JP2005156416A - Method and apparatus for inspecting glass substrate - Google Patents

Method and apparatus for inspecting glass substrate Download PDF

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JP2005156416A
JP2005156416A JP2003396970A JP2003396970A JP2005156416A JP 2005156416 A JP2005156416 A JP 2005156416A JP 2003396970 A JP2003396970 A JP 2003396970A JP 2003396970 A JP2003396970 A JP 2003396970A JP 2005156416 A JP2005156416 A JP 2005156416A
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light
glass substrate
intensity
back surface
inspection
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Noboru Kato
昇 加藤
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Hitachi High Tech Corp
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Hitachi High Tech Electronics Engineering Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To inspect flaws on the periphery of a glass substrate, using an easy method or a simple apparatus. <P>SOLUTION: A light-projecting system 10 projects strip-shaped inspection light with a cross section which is long in the Y-direction, obliquely on the periphery including edge sections of the glass substrate 1. A condenser lens 21 of a light-receiving system 20 condenses reflected light and scattered light from the rear face of the glass substrate 1, and a slit plate 22 blocks the scattered light and makes the reflected light to pass therethrough. An imaging lens 23 provides image of the light passing through the slit plate 22 onto a light receiving surface of a CCD line sensor 24, and the CCD line sensor 24 outputs a detection signal which corresponds to the intensity of the light received by the light-receiving surface, to a detection device 40. Although the intensity of the reflected light hardly varies, even when a foreign substance is attached to the rear face of the glass substrate 1, when a flaw exists in the rear face of the glass substrate 1, a portion of the light reaching the glass substrate 1 is scattered, and the intensity of the reflected light is lowered. The detection device 40 detects flaws in the rear face of the glass substrate 1, based on the position of a variation point in the detection signal from the CCD line sensor 24. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、表示用パネル等の製造に用いられるガラス基板の検査方法及び検査装置に係り、特にガラス基板の周辺部の傷を検査するのに好適なガラス基板の検査方法及び検査装置に関する。   The present invention relates to a glass substrate inspection method and inspection apparatus used for manufacturing display panels and the like, and more particularly to a glass substrate inspection method and inspection apparatus suitable for inspecting scratches on the periphery of a glass substrate.

表示用パネルとして用いられる液晶ディスプレイ装置のTFT(Thin Film Transistor)基板やカラーフィルタ基板、プラズマディスプレイパネル用基板、有機EL(Electroluminescence)表示パネル用基板等の製造は、フォトリソグラフィー技術によりガラス基板上にパターンを形成して行われる。その際、ガラス基板の表面に傷や異物等の欠陥が存在すると、パターンが良好に形成されず、不良の原因となる。このため、従来、欠陥検査装置を用いて、ガラス基板の表面の傷や異物等の欠陥の検査が行われていた。   Manufacture of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, etc. for liquid crystal display devices used as display panels on glass substrates using photolithography technology This is done by forming a pattern. At that time, if a defect such as a scratch or a foreign substance exists on the surface of the glass substrate, the pattern is not formed well, which causes a defect. For this reason, conventionally, inspection of defects such as scratches and foreign matters on the surface of the glass substrate has been performed using a defect inspection apparatus.

欠陥検査装置は、レーザービーム等の検査光をガラス基板へ照射し、ガラス基板の表面又は裏面からの反射光又は散乱光を受光して、傷や異物等の欠陥の検出を行うものである。欠陥検査装置を用いたガラス基板の検査において、検出された欠陥が傷や異物等のいずれであるかを判定する方法として、特許文献1に記載の技術が知られている。また、検出された欠陥がガラス基板の表面と裏面のいずれに存在するかを識別する方法として、特許文献2に記載の技術が知られている。
特開平9−257642号公報 特開平9−258197号公報
The defect inspection apparatus irradiates a glass substrate with inspection light such as a laser beam and receives reflected light or scattered light from the front or back surface of the glass substrate to detect defects such as scratches and foreign matter. A technique described in Patent Document 1 is known as a method for determining whether a detected defect is a scratch or a foreign substance in an inspection of a glass substrate using a defect inspection apparatus. Moreover, the technique of patent document 2 is known as a method of identifying whether the detected defect exists in the front surface or the back surface of a glass substrate.
Japanese Patent Laid-Open No. 9-257642 JP-A-9-258197

