JP2007150229A - Package for housing light emitting element, light source using the same and light emitting device - Google Patents

Package for housing light emitting element, light source using the same and light emitting device Download PDF

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JP2007150229A
JP2007150229A JP2006090197A JP2006090197A JP2007150229A JP 2007150229 A JP2007150229 A JP 2007150229A JP 2006090197 A JP2006090197 A JP 2006090197A JP 2006090197 A JP2006090197 A JP 2006090197A JP 2007150229 A JP2007150229 A JP 2007150229A
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light emitting
emitting element
light
mounting portion
package
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JP4789673B2 (en
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Tomoya Tabuchi
智也 田淵
Mitsuo Yanagisawa
美津夫 柳澤
Kosuke Katabe
浩介 形部
Toru Miyake
徹 三宅
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a low-height compact light emitting element package which does not cause the deterioration of the light emitting efficiency of a light emitting device, and to provide a light source using the package and a light emitting device. <P>SOLUTION: The light emitting element package comprises an insulation base 1 on one main surface and a reflective member 2 on one main surface of the insulation base 1. The base 1 has mounts 1c, 1d for mounting a light emitting element 3 and a protecting element 4 for preventing an over-voltage from being applied to the light emitting element 3, respectively, and a wiring conductor 5 for connecting the light emitting element 3 to the protecting element 4. The reflective member 2 has a light reflective surface 2a on the inner surface and is mounted so as to surround the mount 1c for the light emitting element 3. The mount for the protecting element 4 is disposed outside the light reflective surface 2a, thus forming a low-height compact light emitting element package having a good heat radiation and a high light emitting efficiency. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、発光素子を収納する発光素子収納用パッケージおよびこれを用いた光源ならびに発光装置に関し、より詳細には発光素子を逆方向電圧やサージ電圧等から保護するための保護素子を搭載する発光素子収納用パッケージおよびこれを用いた光源ならびに発光装置に関する。   The present invention relates to a light-emitting element storage package for storing a light-emitting element, a light source using the same, and a light-emitting device, and more particularly, a light-emitting device equipped with a protective element for protecting the light-emitting element from reverse voltage, surge voltage, and the like. The present invention relates to an element storage package, a light source using the same, and a light emitting device.

発光ダイオード（LED）や半導体レーザ（LD）等の発光素子を用いた発光装置は、今後さらなる低消費電力化や長寿命化が進むものと予測されている。そして、近年、各種インジゲーター、光センサ、ディスプレイ、フォトカプラ、バックライト、光プリンタヘッド、ヘッドランプ等の種々の分野で使用され始めている。   Light-emitting devices using light-emitting elements such as light-emitting diodes (LEDs) and semiconductor lasers (LDs) are expected to further reduce power consumption and extend their life. In recent years, it has begun to be used in various fields such as various indicators, optical sensors, displays, photocouplers, backlights, optical printer heads, headlamps and the like.

しかしながら、半導体化合物を発光層として用いた発光素子は逆方向に印加される電圧に対して弱く、過大な逆方向電圧が印加された場合、発光層を構成する半導体層が破壊されることがある。また、外部からのサージ電圧等の定格以上に大きな電圧が印加された場合は、順方向電圧でも発光素子が破壊される場合がある。そして、発光素子をこれらの過大な電圧から保護するために保護素子が用いられている。   However, a light emitting element using a semiconductor compound as a light emitting layer is weak against a voltage applied in the reverse direction, and when an excessive reverse voltage is applied, the semiconductor layer constituting the light emitting layer may be destroyed. . In addition, when a voltage greater than a rating such as an external surge voltage is applied, the light emitting element may be destroyed even with a forward voltage. A protective element is used to protect the light emitting element from these excessive voltages.

