JP2014044094A - Substrate inspection method and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To conduct inspection in positions on the front face and rear face of a substrate without causing mutual interference.SOLUTION: A substrate inspection device includes a space filter 15 so configured as to intercept reception of scattered light by a light receiving area occupying about a half of the side irradiated with inspection light 10a. Even if a foreign matter 1c on the rear face side of the substrate 1 is irradiated with the inspection light 10a having proceeded within a substrate 1 and being emitted from the rear face side, scattered light from the foreign matter 1c is removed by the space filter 15 and is not received by the optical system. The scattered light from the rear face side foreign matter 1c is thereby removed, and inspection in the positions on the front face and rear face sides of the substrate 1 are conducted without causing mutual interference. The space filter 15 is configured of a shield plate in which an opening is provided for receiving the scattered light on the reverse side to the side irradiated with the inspection light 10a, namely the light receiving area occupying about a half of the side in the proceeding direction of the inspection light 10a.

Description

  The present invention relates to a substrate inspection method and apparatus for inspecting a substrate such as a glass substrate or a plastic substrate used for manufacturing a display panel or the like, and more particularly, a substrate inspection capable of improving the separation accuracy of foreign matters on both the front and back surfaces of a substrate. It relates to a method and a device.

  Manufacture of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electro Luminescence) display panel substrates, etc. for liquid crystal display devices used as display panels is a glass substrate by photolithography technology. Or by forming a pattern on a plastic substrate or the like. At that time, if a defect such as a scratch or a foreign substance exists on the surface or inside of the substrate, the pattern is not formed well, which causes a defect. For this reason, a substrate inspection apparatus is used to inspect defects such as scratches and foreign matters on the substrate surface and inside.

  A substrate inspection device irradiates a substrate with inspection light such as laser light and receives reflected light, scattered light or transmitted light from the substrate, and detects defects such as scratches and foreign matter on the front surface, back surface, and inside the substrate. It is. As such a substrate inspection apparatus, one described in Patent Document 1 is known. The substrate inspection apparatus described in Patent Document 1 detects three types of defects existing on the front surface, the back surface, or the inside of a glass substrate, and determines these types.

Japanese Patent Laid-Open No. 9-257642

  FIG. 1 is a diagram showing an outline of a conventional substrate inspection apparatus. FIG. 1 shows a light receiving optical system that receives inspection light irradiated on the substrate 1 and scattered light from the surface of the substrate 1. As shown in FIG. 1, the inspection light 10a is irradiated on the surface of the substrate 1 at a predetermined incident angle θ. When there is no defect such as a scratch or a foreign substance on the front surface, back surface, and inside of the substrate 1, a part of the inspection light 10a irradiated obliquely to the substrate 1 is reflected by the surface of the substrate 1, and the remaining inspection light is the substrate. 1 is transmitted through the inside of the substrate 1 and emitted from the back surface of the substrate 1. When there is a defect such as a scratch or a foreign substance on the front or back surface of the substrate 1, the light irradiated to the defect such as a scratch or a foreign substance on the front or back surface of the substrate 1 is scattered in the inspection light 10a irradiated to the substrate 1. In the same manner as described above, a part of the light irradiated to other portions is reflected by the surface and the rest is transmitted.

  In FIG. 1, the light receiving optical system includes a condenser lens 28, an imaging lens 29, and a CCD line sensor 30. The condensing lens 28 collects light (scattered light) scattered by defects such as scratches on the front surface or back surface of the substrate 1 and defects such as foreign matter out of the light irradiated on the scratches or foreign matters on the front or back surface of the substrate 1. Shine. The imaging lens 29 is scattered light scattered on the surface of the substrate 1 and forms an image of the scattered light collected by the condenser lens 28 on the light receiving surface of the CCD line sensor 30. The CCD line sensor 30 converts a detection signal corresponding to the intensity of scattered light received by the light receiving surface into a digital signal and outputs it to a signal processing circuit (not shown).

