JP2007163137A - Foreign matter inspection device and foreign matter inspection method - Google Patents

Foreign matter inspection device and foreign matter inspection method Download PDF

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JP2007163137A
JP2007163137A JP2005355603A JP2005355603A JP2007163137A JP 2007163137 A JP2007163137 A JP 2007163137A JP 2005355603 A JP2005355603 A JP 2005355603A JP 2005355603 A JP2005355603 A JP 2005355603A JP 2007163137 A JP2007163137 A JP 2007163137A
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light
shielding film
light shielding
foreign matter
inspection
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JP4626764B2 (en
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Hideaki Kataho
秀明 片保
Noboru Kato
昇 加藤
Yuichi Shimoda
勇一 下田
Takashi Ishii
隆嗣 石井
Ryoichi Shinozaki
良一 篠崎
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Hitachi High Tech Corp
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Hitachi High Tech Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To determine whether or not foreign matter exists in an object under inspection and at what position foreign matter exists, if any. <P>SOLUTION: A first inspection beam FL1 from a first light source 11 is caused to enter a surface 82S of a shading film 82 obliquely from above the object 80 under inspection with the shading film 82 formed on a front surface 81S of a transparent substrate 81, and its reflected light is received by a first photo-detector 21. Further, a second inspection beam FL2 from a second light source 12 is caused to enter a rear surface 82R of the shading film 82 obliquely from below the object 80, and its reflected light is received by a second photo-detector 22. Based on a combination of cases where scattered light is received or not by the first photo-detector 21 and/or the second photo-detector 22, it is determined whether or not foreign matter FS is deposited on the object 80, and at what position foreign matter is deposited, if any. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、基体表面に遮光膜が形成された被検査体に付着した異物を検査する異物検査装置及び異物検査方法に関するものである。   The present invention relates to a foreign matter inspection apparatus and a foreign matter inspection method for inspecting foreign matter attached to an inspection object having a light shielding film formed on a substrate surface.

液晶ディスプレイは、カラーフィルタが形成されたガラス基板であるカラーフィルタ基板とTFT(Thin Film Transistor)アレイが形成されたガラス基板であるTFTアレイ基板との間に液晶を封入して構成される。ガラス基板上にTFTアレイを形成するために、ガラス基板上に電極用の金属膜を形成し、この金属膜の上に感光剤であるレジスト膜を塗布する。そして、所定のパターン(回路パターン)を有するマスク基板を微小な間隔をもってレジスト膜に対向させて、紫外線等の光をマスク基板の上方から照射して、レジスト膜に回路パターンを転写する。そして、パターンが転写されていない部分のレジスト膜を除去し、エッチングを行った後に、感光剤を取り除くことにより、回路パターンが形成されたTFTアレイ基板を得ることができる。   The liquid crystal display is configured by sealing liquid crystal between a color filter substrate which is a glass substrate on which a color filter is formed and a TFT array substrate which is a glass substrate on which a TFT (Thin Film Transistor) array is formed. In order to form a TFT array on a glass substrate, a metal film for an electrode is formed on the glass substrate, and a resist film as a photosensitive agent is applied on the metal film. Then, a mask substrate having a predetermined pattern (circuit pattern) is opposed to the resist film with a minute interval, and light such as ultraviolet rays is irradiated from above the mask substrate to transfer the circuit pattern to the resist film. Then, after removing the resist film in the portion where the pattern is not transferred and performing etching, the photosensitive agent is removed, whereby a TFT array substrate on which a circuit pattern is formed can be obtained.

ところで、上述したマスク基板は透明性のガラス基板に遮光性の薄膜である回路パターンが形成されてなるものであり、当該回路パターンがレジスト膜に転写されて、TFTアレイ基板が得られる。従って、マスク基板には高い精度をもって回路パターンが形成されている必要がある。つまり、同一のマスク基板を用いて大量のTFTアレイ基板が生成されるため、マスク基板そのものに欠陥があると、その回路パターンが転写されるTFTアレイ基板にも欠陥を及ぼすことになり、その結果欠陥のあるTFTアレイ基板が大量に生産されることになる。このため、予めマスク基板に欠陥があるか否かの検査を行う必要がある。   By the way, the above-described mask substrate is obtained by forming a circuit pattern which is a light-shielding thin film on a transparent glass substrate, and the circuit pattern is transferred to a resist film to obtain a TFT array substrate. Therefore, the circuit pattern needs to be formed on the mask substrate with high accuracy. In other words, since a large number of TFT array substrates are generated using the same mask substrate, if the mask substrate itself is defective, the TFT array substrate to which the circuit pattern is transferred will also be defective. A defective TFT array substrate will be produced in large quantities. For this reason, it is necessary to inspect whether the mask substrate has a defect in advance.

そこで、ガラス基板の欠陥を検査するものの一例として特許文献1が開示されている。 特許文献1では、ガラス基板の表面又は裏面に欠陥が生じているか否かを検査するものであり、レーザビームをガラス基板に照射して、散乱光を受光することによりガラス基板の表面又は裏面の欠陥を識別している。
特開平9−258197号公報
Then, patent document 1 is disclosed as an example of what inspects the defect of a glass substrate. In patent document 1, it is inspected whether the surface or back surface of the glass substrate has a defect. The glass substrate is irradiated with a laser beam and scattered light is received to detect the surface or back surface of the glass substrate. Identifying defects.
JP-A-9-258197

ところで、特許文献1に示される方法は、ガラス基板に欠陥が生じているか否かの識別をするものであるが、ガラス基板に遮光膜を形成してなるマスク基板等の部品においては、遮光膜の表面に異物が付着しているか、又は基板と遮光膜との間に異物が付着しているかの検査を行う必要がある。つまり、ガラス基板とマスクパターンである遮光膜との間に異物が付着していると、これを洗浄等することによって除去することができず、結果として不良品となる。一方、遮光膜の表面に異物が付着している場合は、洗浄等することにより異物を除去することができるため、異物を除去することにより、良品として使用することができる。従って、マスク基板に異物が付着しているか否かの検査を行う際には、異物が付着しているか否かのみではなく、どの位置に異物が付着しているかを検査することは極めて重要なことである。   By the way, the method disclosed in Patent Document 1 identifies whether or not a defect has occurred in a glass substrate. However, in a part such as a mask substrate formed by forming a light shielding film on a glass substrate, the light shielding film is used. It is necessary to inspect whether foreign matter is adhered to the surface of the substrate or whether foreign matter is adhered between the substrate and the light shielding film. That is, if a foreign substance adheres between the glass substrate and the light shielding film as the mask pattern, it cannot be removed by washing or the like, resulting in a defective product. On the other hand, when a foreign substance adheres to the surface of the light shielding film, the foreign substance can be removed by washing or the like. Therefore, the foreign substance can be used as a non-defective product by removing the foreign substance. Therefore, when inspecting whether or not foreign matter has adhered to the mask substrate, it is extremely important to inspect not only whether or not foreign matter has adhered, but also where the foreign matter has adhered. That is.

