JP2007154160A5 - - Google Patents
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- Publication number
- JP2007154160A5 JP2007154160A5 JP2006279624A JP2006279624A JP2007154160A5 JP 2007154160 A5 JP2007154160 A5 JP 2007154160A5 JP 2006279624 A JP2006279624 A JP 2006279624A JP 2006279624 A JP2006279624 A JP 2006279624A JP 2007154160 A5 JP2007154160 A5 JP 2007154160A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- block
- type epoxy
- resin composition
- copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 claims description 57
- 229920000647 polyepoxide Polymers 0.000 claims description 57
- 239000000203 mixture Substances 0.000 claims description 13
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 11
- 229920001400 block copolymer Polymers 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- 230000009477 glass transition Effects 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 5
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- 238000006664 bond formation reaction Methods 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- 229920003986 novolac Polymers 0.000 claims description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims description 4
- QTPLEVOKSWEYAC-UHFFFAOYSA-N 1,2-diphenyl-9h-fluorene Chemical compound C=1C=CC=CC=1C1=C2CC3=CC=CC=C3C2=CC=C1C1=CC=CC=C1 QTPLEVOKSWEYAC-UHFFFAOYSA-N 0.000 claims description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 3
- 229930185605 Bisphenol Natural products 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 229920001519 homopolymer Polymers 0.000 claims description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 5
- 239000012783 reinforcing fiber Substances 0.000 claims 2
- 239000003733 fiber-reinforced composite Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002244 precipitate Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006279624A JP4946336B2 (ja) | 2005-11-14 | 2006-10-13 | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005328681 | 2005-11-14 | ||
| JP2005328681 | 2005-11-14 | ||
| JP2006279624A JP4946336B2 (ja) | 2005-11-14 | 2006-10-13 | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007154160A JP2007154160A (ja) | 2007-06-21 |
| JP2007154160A5 true JP2007154160A5 (enExample) | 2009-11-19 |
| JP4946336B2 JP4946336B2 (ja) | 2012-06-06 |
Family
ID=38238923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006279624A Expired - Fee Related JP4946336B2 (ja) | 2005-11-14 | 2006-10-13 | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4946336B2 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102604333B (zh) | 2006-06-30 | 2016-10-05 | 东丽株式会社 | 环氧树脂组合物、预浸料及纤维增强复合材料 |
| WO2008051373A2 (en) * | 2006-10-19 | 2008-05-02 | Dow Global Technologies Inc. | Curable epoxy resin composition having improved adhesion to metal substrates and process for making coated and fiber-reinforced composite article |
| JP5444713B2 (ja) | 2007-05-16 | 2014-03-19 | 東レ株式会社 | エポキシ樹脂組成物、プリプレグ、繊維強化複合材料 |
| JP5297607B2 (ja) * | 2007-07-03 | 2013-09-25 | 三菱レイヨン株式会社 | 繊維強化複合材料用樹脂組成物およびその製造方法ならびに複合材料中間体 |
| WO2009093467A1 (ja) * | 2008-01-25 | 2009-07-30 | Mitsui Chemicals, Inc. | エポキシ重合性組成物、それを含むシール材組成物 |
| EP2253666B1 (en) | 2008-02-15 | 2012-05-23 | Kuraray Co., Ltd. | Curable resin composition and cured resin |
| CN102165010A (zh) | 2008-09-29 | 2011-08-24 | 东丽株式会社 | 环氧树脂组合物、预浸料坯及纤维增强复合材料 |
| JP5347630B2 (ja) * | 2009-03-26 | 2013-11-20 | 東レ株式会社 | エポキシ樹脂組成物、プリプレグ、繊維強化複合材料 |
| US20120108132A1 (en) * | 2010-10-28 | 2012-05-03 | General Electric Company | Composite Compositions |
| JP6026095B2 (ja) * | 2011-10-31 | 2016-11-16 | 太陽インキ製造株式会社 | 熱硬化性樹脂組成物及びその硬化物、並びにそれを用いたプリント配線板 |
| CN102698416B (zh) * | 2012-06-29 | 2016-06-29 | 黄展刚 | 一种碳素网球拍的修补方法 |
| JP5768893B2 (ja) | 2012-08-20 | 2015-08-26 | 三菱レイヨン株式会社 | エポキシ樹脂組成物及びこれを用いたフィルム、プリプレグ、繊維強化プラスチック |
| WO2015012348A1 (ja) | 2013-07-26 | 2015-01-29 | 東レ株式会社 | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
| JP6708205B2 (ja) * | 2015-03-23 | 2020-06-10 | 日本ゼオン株式会社 | 粉体成形用塩化ビニル樹脂組成物、塩化ビニル樹脂成形体、及び積層体 |
| WO2017038603A1 (ja) * | 2015-09-04 | 2017-03-09 | 株式会社Adeka | 繊維強化プラスチック用樹脂組成物、その硬化物、該硬化物を含有する繊維強化プラスチック、及び該繊維強化プラスチックの製造方法 |
| CN111295408B (zh) * | 2017-11-08 | 2023-04-11 | Dic株式会社 | 固化性组合物和纤维增强复合材料 |
| WO2022107563A1 (ja) * | 2020-11-18 | 2022-05-27 | 東レ株式会社 | 繊維強化樹脂および一体化成形品 |
| CN116438055A (zh) * | 2020-11-18 | 2023-07-14 | 东丽株式会社 | 环氧树脂组合物、预浸料坯、纤维增强树脂成型体及一体化成型品 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0819723B1 (en) * | 1996-02-02 | 2004-06-02 | Toray Industries, Inc. | Resin compositions for fiber-reinforced composite materials and processes for producing the same, prepregs, fiber-reinforced composite materials, and honeycomb structures |
| FR2809741B1 (fr) * | 2000-05-31 | 2002-08-16 | Atofina | Materiaux thermodurs a tenue au choc amelioree |
| FR2862655B1 (fr) * | 2003-11-25 | 2007-01-05 | Arkema | Fibre organique a base de resine epoxy et d'agent regulateur de rheologie et tissus correspondants |
| FR2864963B1 (fr) * | 2004-01-13 | 2006-03-03 | Arkema | Systeme thermodurcissable reactif presentant une duree de stockage importante |
-
2006
- 2006-10-13 JP JP2006279624A patent/JP4946336B2/ja not_active Expired - Fee Related
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