  Since the light receiving optical system of the substrate inspection apparatus shown in FIG. 1 is in focus on the surface of the substrate 1, the CCD line sensor 30 is mixed with information on scattered light from the surface of the substrate 1 and the substrate 1. Information on scattered light from the inside and the back surface may also be detected. That is, as shown in FIG. 1, when the foreign substance 1a is present on the surface of the substrate 1 in the passage range of the inspection light 10a, the foreign substance 1a is irradiated with the inspection light 10a, and the scattered light therefrom is converted into the CCD line. The sensor 30 is taken in. On the other hand, when the foreign matter 1 b exists on the back surface of the substrate 1, the inspection light 10 a is not irradiated on the foreign matter 1 b, so that scattered light from the foreign matter 1 b is not taken into the CCD line sensor 30. This is a case where the thickness t1 of the substrate 1 is about 0.7 [mm] or more. On the other hand, when the plate thickness t2 of the substrate 1 is about half the plate thickness t1, as shown by the dotted line in FIG. 1, it is the back surface of the substrate 1 and slightly in the −X direction from the focal position of the light receiving optical system. If a foreign object 1c indicated by a dotted line is present at a position apart from each other, a part of the inspection light 10a is irradiated thereto. Then, scattered light from the foreign matter 1c is taken into the visual field range of the CCD line sensor 30, and in the light receiving optical system of the substrate inspection apparatus, foreign matter detection on the surface of the substrate 1 and foreign matter detection on the back surface of the substrate 1 interfere with each other. There was a problem.

  This invention is made in view of the above-mentioned point, and it aims at providing the board | substrate inspection method and apparatus which can perform the test | inspection in each position of the surface of a board | substrate, and each back surface, without mutually interfering. .

  A first feature of the substrate inspection method according to the present invention is that a long inspection light whose longitudinal direction is perpendicular to the moving direction is emitted from a light projecting system with respect to a relatively moving substrate. A substrate inspection method for inspecting the substrate by irradiating obliquely along the moving direction and receiving the scattered light scattered from the substrate by a light receiving system, on the light receiving side of the light receiving system, Spatial filter means for blocking the reception of the scattered light is provided in a light receiving region about half of the inspection light irradiation side. In the present invention, the spatial filter means configured to block the reception of scattered light is provided in about half of the light receiving region on the side irradiated with the inspection light. Therefore, even when the inspection light travels through the substrate and is emitted from the back surface, even if the foreign material on the back surface of the substrate is irradiated, the scattered light from the foreign material is removed by the spatial filter means and is not received by the optical system. Thereby, the scattered light from the back surface foreign matter can be removed, and the inspection at the respective positions on the front surface and the back surface of the substrate can be executed without causing interference.

  A second feature of the substrate inspection method according to the present invention is the substrate inspection method according to the first feature, wherein the spatial filter means is disposed on the front surface of the light receiving system on the opposite side of the inspection light irradiation side. That is, the shield plate is provided with an opening for allowing the scattered light to pass through about half of the light receiving region. The present invention is a specific configuration of the spatial filter means. Spatial filter means is formed by providing an opening for receiving scattered light in a light receiving region on the opposite side to the side on which the inspection light is irradiated, that is, on the side in which the inspection light travels.

  A first feature of the substrate inspection apparatus according to the present invention is that, with respect to a relatively moving substrate, a long inspection light whose longitudinal direction is a direction perpendicular to the moving direction is the moving direction. A light projecting system that irradiates obliquely along the light receiving unit, a light receiving system that receives scattered light scattered from the substrate, and a light receiving area that is approximately half the light receiving side of the light receiving system and the irradiation side of the inspection light. And a spatial filter means provided so as to block the reception of the scattered light, and an inspection means for inspecting the substrate based on a signal from the light receiving system means. This is an invention of a substrate inspection apparatus which realizes the one described in the first feature of the substrate inspection method.

  A second feature of the substrate inspection apparatus according to the present invention is the substrate inspection device according to the first feature, wherein the spatial filter means is disposed on the front surface of the light receiving system means on the side opposite to the irradiation side of the inspection light. The light receiving area is formed of a shielding plate having an opening for allowing the scattered light to pass therethrough. This is an invention of a substrate inspection apparatus that realizes the second feature of the substrate inspection method.

  According to the present invention, there is an effect that inspections at respective positions on the front surface and the back surface of the substrate can be performed without causing interference.

It is a figure which shows the outline | summary of the conventional board | substrate inspection apparatus. It is the top view which looked at the board | substrate inspection apparatus which concerns on this invention from the upper side. It is the side view which looked at the board | substrate inspection apparatus of FIG. 2 from the paper front side direction. It is a figure which shows schematic structure of the optical system and control system of the board | substrate inspection apparatus which concerns on one embodiment of this invention. It is a figure which shows the outline | summary of the light reception optical system of FIG. It is a figure which shows the outline | summary of the light-receiving system of the board | substrate inspection apparatus which concerns on this embodiment. It is a figure explaining the effect of the board | substrate inspection apparatus which concerns on this embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 2 is a top view of the substrate inspection apparatus according to the present invention as viewed from above, and FIG. 3 is a side view of the substrate inspection apparatus of FIG. 2 as viewed from the front side of the drawing. The glass substrate inspection apparatus 100 is roughly composed of a base frame 2, an inspection stage 2 a, an optical unit 3, and lift pins 9.