特に、ガラス基板と遮光膜との間に異物が付着しているとマスクパターンの転写精度に問題が生じることにより、当該異物が剥離されると、異物の上に形成されている遮光膜も一体となって剥離されるため、剥離された部分は光が透過してしまい、誤った回路パターンがレジスト膜に転写されてしまう。その結果、液晶ディスプレイのTFTアレイ基板として適正な動作を行うことができないという問題がある。   In particular, if foreign matter adheres between the glass substrate and the light shielding film, a problem occurs in the transfer accuracy of the mask pattern. If the foreign matter is peeled off, the light shielding film formed on the foreign matter is also integrated. Therefore, light is transmitted through the peeled portion, and an incorrect circuit pattern is transferred to the resist film. As a result, there is a problem that proper operation as a TFT array substrate of a liquid crystal display cannot be performed.

そこで、本発明は、上記の異物が付着しているか否か、及び付着している場合には、異物がどの位置に付着しているかを判定することを目的とする。   In view of the above, an object of the present invention is to determine whether or not the above-mentioned foreign matter is attached and to which position the foreign matter is attached.

本発明の異物検査装置は、透明性の基板の表面に遮光膜が形成された被検査体の前記遮光膜の表面側から当該遮光膜の表面に向かって光を照射する第1の光源と、前記遮光膜で反射した散乱光を受光できる位置に設けられる第1の散乱光検出手段と、前記基板の裏面側から前記遮光膜の裏面に向かって光を照射する第2の光源と、前記遮光膜の裏面で反射した散乱光を受光できる位置に設けられる第2の散乱光検出手段と、前記第1の散乱光検出手段が散乱光を受光し、前記第2の散乱光検出手段が散乱光を受光していない場合は、前記遮光膜の表面に異物が付着していると判定し、前記第1の散乱光検出手段及び前記第2の散乱光検出手段が散乱光を受光した場合は、前記基板と前記遮光膜と間に異物が付着していると判定する判定装置と、を有することを特徴とする。   The foreign matter inspection apparatus of the present invention includes a first light source that irradiates light from the surface side of the light shielding film of the object to be inspected having a light shielding film formed on the surface of the transparent substrate toward the surface of the light shielding film, A first scattered light detecting means provided at a position where the scattered light reflected by the light shielding film can be received; a second light source for irradiating light from the back surface side of the substrate toward the back surface of the light shielding film; Second scattered light detection means provided at a position where the scattered light reflected by the back surface of the film can be received, and the first scattered light detection means receive the scattered light, and the second scattered light detection means is the scattered light. Is not received, it is determined that foreign matter is attached to the surface of the light shielding film, and when the first scattered light detection means and the second scattered light detection means receive scattered light, A determination device for determining that foreign matter is adhered between the substrate and the light shielding film; Characterized in that it has a.

本発明の他の異物検査装置は、透明性の基板の表面に遮光膜が形成された被検査体の前記遮光膜の表面側から当該遮光膜の表面に向かって光を照射する第1の光源と、前記遮光膜の表面で反射した散乱光を受光できる位置に設けられる第1の散乱光検出手段と、前記基板の裏面側から前記遮光膜の裏面に向かって光を照射する第2の光源と、前記遮光膜の裏面で反射した散乱光を受光できる位置に設けられる第2の散乱光検出手段と、前記第1の散乱光検出手段に入射する光に散乱光が含まれているか否かと、前記第2の散乱光検出手段に入射する光に散乱光が含まれているか否かとの組み合わせにより、前記遮光膜に異物が付着しているか否か、及び前記異物が付着している場合には、前記遮光膜の表面に前記異物が付着しているか、前記基板と前記遮光膜との間に前記異物が付着しているか又は前記基板の裏面に前記異物が付着しているか否かを判定する判定装置と、を有することを特徴とする。   Another foreign matter inspection apparatus of the present invention is a first light source that irradiates light from the surface side of the light shielding film of the object to be inspected having a light shielding film formed on the surface of a transparent substrate toward the surface of the light shielding film. A first scattered light detecting means provided at a position where the scattered light reflected by the surface of the light shielding film can be received, and a second light source for irradiating light from the back surface side of the substrate toward the back surface of the light shielding film And second scattered light detection means provided at a position where the scattered light reflected by the back surface of the light shielding film can be received, and whether or not the light incident on the first scattered light detection means contains scattered light. , Whether or not foreign matter adheres to the light-shielding film, depending on whether or not scattered light is included in the light incident on the second scattered light detection means, and when the foreign matter is attached The foreign matter is attached to the surface of the light shielding film, or And having a a determination device whether the foreign substance is adhered to the back surface of or the substrate the foreign substance is adhered to between the shielding film and the plate.

本発明の異物検査方法は、透明性の基板の表面に遮光膜が形成された被検査体の前記遮光膜の表面側から当該遮光膜の表面に向かって第1の検査光を照射し、前記基板の裏面側から前記遮光膜の裏面に向かって第2の検査光を照射し、前記遮光膜の表面で反射した前記第1の検査光に散乱光が含まれ、且つ前記遮光膜の裏面で反射した前記第2の検査光に散乱光が含まれていない場合は、前記遮光膜の表面に異物が付着していると判定し、前記遮光膜の表面で反射した前記第1の検査光及び前記遮光膜の裏面で反射した前記第2の検査光に散乱光が含まれている場合は、前記基板と前記基板との間に異物が付着していると判定することを特徴とする。   In the foreign matter inspection method of the present invention, the first inspection light is irradiated from the surface side of the light-shielding film to the surface of the light-shielding film of the object to be inspected having the light-shielding film formed on the surface of the transparent substrate, The second inspection light is irradiated from the back surface side of the substrate toward the back surface of the light shielding film, the scattered light is included in the first inspection light reflected by the surface of the light shielding film, and on the back surface of the light shielding film. When the reflected second inspection light does not contain scattered light, it is determined that a foreign substance is attached to the surface of the light shielding film, and the first inspection light reflected on the surface of the light shielding film and In the case where scattered light is included in the second inspection light reflected by the back surface of the light shielding film, it is determined that a foreign substance is attached between the substrate and the substrate.

本発明の他の異物検査方法は、透明性の基板の表面に遮光膜が形成された被検査体の前記遮光膜の表面側から当該遮光膜の表面に向かって第1の検査光を照射し、前記基板の裏面側から前記遮光膜の裏面に向かって第2の検査光を照射し、前記遮光膜の表面で反射した前記第1の検査光に散乱光が含まれているか否かと、前記遮光膜の裏面で反射した前記第2の検査光に散乱光が含まれているか否かとの組み合わせにより、前記遮光膜に異物が付着しているか否か、及び前記異物が付着している場合には、前記遮光膜の表面に前記異物が付着しているか、前記基板と前記遮光膜との間に前記異物が付着しているか又は前記基板の裏面に前記異物が付着しているか否かを判定することを特徴とする。   In another foreign matter inspection method of the present invention, the first inspection light is irradiated from the surface side of the light shielding film of the object to be inspected having the light shielding film formed on the surface of the transparent substrate toward the surface of the light shielding film. Irradiating the second inspection light from the back surface side of the substrate toward the back surface of the light shielding film, and whether or not the first inspection light reflected by the surface of the light shielding film contains scattered light, Whether or not foreign matter is attached to the light shielding film by the combination of whether or not scattered light is included in the second inspection light reflected by the back surface of the light shielding film, and when the foreign matter is attached Determines whether the foreign matter is attached to the surface of the light shielding film, whether the foreign matter is attached between the substrate and the light shielding film, or whether the foreign matter is attached to the back surface of the substrate. It is characterized by doing.

