JP2007165366A5 - - Google Patents
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- Publication number
- JP2007165366A5 JP2007165366A5 JP2005355944A JP2005355944A JP2007165366A5 JP 2007165366 A5 JP2007165366 A5 JP 2007165366A5 JP 2005355944 A JP2005355944 A JP 2005355944A JP 2005355944 A JP2005355944 A JP 2005355944A JP 2007165366 A5 JP2007165366 A5 JP 2007165366A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- coating
- processing
- processing liquid
- contact angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims 37
- 239000007788 liquid Substances 0.000 claims 22
- 239000011248 coating agent Substances 0.000 claims 21
- 238000000576 coating method Methods 0.000 claims 21
- 238000003672 processing method Methods 0.000 claims 11
- 230000002093 peripheral effect Effects 0.000 claims 3
- 238000005530 etching Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005355944A JP2007165366A (ja) | 2005-12-09 | 2005-12-09 | 基板処理装置および基板処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005355944A JP2007165366A (ja) | 2005-12-09 | 2005-12-09 | 基板処理装置および基板処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007165366A JP2007165366A (ja) | 2007-06-28 |
| JP2007165366A5 true JP2007165366A5 (https=) | 2007-12-06 |
Family
ID=38247987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005355944A Withdrawn JP2007165366A (ja) | 2005-12-09 | 2005-12-09 | 基板処理装置および基板処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007165366A (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013201418A (ja) * | 2012-02-24 | 2013-10-03 | Ebara Corp | 基板処理方法 |
| JP6363876B2 (ja) * | 2014-05-21 | 2018-07-25 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| JP6575538B2 (ja) * | 2017-01-23 | 2019-09-18 | 信越半導体株式会社 | 半導体ウェーハの洗浄方法 |
| KR102553643B1 (ko) | 2021-05-17 | 2023-07-13 | 세메스 주식회사 | 기판 처리 장치 및 기판 반송로봇 |
| JP7563329B2 (ja) * | 2021-08-12 | 2024-10-08 | 株式会社Sumco | 半導体ウェーハの洗浄方法及び半導体ウェーハの製造方法 |
-
2005
- 2005-12-09 JP JP2005355944A patent/JP2007165366A/ja not_active Withdrawn
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