ガラス基板のパターンが形成されない周辺部では、異物の付着があまり問題とならない。一方、ガラス基板の周辺部は欠け等の傷が発生し易く、ガラス基板の周辺部に傷があると、熱的衝撃又は物理的衝撃を受けた際にガラス基板が破損する恐れがある。このため、ガラス基板の周辺部の傷のみを独立して検査したいという要求があり、近年のガラス基板の大型化に伴って、そのような要求が益々強くなってきた。   In the peripheral part where the pattern of the glass substrate is not formed, the adhesion of foreign matters is not a problem. On the other hand, scratches such as chips are easily generated in the peripheral portion of the glass substrate, and if there is a scratch in the peripheral portion of the glass substrate, the glass substrate may be damaged when subjected to thermal shock or physical shock. For this reason, there is a demand to independently inspect only the scratches on the peripheral portion of the glass substrate, and such a demand has become stronger with the recent increase in size of the glass substrate.

しかしながら、従来の欠陥検査装置では、ガラス基板の傷を異物と分離して検出することができず、検出された欠陥が傷であるかを判定するために特許文献1に記載のような処理を行わなければならなかった。従って、装置が複雑となり、また検査に時間が掛かるという問題があった。   However, the conventional defect inspection apparatus cannot detect the scratches on the glass substrate separately from the foreign matter, and performs a process as described in Patent Document 1 in order to determine whether the detected defects are scratches. Had to be done. Therefore, there is a problem that the apparatus becomes complicated and the inspection takes time.

本発明の課題は、ガラス基板に付着した異物を検出することなく、ガラス基板の傷を検出することである。また、本発明の課題は、簡単な方法又は装置で、ガラス基板の周辺部の傷を検査することである。   The subject of this invention is detecting the damage | wound of a glass substrate, without detecting the foreign material adhering to the glass substrate. Moreover, the subject of this invention is test | inspecting the damage | wound of the peripheral part of a glass substrate with a simple method or apparatus.

本発明のガラス基板の検査方法は、平行光線束からなる検査光をガラス基板の表面へ斜めに照射し、ガラス基板の裏面からの散乱光を遮断して、ガラス基板の裏面からの反射光を受光し、受光した反射光の強度から、ガラス基板の裏面の傷を検出するものである。   The glass substrate inspection method of the present invention obliquely irradiates the surface of the glass substrate with inspection light comprising a parallel light bundle, blocks scattered light from the back surface of the glass substrate, and reflects reflected light from the back surface of the glass substrate. The scratches on the back surface of the glass substrate are detected from the received light and the intensity of the received reflected light.

また、本発明のガラス基板の検査装置は、光源と、光源が発生した光を平行光線束に集束する集束手段とを有し、集束手段により集束された検査光をガラス基板の表面へ斜めに照射する投光系と、ガラス基板の裏面からの散乱光を遮断してガラス基板の裏面からの反射光を通過させる遮光手段と、遮光手段を通過した光を受光する受光手段とを有する受光系と、受光手段が受光した光の強度から、ガラス基板の裏面の傷を検出する検出手段とを備えたものである。   The glass substrate inspection apparatus of the present invention includes a light source and a focusing unit that focuses the light generated by the light source into a parallel light bundle, and the inspection light focused by the focusing unit is obliquely directed to the surface of the glass substrate. A light receiving system having a light projecting system for irradiating, a light shielding means for blocking scattered light from the back surface of the glass substrate and allowing reflected light from the back surface of the glass substrate to pass, and a light receiving means for receiving the light passing through the light shielding means And detecting means for detecting a scratch on the back surface of the glass substrate from the intensity of light received by the light receiving means.

