JP3336392B2 - Foreign matter inspection apparatus and method - Google Patents

Foreign matter inspection apparatus and method

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Publication number
JP3336392B2
JP3336392B2 JP30219493A JP30219493A JP3336392B2 JP 3336392 B2 JP3336392 B2 JP 3336392B2 JP 30219493 A JP30219493 A JP 30219493A JP 30219493 A JP30219493 A JP 30219493A JP 3336392 B2 JP3336392 B2 JP 3336392B2
Authority
JP
Japan
Prior art keywords
light
foreign matter
optical system
oblique incidence
light receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP30219493A
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Japanese (ja)
Other versions
JPH07134104A (en
Inventor
欣也 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
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Filing date
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Priority to JP30219493A priority Critical patent/JP3336392B2/en
Publication of JPH07134104A publication Critical patent/JPH07134104A/en
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Publication of JP3336392B2 publication Critical patent/JP3336392B2/en
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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は例えば、半導体素子の製
造工程において用いられるフォトマスク、レチクル、半
導体ウエハなどの基板上に付着した回路パターン以外の
異物を検出する異物検査装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a foreign matter inspection apparatus for detecting foreign matter other than a circuit pattern adhered to a substrate such as a photomask, a reticle, or a semiconductor wafer used in a semiconductor device manufacturing process.

【0002】[0002]

【従来の技術】一般的に、半導体素子の製造工程におい
ては、レチクルやフォトマスク等の基板上に形成された
回路パターンを露光装置によって半導体ウエハ上に転写
する工程が含まれる。この時、基板上にゴミ等の異物が
付着していると、その異物像も回路パターンと共に転写
されてしまい、回路パターンの欠陥として現れ、半導体
素子製造の歩留り低下の原因となる。
2. Description of the Related Art Generally, a semiconductor device manufacturing process includes a process of transferring a circuit pattern formed on a substrate such as a reticle or a photomask onto a semiconductor wafer by an exposure apparatus. At this time, if foreign matter such as dust adheres to the substrate, the foreign matter image is also transferred together with the circuit pattern, appears as a defect in the circuit pattern, and causes a reduction in the yield of semiconductor device production.

【0003】そこで、現在は、転写を行なう前に基板上
の異物の有無を検査する工程が必要不可欠となってい
る。このような異物検査には、レチクル上にレーザビー
ムを集光して走査し、異物による散乱光を検出する方式
の異物検査装置が用いられている。
Therefore, at present, a step of inspecting the substrate for the presence or absence of foreign matter before transfer is indispensable. For such a foreign substance inspection, a foreign substance inspection apparatus of a type in which a laser beam is condensed and scanned on a reticle to detect scattered light due to the foreign substance is used.

【0004】従来の異物検査装置の一例を図4に示す。
これは、光源101から射出されたレーザービームは、
ビームエキスパンダ102,103によって所定のビー
ム径にされた後、振動ミラー104、走査レンズ105
によって被検面109上に斜入射で集光され、走査スポ
ットが被検面上を所定方向(走査スポットの軌跡107
となるよう)に走査する。
FIG. 4 shows an example of a conventional foreign matter inspection apparatus.
This is because the laser beam emitted from the light source 101 is
After having a predetermined beam diameter by the beam expanders 102 and 103, the vibration mirror 104 and the scanning lens 105
The scanning spot is condensed at an oblique incidence on the surface 109 to be inspected, and the scanning spot moves in a predetermined direction
Scanning).

【0005】被検面上に異物が付着していれば、異物か
ら散乱光が生じるので、このうち後方散乱光を、受光レ
ンズ112、フィルター113、レンズ14からならな
る受光系を介して受光レンズ112系の瞳面上にスリッ
ト状に配置されたファイバーA〜Fの端面からなる受光
面115を通して受光することによって異物の有無を検
出していた。
If foreign matter adheres to the surface to be inspected, scattered light is generated from the foreign matter. Among them, the backward scattered light is transmitted through a light receiving system consisting of a light receiving lens 112, a filter 113 and a lens 14. The presence / absence of a foreign substance is detected by receiving light through a light receiving surface 115 composed of end faces of fibers A to F arranged in a slit shape on the pupil plane of the 112 system.