従来の発光装置の断面図を図２６および図２７に示す。図２６は、一般的に表面実装型と呼ばれる形状をした発光装置を示し、図２７は、一般的に砲弾型と呼ばれる形状をした発光装置を示している。   Cross-sectional views of a conventional light emitting device are shown in FIGS. FIG. 26 shows a light emitting device having a shape generally called a surface mount type, and FIG. 27 shows a light emitting device having a shape generally called a shell type.

図２６および図２７において、１１は絶縁基体、１２は反射部材、１３は発光素子、１４は保護素子、１５は配線導体、１６は透光性部材、１７はボンディングワイヤを示し、基本的にこれらにより従来の表面実装型または砲弾型の発光装置が構成される。   26 and 27, 11 is an insulating substrate, 12 is a reflecting member, 13 is a light emitting element, 14 is a protective element, 15 is a wiring conductor, 16 is a translucent member, and 17 is a bonding wire. Thus, a conventional surface mount type or bullet type light emitting device is formed.

そして、これらの発光装置には、逆方向電圧やサージ電圧（以下、単に過電圧とする）の印加に対する発光素子１３の破壊を防止するため、発光素子１３と電気的に並列に保護素子１４が搭載されている。保護素子１４は、ツェナーダイオードを発光素子１３と逆方向に接続したものや、バリスタやサイリスタ等を接続したものによって構成される。一般的にこれら保護素子１４は、保護素子１４が発光素子１３から出る光の経路を妨げることにより発光装置の発光効率が低下しないように、発光素子１３の搭載部１１ｃが設けられる絶縁基体１１の表面側と反対の裏面側に配置される。   In these light emitting devices, a protective element 14 is mounted electrically in parallel with the light emitting element 13 in order to prevent destruction of the light emitting element 13 against application of reverse voltage or surge voltage (hereinafter simply referred to as overvoltage). Has been. The protective element 14 is configured by a Zener diode connected in the opposite direction to the light emitting element 13 or a varistor, a thyristor, or the like. Generally, these protective elements 14 are provided on the insulating substrate 11 on which the mounting portion 11c of the light emitting element 13 is provided so that the light emitting efficiency of the light emitting device is not lowered by preventing the light path from the light emitting element 13 by the protective element 14. It is arranged on the back side opposite to the front side.

図２６に示す発光装置においては、絶縁基体１１の裏面側に保護素子１４を収納する凹部１１ｅが設けられており、保護素子１４を凹部１１ｅの内側に半田等で固着して、保護素子１４の電極と配線導体１５とをワイヤボンディング法やフリップチップボンディング法等で接続することにより、発光素子１３と電気的に並列接続されている。そして、例えば、保護素子１４の電圧閾値を発光素子１３の定格電圧値の１００パーセント乃至１２０パーセント程度のものとしておき、この電圧を超える過電圧の印加があった場合、保護素子１４は電気的に短絡状態（電気抵抗が非常に低い状態）となって、過電圧により突発的に発生した電流は、保護素子１４側に流れることとなり発光素子１３の破壊を防止することができる。   In the light emitting device shown in FIG. 26, a recess 11e for housing the protection element 14 is provided on the back surface side of the insulating base 11, and the protection element 14 is fixed to the inside of the recess 11e with solder or the like. The electrodes and the wiring conductor 15 are connected in parallel with the light emitting element 13 by connecting them by wire bonding or flip chip bonding. For example, the voltage threshold value of the protective element 14 is set to about 100% to 120% of the rated voltage value of the light emitting element 13, and when an overvoltage exceeding this voltage is applied, the protective element 14 is electrically short-circuited. In this state (electric resistance is very low), the current suddenly generated by the overvoltage flows to the protective element 14 side, and the light emitting element 13 can be prevented from being destroyed.