ガラス基板の表面へ斜めに照射された検査光の一部は、ガラス基板の内部へ屈折してガラス基板の裏面へ到達し、ガラス基板の裏面で反射される。ガラス基板の裏面に異物が付着していても、ガラス基板の裏面からの反射光の強度はほとんど変化しない。一方、ガラス基板の裏面に傷があると、ガラス基板の裏面へ到達した光の一部が散乱され、ガラス基板の裏面からの反射光の強度が低下する。ガラス基板の裏面からの散乱光を遮断して、ガラス基板の裏面からの反射光を受光し、受光した反射光の強度から、ガラス基板の裏面の傷を検出する。   Part of the inspection light irradiated obliquely onto the surface of the glass substrate is refracted into the glass substrate, reaches the back surface of the glass substrate, and is reflected by the back surface of the glass substrate. Even if foreign matter adheres to the back surface of the glass substrate, the intensity of the reflected light from the back surface of the glass substrate hardly changes. On the other hand, if there is a scratch on the back surface of the glass substrate, a part of the light reaching the back surface of the glass substrate is scattered, and the intensity of reflected light from the back surface of the glass substrate is reduced. The scattered light from the back surface of the glass substrate is blocked, the reflected light from the back surface of the glass substrate is received, and scratches on the back surface of the glass substrate are detected from the intensity of the received reflected light.

さらに、本発明のガラス基板の検査方法は、断面が帯状の検査光をガラス基板の端部を含む周辺部へ照射し、受光した反射光の強度の変化点の位置から、ガラス基板の周辺部の傷を検出するものである。また、本発明のガラス基板の検査装置は、集束手段が、光源が発生した光を断面が帯状の平行光線束に集束し、投光系が、検査光をガラス基板の端部を含む周辺部へ照射し、検出手段が、受光手段が受光した光の強度の変化点の位置から、ガラス基板の周辺部の傷を検出するものである。   Further, the glass substrate inspection method of the present invention irradiates the peripheral portion including the end portion of the glass substrate with inspection light having a strip-like cross section, and from the position of the intensity change point of the received reflected light, the peripheral portion of the glass substrate It is intended to detect flaws. Further, in the glass substrate inspection apparatus of the present invention, the focusing means focuses the light generated by the light source into a parallel light bundle having a cross section in the cross section, and the light projecting system includes a peripheral portion including the end of the glass substrate. The detection means detects scratches on the periphery of the glass substrate from the position of the change point of the intensity of the light received by the light receiving means.

断面が帯状の検査光をガラス基板の端部を含む周辺部へ照射すると、ガラス基板の外側では反射が行われないので、ガラス基板の端部の位置で反射光の強度が変化する。ガラス基板の裏面に傷があると、ガラス基板の裏面へ到達した光の一部が散乱され、反射光の強度の変化点が移動する。反射光の強度の変化点の位置から、ガラス基板の周辺部の傷を検出する。   When the inspection light having a strip-like cross section is irradiated to the peripheral portion including the end portion of the glass substrate, since the reflection is not performed outside the glass substrate, the intensity of the reflected light changes at the position of the end portion of the glass substrate. If there is a scratch on the back surface of the glass substrate, a part of the light reaching the back surface of the glass substrate is scattered, and the changing point of the intensity of the reflected light moves. A scratch on the periphery of the glass substrate is detected from the position of the change point of the intensity of the reflected light.