本発明では、被検査体に異物が付着しているか否か、及び付着している場合にはどの位置に付着しているかを判定することができる。   In the present invention, it is possible to determine whether or not foreign matter is attached to the object to be inspected, and if it is attached, to which position it is attached.

以下、図面を参照して本発明の実施形態について説明する。図1において、本発明の異物検査装置1は、第1の光源11と第2の光源12と第1の光検出器21と第2の光検出器22と第3の光検出器23と第1の集束レンズ41と第1の結像レンズ42と第2の集束レンズ51と第2の結像レンズ52と第3の結像レンズ53と判定装置30とを有して構成される。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In FIG. 1, the foreign matter inspection apparatus 1 of the present invention includes a first light source 11, a second light source 12, a first photodetector 21, a second photodetector 22, a third photodetector 23, and a first detector. 1 focusing lens 41, first imaging lens 42, second focusing lens 51, second imaging lens 52, third imaging lens 53, and determination device 30.

そして、異物検査装置1に検査される被検査体80は透明性の基板81の表面に遮光膜82が形成されている。遮光膜82は光を透過しない性質を有する薄膜であるため、被検査体80の上方から入射する光は表面82Sで、下方から入射する光は裏面82Rで反射する。なお、遮光膜82は完全に光を遮断するものであってもよいが、透過光量が少ないものであってもよい。被検査体80としては、液晶ディスプレイの製造に用いられるマスク基板やTFTアレイ基板等がある。マスク基板は透明性のガラス基板に回路パターンである遮光性の薄膜が形成されている。また、TFTアレイ基板はガラス基板に回路パターンの金属膜が形成されている。従って、本実施形態でいう遮光膜82はマスク基板の遮光性の薄膜となり、またTFTアレイ基板の金属膜となる。   The object 80 to be inspected by the foreign substance inspection apparatus 1 has a light shielding film 82 formed on the surface of a transparent substrate 81. Since the light shielding film 82 is a thin film that does not transmit light, light incident from above the object 80 is reflected by the front surface 82S, and light incident from below is reflected by the rear surface 82R. Note that the light shielding film 82 may completely block light, but may have a small amount of transmitted light. The inspection object 80 includes a mask substrate and a TFT array substrate used for manufacturing a liquid crystal display. As the mask substrate, a light-shielding thin film as a circuit pattern is formed on a transparent glass substrate. The TFT array substrate has a circuit pattern metal film formed on a glass substrate. Therefore, the light shielding film 82 in the present embodiment is a light shielding thin film of the mask substrate and a metal film of the TFT array substrate.

異物検査装置1は被検査体80に異物(ゴミや有機汚れ等)が付着しているか否か、及び付着しているのであればどの位置に付着しているかを判定するための装置である。異物検査装置1において、第1の光源11からは発散光であるレーザ光が発振され、第1の集束レンズ41により収束光となって遮光膜82の表面82Sに入射する。そして、遮光膜82で反射した光は、第1の結像レンズ42に入射し、第1の光検出器21に結像される。第1の光源11は斜め上方から遮光膜82の表面82Sにレーザ光を入射させ、遮光膜82の表面82Sで反射したレーザ光を受光できる位置に第1の光検出器21を配置する。第1の光検出器21は遮光膜82の表面82Sで反射したレーザ光を受光するものであるが、第1の検査光FL1が反射したときに散乱光が生じた場合には、必ず散乱光が受光されるようにする(つまり、第1の光検出器21は、換言すれば第1の散乱光検出器である)。そして、第1の光検出器21としてはCCD(Charge Coupled Device)を適用したものについて説明するが、光を検出できるものであれば任意のものを適用してよい。第1の光検出器21には第1の結像レンズ42により所定領域に光が入射する。第1の光検出器21を構成するCCDは入射した光を光電変換して電気信号に変換して判定装置30に出力する。   The foreign matter inspection apparatus 1 is a device for determining whether or not foreign matter (dust, organic stains, etc.) is attached to the inspected object 80 and to which position it is attached. In the foreign matter inspection apparatus 1, laser light that is diverging light is oscillated from the first light source 11, and is incident on the surface 82 </ b> S of the light shielding film 82 as convergent light by the first focusing lens 41. The light reflected by the light shielding film 82 enters the first imaging lens 42 and forms an image on the first photodetector 21. The first light source 11 causes laser light to enter the surface 82S of the light shielding film 82 from obliquely above, and the first photodetector 21 is disposed at a position where the laser light reflected by the surface 82S of the light shielding film 82 can be received. The first photodetector 21 receives the laser light reflected by the surface 82S of the light shielding film 82. However, if scattered light is generated when the first inspection light FL1 is reflected, the scattered light is always generated. (That is, the first photodetector 21 is, in other words, the first scattered light detector). The first photodetector 21 will be described using a CCD (Charge Coupled Device). However, any detector that can detect light may be used. Light enters the first photodetector 21 in a predetermined region by the first imaging lens 42. The CCD constituting the first photodetector 21 photoelectrically converts incident light into an electric signal and outputs it to the determination device 30.

第2の光源12も第1の光源11と同様にレーザ光を発振するためのものであり、第2の光源12から射出されたレーザ光は第1の集束レンズ51により被検査体80の遮光膜82の裏面82Rで反射して、第2の結像レンズ52により第2の光検出器22に結像される。また、第2の光検出器22も第1の光検出器21と同様に、第2の光源12は斜め下方から遮光膜82の裏面82Rにレーザ光を入射させ、遮光膜82の裏面82Rで反射したレーザ光を受光できる位置に配置し、受光手段としてCCDを適用するものとする。また、第2の光検出手段22についても、第2の検査光FL2が反射したときに散乱光が生じた場合には、必ず散乱光が受光されるようにする(つまり、第2の光検出器22は、換言すれば、第2の散乱光検出器である)。そして、第2の光検出器22で光電変換された電気信号が判定装置30に出力される。ここで、第2の光源12から射出されたレーザ光の遮光膜82の裏面82Rのスポット位置と、第1の光源11から射出されたレーザ光の遮光膜82の表面82Sのスポット位置とは、遮光膜82の表裏において同じ位置となるように第1の光源11及び第2の光源12が配置される。なお、第1の光源11及び第2の光源12からはレーザ光が出力されるものについて説明したが、これに限定されず、例えば発光ダイオードやランプ光源等からの光を適用してもよい。   Similarly to the first light source 11, the second light source 12 is also for oscillating laser light. The laser light emitted from the second light source 12 is shielded from the object 80 by the first focusing lens 51. The light is reflected by the back surface 82 </ b> R of the film 82, and is imaged on the second photodetector 22 by the second imaging lens 52. Similarly to the first photodetector 21, the second light source 22 causes the second light source 12 to make laser light incident on the back surface 82 </ b> R of the light shielding film 82 from obliquely below, and the back surface 82 </ b> R of the light shielding film 82. It is assumed that the reflected laser beam is disposed at a position where it can be received and a CCD is applied as the light receiving means. The second light detection means 22 is also configured to always receive the scattered light when scattered light is generated when the second inspection light FL2 is reflected (that is, the second light detection). In other words, the device 22 is a second scattered light detector). Then, the electrical signal photoelectrically converted by the second photodetector 22 is output to the determination device 30. Here, the spot position of the back surface 82R of the light shielding film 82 of the laser light emitted from the second light source 12 and the spot position of the surface 82S of the light shielding film 82 of the laser light emitted from the first light source 11 are: The 1st light source 11 and the 2nd light source 12 are arrange | positioned so that it may become the same position in the front and back of the light shielding film 82. FIG. In addition, although what demonstrated the laser beam from the 1st light source 11 and the 2nd light source 12 was demonstrated, it is not limited to this, For example, you may apply the light from a light emitting diode, a lamp light source, etc.