【0006】一般的に、規則正しく並んでいる回路パタ
ーンからの回折光は離散的に発生し、異物からの散乱光
は空間的に連続してほぼ一様な強度で発生することか
ら、各ファイバーA〜Fを介して瞳面で得られる強度
が、予め設定された所定値を超えた場合に異物からの散
乱光、各ファイバー毎に強度のバラツキがあった場合に
はパターンからの回折光と判断していた。
Generally, diffracted light from a regularly arranged circuit pattern is discretely generated, and scattered light from a foreign substance is spatially continuously generated at substantially uniform intensity. When the intensity obtained on the pupil plane via F exceeds a predetermined value, it is determined as scattered light from a foreign substance, and when there is a variation in intensity for each fiber, it is determined as diffracted light from the pattern. Was.

【0007】[0007]

【発明が解決しようとする課題】上記の如き従来の異物
検査装置では、被検面へのレーザービームの入射角がで
きるだけ大きくし、かつ入射光とほぼ同じ方向に発生す
る後方散乱光を検出するように設定されている。これ
は、パターンからの回折光との異物からの散乱光との強
度差が大きすぎると、強度の弱い異物散乱光の信号レベ
ルが殆ど0に近くなってノイズに埋もれて検出できなく
なるため、パターンからの回折光の強度分布を考慮し、
0次回折光の方向から離れる程その強度は弱くなること
から、異物の検出にはパターン回折光の強度が十分弱く
なっている後方散乱光を受光することによって異物検出
の精度を向上させている。
In the above-described conventional foreign matter inspection apparatus, the angle of incidence of the laser beam on the surface to be inspected is made as large as possible, and the backscattered light generated in substantially the same direction as the incident light is detected. It is set as follows. This is because if the intensity difference between the diffracted light from the pattern and the scattered light from the foreign matter is too large, the signal level of the scattered light with the weak foreign matter is almost close to 0 and cannot be detected because it is buried in noise and cannot be detected. Considering the intensity distribution of the diffracted light from
Since the intensity becomes weaker as the distance from the direction of the 0th-order diffracted light increases, the accuracy of foreign matter detection is improved by receiving the backscattered light whose pattern diffracted light intensity is sufficiently weak for detecting foreign matter.

【0008】しかしながら、このような構成の異物検査
装置では、粒状異物は精度良く検出されるが、基板上に
油膜、シミ汚れ等の位相物体が付着している場合、この
位相物体を異物として検出することが非常に困難であっ
た。位相物体は、粒状異物と異なり高さのない薄いもの
であるため、入射角が大きいと散乱光が殆ど生じない。
従って、従来の異物検査装置では、位相物体からの回折
光に相当する光は強度が弱過ぎて検出することができな
かった。
However, in the foreign substance inspection apparatus having such a configuration, particulate foreign substances are accurately detected. However, if a phase substance such as an oil film or stains adheres to the substrate, the phase substance is detected as a foreign substance. It was very difficult to do. Since the phase object is a thin object having no height unlike the granular foreign material, scattered light hardly occurs when the incident angle is large.
Therefore, in the conventional foreign matter inspection apparatus, the light corresponding to the diffracted light from the phase object has too low intensity to be detected.

【0009】本発明は、上記問題点を解消し、粒状異物
を精度良く検出できるだけでなく、シミ等の位相物体を
も異物として検出することができる異物検査装置を得る
ことを目的とする。
SUMMARY OF THE INVENTION It is an object of the present invention to solve the above problems and to provide a foreign matter inspection apparatus which can detect not only particulate foreign matter with high accuracy but also phase objects such as spots as foreign matter.