本発明によれば、ガラス基板の裏面からの散乱光を遮断して、ガラス基板の裏面からの反射光を受光することにより、ガラス基板の裏面の異物を検出することなく、ガラス基板の裏面の傷を検出することができる。また、平行光線束からなる検査光をガラス基板の表面へ斜めに照射することにより、スリット板等の遮光手段を用いてガラス基板の裏面からの散乱光を容易に遮断することができる。   According to the present invention, the scattered light from the back surface of the glass substrate is blocked, and the reflected light from the back surface of the glass substrate is received, so that no foreign matter on the back surface of the glass substrate is detected. Scratches can be detected. Further, by irradiating the surface of the glass substrate with inspection light composed of parallel light beams obliquely, scattered light from the back surface of the glass substrate can be easily blocked using a light shielding means such as a slit plate.

さらに、断面が帯状の検査光を用い、反射光の強度の変化点の位置からガラス基板の周辺部の傷を検出することにより、簡単な方法又は装置で、ガラス基板の周辺部の傷を検査することができる。   Furthermore, by using a strip-shaped inspection light and detecting scratches on the periphery of the glass substrate from the position of the reflected light intensity change point, the scratches on the periphery of the glass substrate are inspected with a simple method or apparatus. can do.

図1は、本発明の一実施の形態によるガラス基板の検査装置の概略構成を示す図である。検査装置は、チャック2、投光系10、受光系20、移動機構30、及び検出装置40を含んで構成されている。図2は、本発明の一実施の形態によるガラス基板の検査装置の投光系及び受光系を示す斜視図である。なお、チャック2、移動機構30及び検出装置40は、図2では省略されている。   FIG. 1 is a diagram showing a schematic configuration of a glass substrate inspection apparatus according to an embodiment of the present invention. The inspection device includes the chuck 2, the light projecting system 10, the light receiving system 20, the moving mechanism 30, and the detection device 40. FIG. 2 is a perspective view showing a light projecting system and a light receiving system of the glass substrate inspection apparatus according to the embodiment of the present invention. Note that the chuck 2, the moving mechanism 30, and the detection device 40 are omitted in FIG.

本実施の形態の検査装置による検査は、従来の欠陥検査装置による検査とは別に実施される。両者を実施する場合、従来の欠陥検査装置による検査は、ガラス基板の周辺部を支持した状態で、ガラス基板の周辺部を除く中央部について行う。一方、本実施の形態の検査装置による検査は、ガラス基板の中央部を支持した状態で、ガラス基板1の端部を含む周辺部について行う。   The inspection by the inspection apparatus of this embodiment is performed separately from the inspection by the conventional defect inspection apparatus. When both are implemented, the inspection by the conventional defect inspection apparatus is performed on the central portion excluding the peripheral portion of the glass substrate while supporting the peripheral portion of the glass substrate. On the other hand, the inspection by the inspection apparatus of the present embodiment is performed on the peripheral portion including the end portion of the glass substrate 1 while supporting the central portion of the glass substrate.

図1において、チャック2は、ガラス基板1の中央部を真空吸着等により固定する。チャック2に固定されたガラス基板1の上方には、投光系10及び受光系20が配置されている。   In FIG. 1, a chuck 2 fixes the central portion of a glass substrate 1 by vacuum suction or the like. A light projecting system 10 and a light receiving system 20 are arranged above the glass substrate 1 fixed to the chuck 2.

投光系10は、レーザー光源11及び集束レンズ12を含んで構成されている。レーザー光源11は、検査光となるレーザー光を発生する。集束レンズ12は、レーザー光源11から発生されたレーザー光を、断面がY方向に長い帯状の平行光線束に集束する。投光系10は、集束レンズ12から射出された断面がY方向に長い帯状の検査光を、ガラス基板1の端部を含む周辺部へ角度αで斜めに照射する。   The light projecting system 10 includes a laser light source 11 and a focusing lens 12. The laser light source 11 generates laser light serving as inspection light. The converging lens 12 condenses the laser light generated from the laser light source 11 into a strip-shaped parallel light beam having a long cross section in the Y direction. The light projecting system 10 irradiates the peripheral portion including the end portion of the glass substrate 1 obliquely at an angle α with a strip-shaped inspection light having a cross section emitted from the focusing lens 12 and extending in the Y direction.