そして、被検査体80の斜め下方(第1の光源11とは反対側)に第3の光検出器23が配置されている。第3の光検出器23についてもCCDが適用される。ここで、第3の光検出器23は第1の光源11からのレーザ光を受光可能な位置に配置される。後述するが、被検査体80の遮光膜82に欠落(ピンホール)が生じているか否かを検出するために用いられる。第3の光検出器23に入射した光は光電変換され、電気信号として判定装置30に出力される。   And the 3rd photodetector 23 is arrange | positioned diagonally below the to-be-inspected object 80 (on the opposite side to the 1st light source 11). A CCD is also applied to the third photodetector 23. Here, the third photodetector 23 is arranged at a position where the laser beam from the first light source 11 can be received. As will be described later, it is used to detect whether or not a missing portion (pinhole) has occurred in the light shielding film 82 of the object 80. The light incident on the third photodetector 23 is photoelectrically converted and output to the determination device 30 as an electrical signal.

図1に示される異物検査装置1は、被検査体80の全体について検査を行うため、異物検査装置1の光学系(図1の異物検査装置1のうち判定装置30を除いた部分)、又は被検査体80をX方向(図1矢印方向)及びY方向(図1紙面奥行方向)に動作させて、被検査体80の全ての部分に第1の検査光FL1及び第2の検査光FL2を照射して、散乱光の検出を行う。このため、例えば被検査体80にXY方向に動作する図示しないステージが設けられる。   Since the foreign object inspection apparatus 1 shown in FIG. 1 inspects the entire object to be inspected 80, the optical system of the foreign object inspection apparatus 1 (part of the foreign object inspection apparatus 1 in FIG. 1 excluding the determination device 30), or The inspection object 80 is moved in the X direction (arrow direction in FIG. 1) and the Y direction (FIG. 1 depth direction), and the first inspection light FL1 and the second inspection light FL2 are applied to all portions of the inspection object 80. To detect scattered light. For this reason, for example, a stage (not shown) that operates in the XY directions is provided on the inspection object 80.

判定装置30は、被検査体80に異物が付着しているか否か、及び付着している場合にはどの位置に異物が付着しているかを判定するための装置である。つまり、判定装置30は、第1の光検出器21、第2の光検出器22及び第3の光検出器23から出力された光電変換された電気信号に基づいて、異物が付着しているか否か、及び付着している場合にはどの位置に付着しているかを判定し、その結果を出力する。結果を出力する出力手段の一例としては、例えば判定結果を印刷するための印刷手段であるプリンタや判定結果を表示するための表示手段であるモニタ等の表示装置がある。かかる出力手段が判定装置30に接続されることにより、被検査体80に異物が付着しているか否か、及び付着している場合にはどの位置に付着しているかを出力することができる。   The determination device 30 is a device for determining whether or not a foreign substance is attached to the inspection object 80 and in which position the foreign substance is attached when it is attached. That is, the determination device 30 has foreign matters attached based on the photoelectrically converted electrical signals output from the first photodetector 21, the second photodetector 22, and the third photodetector 23. If it is attached or not, it is determined at which position it is attached, and the result is output. As an example of the output means for outputting the result, there is a display device such as a printer as a printing means for printing the determination result and a monitor as a display means for displaying the determination result. By connecting such an output means to the determination device 30, it is possible to output whether or not foreign matter is attached to the inspection object 80, and where it is attached, if it is attached.

次に、異物検査装置1が行う処理について説明する。図1において、被検査体80の遮光膜82の表面82Sに異物FSが付着していなければ、第1の光源11から射出したレーザ光(第1の検査光FL1とする)は第1の集束レンズ41を経て、平面形状の遮光膜82の表面82Sで反射する。従って、反射面が平面であるため、遮光膜82の表面82Sで反射した第1の検査光FL1は、第1の結像レンズ42により第1の光検出器21の所定の領域(結像領域)に受光される。一方、第2の光源12から射出したレーザ光(第2の検査光FL2とする)は、第2の集束レンズ51を経て、平面形状の遮光膜82の裏面82Rで反射し、第2の結像レンズ52により第2の光検出器22の所定の領域(結像領域)に受光される。   Next, processing performed by the foreign matter inspection apparatus 1 will be described. In FIG. 1, if no foreign matter FS is attached to the surface 82S of the light shielding film 82 of the inspection object 80, the laser light emitted from the first light source 11 (referred to as the first inspection light FL1) is first focused. The light is reflected by the surface 82S of the planar light-shielding film 82 through the lens 41. Accordingly, since the reflecting surface is a plane, the first inspection light FL1 reflected by the surface 82S of the light shielding film 82 is caused to pass through a predetermined region (imaging region) of the first photodetector 21 by the first imaging lens 42. ). On the other hand, the laser light emitted from the second light source 12 (referred to as the second inspection light FL2) passes through the second focusing lens 51 and is reflected by the back surface 82R of the planar light shielding film 82, so that the second result is obtained. The light is received by a predetermined region (imaging region) of the second photodetector 22 by the image lens 52.

図2は、被検査体80の遮光膜82の表面82Sに異物FSが付着しているものを示す。遮光膜82の表面82Sに異物が付着する原因としては、基板81に遮光膜82を形成する工程を経た後に、異物検査装置1により検査が行われる工程に移行するまでの間に何らかの異物が付着すること等が考えられる。遮光膜82の表面82Sに異物が付着している場合は、被検査体80の洗浄を行えば異物を除去することができ、異物を除去すれば、被検査体80は良品として使用することができる。   FIG. 2 shows the surface 82S of the light shielding film 82 of the object 80 to be inspected with a foreign substance FS attached thereto. The cause of foreign matter adhering to the surface 82S of the light shielding film 82 is that some foreign matter adheres after the process of forming the light shielding film 82 on the substrate 81 and before the process proceeds to the step of inspecting by the foreign matter inspection apparatus 1. It may be possible to do so. If foreign matter adheres to the surface 82S of the light shielding film 82, the foreign object can be removed by cleaning the inspected object 80. If the foreign object is removed, the inspected object 80 can be used as a non-defective product. it can.