【0010】[0010]

【課題を解決するための手段】上記目的を達成するた
め、請求項1に記載の発明に係る異物検査装置では、第
1の光源と該光源からの光束を所定の入射角で被検査物
面上に集光する第1の集光手段とからなる第1の斜入射
光学系と、前記被検査物面からの第1の散乱光を受光す
る少なくとも1組以上の受光光学系からなる第1の受光
手段とを備え、受光手段からの出力信号に基づいて前記
被検査物面上の異物の有無を検出する異物検査装置にお
いて、第2の光源と該光源からの光束を前記第1の斜入
射光学系と異なる入射角で前記被検査物面上に集光する
第2の集光手段とからなる第2の斜入射光学系と、前記
被検査物面からの第2の散乱光を受光する少なくとも1
組以上の受光光学系からなる第2の受光手段とをさらに
備えると共に、前記被検査物面に対する前記第1の斜入
射光学系による入射角がθ1 、前記第2の斜入射光学系
による入射角がθ2 であるとき、以下の条件を満たすも
のとした。 45°≦θ1 <90°,0<θ2 <45°
In order to achieve the above object, in the foreign matter inspection apparatus according to the first aspect of the present invention, a first light source and a light beam from the light source are irradiated on a surface of an object to be inspected at a predetermined incident angle. A first oblique incidence optical system comprising first condensing means for converging light thereon, and a first optical system comprising at least one set of light receiving optical systems for receiving first scattered light from the surface of the inspection object. A foreign matter inspection device for detecting the presence or absence of foreign matter on the surface of the inspection object based on an output signal from the light receiving means, wherein a second light source and a light beam from the light source are reflected by the first oblique light source. A second oblique incidence optical system including a second light condensing means for condensing light on the surface of the inspection object at an incident angle different from that of the incident optical system, and receiving a second scattered light from the inspection object surface At least one
A second light receiving means comprising at least one set of light receiving optical systems, wherein the incident angle with respect to the inspection object surface by the first oblique incidence optical system is θ 1 , and the incident angle by the second oblique incidence optical system is when the corner is theta 2, and with the following condition is satisfied. 45 ° ≦ θ 1 <90 °, 0 <θ 2 <45 °

【0011】 また、請求項2に記載の発明に係る異物検
査装置では、請求項1に記載の異物検査装置において、
前記第1の受光光学系は前記第1の斜入射光学系による
第1の散乱光をのみを受光し、かつ前記第2の受光光学
系は前記第2の斜入射光学系による第2の散乱光をのみ
を受光するための手段を有するものである。また、請求
項3に記載の発明に係る異物検査方法では、請求項1又は
請求項2に記載の異物検査装置を用いて被検査面上の異
物を検査するものである。
According to a second aspect of the present invention, there is provided a foreign matter inspection apparatus according to the first aspect.
The first light receiving optical system receives only the first scattered light from the first oblique incidence optical system, and the second light receiving optical system receives a second scattered light from the second oblique incidence optical system. It has means for receiving only light. Also, billing
In the foreign matter inspection method according to the invention according to claim 3, claim 1 or
The foreign matter inspection device according to claim 2 is used to inspect the surface to be inspected.
It inspects things.

【0012】[0012]

【作用】本発明は、第1の斜入射光光学系において第1
の光源からの光束を第1の集光手段によって所定の入射
角で被検査物面上に集光し、被検査物面からの第1の散
乱光を少なくとも1組以上の受光光学系からなる第1の
受光手段によって受光する一方、第2の散乱光を少なく
とも1組以上の受光光学系からなる第2の受光手段によ
って受光し、受光手段からの出力信号に基づいて前記被
検査物面上の異物の有無を検出する異物検査装置であ
る。
According to the present invention, there is provided a first obliquely incident light optical system, comprising:
A light beam from the light source is condensed on the surface of the inspection object at a predetermined incident angle by the first light condensing means, and the first scattered light from the inspection object surface is composed of at least one or more light receiving optical systems. While receiving the light by the first light receiving means, the second scattered light is received by the second light receiving means comprising at least one or more sets of light receiving optical systems, and on the surface of the inspection object based on an output signal from the light receiving means. This is a foreign matter inspection device that detects the presence or absence of foreign matter.

【0013】ここで、第1の斜入射光学系による入射角
θ1 が、45°≦θ1 <90°という条件を満たすもの
とした。従って、被検物面に対する入射角を大きく設定
し、パターンからの回折光の強度が弱くなる0次回折光
の方向から離れた位置で後方散乱光を受光することとな
り、粒状異物に関しては高い検出精度が得られる。な
お、入射角θ1 が上記条件の下限より小さい場合、検出
感度が落ちて実用的ではない。
Here, it is assumed that the incident angle θ 1 by the first oblique incidence optical system satisfies the condition of 45 ° ≦ θ 1 <90 °. Therefore, the incident angle with respect to the surface of the test object is set large, and the backscattered light is received at a position distant from the direction of the 0th-order diffracted light, at which the intensity of the diffracted light from the pattern becomes weak. Is obtained. Note that the incident angle theta 1 is smaller than the lower limit of the above condition is not practical fall detection sensitivity.