  The base frame 2 is composed of a welded structure of a plurality of square pipes, and is installed on the floor by having legs at the bottom. The inspection stage 2a is fixed near the substrate insertion port side of the upper part of the base frame 2. The optical unit 3 has a gate-type gantry structure, and is movably mounted on the linear guides 7a and 7b that are arranged in parallel along the loading direction of the substrate 1 at the top of the base frame 2. ing. The optical unit 3 reciprocates in the X direction, which is the glass substrate loading direction, by the optical unit X driving unit 5 provided on the side surface of the base frame 2. The optical system units 4a and 4b are for inspecting defects and foreign matters on the surface of the substrate 1, and according to guides 8a and 8b provided along the side surface Y direction of the optical unit 3, an optical unit Y driving unit (not shown). 1), the shift operation is performed in the Y direction, which is perpendicular to the X direction.

  The inspection by the glass substrate inspection apparatus 100 is performed by irradiating the surface or inside of the substrate 1 with inspection light and receiving the scattered light. At this time, the optical system units 4a and 4b can inspect the surface and the inside of the substrate 1 only in the recessed portion between the mounting bars of the inspection stage 2a. Therefore, once the scanning is completed, the substrate 1 is shifted in the Y direction and the remaining portion is inspected. The entire surface of the substrate 1 can be inspected by the reciprocating operation in the X direction and the Y direction shifting operation of the optical unit 3 and the shifting operation in the Y direction of the glass substrate by the lift pins 9.

  As shown in FIG. 2, linear guides 12a and 12b are installed inside the base frame 2 in parallel in the Y direction, and a first lifter upper and lower base on which a pin Y drive unit 11 and a pin vertical drive unit 10 are mounted. A table 13 is installed. The inspection stage 2a is provided with a plurality of holes for allowing a plurality of lift pins 9 for lifting the substrate 1 to pass therethrough. A plurality of lift pins 9 are installed on the upper surface side of the lifter unit base 14 mounted on the pin vertical drive unit 10. The lift pins 9 are raised when the substrate 1 is received, and lowered after being received, thereby delivering the substrate 1 to the inspection stage 2a. Further, the lift pins 9 are raised to lift the substrate 1 and perform a shift operation in the Y direction.

  The lifter unit base 14 rides on a ball bearing 16 on the second lifter upper and lower base 15 and is freely movable in the X direction and the Y direction. The movement in the X direction and the Y direction is performed by driving an X direction alignment motor and a Y direction alignment motor mounted on the lifter upper and lower base 15 (not shown). The lifter vertical base 15 is moved in the vertical direction by driving the pin vertical drive unit 10. By raising the lifter upper / lower base 15, the lifter unit base 14 and the lift pins 9 are also raised, and the substrate 1 on the inspection stage 2 a is lifted away from the mounting bar constituting the inspection stage 2 a, and alignment and The shift operation of the substrate 1 during the inspection operation can be performed.

  FIG. 4 is a diagram showing a schematic configuration of the optical system and the control system of the substrate inspection apparatus according to the embodiment of the present invention. The optical system unit 4a includes a light projecting system that irradiates the substrate 1 with the inspection light 10a, a reflected light detection system that detects the surface reflected light 11 from the surface of the substrate 1, and a light receiving system that receives the scattered light from the substrate 1. Consists of including. Since the optical system unit 4b has the same configuration as the optical system unit 4a, description thereof is omitted. The control system includes a focus adjustment control circuit 40, a signal processing circuit 50, an inspection start sensor 51, a section speed measurement sensor 52, an optical system movement control circuit 60, a memory 70, a notification device 80, an input / output device 90, and a CPU 95. Is done.

