JP2007165366A - 基板処理装置および基板処理方法 - Google Patents
基板処理装置および基板処理方法 Download PDFInfo
- Publication number
- JP2007165366A JP2007165366A JP2005355944A JP2005355944A JP2007165366A JP 2007165366 A JP2007165366 A JP 2007165366A JP 2005355944 A JP2005355944 A JP 2005355944A JP 2005355944 A JP2005355944 A JP 2005355944A JP 2007165366 A JP2007165366 A JP 2007165366A
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- Prior art keywords
- substrate
- processing
- coating
- contact angle
- processing liquid
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- 239000000758 substrate Substances 0.000 title claims abstract description 360
- 238000012545 processing Methods 0.000 title claims abstract description 297
- 238000000034 method Methods 0.000 title claims description 45
- 239000007788 liquid Substances 0.000 claims abstract description 202
- 238000005530 etching Methods 0.000 claims abstract description 118
- 230000007246 mechanism Effects 0.000 claims abstract description 59
- 238000003672 processing method Methods 0.000 claims abstract description 46
- 238000004140 cleaning Methods 0.000 claims abstract description 29
- 238000000576 coating method Methods 0.000 claims description 134
- 239000011248 coating agent Substances 0.000 claims description 123
- 230000002093 peripheral effect Effects 0.000 claims description 44
- 230000008569 process Effects 0.000 claims description 37
- 238000011282 treatment Methods 0.000 claims description 15
- 238000005259 measurement Methods 0.000 claims description 12
- 238000003860 storage Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000000126 substance Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- 239000002365 multiple layer Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005355944A JP2007165366A (ja) | 2005-12-09 | 2005-12-09 | 基板処理装置および基板処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005355944A JP2007165366A (ja) | 2005-12-09 | 2005-12-09 | 基板処理装置および基板処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007165366A true JP2007165366A (ja) | 2007-06-28 |
| JP2007165366A5 JP2007165366A5 (https=) | 2007-12-06 |
Family
ID=38247987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005355944A Withdrawn JP2007165366A (ja) | 2005-12-09 | 2005-12-09 | 基板処理装置および基板処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007165366A (https=) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130220382A1 (en) * | 2012-02-24 | 2013-08-29 | Ebara Corporation | Substrate processing method |
| KR20150134279A (ko) * | 2014-05-21 | 2015-12-01 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 방법 및 기판 처리 장치 |
| CN110140197A (zh) * | 2017-01-23 | 2019-08-16 | 信越半导体株式会社 | 半导体晶圆的洗净方法 |
| CN115376963A (zh) * | 2021-05-17 | 2022-11-22 | 细美事有限公司 | 基板处理设备和基板传送机器人 |
| WO2023017691A1 (ja) * | 2021-08-12 | 2023-02-16 | 株式会社Sumco | 半導体ウェーハの洗浄方法及び半導体ウェーハの製造方法 |
-
2005
- 2005-12-09 JP JP2005355944A patent/JP2007165366A/ja not_active Withdrawn
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013201418A (ja) * | 2012-02-24 | 2013-10-03 | Ebara Corp | 基板処理方法 |
| TWI560766B (en) * | 2012-02-24 | 2016-12-01 | Ebara Corp | Substrate processing method |
| US20130220382A1 (en) * | 2012-02-24 | 2013-08-29 | Ebara Corporation | Substrate processing method |
| KR20150134279A (ko) * | 2014-05-21 | 2015-12-01 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 방법 및 기판 처리 장치 |
| KR102369452B1 (ko) | 2014-05-21 | 2022-03-02 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 방법 및 기판 처리 장치 |
| CN110140197B (zh) * | 2017-01-23 | 2023-04-28 | 信越半导体株式会社 | 半导体晶圆的洗净方法 |
| CN110140197A (zh) * | 2017-01-23 | 2019-08-16 | 信越半导体株式会社 | 半导体晶圆的洗净方法 |
| CN115376963A (zh) * | 2021-05-17 | 2022-11-22 | 细美事有限公司 | 基板处理设备和基板传送机器人 |
| US12417934B2 (en) | 2021-05-17 | 2025-09-16 | Semes Co., Ltd. | Substrate treating apparatus and substrate transfer robot |
| WO2023017691A1 (ja) * | 2021-08-12 | 2023-02-16 | 株式会社Sumco | 半導体ウェーハの洗浄方法及び半導体ウェーハの製造方法 |
| KR20230162113A (ko) * | 2021-08-12 | 2023-11-28 | 가부시키가이샤 사무코 | 반도체 웨이퍼의 세정 방법 및 반도체 웨이퍼의 제조 방법 |
| TWI825859B (zh) * | 2021-08-12 | 2023-12-11 | 日商Ｓｕｍｃｏ股份有限公司 | 半導體晶圓的洗淨方法及半導體晶圓的製造方法 |
| JP7563329B2 (ja) | 2021-08-12 | 2024-10-08 | 株式会社Sumco | 半導体ウェーハの洗浄方法及び半導体ウェーハの製造方法 |
| KR102754675B1 (ko) | 2021-08-12 | 2025-01-13 | 가부시키가이샤 사무코 | 반도체 웨이퍼의 세정 방법 및 반도체 웨이퍼의 제조 방법 |
| US12532686B2 (en) | 2021-08-12 | 2026-01-20 | Sumco Corporation | Method of cleaning semiconductor wafer and method of manufacturing semiconductor wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071024 |
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| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20071024 |
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| A977 | Report on retrieval |
Effective date: 20080331 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
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| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20090812 |