【0014】一方、本発明は、第2の斜入射光光学系に
おいて第2の光源からの光束を第2の集光手段によって
前記第1の斜入射光学系と異なる入射角で被検査物面上
に集光し、被検査物面からの第2の散乱光を少なくとも
1組以上の受光光学系からなる第2の受光手段によって
受光し、受光手段からの出力信号に基づいて前記被検査
物面上の異物の有無を検出するものであり、この第2の
斜入射光学系による入射角θ2 が、0<θ2 <45°と
いう条件を満たすものとした。
On the other hand, according to the present invention, in the second oblique incidence optical system, the light beam from the second light source is incident on the surface of the inspection object at an incident angle different from that of the first oblique incidence optical system by the second focusing means. And a second scattered light from the surface of the object to be inspected is received by a second light receiving means comprising at least one set of light receiving optical systems, and the object to be inspected is received based on an output signal from the light receiving means. This is to detect the presence or absence of foreign matter on the surface, and the incident angle θ 2 by the second oblique incidence optical system satisfies the condition of 0 <θ 2 <45 °.

【0015】従って、第2の斜入射光学系による光束は
被検物面に対する入射角が小さく、通常の異物検査装置
では受光できないような強度の弱い位相物体からの散乱
光も検出することができる。なお、このような入射角の
小さい設定において得られる後方散乱光は、あまり強度
の弱まっていないパターンからの回折光も混入するが、
位相物体としての異物に関しては、微小なものまで検出
する必要がなく、ある程度大きさのあるものがラフに検
出できれば良く、パターンからの回折光の影響は第1の
受光光学系ほど問題にならない。また、第2の集光手段
による被検物面上でのスポットサイズについても、第1
の集光手段によるもの程小さくする必要はない。なお、
入射角θ2 が上記条件の上限を超えた場合、位相物体か
らの散乱光は強度が弱くなり過ぎて検出が困難である。
Therefore, the luminous flux of the second oblique incidence optical system has a small incident angle with respect to the surface of the test object, and can detect scattered light from a phase object having a low intensity that cannot be received by a normal foreign matter inspection device. . Note that the backscattered light obtained at such a small incident angle setting also includes diffracted light from a pattern whose intensity is not so weak.
Regarding foreign matter as a phase object, it is not necessary to detect even a very small one, and it is sufficient that an object having a certain size can be roughly detected, and the effect of diffracted light from the pattern is less problematic than in the first light receiving optical system. In addition, the spot size on the surface of the test object by the second light condensing means is also equal to the first size.
It is not necessary to make the size smaller than that by the light collecting means. In addition,
When the incident angle theta 2 exceeds the upper limit of the condition, the scattered light from the phase objects is difficult to detect the strength is too weak.

【0016】このように、本発明の異物検査装置によれ
ば、粒状異物が精度良く検出できるだけでなく、位相物
体としての異物をも検出することができる。
As described above, according to the foreign matter inspection apparatus of the present invention, it is possible to detect not only particulate foreign matter with high accuracy but also foreign matter as a phase object.

【0017】また、本発明では、第1の受光光学系は第
1の斜入射光学系による第1の散乱光をのみを受光し、
かつ第2の受光光学系は前記第2の斜入射光学系による
第2の散乱光をのみを受光するための手段を備えたもの
であるため、各々の受光光学系に異なる光学系からの信
号が混入することを回避できる。
Further, in the present invention, the first light receiving optical system receives only the first scattered light by the first oblique incidence optical system,
Further, since the second light receiving optical system is provided with means for receiving only the second scattered light by the second oblique incidence optical system, each light receiving optical system has a signal from a different optical system. Can be avoided.