  In FIG. 4, the light projecting system for irradiating the substrate 1 with inspection light 10 a includes a laser light source 21, a lens group 22, and a mirror 23. The laser light source 21 generates laser light that becomes the inspection light 10a. The lens group 22 condenses the inspection light 10a generated from the laser light source 21, spreads the collected inspection light 10a in a direction (Y direction) orthogonal to the substrate movement direction (X direction), and spreads the inspection light 10a. Are converged in the substrate movement direction (X direction). The mirror 23 irradiates the surface of the substrate 1 with the inspection light 10a collected by the lens group 22 at a predetermined incident angle θ. The inspection light 10a irradiated on the surface of the substrate 1 is a long (band-shaped) inspection on the surface of the substrate 1 such that the direction perpendicular to the substrate movement direction (X direction) (Y direction) is the longitudinal direction. It becomes light 10a.

  As the substrate 1 moves in the substrate moving direction (X direction), the inspection light 10a irradiated from the light projecting system scans the substrate 1 with a predetermined width. The substrate inspection apparatus inspects the front and back defects of the substrate 1 in this scanning region. In other words, the substrate inspection apparatus emits a long inspection light 10a such that the direction perpendicular to the movement direction (X direction) (Y direction) is the longitudinal direction with respect to the relatively moving substrate 1 in the movement direction. The substrate is inspected by irradiating obliquely at a predetermined incident angle θ along (X direction) and receiving scattered light scattered from the substrate 1. When there is no defect such as a scratch or a foreign substance on the surface of the substrate 1, a part of the inspection light 10a irradiated obliquely on the surface of the substrate 1 is reflected by the surface of the substrate 1 to become surface reflected light 11, and the remaining The inspection light 10 a passes through the inside of the substrate 1 and is emitted from the back surface of the substrate 1.

  In FIG. 4, the reflected light detection system includes a mirror 25, a lens 26, and a reflected light CCD line sensor 27. The surface reflected light 11 from the surface of the substrate 1 enters the lens 26 via the mirror 25. The lens 26 focuses the surface reflected light 11 from the substrate 1 and forms an image on the light receiving surface of the reflected light CCD line sensor 27. At this time, the position of the surface reflected light 11 imaged on the light receiving surface of the reflected light CCD line sensor 27 varies depending on the relative height between the optical system unit 4 a and the surface of the substrate 1. Such a change occurs due to warpage and non-uniformity of the plate thickness accompanying the increase in size of the substrate 1.

  The reflected light CCD line sensor 27 outputs a detection signal corresponding to the intensity of the surface reflected light 11 received by the light receiving surface to the focus adjustment control circuit 40. In accordance with a command from the CPU 95, the focus adjustment control circuit 40, based on the detection signal of the reflected light CCD line sensor 27, the surface reflected light 11 from the surface of the substrate 1 is the same position on the light receiving surface of the reflected light CCD line sensor 27. The focus adjustment mechanism 41 is driven to move the optical system unit 4a in the vertical direction so that the light is received at (reference position). The focus adjustment mechanism 41 includes a pulse motor 42, a ball screw 43, a nut 44, and a nut attachment 45. A ball screw 43 is attached to the rotation shaft of the pulse motor 42, and a nut 44 is attached to the side surface of the optical system unit 4a via a nut attachment 45. By supplying a driving pulse from the focus adjustment control circuit 40 to the pulse motor 42, the pulse motor 42 is rotationally driven to rotate the ball screw 43, and the optical system unit 4a is moved in the vertical direction together with the nut 44. The focal position 4a is adjusted and controlled.

  FIG. 5 is a diagram showing an outline of the light receiving optical system of FIG. FIG. 4 shows a light-receiving optical system that receives the scattered light that is irradiated with the inspection light 10 a on the substrate 1 and scattered by defects (foreign matter or the like) that exist in the irradiation region on the surface of the substrate 1. In FIG. 4, the light receiving optical system includes a spatial filter 15, a condenser lens 28, an imaging lens 29, and a CCD line sensor 30. The condensing lens 28 condenses the scattered light of the light irradiated on the surface 1 or the back surface of the substrate 1 and defects such as foreign matter. The imaging lens 29 is scattered light scattered on the surface of the substrate 1 and forms an image of the scattered light collected by the condenser lens 28 on the light receiving surface of the CCD line sensor 30. The CCD line sensor 30 converts a detection signal corresponding to the intensity of scattered light received by the light receiving surface into a digital signal and outputs it to the signal processing circuit 50. The spatial filter 15 is scattered light collected by the condenser lens 28 and shields about half of the irradiation side of the inspection light 10a. As shown in FIG. 5, the spatial filter 15 includes a light shielding plate having a semicircular opening corresponding to the circular semicircle of the condenser lens 28. That is, in the spatial filter 15, the light receiving region of the condenser lens 28 is formed with a semicircular opening. By providing such a spatial filter 15 on the light receiving surface side of the condenser lens 28, scattered light due to foreign matter on the back surface can be effectively removed.