また、図２７に示す発光装置おいては、リード端子１５ａは、その先端部に発光素子１３の搭載部１１ｃおよび保護素子１４の搭載部１１ｄが設けられた、金属から成る反射部材１２が設けられており、発光素子１３および保護素子１４は、発光素子１３の搭載部１１ｃおよび保護素子１４の搭載部１１ｄに、Ａｕ−Ｓｎ半田やＰｂ−Ｓｎ半田等の半田やＡｇペースト等の樹脂により固着され、発光素子１３および保護素子１４の電極とリード端子１５ｂとをボンディングワイヤ１７によって電気的に接続する。   Further, in the light emitting device shown in FIG. 27, the lead terminal 15a is provided with a reflective member 12 made of metal having a mounting portion 11c of the light emitting element 13 and a mounting portion 11d of the protective element 14 provided at the tip thereof. The light emitting element 13 and the protective element 14 are fixed to the mounting portion 11c of the light emitting element 13 and the mounting portion 11d of the protective element 14 with a solder such as Au—Sn solder or Pb—Sn solder, or a resin such as Ag paste. The electrodes of the light emitting element 13 and the protective element 14 and the lead terminal 15b are electrically connected by the bonding wire 17.

なお、保護素子１４をリード端子１５ｂと電気的に接続させるために、保護素子１４の搭載部１１ｄを形成する反射部材１２の側壁部に切り欠き部１２ｂを設け、この切り欠き部１２ｂに保護素子１４とリード端子１５ｂとを接続するボンディングワイヤ１７を通すことによって反射部材１２と電気的に接続しないようにしてある。   In order to electrically connect the protection element 14 to the lead terminal 15b, a notch 12b is provided on the side wall portion of the reflecting member 12 forming the mounting portion 11d of the protection element 14, and the protection element is provided in the notch 12b. By connecting the bonding wire 17 connecting the lead 14 and the lead terminal 15b, the reflecting member 12 is not electrically connected.

図２６および図２７に示す上記従来の発光素子収納用パッケージの場合、保護素子１４を実装するためのエリアを発光素子１３の搭載部の横に並べて確保する必要が無く、発光装置を小型にすることが可能である。
特開２００１−０３６１４０号公報 特開２００２−２１７４５８号公報 In the case of the conventional light emitting element storage package shown in FIG. 26 and FIG. 27, it is not necessary to secure an area for mounting the protection element 14 next to the mounting portion of the light emitting element 13, and the light emitting device is downsized. It is possible.
JP 2001-036140 A JP 2002-217458 A

しかしながら、図２６に示す発光装置では、絶縁基体１１の発光素子１３搭載部１１ｃの裏面側に保護素子１４の搭載部１１ｄを形成するための凹部１１ｅが必要であり、発光素子１３が発生する熱の放熱経路に凹部１１ｅがあるために、効率良く外部へ放熱を行なうことが困難であり、発光素子１３近傍に熱が滞留してしまう。このために、発光素子１３の熱による劣化が起こり、発光装置の発光効率が低下するという問題点があった。   However, in the light emitting device shown in FIG. 26, the recess 11e for forming the mounting portion 11d of the protection element 14 is required on the back side of the light emitting element 13 mounting portion 11c of the insulating base 11, and the heat generated by the light emitting element 13 is required. Therefore, it is difficult to efficiently dissipate heat to the outside, and heat stays in the vicinity of the light emitting element 13. For this reason, there has been a problem that the light emitting element 13 is deteriorated by heat and the light emission efficiency of the light emitting device is lowered.

また、図２６に示す発光装置では、発光装置を作動させる際に発光素子１３から発生する熱が、絶縁基体１１を介して保護素子１４の搭載部および保護素子１４に伝導されることにより、保護素子１４の温度が上昇し、熱によって保護素子１４の動作特性が変動してしまうという問題点を有していた。   In the light emitting device shown in FIG. 26, heat generated from the light emitting element 13 when the light emitting device is operated is conducted to the mounting portion of the protective element 14 and the protective element 14 through the insulating base 11, thereby protecting the light emitting device. There has been a problem that the temperature of the element 14 rises and the operating characteristics of the protection element 14 fluctuate due to heat.