【0018】このような手段としては、例えば、第1の
光源と第2の光源とで各々波長の異なるレーザ光源を用
い、各受光光学系に干渉フィルター等の波長選択性フィ
ルターを設ける方法がある。この時、照射光の波長が短
いほど散乱光の強度が大きくなることから、より高精度
な検出感度が要求される粒状異物を対象とした第1の斜
入射光学系の第1の光源に波長の短い方を用いることが
望ましい。
As such means, for example, there is a method in which laser light sources having different wavelengths are used for the first light source and the second light source, and a wavelength selective filter such as an interference filter is provided in each light receiving optical system. . At this time, since the intensity of the scattered light increases as the wavelength of the irradiation light becomes shorter, the wavelength of the first light source of the first oblique incidence optical system for the particulate foreign matter requiring higher precision detection sensitivity is increased. It is desirable to use the shorter one.

【0019】また、波長の異なる2つの光源を用いる以
外にも、第1及び第2の光源に同波長のものを用い、空
間的あるいは時間的にずらすことによって第1、第2の
散乱光に対応する各受光光学系を区別することも可能で
ある。
In addition to using two light sources having different wavelengths, first and second light sources having the same wavelength may be used, and the first and second light sources may be shifted spatially or temporally to generate first and second scattered lights. It is also possible to distinguish each corresponding light receiving optical system.

【0020】[0020]

【実施例】以下に、本発明を実施例を以て説明する。図
1は、第1の斜入射光学系と第2の斜入射光学系とで各
々波長の異なる光源を用いてレチクル9表面を検査する
場合の異物検査装置を示したものである。ここでは、第
1の光源1に比較的波長の短いレーザ(例えばアルゴ
ン)を、第2の光源2として波長の長い方のレーザ(例
えばヘリウムネオン)を用いた。
The present invention will be described below with reference to examples. FIG. 1 shows a foreign matter inspection apparatus when inspecting the surface of the reticle 9 using light sources having different wavelengths in the first oblique incidence optical system and the second oblique incidence optical system. Here, a laser having a relatively short wavelength (for example, argon) is used as the first light source 1, and a laser having a longer wavelength (for example, helium neon) is used as the second light source 2.

【0021】図1に示すように、まず、第1の斜入射光
学系において、第1の光源1から射出されたレーザビー
ムは、ビームエキスパンダ2,3によって所定のビーム
径に拡大された後、振動ミラー4で反射され、走査レン
ズ5を介してレチクル9表面上に比較的大きな入射角で
集光され走査スポットを形成する。走査スポットは、振
動ミラー4の振動によってレチクル9表面上をx方向に
軌跡7のように走査し、レチクル9が載置される台(不
図示)のy方向への駆動によってレチクル9の全表面が
走査される。レチクル9表面上に(粒状)異物が付着し
ていれば、散乱光が生じ、この散乱光のうち後方散乱光
が第1の受光光学系へ入射する。
As shown in FIG. 1, first, in a first oblique incidence optical system, a laser beam emitted from a first light source 1 is expanded to a predetermined beam diameter by beam expanders 2 and 3. The light is reflected by the oscillating mirror 4 and condensed on the surface of the reticle 9 via the scanning lens 5 at a relatively large incident angle to form a scanning spot. The scanning spot scans the surface of the reticle 9 in the x direction as a trajectory 7 by the vibration of the vibrating mirror 4, and the table (not shown) on which the reticle 9 is mounted is driven in the y direction to move the entire surface of the reticle 9. Is scanned. If (granular) foreign matter adheres to the surface of the reticle 9, scattered light is generated, and of the scattered light, backward scattered light is incident on the first light receiving optical system.

【0022】第1の受光光学系において、異物からの散
乱光は、反射ミラー11で反射され、受光レンズ12、
スリット13、レンズ14を通った後、検出部に到達し
検出される。本実施例では、検出部として、その受光面
が受光レンズ12の瞳面と共役な位置に来るよう配置さ
れた二次元イメージセンサを用いた。ここでは、大きな
入射角と同方向に発生する後方散乱光を受光するため、
粒状異物が高精度で検出できる。
In the first light receiving optical system, the scattered light from the foreign matter is reflected by the reflecting mirror 11, and is reflected by the light receiving lens 12,
After passing through the slit 13 and the lens 14, the light reaches the detection unit and is detected. In this embodiment, a two-dimensional image sensor arranged so that its light receiving surface is conjugate with the pupil plane of the light receiving lens 12 is used as the detection unit. Here, to receive the backscattered light generated in the same direction as the large incident angle,
Granular foreign matter can be detected with high accuracy.