  FIG. 6 is a diagram showing an outline of the light receiving system of the substrate inspection apparatus according to this embodiment. The light receiving system of the substrate inspection apparatus according to this embodiment is different from that of FIG. 1 as shown in FIGS. 4 and 5 and receives about half of the light received by the condenser lens 28 on the irradiation side of the inspection light 10a. This is in that a spatial filter (light shielding plate) 15 for shielding scattered light from the surface of the substrate 1 is provided on the surface. That is, the spatial filter 15 is a shielding plate having a semicircular opening for allowing scattered light to pass through approximately half of the light receiving region on the side opposite to the irradiation side (+ X direction) of the inspection light 10a (−X direction). is there. 4 and 6, for convenience of explanation, scattered light is received in the light receiving region of the light receiving system (front surface of the condensing lens 28) and about half the light receiving region on the irradiation side of the inspection light 10a (+ X direction). Only the shielding plate 15 for shielding the light is shown, and the illustration of the opening and the surrounding shielding plate is omitted.

  As shown in FIG. 6, when foreign matters 1 a and 1 b exist on the front and back surfaces of the same scanning position of the substrate 1, the inspection light 10 a is irradiated to the foreign matter 1 a on the front surface of the substrate 1, but the back surface of the substrate 1. The foreign matter 1b is not irradiated. That is, as shown in FIG. 6, when the foreign matter 1a is present on the surface of the substrate 1 in the passage range of the inspection light 10a, the foreign matter 1a is irradiated with the inspection light 10a, and the scattered light therefrom is converted into the CCD line. It is captured in the visual field range of the sensor 30. On the other hand, when the foreign matter 1 b exists on the back surface of the substrate 1, the inspection light 10 a is not irradiated on the foreign matter 1 b, so that scattered light from the foreign matter 1 b is not taken into the CCD line sensor 30.

  Further, if the foreign matter 1c indicated by the dotted line is present on the back surface of the substrate 1 and at a position slightly spaced in the −X direction from the focal position of the light receiving optical system in the passing range of the inspection light 10a, the inspection light 10a A part will be irradiated. However, in this embodiment, since the visual field range of the CCD line sensor 30 is blocked by the spatial filter 15, the scattered light from the foreign matter 1 c is not taken into the CCD line sensor 30. Therefore, according to the light receiving optical system of this embodiment, detection of the foreign matter 1a on the surface of the substrate 1 and detection of the foreign matter 1c on the back surface of the substrate 1 can be separated. Further, the scattered light from these foreign substances 1a and 1c is not generated at the same time (foreign substance detection on both the front and back surfaces of the substrate does not interfere with each other), and high-precision inspection can be performed.

  In FIG. 4, the optical system movement control circuit 60 supplies power to a drive system (not shown) according to a command from the CPU 95, and moves the optical system unit 4a in a direction (Y direction) orthogonal to the substrate movement direction (X direction). Then, the scanning area of the substrate 1 scanned with the inspection light having a predetermined width from the light projecting system of the optical system unit 4a is changed for each substrate.

  In FIG. 4, the inspection start sensor 51 and the section speed measurement sensor 52 detect the edge of the substrate 1 on the substrate moving direction side, and output the detection signal to the signal processing circuit 50. On the other hand, in FIG. 5, the signal processing circuit 50 processes the digital signal from the CCD line sensor 30 to detect defects of the substrate 1 in the scanning region for each rank of a predetermined size, and scans the detected defects. A position in a direction (Y direction) orthogonal to the substrate movement direction (X direction) in the region is detected. The signal processing circuit 50 also receives detection signals from the inspection start sensor 51 and the section speed measurement sensor 52, detects the substrate transport speed (movement speed) based on the detection elapsed time between the sensors, Based on this, the position of the defect in the substrate movement direction (X direction) is corrected and detected. The signal processing circuit 50 outputs the detected defect data to the CPU 95.

  In FIG. 4, the memory 70 stores defect data of the substrate 1 in the scanning region detected by the signal processing circuit 50 for each scanning region under the control of the CPU 95. The reporting device 80 makes various reports under the control of the CPU 95. The input / output device 90 inputs a line stop command and the like, and outputs defect data and determination results under the control of the CPU 95.