遮光膜82の表面82Sに異物FSが付着している場合、第1の光源11から射出されて第1の集束レンズ41を経た第1の検査光FL1は遮光膜82の表面82Sで反射するが、当該第1の検査光FL1は異物FSに入射する。異物FSの部分は反射面が平面ではないため、散乱光SLが発生する。従って、第1の光検出器21には散乱光SLが受光されることになる。一方、第2の光源12から射出した第2の検査光FL2は、遮光膜82の表面82Sに付着している異物FSには到達しないため、遮光膜82の裏面82Rで反射する。従って、反射面は全て平面であるため、遮光膜82の裏面82Rで反射する第2の検査光FL2は散乱光を含んだ光とはならず、第2の光検出器2では散乱光は検出されない。   When the foreign matter FS adheres to the surface 82S of the light shielding film 82, the first inspection light FL1 emitted from the first light source 11 and passing through the first focusing lens 41 is reflected by the surface 82S of the light shielding film 82. The first inspection light FL1 enters the foreign material FS. Since the part of the foreign material FS has a non-planar reflecting surface, scattered light SL is generated. Therefore, the first photodetector 21 receives the scattered light SL. On the other hand, the second inspection light FL2 emitted from the second light source 12 does not reach the foreign material FS adhering to the surface 82S of the light shielding film 82, and is reflected by the back surface 82R of the light shielding film 82. Accordingly, since the reflecting surfaces are all flat, the second inspection light FL2 reflected by the back surface 82R of the light shielding film 82 is not light containing scattered light, and the second photodetector 2 detects scattered light. Not.

図3は、基板81と遮光膜82との間(遮光膜82の裏面82R)に異物FSが付着している場合を示す。遮光膜82の裏面82Rに異物FSが付着する原因としては、基板81に遮光膜82を形成する前に、基板81の表面81Sに異物FSが付着すること等が考えられる。遮光膜82の裏面82Rに異物FSが付着している場合、図3に示されるように、異物FSが付着している部分において、異物FSにより遮光膜82は若干隆起する。第1の光源11からの第1の検査光FL1が隆起した遮光膜82に入射すると、隆起部分での反射面は平面ではないため、散乱光SLが発生する。従って、異物FSが遮光膜82の裏面82Rに付着していると、第1の光検出器21には散乱光SLが検出される。   FIG. 3 shows a case where the foreign substance FS adheres between the substrate 81 and the light shielding film 82 (the back surface 82R of the light shielding film 82). As a cause of the foreign material FS adhering to the back surface 82R of the light shielding film 82, the foreign material FS may adhere to the front surface 81S of the substrate 81 before the light shielding film 82 is formed on the substrate 81. When the foreign matter FS adheres to the back surface 82R of the light shielding film 82, as shown in FIG. 3, the light shielding film 82 slightly protrudes due to the foreign matter FS in the portion where the foreign matter FS adheres. When the first inspection light FL1 from the first light source 11 is incident on the raised light shielding film 82, the reflection surface at the raised portion is not a flat surface, and thus scattered light SL is generated. Therefore, if the foreign matter FS is attached to the back surface 82 </ b> R of the light shielding film 82, the scattered light SL is detected by the first photodetector 21.

一方、第2の光源12から射出した第2の検査光FL2は、遮光膜82の裏面82Rで反射するが、遮光膜82の裏面82Rに異物FSが付着していると、基板81を透過して、遮光膜82の裏面82Rに付着している異物FSで反射する。従って、反射面は平面とはならず、散乱光SLが発生する。従って、第2の光検出器22には散乱光SLが検出される。つまり、遮光膜82の裏面82Rに異物FSが付着していると、第1の光検出器21及び第2の光検出器22の両者に、散乱光が検出されることになる。   On the other hand, the second inspection light FL2 emitted from the second light source 12 is reflected by the back surface 82R of the light shielding film 82. However, if the foreign matter FS is attached to the back surface 82R of the light shielding film 82, the second inspection light FL2 is transmitted through the substrate 81. Then, the light is reflected by the foreign matter FS adhering to the back surface 82R of the light shielding film 82. Therefore, the reflecting surface is not flat and scattered light SL is generated. Accordingly, the scattered light SL is detected by the second photodetector 22. That is, when the foreign substance FS is attached to the back surface 82R of the light shielding film 82, scattered light is detected by both the first photodetector 21 and the second photodetector 22.

図4は、基板81の裏面81Rに異物FSが付着している場合を示す。基板81の裏面81Rに異物FSが付着していたとしても、第1の光源11から射出する第1の検査光FL1は、遮光膜82の表面82Sで反射する。従って、反射面は平面形状となるため、第1の光検出器21には散乱光は受光ない。一方、第2の光源12から射出したレーザ光は、平面形状の遮光膜82の裏面82Rで反射して、第2の光検出器22に受光されるが、第2の光源12から射出した第2の検査光FL2の一部は基板81の裏面81Rに付着している異物FSで反射する。従って、異物FSで散乱光SLが発生し、第2の光検出器22で散乱光SLが検出される。   FIG. 4 shows a case where the foreign substance FS is attached to the back surface 81 </ b> R of the substrate 81. Even if the foreign matter FS adheres to the back surface 81R of the substrate 81, the first inspection light FL1 emitted from the first light source 11 is reflected by the surface 82S of the light shielding film 82. Therefore, since the reflecting surface has a planar shape, the first photodetector 21 does not receive scattered light. On the other hand, the laser light emitted from the second light source 12 is reflected by the back surface 82R of the planar light shielding film 82 and is received by the second photodetector 22, but the second light emitted from the second light source 12 is reflected. Part of the second inspection light FL2 is reflected by the foreign matter FS adhering to the back surface 81R of the substrate 81. Accordingly, the scattered light SL is generated by the foreign matter FS, and the scattered light SL is detected by the second photodetector 22.

図5は、遮光膜82の一部に欠落部(ピンホール)DFが生じている場合を示している。遮光膜82に欠落部DFが生じる原因としては、遮光膜82に亀裂や剥離等が生じていることが考えられる。遮光膜82に欠落部DFが生じていると、第1の光源11から射出された第1の検査光FL1の一部又は全部が、遮光膜82の表面82Sで反射せず、欠落部DFを透過する。そして、透過した光は透過光TLとして、第3の結像レンズ53を経て、第3の光検出器23に透過光TLが検出される。欠落部DFにおいて第1の検査光FL1の全部が透過した場合には、遮光膜82の表面82Sで光は反射しないため、第1の光検出器21に光が検出されることはない。これに対し、欠落部DFにおいて第1の検査光FL1の一部が透過した場合には、遮光膜82の表面82Sで光の一部が反射するため、第1の光検出器21に反射光が検出される。   FIG. 5 shows a case where a missing portion (pinhole) DF is generated in a part of the light shielding film 82. A possible cause of the occurrence of the missing portion DF in the light shielding film 82 is that the light shielding film 82 is cracked or peeled off. When the missing portion DF is generated in the light shielding film 82, part or all of the first inspection light FL1 emitted from the first light source 11 is not reflected by the surface 82S of the light shielding film 82, and the missing portion DF is removed. To Penetrate. The transmitted light passes through the third imaging lens 53 as transmitted light TL, and the transmitted light TL is detected by the third photodetector 23. When all of the first inspection light FL1 is transmitted through the missing portion DF, the light is not reflected by the surface 82S of the light shielding film 82, and therefore the light is not detected by the first photodetector 21. On the other hand, when a part of the first inspection light FL1 is transmitted through the missing portion DF, a part of the light is reflected by the surface 82S of the light shielding film 82, so that the reflected light is reflected on the first photodetector 21. Is detected.