【0023】一方、第2の斜入射光学系において、第2
の光源21から射出されたレーザビームは、ビームエキ
スパンダ22,23によって所定のビーム径に拡大され
た後、振動ミラー24で反射され、走査レンズ25を介
してレチクル9表面上に第1の斜入射光学系の場合より
小さい入射角で集光され走査スポットを形成する。この
走査スポットは、振動ミラー24の振動によってレチク
ル9表面上をx方向に走査し、レチクル9載置台のy方
向への駆動によってレチクル9全表面が走査される。レ
チクル9表面上に異物(位相物体)が付着していれば、
この異物からの後方散乱光が第2の受光光学系へ入射す
る。
On the other hand, in the second oblique incidence optical system,
The laser beam emitted from the light source 21 is expanded to a predetermined beam diameter by the beam expanders 22 and 23, then reflected by the vibrating mirror 24, and passed through the scanning lens 25 onto the surface of the reticle 9 to form a first oblique beam. The light is condensed at an incident angle smaller than that in the case of the incident optical system to form a scanning spot. The scanning spot scans the surface of the reticle 9 in the x direction by the vibration of the vibrating mirror 24, and the entire surface of the reticle 9 is scanned by driving the reticle 9 mounting table in the y direction. If foreign matter (phase object) adheres to the surface of the reticle 9,
Backscattered light from the foreign matter enters the second light receiving optical system.

【0024】第2の受光光学系において、異物からの散
乱光は、反射ミラー31で反射され、受光レンズ32、
スリット33、レンズ34を通った後、その受光面が受
光レンズ32の瞳面と共役な位置に来るよう配置された
二次元イメージセンサ35に到達し検出される。ここで
は、小さい入射角と同方向に発生する後方散乱光を検出
するので、高さのない位相物体であるシミなどの汚れを
検出することができる。
In the second light receiving optical system, the scattered light from the foreign matter is reflected by the reflecting mirror 31, and is reflected by the light receiving lens 32,
After passing through the slit 33 and the lens 34, the light reaches the two-dimensional image sensor 35 arranged so that the light receiving surface thereof is conjugate with the pupil plane of the light receiving lens 32, and is detected. Here, since the backscattered light generated in the same direction as the small incident angle is detected, it is possible to detect a stain such as a stain, which is a phase object having no height.

【0025】なお、両受光光学系において、スリット1
3、スリット33は、各々スポット走査軌跡と共役であ
り、且つ干渉フィルタで構成されているため、各々他方
の斜入射光学系からの光はセンサまで到達することがで
きず、信号の混入はない。なお、これらのスリットは、
干渉フィルタに限らず、各々他方の光に対してフィルタ
効果のあるものであれば良い。
In the two light receiving optical systems, the slit 1
3. Since the slits 33 are each conjugate with the spot scanning locus and are constituted by an interference filter, the light from the other oblique incidence optical system cannot reach the sensor and there is no signal mixing. . In addition, these slits
The filter is not limited to the interference filter and may be any filter that has a filter effect on the other light.

【0026】ここで、二次元センサ15、35における
瞳画像情報の処理方法について説明する。まず、各二次
元センサ上には、各受光レンズの瞳面の像が形成され
る。被検面上に規則的に形成されているパターンによる
回折光は離散的に生じるため、瞳面での像は図2(a)
に示すように格子点状となり、その一走査線の画像信号
は図2(b)に示す通りである。また、異物による散乱
光は、空間的に連続して発生するため、瞳面上における
強度分布はほぼ一様であり、パターンによる回折光と異
物散乱光とが混在した瞳面での像は図2(c)のような
強度分布となり、その一走査線の画像信号は図2(d)
に示すとおりである。
Here, a method of processing pupil image information in the two-dimensional sensors 15 and 35 will be described. First, an image of the pupil plane of each light receiving lens is formed on each two-dimensional sensor. Since the diffracted light due to the pattern regularly formed on the test surface is discretely generated, the image on the pupil plane is shown in FIG.
As shown in FIG. 2 (b), the image signal of one scanning line is as shown in FIG. 2 (b). In addition, since the scattered light due to the foreign matter is continuously generated spatially, the intensity distribution on the pupil plane is substantially uniform, and the image on the pupil plane where the diffracted light due to the pattern and the foreign matter scattered light are mixed is shown in FIG. 2C, and the image signal of one scanning line is shown in FIG.
As shown in FIG.