また、図２７に示す発光装置では、保護素子１４の電極を外部電極と電気的に接続するために保護素子１４の搭載部１１ｄとなる反射部材１２の側壁の一部に側壁部を貫通する切り欠き部１２ｂを設ける必要がある。このために、切り欠き部１２ｂの角部に応力集中が起こり、保護素子１４の搭載部１１ｄに変形が発生するとともに、発光素子１３を載置する搭載部１１ｃに位置ずれが生じる場合がある。これによって、発光素子１３から出た光の発光装置外部への取り出し効率が低下し、発光装置の発光効率が低下する。また、保護素子１４の搭載部１１ｄの上部に発光素子１３の搭載部１１ｃを接合するために、低背化することが困難であるという問題点があった。   In the light emitting device shown in FIG. 27, in order to electrically connect the electrode of the protective element 14 to the external electrode, a part of the side wall of the reflecting member 12 serving as the mounting portion 11d of the protective element 14 is cut through the side wall. It is necessary to provide the notch 12b. For this reason, stress concentration occurs in the corners of the notch 12b, the deformation of the mounting portion 11d of the protection element 14 occurs, and the mounting portion 11c on which the light emitting element 13 is mounted may be displaced. Thereby, the extraction efficiency of the light emitted from the light emitting element 13 to the outside of the light emitting device is lowered, and the light emitting efficiency of the light emitting device is lowered. Further, since the mounting portion 11c of the light emitting element 13 is joined to the upper portion of the mounting portion 11d of the protective element 14, there is a problem that it is difficult to reduce the height.

したがって本発明は、上記従来の問題点に鑑みて完成されたものであり、その目的は、発光装置の発光効率の低下を招来することなく、低背で小型の発光素子収納用パッケージおよびこれを用いた光源ならびに発光装置を提供することにある。   Accordingly, the present invention has been completed in view of the above-described conventional problems, and an object of the present invention is to provide a low-profile, small-sized light emitting element housing package without causing a decrease in light emission efficiency of the light emitting device. It is an object to provide a light source and a light emitting device used.

本発明の発光素子収納用パッケージは、一主面に、発光素子およびこの発光素子の過電圧印加を防止する保護素子の搭載部をそれぞれ有するとともに、前記発光素子および前記保護素子を接続する配線導体が形成された絶縁基体と、この絶縁基体の一主面に、内周面が光反射面とされるとともに前記発光素子の搭載部を取り囲むように取着された反射部材とを具備しており、前記保護素子の搭載部が前記光反射面より外側に配置されていることを特徴とする。   The light-emitting element storage package of the present invention has a light-emitting element and a mounting portion for a protective element that prevents overvoltage application of the light-emitting element on one main surface, and a wiring conductor that connects the light-emitting element and the protective element. The formed insulating base, and a reflecting member attached to one main surface of the insulating base so that the inner peripheral surface is a light reflecting surface and surrounds the mounting portion of the light emitting element, The protective element mounting portion is disposed outside the light reflecting surface.

本発明の発光素子収納用パッケージにおいて好ましくは、前記保護素子の搭載部は、前記保護素子を収納可能な凹部の内側に設けられていることを特徴とする。   In the light emitting element storage package according to the present invention, preferably, the protection element mounting portion is provided inside a recess capable of storing the protection element.

本発明の発光素子収納用パッケージにおいて好ましくは、前記凹部は、前記発光素子搭載部側の内側面のうち、開口部側の部位が底面側の部位より前記発光素子搭載部側寄りとなるように形成されていることを特徴とする。   Preferably, in the light emitting element storage package according to the present invention, the concave portion is configured such that, of the inner side surface on the light emitting element mounting portion side, the opening side portion is closer to the light emitting element mounting portion side than the bottom surface side portion. It is formed.