一方、遮光膜82に欠落部DFが生じていると、第2の光源12から射出した第2の検査光FL2も一部又は全部が、遮光膜82の表面82Sで反射せず、欠落部DFを透過する。第2の光源12からの第2の検査光FL2の全部が欠落部DFを透過したときは、第2の光検出器22に光が検出されることはない。これに対し、第2の光源12からの第2の検査光FL2の一部が欠落部DFを透過したときは、一部が反射されるため、当該反射光が第2の光検出器22に検出される。なお、図1に示されるように、基板81の裏面側において、第2の光検出器22と第3の光検出器23とが配置され、夫々光を受光するため、第1の光源11からのレーザ光の照射角度と第2の光源12からのレーザ光の照射角度とは異なる角度で被検査体80に入射されるように第1の光源11及び第2の光源12は配置される。   On the other hand, when the missing portion DF is generated in the light shielding film 82, a part or all of the second inspection light FL2 emitted from the second light source 12 is not reflected by the surface 82S of the light shielding film 82, and the missing portion DF. Transparent. When all of the second inspection light FL2 from the second light source 12 passes through the missing portion DF, no light is detected by the second photodetector 22. On the other hand, when a part of the second inspection light FL2 from the second light source 12 is transmitted through the missing portion DF, a part of the second inspection light FL2 is reflected, so that the reflected light is transmitted to the second photodetector 22. Detected. As shown in FIG. 1, the second light detector 22 and the third light detector 23 are arranged on the back surface side of the substrate 81, and each receives light. The first light source 11 and the second light source 12 are arranged so that the laser light is incident on the inspection object 80 at an angle different from the irradiation angle of the laser light from the second light source 12.

判定装置30には、上述した第1の光検出器21、第2の光検出器22及び第3の光検出器23が接続され、各光検出器において光電変換された電気信号が判定装置30に出力される。各光検出器としては、CCDを適用したものを例示している。CCDの場合、X方向(横方向)及びY方向(縦方向)に複数の受光素子が配列されてなるものが適用される。X方向及びY方向に複数の受光素子が配列されたものを適用することにより、一定範囲の面積を有する領域に光を受光させることができる。受光素子が受光した光は電気信号に光電変換され、判定装置30に出力される。従って、各光検出器から判定装置30に出力される電気信号の情報としては、各光検出器を構成する受光素子のアドレス(X方向とY方向とに夫々付された番地)と光強度との情報がある。   The determination device 30 is connected to the first light detector 21, the second light detector 22, and the third light detector 23 described above, and the electric signal photoelectrically converted in each light detector is determined by the determination device 30. Is output. As each photodetector, a CCD is applied. In the case of a CCD, one in which a plurality of light receiving elements are arranged in the X direction (horizontal direction) and the Y direction (vertical direction) is applied. By applying a plurality of light receiving elements arranged in the X direction and the Y direction, light can be received in a region having a certain area. The light received by the light receiving element is photoelectrically converted into an electrical signal and output to the determination device 30. Therefore, as information on the electrical signal output from each photodetector to the determination device 30, the addresses (addresses assigned to the X direction and the Y direction) and the light intensity of the light receiving elements constituting each photodetector, respectively. There is information.

判定装置30では、各光検出器から出力された情報に基づいて、散乱光SLを受光しているか否かの判定を行う。散乱光SLを受光しているか否かの判定に際しては、光量分布に基づいて判定が行われる。図6(a)は、散乱光SLを受光していないときの各光検出器の受光領域を示している。散乱光SLが発生しなければ、各光検出器に受光される光は、所定の結像領域FAに結像される。このとき、同図(a)に示される中心軸C上における光量分布は同図(b)で示されるようになる。すなわち、結像領域FAでは高い光量となるが、結像領域以外では光量が「0」である光量分布を示す。   The determination device 30 determines whether or not the scattered light SL is received based on the information output from each photodetector. When determining whether or not the scattered light SL is received, the determination is performed based on the light amount distribution. FIG. 6A shows a light receiving area of each photodetector when the scattered light SL is not received. If the scattered light SL is not generated, the light received by each photodetector is imaged in a predetermined imaging area FA. At this time, the light quantity distribution on the central axis C shown in FIG. 4A is as shown in FIG. That is, the light amount distribution is high in the imaging area FA, but the light quantity is “0” outside the imaging area.

これに対し、図7(a)は、散乱光SLが発生したときの各検出光の受光領域を示している。各検出器が散乱光SLを受光すると、結像領域FAの他に、例えば同図(a)に示されるように、散乱光SL1、SL2等が受光される。従って、中心軸C上における光量分布は、同図(b)で示されるように、結像領域FA以外においても散乱光SA1、SA2が検出される。なお、結像領域FA以外で光量が「0」でない光があるときに散乱光SLを検出したと判定してもよいが、誤差等を考慮して、ある閾値以上の強度を持つ光を受光したときに散乱光として検出してもよい。   On the other hand, FIG. 7A shows a light receiving area of each detection light when the scattered light SL is generated. When each detector receives the scattered light SL, in addition to the imaging area FA, for example, as shown in FIG. Accordingly, the light quantity distribution on the central axis C detects scattered light SA1 and SA2 even outside the imaging area FA, as shown in FIG. Although it may be determined that the scattered light SL is detected when there is light other than the image formation area FA and the light amount is not “0”, light having an intensity equal to or greater than a certain threshold is received in consideration of errors and the like. May be detected as scattered light.

以上により、判定装置30は、各検出器が散乱光SLを受光しているか否かを判定することができる。ここで、上述したように、遮光膜82の表面82Sに異物FSが付着している場合は、第1の光検出器21では散乱光SLが検出されるが、第2の光検出器22では散乱光SLは検出されない。また、基板81と遮光膜82との間(遮光膜82の裏面82R)に異物FSが付着している場合は、第1の光検出器21及び第2の光検出器22の両者に散乱光SLが検出される。また、基板81の裏面81Rに異物FSが付着している場合は、第1の光検出器21には散乱光SLは検出されないが、第2の光検出器22には散乱光SLが検出される。そして、被検査体80に異物FSが付着していない場合は、第1の光検出器21及び第2の光検出器22の両者に散乱光SLは検出されない。   As described above, the determination device 30 can determine whether or not each detector receives the scattered light SL. Here, as described above, when the foreign matter FS adheres to the surface 82S of the light shielding film 82, the scattered light SL is detected by the first photodetector 21, but the second photodetector 22 detects. Scattered light SL is not detected. Further, when the foreign substance FS is attached between the substrate 81 and the light shielding film 82 (the back surface 82R of the light shielding film 82), scattered light is emitted to both the first photodetector 21 and the second photodetector 22. SL is detected. Further, when the foreign substance FS is attached to the back surface 81R of the substrate 81, the scattered light SL is not detected by the first photodetector 21, but the scattered light SL is detected by the second photodetector 22. The And when the foreign material FS has not adhered to the to-be-inspected object 80, the scattered light SL is not detected by both the 1st photodetector 21 and the 2nd photodetector 22. FIG.