ガラス基板1の表面へ斜めに照射された検査光の一部は、ガラス基板1の内部へ屈折してガラス基板1の裏面へ到達し、ガラス基板1の裏面で反射される。ガラス基板1の裏面で反射された反射光は、ガラス基板1の内部を通り、ガラス基板1の表面から外部へ入射角と同じ角度αで斜めに射出される。また、ガラス基板1の裏面に傷がある場合、ガラス基板1の裏面へ到達した光の一部が散乱され、散乱光が発生する。発生した散乱光は、ガラス基板1の内部を通り、ガラス基板1の表面から外部へ任意の角度で射出される。   A part of the inspection light irradiated obliquely onto the surface of the glass substrate 1 is refracted into the glass substrate 1 to reach the back surface of the glass substrate 1 and reflected by the back surface of the glass substrate 1. The reflected light reflected by the back surface of the glass substrate 1 passes through the inside of the glass substrate 1 and is emitted obliquely from the surface of the glass substrate 1 to the outside at the same angle α as the incident angle. Moreover, when there is a scratch on the back surface of the glass substrate 1, a part of the light reaching the back surface of the glass substrate 1 is scattered, and scattered light is generated. The generated scattered light passes through the inside of the glass substrate 1 and is emitted from the surface of the glass substrate 1 to the outside at an arbitrary angle.

受光系20は、集光レンズ21、スリット板22、結像レンズ23、及びCCDラインセンサー24を含んで構成されている。集光レンズ21は、ガラス基板1の表面から射出された反射光及び散乱光を集光する。スリット板22は、Y方向に長い帯状のスリットを有し、集光レンズ21で集光された反射光及び散乱光のうち、散乱光を遮断して反射光を通過させる。結像レンズ23は、スリット板22を通過した光を、CCDラインセンサー24の受光面に結像させる。CCDラインセンサー24は、受光面のY方向に複数のCCDが配列され、受光面で受光した光の強度に応じた検出信号を検出装置40へ出力する。   The light receiving system 20 includes a condenser lens 21, a slit plate 22, an imaging lens 23, and a CCD line sensor 24. The condensing lens 21 condenses the reflected light and scattered light emitted from the surface of the glass substrate 1. The slit plate 22 has a strip-like slit that is long in the Y direction, and blocks the scattered light out of the reflected light and scattered light collected by the condenser lens 21 and allows the reflected light to pass. The imaging lens 23 forms an image of the light that has passed through the slit plate 22 on the light receiving surface of the CCD line sensor 24. The CCD line sensor 24 has a plurality of CCDs arranged in the Y direction of the light receiving surface, and outputs a detection signal corresponding to the intensity of light received by the light receiving surface to the detection device 40.

移動機構30は、XY移動機構と回転機構とを備え、投光系10と受光系20との相対位置を一定に保ちながら、両者をX方向又はY方向へ移動させ、または回転させる。投光系10及び受光系20をX方向へ移動させることにより、図2において、投光系10から照射された検査光がガラス基板1の端部1aを含む周辺部をX方向へ移動し、ガラス基板1の端部1aを含む周辺部の検査が行われる。続いて、投光系10及び受光系20をY方向へステップ移動させた後、投光系10及び受光系20をX方向に逆方向へ移動させることにより、ガラス基板1の端部1cを含む周辺部の検査が行われる。投光系10及び受光系20を90度回転させた後、X方向とY方向を入れ替えて同様の操作を行うことにより、ガラス基板1の端部1b,1dを含む周辺部の検査が行われる。   The moving mechanism 30 includes an XY moving mechanism and a rotating mechanism, and moves or rotates both in the X direction or the Y direction while keeping the relative position of the light projecting system 10 and the light receiving system 20 constant. By moving the light projecting system 10 and the light receiving system 20 in the X direction, in FIG. 2, the inspection light irradiated from the light projecting system 10 moves in the X direction around the peripheral portion including the end 1a of the glass substrate 1, The peripheral part including the end part 1a of the glass substrate 1 is inspected. Subsequently, after the light projecting system 10 and the light receiving system 20 are moved stepwise in the Y direction, the light projecting system 10 and the light receiving system 20 are moved in the reverse direction in the X direction, thereby including the end 1c of the glass substrate 1. Peripheral inspection is performed. After rotating the light projecting system 10 and the light receiving system 20 by 90 degrees, the peripheral portion including the end portions 1b and 1d of the glass substrate 1 is inspected by switching the X direction and the Y direction and performing the same operation. .

