquid state on a film or sheet of the thermoplastic resin or a cured product of the thermosetting resin, and a punched portion inside the pattern forming portion Punching the composite base material so as to form, and after aligning with the mother stamper using the punched portion, the composite base material is pressed against the mother stamper and compression molded, 7. The resin stamper according to claim 6 , wherein the step of transferring the pattern of the mother stamper to the composite base material and the step of curing a part of the composite base material are successively performed in this order. Method. A composite base material having at least one curable resin layer is pressed against a mother stamper having a pattern formed on the surface thereof, and compression molding is performed. The pattern of the mother stamper is transferred to the composite base material. And an apparatus for producing a resin stamper by punching the composite base material,
A cutter member is provided movably with respect to the mother stamper, and an irradiation device and a translucent pressing base for irradiating light on the front side of the cutter member are installed in the vicinity of the cutter member
The composite base material is freely inserted between the mother stamper and the cutter member, and the composite base material disposed between the cutter member and the mother stamper is used as the translucent pressing base and the mother stamper. The desired pattern on the mother stamper side is transferred to the composite base material, and the composite base material is irradiated with light from the irradiation device to cure the curable resin layer, and An apparatus for manufacturing a resin stamper, wherein the composite member is punched by the cutter member before and after curing of the curable resin layer or simultaneously with the curing of the curable resin layer. . A composite base material having at least one curable resin layer is pressed against a mother stamper having a pattern formed on the surface thereof, and compression molding is performed. The pattern of the mother stamper is transferred to the composite base material. And an apparatus for producing a resin stamper by punching the composite base material,
A cutter member is provided movably with respect to the mother stamper, a heating member is provided in the vicinity of the cutter member, and a pressing base is installed between the outer cutter unit and the inner cutter unit,
The composite base material is freely inserted between the mother stamper and the cutter member,
The composite base material disposed between the cutter member and the mother stamper is sandwiched between the pressing base and the mother stamper, a desired pattern on the mother stamper side is transferred to the composite base material, and the heating device So that the layer of the curable resin can be cured by heat from, and the composite base material is cured by the cutter member before and after the curing of the layer of the curable resin or the curing of the layer of the curable resin. An apparatus for manufacturing a resin stamper, characterized in that it is configured to be stamped freely at the same time. The said cutter member is equipped with the inner peripheral cutter part which has an inner peripheral cutter blade which punches out the center part of the said resin composite base material, The manufacturing apparatus of the resin stamper of Claim 8 or 9 characterized by the above-mentioned. The said cutter member is made into the structure which comprises the outer periphery cutter part which has an outer periphery cutter blade, and the inner periphery cutter part which has the inner periphery cutter blade arrange | positioned inside this outer periphery cutter part, It is characterized by the above-mentioned. The apparatus for producing a resin stamper according to 8 or 9 . To any one of claims 8-11, characterized by comprising sliding support member is provided for guiding the cutter blade punched the composite base material with the positioning of the mother stamper around the mother stamper The manufacturing apparatus of the resin stamper of description. Using the resin stamper by the manufacturing method according to any one of claims 1 to 5 with respect to the thin film formed on a substrate, or, the relative thin film formed on the mask layer formed on the substrate An imprinting method comprising imprinting by pressing a resin stamper pattern. As a substrate according to claim 1 3, or a magnetic film applied to a magnetic recording medium having on a substrate, by using a pattern formed on the thin film to remove a portion of the magnetic layer, or a non-magnetic An imprint method characterized by comprising:

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