本発明の発光素子収納用パッケージにおいて好ましくは、前記保護素子の搭載部と前記発光素子の搭載部との間に溝が設けられていることを特徴とする。   The light emitting element storage package of the present invention is preferably characterized in that a groove is provided between the protective element mounting portion and the light emitting element mounting portion.

本発明の発光素子収納用パッケージにおいて好ましくは、前記保護素子の搭載部の底面と前記絶縁基体の他主面との間に空隙部が設けられていることを特徴とする。   The light emitting element storage package of the present invention is preferably characterized in that a gap is provided between the bottom surface of the protective element mounting portion and the other main surface of the insulating base.

本発明の光源は、上記本発明の発光素子収納用パッケージと、前記発光素子および前記保護素子の搭載部にそれぞれ搭載され、前記配線導体に接続された発光素子および保護素子とを具備していることを特徴とする。   The light source of the present invention includes the light emitting element storage package of the present invention, and the light emitting element and the protective element mounted on the light emitting element and the protection element mounting portion and connected to the wiring conductor. It is characterized by that.

本発明の発光装置は、上記本発明の光源と、前記光源が搭載され、前記光源を駆動する電気配線を有する駆動部と、前記光源から出射される光を反射する光反射手段とを含むことを特徴とする。   The light-emitting device of the present invention includes the light source of the present invention, a drive unit on which the light source is mounted and having an electrical wiring that drives the light source, and a light reflecting unit that reflects light emitted from the light source. It is characterized by.

本発明の発光素子収納用パッケージは、一主面に、発光素子およびこの発光素子の過電圧印加を防止する保護素子の搭載部をそれぞれ有するとともに、発光素子および保護素子を接続する配線導体が形成された絶縁基体と、絶縁基体の一主面に、内周面が光反射面とされるとともに発光素子の搭載部を取り囲むように取着された反射部材とを具備しており、保護素子の搭載部が光反射面より外側に配置されていることから、保護素子が発光素子から出る光の経路を妨げることが無く、発光装置の発光効率を低下させることが無い。また、発光素子搭載部を有する絶縁基体の裏面側に、保護素子を収納する凹部を形成する必要が無いので、発光素子が発する熱を絶縁基体を介して良好に外部へ放熱させることができる。その結果、発光装置の発光効率が高く、かつ長期にわたり安定に動作可能な信頼性の高い発光素子収納用パッケージを提供できる。   The light-emitting element storage package of the present invention has a light-emitting element and a protective element mounting portion for preventing overvoltage application of the light-emitting element on one main surface, and a wiring conductor connecting the light-emitting element and the protective element. A protective element mounted on the main surface of the insulating base, and a reflective member attached to the main surface of the insulating base so that the inner peripheral surface is a light reflecting surface and surrounds the mounting portion of the light emitting element. Since the portion is arranged outside the light reflecting surface, the protective element does not hinder the light path from the light emitting element, and the light emission efficiency of the light emitting device is not lowered. In addition, since it is not necessary to form a recess for housing the protective element on the back side of the insulating base having the light emitting element mounting portion, the heat generated by the light emitting element can be radiated to the outside through the insulating base. As a result, it is possible to provide a highly reliable light-emitting element storage package in which the light-emitting device has high luminous efficiency and can operate stably over a long period of time.

また、本発明の発光素子収納用パッケージにおいて、保護素子の搭載部は、保護素子を収納可能な凹部の内側に設けられていることから、保護素子周辺部に空隙を持たすことができ、保護素子近傍を伝導してきた熱は、熱伝導率の高い絶縁基体や反射部材側に伝導させることができ、保護素子に伝導する熱を低減することができる。その結果、発光素子の熱による発光効率の低下を抑制するとともに保護素子が熱によって劣化するのを抑制し、外部への発光効率が高く、かつ長期にわたる安定動作の可能な信頼性の高いパッケージを作製できる。   Further, in the light emitting element storage package of the present invention, since the protection element mounting portion is provided inside the recess that can store the protection element, a space can be provided in the periphery of the protection element. The heat conducted in the vicinity can be conducted to the insulating base or the reflecting member having a high thermal conductivity, and the heat conducted to the protection element can be reduced. As a result, it is possible to suppress a decrease in luminous efficiency due to heat of the light emitting element and suppress deterioration of the protective element due to heat, and to provide a highly reliable package with high light emitting efficiency to the outside and capable of stable operation over a long period of time. Can be made.