一方、第1の光検出器21、第2の光検出器22に光が受光されるか否かにかかわらず、遮光膜82に欠落部DFがある場合は、第3の光検出器23に光が受光され、欠落部DFがない場合は、第3の光検出器23に光は受光されない。   On the other hand, regardless of whether or not light is received by the first photodetector 21 and the second photodetector 22, if the light-shielding film 82 has the missing portion DF, the third photodetector 23 is When the light is received and there is no missing portion DF, the third photodetector 23 does not receive the light.

以上をテーブル(対応表)化したものを図8(同図において、第1の光検出器21及び第2の光検出器22の最下段に示される「−」は、真偽何れの値でもよいことを示す)に示す。判定装置30では、第1の光検出器21、第2の光検出器22及び第3の光検出器23から出力される電気信号に基づいて、散乱光を受光しているか否かを、光量分布に応じて判定する。このとき、結像領域外で光量が「0」でないことを検出したか否か、又は予め設定された閾値以上の光量を検出したか否かにより、各光検出器に散乱光が検出されたか否かを判定する。そして、各光検出器における散乱光の検出有無と図8のテーブルとを比較して、被検査体80に異物FSが付着しているか否か、及び付着している場合には、異物FSが遮光膜82の表面82Sに付着しているか、遮光膜82の裏面82Rの表面に付着しているか又は基板81の裏面81Rに付着しているかを判定する。そして、第3の光検出器23に光が受光されているか否かによって、遮光膜82に欠落部DFが生じているか否かを判定する。判定装置30は、判定した結果に基づいて、図示しない出力手段に、被検査体80に異物FSが付着しているか、及び付着しているのであればどの位置に付着しているかを出力する。   FIG. 8 (in the figure, “−” shown at the bottom of the first photodetector 21 and the second photodetector 22 is true or false). Show good). The determination device 30 determines whether or not the scattered light is received based on the electrical signals output from the first photodetector 21, the second photodetector 22, and the third photodetector 23. Determine according to the distribution. At this time, whether or not the scattered light was detected by each photodetector depending on whether or not it was detected that the light amount was not “0” outside the imaging region, or whether or not a light amount equal to or greater than a preset threshold was detected. Determine whether or not. Then, by comparing the presence / absence of detection of scattered light in each photodetector with the table of FIG. 8, whether or not the foreign matter FS is attached to the inspected object 80, and if the foreign matter FS is attached, It is determined whether it is attached to the front surface 82S of the light shielding film 82, the rear surface 82R of the light shielding film 82, or the rear surface 81R of the substrate 81. Then, it is determined whether or not the missing portion DF is generated in the light shielding film 82 depending on whether or not the light is received by the third photodetector 23. Based on the determination result, the determination device 30 outputs to the output means (not shown) whether the foreign matter FS is attached to the inspection object 80 and where it is attached.

以上説明したように、本発明は、透明性の基板に遮光膜を形成した被検査体の遮光膜の表面側から遮光膜の表面に向かって第1の検査光を照射する第1の光源と基板の裏面側から遮光膜の裏面に向かって第2の検査光を照射する第2の光源とを設け、遮光膜の表面で反射した第1の検査光を受光可能な位置に第1の光検出器を、遮光膜の裏面で反射した第2の検査光を受光可能な位置に第2の光検出器を設け、第1の光検出器及び第2の光検出器が散乱光を検出したか否かによって、被検査体に異物が付着しているか、及び付着している場合にはどの位置に付着しているかを判定することができる。また、遮光膜に欠落部が生じているか否かは、第3の光検出器の受光の有無により判定することができる。   As described above, the present invention includes a first light source that irradiates a first inspection light from a surface side of a light shielding film of a test object having a light shielding film formed on a transparent substrate toward the surface of the light shielding film. A second light source that emits second inspection light from the back surface side of the substrate toward the back surface of the light shielding film, and the first light at a position where the first inspection light reflected by the surface of the light shielding film can be received. The detector is provided with a second photodetector at a position where the second inspection light reflected by the back surface of the light shielding film can be received, and the first photodetector and the second photodetector detect the scattered light. It can be determined whether or not a foreign object is attached to the object to be inspected, and if it is attached, which position is attached. Further, whether or not a missing portion is generated in the light shielding film can be determined by the presence or absence of light reception by the third photodetector.

本発明の異物検査装置の概略構成図である。It is a schematic block diagram of the foreign material inspection apparatus of this invention. 異物が遮光膜の表面に付着しているときの説明図である。It is explanatory drawing when the foreign material has adhered to the surface of the light shielding film. 異物が遮光膜の裏面に付着しているときの説明図である。It is explanatory drawing when the foreign material has adhered to the back surface of the light shielding film. 異物が基板の裏面に付着しているときの説明図である。It is explanatory drawing when the foreign material has adhered to the back surface of a board | substrate. 遮光膜に欠落部が生じているときの説明図である。It is explanatory drawing when the missing part has arisen in the light shielding film. 散乱光が含まれていないときの受光領域及び光量分布を模式的に示す説明図である。It is explanatory drawing which shows typically the light reception area | region and light quantity distribution when scattered light is not contained. 散乱光が含まれているときの受光領域及び光量分布を模式的に示す説明図である。It is explanatory drawing which shows typically a light reception area | region and scattered light distribution when scattered light is contained. 散乱光の有無を検出した結果に基づくテーブルを示す図である。It is a figure which shows the table based on the result of having detected the presence or absence of scattered light.