なお、移動機構30を用いて投光系10及び受光系20を移動及び回転させる代わりに、チャック2を搭載するXYθステージ等を用いて、ガラス基板1を移動及び回転させてもよい。   Instead of moving and rotating the light projecting system 10 and the light receiving system 20 using the moving mechanism 30, the glass substrate 1 may be moved and rotated using an XYθ stage on which the chuck 2 is mounted.

検出装置40は、CCDラインセンサー24の検出信号から、ガラス基板1の裏面の傷を次の様にして検出する。ガラス基板の裏面の周辺部に異物が付着している場合について、図3(a)はガラス基板の端部を含む周辺部の斜視図、図3(b)は同断面図、図3(c)は検出信号を示す図である。また、ガラス基板の裏面の端部に欠けがある場合について、図4(a)はガラス基板の端部を含む周辺部の斜視図、図4(b)は同断面図、図4(c)は検出信号を示す図である。   The detection device 40 detects a scratch on the back surface of the glass substrate 1 from the detection signal of the CCD line sensor 24 as follows. FIG. 3A is a perspective view of a peripheral portion including an end portion of the glass substrate, FIG. 3B is a cross-sectional view thereof, and FIG. ) Is a diagram showing a detection signal. 4A is a perspective view of a peripheral portion including the end portion of the glass substrate, FIG. 4B is a cross-sectional view thereof, and FIG. FIG. 4 is a diagram showing detection signals.

図3(a)に示すように検査光が照射されと、ガラス基板1の裏面の周辺部に異物3が付着していても、ガラス基板1の裏面からの反射光の強度はほとんど変化しない。ガラス基板1の外側では反射が行われないので、図3(b),(c)に示すように、ガラス基板1の端部の位置で反射光の強度を示す検出信号が変化する。   When the inspection light is irradiated as shown in FIG. 3A, the intensity of the reflected light from the back surface of the glass substrate 1 hardly changes even if the foreign material 3 adheres to the peripheral portion of the back surface of the glass substrate 1. Since reflection is not performed outside the glass substrate 1, the detection signal indicating the intensity of the reflected light changes at the end position of the glass substrate 1 as shown in FIGS. 3 (b) and 3 (c).

一方、ガラス基板1の裏面の端部に欠け4がある場合、図4(a)に示すように検査光が照射されると、ガラス基板1の裏面へ到達した検査光の一部が欠け4の部分で散乱される。従って、図4(b),(c)に示すように、ガラス基板1の欠け4の位置で反射光の強度を示す検出信号が変化する。検出装置40は、CCDラインセンサー24の検出信号の変化点の位置、即ち反射光の強度の変化点の位置から、ガラス基板1の端部の欠け4を検出する。   On the other hand, when there is a chip 4 at the end of the back surface of the glass substrate 1, when the inspection light is irradiated as shown in FIG. 4A, a part of the inspection light reaching the back surface of the glass substrate 1 is chipped 4. It is scattered in the part. Therefore, as shown in FIGS. 4B and 4C, the detection signal indicating the intensity of the reflected light changes at the position of the chip 4 on the glass substrate 1. The detection device 40 detects the chip 4 at the end of the glass substrate 1 from the position of the change point of the detection signal of the CCD line sensor 24, that is, the position of the change point of the intensity of the reflected light.