【0027】従って、パターン回折光と異物散乱光が混
在している場合に、異物散乱光による信号のみを検出す
るためには、パターン回折光の格子状部以外の部分の信
号強度B1 、B2 、B3 が0以上あるいは所定値以上か
どうかを検出することによって異物の有無を判断するこ
とができる。また被検面全体でパターンの周期が一定の
場合は、パターン回折光の位置も一定であるので、回折
光のこない部位の画像信号を取り出せば良い。
Therefore, in the case where the pattern diffracted light and the foreign matter scattered light are mixed, in order to detect only the signal due to the foreign matter scattered light, the signal intensities B 1 , B 1 of the parts other than the lattice portion of the pattern diffracted light are required. 2, B 3 can determine the presence or absence of a foreign object by detecting whether 0 or more or a predetermined value or more. In addition, when the pattern period is constant over the entire surface to be inspected, the position of the pattern diffracted light is also constant, so that it is sufficient to extract an image signal of a portion where the diffracted light does not come.

【0028】なお、第1、第2の受光光学系への他方の
光学系からの信号の混入を避けるための手段として、上
記実施例では波長の異なる2種のレーザ光を用いたが、
本発明はこれに限らず、同一波長のレーザ光を用いた構
成であっても、2種の光学系を区別する手段があればよ
い。
In the above-described embodiment, two types of laser beams having different wavelengths are used as means for avoiding mixing of signals from the other optical system into the first and second light receiving optical systems.
The present invention is not limited to this, and even if a configuration using laser light of the same wavelength is used, it suffices if there is means for distinguishing two types of optical systems.

【0029】例えば、図3に示すようにレチクル9表面
上で第1の斜入射光学系によるスポット走査位置(67
A)と第2の斜入射光学系のスポット走査位置(67
B)とを空間的にずらして検出を行なう方法や、AOM
(超音波変調器)や光チョッパーを用いて同一波長のレ
ーザ光を第1の光学系用と第2の光学系用とで交互に用
いるなど時間的に分離する方法をがある。
For example, as shown in FIG. 3, a spot scanning position (67) on the surface of the reticle 9 by the first oblique incidence optical system.
A) and the spot scanning position (67) of the second oblique incidence optical system.
B) and a method of performing detection by spatially shifting
There is a method in which laser beams of the same wavelength are alternately used for the first optical system and for the second optical system by using an (ultrasonic modulator) or an optical chopper, and temporally separated.

【0030】[0030]

【発明の効果】本発明は以上説明したとおり、粒状異物
が精度良く検出できるだけでなく、位相物体としての異
物をも検出することができるという効果がある。
As described above, the present invention has an effect that not only can particulate foreign matter be detected with high accuracy, but also foreign matter as a phase object can be detected.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例による異物検査装置の概略構
成図である。
FIG. 1 is a schematic configuration diagram of a foreign matter inspection apparatus according to one embodiment of the present invention.

【図2】図1の異物検査装置の二次元センサにおける瞳
画像情報の処理方法を説明する模式図である。
FIG. 2 is a schematic diagram illustrating a method of processing pupil image information in a two-dimensional sensor of the foreign matter inspection device in FIG. 1;

【図3】本発明の実施例の変形例におけるレチクル上で
のスポット走査軌跡を示す模式図である。
FIG. 3 is a schematic diagram showing a spot scanning locus on a reticle in a modification of the embodiment of the present invention.

【図4】従来の異物検査装置の概略構成図である。FIG. 4 is a schematic configuration diagram of a conventional foreign matter inspection device.