符号の説明Explanation of symbols

1 異物検査装置 11 第1の光源
12 第2の光源 21 第1の光検出器
22 第2の光検出器 23 第3の光検出器
30 判定装置 81 基板
82 遮光膜 DF 欠落部
FL1 検査光 FL2 検査光
FS 異物
DESCRIPTION OF SYMBOLS 1 Foreign substance inspection apparatus 11 1st light source 12 2nd light source 21 1st photodetector 22 2nd photodetector 23 3rd photodetector 30 Determination apparatus 81 Substrate 82 Light shielding film DF Missing part FL1 Inspection light FL2 Inspection light FS Foreign matter

Claims (6)

透明性の基板の表面に遮光膜が形成された被検査体の前記遮光膜の表面側から当該遮光膜の表面に向かって光を照射する第1の光源と、前記遮光膜で反射した散乱光を受光できる位置に設けられる第1の散乱光検出手段と、前記基板の裏面側から前記遮光膜の裏面に向かって光を照射する第2の光源と、前記遮光膜の裏面で反射した散乱光を受光できる位置に設けられる第2の散乱光検出手段と、
前記第1の散乱光検出手段が散乱光を受光し、前記第2の散乱光検出手段が散乱光を受光していない場合は、前記遮光膜の表面に異物が付着していると判定し、前記第1の散乱光検出手段及び前記第2の散乱光検出手段が散乱光を受光した場合は、前記基板と前記遮光膜と間に異物が付着していると判定する判定装置と、を有することを特徴とする異物検査装置。
A first light source for irradiating light from the surface side of the light shielding film to the surface of the light shielding film of a test object having a light shielding film formed on the surface of the transparent substrate, and scattered light reflected by the light shielding film First scattered light detection means provided at a position where the light can be received, a second light source that emits light from the back surface side of the substrate toward the back surface of the light shielding film, and scattered light reflected by the back surface of the light shielding film Second scattered light detection means provided at a position where the light can be received;
When the first scattered light detection means receives scattered light and the second scattered light detection means does not receive scattered light, it is determined that foreign matter is attached to the surface of the light shielding film; A determination device that determines that a foreign substance is attached between the substrate and the light shielding film when the first scattered light detection unit and the second scattered light detection unit receive the scattered light. Foreign matter inspection apparatus characterized by
透明性の基板の表面に遮光膜が形成された被検査体の前記遮光膜の表面側から当該遮光膜の表面に向かって光を照射する第1の光源と、前記遮光膜の表面で反射した散乱光を受光できる位置に設けられる第1の散乱光検出手段と、前記基板の裏面側から前記遮光膜の裏面に向かって光を照射する第2の光源と、前記遮光膜の裏面で反射した散乱光を受光できる位置に設けられる第2の散乱光検出手段と、
前記第1の散乱光検出手段に入射する光に散乱光が含まれているか否かと、前記第2の散乱光検出手段に入射する光に散乱光が含まれているか否かとの組み合わせにより、前記遮光膜に異物が付着しているか否か、及び前記異物が付着している場合には、前記遮光膜の表面に前記異物が付着しているか、前記基板と前記遮光膜との間に前記異物が付着しているか又は前記基板の裏面に前記異物が付着しているか否かを判定する判定装置と、を有することを特徴とする異物検査装置。
A first light source that irradiates light from the surface side of the light shielding film to the surface of the light shielding film of the object to be inspected having a light shielding film formed on the surface of the transparent substrate, and the light reflected from the surface of the light shielding film First scattered light detection means provided at a position where scattered light can be received, a second light source for irradiating light from the back side of the substrate toward the back side of the light shielding film, and reflected by the back side of the light shielding film Second scattered light detection means provided at a position where the scattered light can be received;
The combination of whether or not the light incident on the first scattered light detecting means includes scattered light and whether or not the light incident on the second scattered light detecting means includes scattered light, Whether or not foreign matter has adhered to the light shielding film, and if the foreign matter has adhered, the foreign matter has adhered to the surface of the light shielding film or the foreign matter between the substrate and the light shielding film. A foreign substance inspection apparatus comprising: a determination device that determines whether or not the foreign substance is attached to the back surface of the substrate.
前記基板の前記遮光膜が形成されている面とは反対側であって、前記第1の光源からの光が前記被検査体を透過したときに、前記被検査体を透過した光を受光可能な位置に第3の光検出手段が設けられ、
前記判定装置は、前記第3の光検出手段が前記遮光膜を透過した前記被検査体を透過した光を受光したことを検出することにより、前記遮光膜に欠損部があることを判定することを特徴とする請求項2記載の異物検査装置。
The opposite side of the surface of the substrate on which the light shielding film is formed, and when the light from the first light source passes through the object to be inspected, the light transmitted through the object to be inspected can be received A third light detecting means is provided at a position,
The determination apparatus determines that the light-shielding film has a defective portion by detecting that the third light detection unit has received light transmitted through the object to be inspected that has passed through the light-shielding film. The foreign matter inspection apparatus according to claim 2.
前記第1の検査光及び前記第2の検査光はレーザ光であることを特徴とする請求項2又は3記載の異物検査装置。   4. The foreign matter inspection apparatus according to claim 2, wherein the first inspection light and the second inspection light are laser beams. 透明性の基板の表面に遮光膜が形成された被検査体の前記遮光膜の表面側から当該遮光膜の表面に向かって第1の検査光を照射し、前記基板の裏面側から前記遮光膜の裏面に向かって第2の検査光を照射し、
前記遮光膜の表面で反射した前記第1の検査光に散乱光が含まれ、且つ前記遮光膜の裏面で反射した前記第2の検査光に散乱光が含まれていない場合は、前記遮光膜の表面に異物が付着していると判定し、前記遮光膜の表面で反射した前記第1の検査光及び前記遮光膜の裏面で反射した前記第2の検査光に散乱光が含まれている場合は、前記基板と前記基板との間に異物が付着していると判定することを特徴とする異物検査方法。
A first inspection light is irradiated from the surface side of the light shielding film of the object to be inspected having a light shielding film formed on the surface of the transparent substrate toward the surface of the light shielding film, and the light shielding film is formed from the back surface side of the substrate. Irradiate the second inspection light toward the back of the
When the first inspection light reflected on the surface of the light shielding film includes scattered light and the second inspection light reflected on the back surface of the light shielding film does not include scattered light, the light shielding film Scattered light is included in the first inspection light reflected on the surface of the light shielding film and the second inspection light reflected on the back surface of the light shielding film. In this case, it is determined that a foreign substance is adhered between the substrate and the substrate.
透明性の基板の表面に遮光膜が形成された被検査体の前記遮光膜の表面側から当該遮光膜の表面に向かって第1の検査光を照射し、前記基板の裏面側から前記遮光膜の裏面に向かって第2の検査光を照射し、
前記遮光膜の表面で反射した前記第1の検査光に散乱光が含まれているか否かと、前記遮光膜の裏面で反射した前記第2の検査光に散乱光が含まれているか否かとの組み合わせにより、前記遮光膜に異物が付着しているか否か、及び前記異物が付着している場合には、前記遮光膜の表面に前記異物が付着しているか、前記基板と前記遮光膜との間に前記異物が付着しているか又は前記基板の裏面に前記異物が付着しているか否かを判定することを特徴とする異物検査方法。
A first inspection light is irradiated from the surface side of the light shielding film of the object to be inspected having a light shielding film formed on the surface of the transparent substrate toward the surface of the light shielding film, and the light shielding film is formed from the back surface side of the substrate. Irradiate the second inspection light toward the back of the
Whether scattered light is included in the first inspection light reflected on the surface of the light shielding film, and whether scattered light is included in the second inspection light reflected on the back surface of the light shielding film. Depending on the combination, whether or not foreign matter has adhered to the light shielding film, and if the foreign matter has adhered, whether the foreign matter has adhered to the surface of the light shielding film, or between the substrate and the light shielding film A foreign matter inspection method, wherein it is determined whether or not the foreign matter is attached between them or the foreign matter is attached to the back surface of the substrate.
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