  FIG. 7 is a diagram for explaining the effect of the substrate inspection apparatus according to this embodiment. FIG. 7 is a diagram showing a histogram of detection level values in the inspection region when foreign matter on the back surface is detected using a reference sample substrate coated with standard particles on the back surface. FIG. 7A shows a histogram of foreign matter on the back surface of the substrate 1 detected without a spatial filter as shown in FIG. 1, and FIG. 7B shows a histogram of FIGS. The histogram of the foreign material of the back surface of the board | substrate 1 detected in the state which provided the spatial filter 15 in the light-receiving surface side of the condensing lens 28 is shown. By providing the spatial filter 15 immediately before the light receiving surface of the condenser lens 18, it is possible to confirm the effect that the scattered light due to the foreign matter on the back surface of the substrate 1 can be efficiently removed.

In the above-described embodiment, the case of inspecting the surface of the substrate 1 has been described. However, after the surface of the substrate 1 is inspected using the CCD line sensor 30, the height of the optical system unit 4a from the substrate 1 is determined. It is also possible to adjust and inspect the back surface of the substrate 1 as well. Further, not only the front and back surfaces of the substrate 1 but also the inside of the substrate 1, that is, the intermediate portion between the front and back surfaces may be inspected for defects.
Further, in the above-described embodiment, the case where the spatial filter (shielding plate) 15 is provided on the front surface of the condenser lens 28 has been described. However, the condensing lens 28 and the imaging lens 29 are provided with the same effect. A spatial filter (shielding plate) may be provided between or after the imaging lens 29.

1 ... substrate,
10: Pin vertical drive unit,
100: Glass substrate inspection device,
10a: Inspection light,
11: Pin Y drive unit,
11 ... surface reflected light,
12a, 12b ... linear guide,
13 ... Lifter top / bottom base,
14 ... Lifter unit base,
15 ... Lifter top / bottom base,
15 ... Spatial filter (shielding plate),
16 ... Ball bearing,
18 ... Condensing lens,
1a, 1b, 1c ... foreign matter,
2 ... Base frame,
21 ... Laser light source,
22 ... Lens group,
23, 25 ... mirror,
26 ... Lens,
27 ... CCD line sensor for reflected light,
28 ... Condensing lens,
29 ... imaging lens,
2A ... half mirror,
2a ... Inspection stage,
3 Optical part,
30 ... CCD line sensor,
40. Focus adjustment control circuit,
41. Focus adjustment mechanism,
42 ... pulse motor,
43 ... Ball screw,
44 ... nuts,
45 ... Nut fitting,
4a, 4b ... optical system unit,
5 ... Optical part X drive part,
50. Signal processing circuit,
51. Inspection start sensor,
52 ... Section speed measurement sensor,
60: Optical system movement control circuit,
70 ... Memory,
7a, 7b ... linear guide,
80 ... Reporting device,
8a, 8b ... guide,
9 ... Lift pin,
90 ... I / O device,
95 ... CPU

Claims (4)

  A long inspection light whose longitudinal direction is perpendicular to the moving direction is irradiated obliquely from the light projecting system along the moving direction with respect to the relatively moving substrate. A substrate inspection method for inspecting the substrate by receiving scattered light scattered by a light receiving system, wherein the light receiving side of the light receiving system is in a light receiving region that is approximately half of the irradiation side of the inspection light. A substrate inspection method comprising a spatial filter means for blocking scattered light reception.   2. The substrate inspection method according to claim 1, wherein the spatial filter means has an opening for allowing the scattered light to pass through a light receiving region on a front side of the light receiving system opposite to the irradiation side of the inspection light. A substrate inspection method comprising a shielding plate provided. Projection system means for irradiating a long-shaped inspection light obliquely along the moving direction such that a direction perpendicular to the moving direction is a longitudinal direction with respect to a relatively moving substrate;
A light receiving system means for receiving scattered light scattered from the substrate;
Based on a signal from the light receiving system means and a spatial filter means provided on the light receiving side of the light receiving system means so as to block light reception of the scattered light in a light receiving region about half of the irradiation side of the inspection light A substrate inspection apparatus comprising: inspection means for inspecting a substrate.   4. The substrate inspection apparatus according to claim 3, wherein the spatial filter means has an opening for allowing the scattered light to pass through a front surface of the light receiving system means to a light receiving region on a side opposite to the irradiation side of the inspection light. A substrate inspection apparatus comprising a shielding plate provided with

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