【符号の説明】[Explanation of symbols]

1,21,101:光源 4,24,104:振動ミラー 5,25,105:走査レンズ 7,107,67A,67B:走査スポット軌跡 9,109:レチクル 11,111:反射ミラー 12,32,112:受光レンズ 13,33:スリット(干渉フィルタ) 113:スリット 35:二次元イメージセンサ 1, 21, 101: light source 4, 24, 104: vibrating mirror 5, 25, 105: scanning lens 7, 107, 67A, 67B: scanning spot locus 9, 109: reticle 11, 111: reflecting mirror 12, 32, 112 : Light receiving lens 13, 33: slit (interference filter) 113: slit 35: two-dimensional image sensor

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 第1の光源と該光源からの光束を所定の
入射角で被検査物面上に集光する第1の集光手段とから
なる第1の斜入射光学系と、前記被検査物面からの第1
の散乱光を受光する少なくとも1組以上の受光光学系か
らなる第1の受光手段とを備え、受光手段からの出力信
号に基づいて前記被検査物面上の異物の有無を検出する
異物検査装置において、 第2の光源と該光源からの光束を前記第1の斜入射光学
系と異なる入射角で前記被検査物面上に集光する第2の
集光手段とからなる第2の斜入射光学系と、前記被検査
物面からの第2の散乱光を受光する少なくとも1組以上
の受光光学系からなる第2の受光手段とをさらに備える
と共に、前記被検査物面に対する前記第1の斜入射光学
系による入射角がθ1 、前記第2の斜入射光学系による
入射角がθ2 であるとき、以下の条件を満たすことを特
徴とする異物検査装置。 45°≦θ1 <90°,0<θ2 <45°
A first oblique incidence optical system comprising: a first light source; and a first light condensing means for condensing a light beam from the light source on a surface of the inspection object at a predetermined incident angle; First from the inspection object side
A first light receiving means comprising at least one set of light receiving optical systems for receiving scattered light, and a foreign matter inspection apparatus for detecting presence or absence of foreign matter on the surface of the inspection object based on an output signal from the light receiving means A second oblique incidence comprising: a second light source; and a second condensing means for condensing a light beam from the light source on the surface of the inspection object at an incident angle different from that of the first oblique incidence optical system. An optical system; and a second light receiving unit including at least one set of light receiving optical systems for receiving the second scattered light from the surface of the inspection object. A foreign matter inspection apparatus characterized by satisfying the following conditions when the incident angle by the oblique incidence optical system is θ 1 and the incident angle by the second oblique incidence optical system is θ 2 . 45 ° ≦ θ 1 <90 °, 0 <θ 2 <45 °
【請求項2】 前記第1の受光光学系は前記第1の斜入
射光学系による第1の散乱光をのみを受光し、かつ前記
第2の受光光学系は前記第2の斜入射光学系による第2
の散乱光をのみを受光するための手段を有することを特
徴とする請求項1に記載の異物検査装置。
2. The first light receiving optical system receives only the first scattered light by the first oblique incidence optical system, and the second light receiving optical system is the second oblique incidence optical system. By the second
2. The foreign matter inspection apparatus according to claim 1, further comprising means for receiving only the scattered light.
【請求項3】(3) 請求項1又は請求項2に記載の異物検査Foreign matter inspection according to claim 1 or claim 2.
装置を用いて、被検査面上の異物を検査することを特徴Inspecting foreign matter on the surface to be inspected using the device
とする異物検査方法。Foreign matter inspection method.
JP30219493A 1993-11-09 1993-11-09 Foreign matter inspection apparatus and method Expired - Lifetime JP3336392B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30219493A JP3336392B2 (en) 1993-11-09 1993-11-09 Foreign matter inspection apparatus and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30219493A JP3336392B2 (en) 1993-11-09 1993-11-09 Foreign matter inspection apparatus and method

Publications (2)

Publication Number Publication Date
JPH07134104A JPH07134104A (en) 1995-05-23
JP3336392B2 true JP3336392B2 (en) 2002-10-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP3336392B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR980010412A (en) * 1996-07-09 1998-04-30 고노 시게오 Foreign body inspection device
JP4808162B2 (en) * 2007-01-17 2011-11-02 株式会社日立ハイテクノロジーズ Substrate inspection apparatus and substrate inspection method
JP2010133864A (en) * 2008-12-05 2010-06-17 Nikon Corp Apparatus and method for detecting foreign substance, and apparatus and method for exposure

Also Published As

Publication number Publication date
JPH07134104A (en) 1995-05-23

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