また、本発明の発光素子収納用パッケージにおいて、凹部は、発光素子搭載部側の内側面のうち、開口部側の部位が底面側の部位より発光素子搭載部側寄りとなるように形成されていることから、発光素子搭載部から放射状に伝導する熱経路が保護素子の搭載部を形成する凹部により遮断されることが無く、発光素子から発生した熱は絶縁基体を介して良好に放熱することが可能となる。その結果、発光素子の熱による発光効率の劣化を抑制し、発光装置外部への発光効率が高く、かつ長期にわたる安定動作の可能な信頼性の高い発光素子収納用パッケージとすることができる。   In the light emitting element storage package of the present invention, the recess is formed such that, of the inner side surface on the light emitting element mounting portion side, the opening side portion is closer to the light emitting element mounting portion side than the bottom surface side portion. Therefore, the heat path that conducts radially from the light emitting element mounting portion is not blocked by the recess that forms the protective element mounting portion, and the heat generated from the light emitting element can be radiated well through the insulating substrate. Is possible. As a result, it is possible to obtain a light-emitting element storage package that suppresses deterioration of light-emitting efficiency due to heat of the light-emitting element, has high light-emitting efficiency to the outside of the light-emitting device, and can perform stable operation over a long period of time.

また、本発明の発光素子収納用パッケージにおいて、保護素子の搭載部と発光素子の搭載部との間に溝が設けられていることにより、発光装置を作動させる際に発光素子から発生する熱が、絶縁基体を介して保護素子の搭載部および保護素子に伝導しにくくできる。   Further, in the light emitting element storage package of the present invention, since the groove is provided between the protective element mounting portion and the light emitting element mounting portion, heat generated from the light emitting element when the light emitting device is operated is increased. Further, it is difficult to conduct to the protection element mounting portion and the protection element through the insulating base.

また、本発明の発光素子収納用パッケージにおいて、保護素子の搭載部と絶縁基体の他主面との間に空隙部が設けられていることにより、発光装置を作動させる際に発光素子から発生する熱や、発光装置が実装される発光装置駆動回路基板からの熱が、絶縁基体を介して保護素子の搭載部および保護素子に伝導しにくくできる。   Further, in the light emitting element storage package of the present invention, the air gap is provided between the protective element mounting portion and the other main surface of the insulating substrate, so that the light emitting element is generated when the light emitting device is operated. Heat or heat from the light emitting device driving circuit board on which the light emitting device is mounted can be hardly conducted to the mounting portion of the protective element and the protective element through the insulating base.

本発明の光源は、上記本発明の発光素子収納用パッケージと、発光素子および保護素子の搭載部にそれぞれ搭載され、配線導体に接続された発光素子および保護素子を具備していることから、上記本発明の発光素子収納用パッケージによって発光素子から出る光の利用効率を損なうことなく、また発光素子から出る熱を効率良く外部へ伝導させて、発光素子の発光効率の低下を抑制でき、高い発光効率を有し、かつ長期にわたる安定動作が可能な光源となる。   Since the light source of the present invention includes the light emitting element storage package of the present invention, and the light emitting element and the protective element that are mounted on the mounting portions of the light emitting element and the protective element and connected to the wiring conductor, The light emitting element storage package of the present invention can efficiently reduce the efficiency of light emitted from the light emitting element and efficiently conduct the heat emitted from the light emitting element to the outside, thereby suppressing a decrease in the light emitting efficiency of the light emitting element. It is a light source that has efficiency and can be stably operated over a long period of time.