さらに、ガラス基板1の裏面にスクラッチ傷等のその他の傷がある場合も、ガラス基板1の裏面へ到達した検査光の一部がそれらの傷で散乱されるので、CCDラインセンサー24の検出信号の変化点の位置から、ガラス基板1の裏面のその他の傷を検出することができる。   Furthermore, even when there are other scratches such as scratches on the back surface of the glass substrate 1, a part of the inspection light reaching the back surface of the glass substrate 1 is scattered by these scratches, so that the detection signal of the CCD line sensor 24 Other scratches on the back surface of the glass substrate 1 can be detected from the position of the change point.

以上説明した実施の形態によれば、ガラス基板の裏面からの散乱光を遮断して、ガラス基板の裏面からの反射光を受光することにより、ガラス基板の裏面の異物を検出することなく、ガラス基板の裏面の傷を検出することができる。また、平行光線束からなる検査光をガラス基板の表面へ斜めに照射することにより、スリット板22を用いてガラス基板の裏面からの散乱光を容易に遮断することができる。   According to the embodiment described above, the scattered light from the back surface of the glass substrate is blocked, and the reflected light from the back surface of the glass substrate is received, so that the glass is not detected on the back surface of the glass substrate. Scratches on the back surface of the substrate can be detected. Moreover, by irradiating the surface of the glass substrate obliquely with the inspection light composed of parallel light beams, the scattered light from the back surface of the glass substrate can be easily blocked using the slit plate 22.

さらに、断面が帯状の検査光を用い、反射光の強度の変化点の位置からガラス基板の周辺部の傷を検出することにより、簡単な手順又は装置で、ガラス基板の周辺部の傷を検査することができる。   In addition, by using a strip-shaped inspection light and detecting scratches on the periphery of the glass substrate from the position of the reflected light intensity change point, the scratches on the periphery of the glass substrate are inspected with a simple procedure or device. can do.

本発明の一実施の形態によるガラス基板の検査装置の概略構成を示す図である。It is a figure which shows schematic structure of the inspection apparatus of the glass substrate by one embodiment of this invention. 本発明の一実施の形態によるガラス基板の検査装置の投光系及び受光系を示す斜視図である。It is a perspective view which shows the light projection system and light reception system of the inspection apparatus of the glass substrate by one embodiment of this invention. ガラス基板の裏面の周辺部に異物が付着している場合について、図3(a)はガラス基板の端部を含む周辺部の斜視図、図3(b)は同断面図、図3(c)は検出信号を示す図である。FIG. 3A is a perspective view of a peripheral portion including an end portion of the glass substrate, FIG. 3B is a cross-sectional view thereof, and FIG. ) Is a diagram showing a detection signal. ガラス基板の裏面の端部に欠けがある場合について、図4(a)はガラス基板の端部を含む周辺部の斜視図、図4(b)は同断面図、図4(c)は検出信号を示す図である。FIG. 4A is a perspective view of a peripheral portion including the end of the glass substrate, FIG. 4B is a cross-sectional view thereof, and FIG. It is a figure which shows a signal.

符号の説明Explanation of symbols

1 ガラス基板
2 チャック
10 投光系
11 レーザー光源
12 集束レンズ
20 受光系
21 集光レンズ
22 スリット板
23 結像レンズ
24 CCDラインセンサー
30 移動機構
40 検出装置
DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Chuck 10 Light projection system 11 Laser light source 12 Condensing lens 20 Light receiving system 21 Condensing lens 22 Slit plate 23 Imaging lens 24 CCD line sensor 30 Moving mechanism 40 Detection apparatus

Claims (4)