本発明の発光装置は、上記本発明の光源と、光源が搭載され、光源を駆動する電気配線を有する駆動部と、光源から出射される光を反射する光反射手段とを含むことから、高い発光効率を有し、かつ長期にわたる安定動作が可能な発光装置となる。   The light emitting device of the present invention is high because it includes the light source of the present invention, a drive unit on which the light source is mounted and having an electrical wiring for driving the light source, and a light reflecting means for reflecting light emitted from the light source. A light emitting device having light emission efficiency and capable of stable operation over a long period of time is obtained.

本発明の第一の発明の発光素子収納用パッケージについて以下に詳細に説明する。図１は本発明の発光素子収納用パッケージ（以下、単にパッケージともいう）の実施の形態の一例を示し、図１（ａ）はパッケージの平面図、図１（ｂ）はパッケージの断面図である。図１において、１は絶縁基体、２は反射部材、１ｃは発光素子３を載置するための発光素子３の搭載部、１ｄは保護素子４を載置するための保護素子４の搭載部、５は配線導体であり、主としてこれらで発光素子３および保護素子４を収納するためのパッケージが構成される。ただし、図１（ａ）において、発光素子３、保護素子４およびこれらを配線導体５に接続するボンディングワイヤ７は図示していない。   The light emitting element storage package according to the first aspect of the present invention will be described in detail below. FIG. 1 shows an example of an embodiment of a light emitting element storage package (hereinafter also simply referred to as a package) according to the present invention, FIG. 1 (a) is a plan view of the package, and FIG. 1 (b) is a sectional view of the package. is there. In FIG. 1, 1 is an insulating substrate, 2 is a reflecting member, 1c is a mounting portion of the light emitting element 3 for mounting the light emitting element 3, 1d is a mounting portion of the protective element 4 for mounting the protective element 4, Reference numeral 5 denotes a wiring conductor, which mainly constitutes a package for housing the light emitting element 3 and the protection element 4. However, in FIG. 1A, the light emitting element 3, the protective element 4, and the bonding wire 7 that connects these to the wiring conductor 5 are not illustrated.

絶縁基体１は、窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス等のセラミックス、またはエポキシ樹脂等の樹脂から成り、切削加工、金型成型、押し出し成型等により形成される。また、絶縁基体１の一主面側には発光素子３および保護素子４を搭載するための発光素子３の搭載部１ｃおよび保護素子４の搭載部１ｄがそれぞれ形成され、他主面側には電力を供給する外部の電気配線と電気的に接続できるようにするための端子部が形成されている。   The insulating substrate 1 is made of an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, or a resin such as epoxy resin, and is formed by cutting, die molding, extrusion molding, or the like. In addition, a mounting portion 1c of the light emitting element 3 and a mounting portion 1d of the protection element 4 for mounting the light emitting element 3 and the protection element 4 are formed on one main surface side of the insulating substrate 1, respectively. A terminal portion is formed to be able to be electrically connected to an external electric wiring that supplies electric power.

絶縁基体１は、例えば、絶縁基体１にアルミナセラミックスを用いる場合、酸化アルミニウム、酸化珪素、酸化マグネシウム、酸化カルシウム等の原料粉末に適当な有機溶剤、溶媒を添加混合してスラリー状にし、これを従来周知のドクターブレード法やカレンダロール法によりシート状に成形してセラミックグリーンシートを作製する。また、タングステン（Ｗ）やモリブデン（Ｍｏ）−マンガン（Ｍｎ）、銅（Ｃｕ）、銀（Ａｇ）等の高融点金属、酸化アルミニウム、酸化珪素、酸化マグネシウム、酸化カルシウム等の原料粉末に適当な有機溶剤、溶媒を添加混合してメタライズペーストを準備する。   For example, in the case of using alumina ceramics for the insulating substrate 1, the insulating substrate 1 is made into a slurry by adding an appropriate organic solvent and solvent to a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc. A ceramic green sheet is produced by forming into a sheet by a conventionally known doctor blade method or calendar roll method. Also suitable for raw material powders such as refractory metals such as tungsten (W), molybdenum (Mo) -manganese (Mn), copper (Cu), silver (Ag), aluminum oxide, silicon oxide, magnesium oxide, calcium oxide An organic solvent and a solvent are added and mixed to prepare a metallized paste.