平行光線束からなる検査光をガラス基板の表面へ斜めに照射し、
ガラス基板の裏面からの散乱光を遮断して、ガラス基板の裏面からの反射光を受光し、
受光した反射光の強度から、ガラス基板の裏面の傷を検出することを特徴とするガラス基板の検査方法。
Irradiate the surface of the glass substrate obliquely with inspection light consisting of parallel light bundles,
Blocks scattered light from the back side of the glass substrate, receives reflected light from the back side of the glass substrate,
A method for inspecting a glass substrate, comprising detecting a scratch on the back surface of the glass substrate from the intensity of received reflected light.
断面が帯状の検査光をガラス基板の端部を含む周辺部へ照射し、
受光した反射光の強度の変化点の位置から、ガラス基板の周辺部の傷を検出することを特徴とする請求項1に記載のガラス基板の検査方法。
Irradiate the periphery including the edge of the glass substrate with a strip-shaped inspection light,
The method for inspecting a glass substrate according to claim 1, wherein a flaw on the periphery of the glass substrate is detected from the position of the change point of the intensity of the received reflected light.
光源と、前記光源が発生した光を平行光線束に集束する集束手段とを有し、前記集束手段により集束された検査光をガラス基板の表面へ斜めに照射する投光系と、
ガラス基板の裏面からの散乱光を遮断してガラス基板の裏面からの反射光を通過させる遮光手段と、前記遮光手段を通過した光を受光する受光手段とを有する受光系と、
前記受光手段が受光した光の強度から、ガラス基板の裏面の傷を検出する検出手段とを備えたことを特徴とするガラス基板の検査装置。
A light source and a light projecting system that obliquely irradiates the surface of the glass substrate with the inspection light focused by the focusing means, the light source and a focusing means for focusing the light generated by the light source into a parallel beam bundle;
A light receiving system having a light shielding means for blocking scattered light from the back surface of the glass substrate and allowing reflected light from the back surface of the glass substrate to pass through, and a light receiving means for receiving the light that has passed through the light shielding means;
An inspection apparatus for a glass substrate, comprising: detection means for detecting scratches on the back surface of the glass substrate from the intensity of light received by the light receiving means.
前記集束手段は、前記光源が発生した光を断面が帯状の平行光線束に集束し、
前記投光系は、検査光をガラス基板の端部を含む周辺部へ照射し、
前記検出手段は、前記受光手段が受光した光の強度の変化点の位置から、ガラス基板の周辺部の傷を検出することを特徴とする請求項3に記載のガラス基板の検査装置。
The focusing means focuses the light generated by the light source into a parallel light beam having a strip-like cross section,
The light projecting system irradiates the peripheral part including the end of the glass substrate with inspection light,
The said detection means detects the damage | wound of the peripheral part of a glass substrate from the position of the change point of the intensity | strength of the light which the said light-receiving means received, The inspection apparatus of the glass substrate of Claim 3 characterized by the above-mentioned.
JP2003396970A 2003-11-27 2003-11-27 Method and apparatus for inspecting glass substrate Pending JP2005156416A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100921833B1 (en) * 2007-11-08 2009-10-16 주식회사 나래나노텍 Apparatus and Method for Sensing Foreign Particles On or Below Glass for Flat Panel Display
JP2014044094A (en) * 2012-08-24 2014-03-13 Hitachi High-Technologies Corp Substrate inspection method and device
CN104316189A (en) * 2014-11-03 2015-01-28 苏州精创光学仪器有限公司 Online measuring method for color and reflectivity of glass
CN114002232A (en) * 2021-09-23 2022-02-01 蔡婷 Liquid crystal display panel cutting detection method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100921833B1 (en) * 2007-11-08 2009-10-16 주식회사 나래나노텍 Apparatus and Method for Sensing Foreign Particles On or Below Glass for Flat Panel Display
JP2014044094A (en) * 2012-08-24 2014-03-13 Hitachi High-Technologies Corp Substrate inspection method and device
CN104316189A (en) * 2014-11-03 2015-01-28 苏州精创光学仪器有限公司 Online measuring method for color and reflectivity of glass
CN114002232A (en) * 2021-09-23 2022-02-01 蔡婷 Liquid crystal display panel cutting detection method

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