次に、打ち抜き法によってセラミックグリーンシートに発光素子３の搭載部１ｃの導体部および保護素子４の搭載部１ｄの導体部と端子部とを電気的に接続する配線貫通導体５ａを形成するための貫通孔を形成し、印刷法によってその貫通孔に前記メタライズペーストを埋め込み、続いて一方の面に第１の配線導体５ｂの形状にメタライズペーストを印刷することで第１の絶縁基体１ａが形成される。次に、前述と同様に貫通孔にメタライズペーストを埋め込み、一方の面に発光素子３搭載部１ｃの導体部および保護素子４搭載部１ｄの導体部を、他方の面に第２の配線導体５ｃの形状にメタライズペーストを印刷することで第２の絶縁基体１ｂが形成される。   Next, the wiring through conductor 5a for electrically connecting the conductor portion of the mounting portion 1c of the light emitting element 3 and the conductor portion of the mounting portion 1d of the protective element 4 and the terminal portion is formed on the ceramic green sheet by a punching method. A first insulating substrate 1a is formed by forming a through hole, embedding the metallized paste in the through hole by a printing method, and then printing the metallized paste in the shape of the first wiring conductor 5b on one surface. The Next, metallized paste is embedded in the through hole in the same manner as described above, the conductor portion of the light emitting element 3 mounting portion 1c and the conductor portion of the protection element 4 mounting portion 1d are disposed on one surface, and the second wiring conductor 5c is disposed on the other surface. The second insulating substrate 1b is formed by printing the metallized paste in the shape.

その後、第１および第２の絶縁基体１ａ、１ｂを、それぞれ発光素子３の搭載部１ｃおよび保護素子４の搭載部１ｄを有する面と第１の配線導体５ｂを有する面とが外側となるように積層し、加圧して圧着し、高温（約1600℃）で焼成する。このような工程により、一主面に、発光素子３の搭載部１ｃおよび保護素子４の搭載部１ｄをそれぞれ有し、発光素子３および保護素子４を電気的に接続する配線導体５が形成された絶縁基体を作製する。   Thereafter, the first and second insulating bases 1a and 1b are arranged such that the surface having the mounting portion 1c of the light emitting element 3 and the mounting portion 1d of the protective element 4 and the surface having the first wiring conductor 5b are outside. Are pressed and pressure-bonded, and fired at a high temperature (about 1600 ° C.). By such a process, the wiring conductor 5 having the mounting portion 1c of the light emitting element 3 and the mounting portion 1d of the protection element 4 and electrically connecting the light emitting element 3 and the protection element 4 is formed on one main surface. An insulating base was prepared.

なお、配線貫通導体５ａを構成する貫通導体は、貫通孔の内壁に導体層が被着された、いわゆるスルーホール導体や、貫通孔の内部が導体で充填されたいわゆるビア導体によって形成することができる。   The through conductor constituting the wiring through conductor 5a may be formed of a so-called through-hole conductor in which a conductor layer is attached to the inner wall of the through-hole or a so-called via conductor in which the inside of the through-hole is filled with a conductor. it can.

発光素子３の搭載部１ｃや保護素子４の搭載部１ｄおよび配線導体５の露出する導体層の表面には、ニッケル（Ｎｉ）やＡｕ等の耐食性に優れる金属を１〜20μｍ程度の厚さで被着しておくのが良く、発光素子３の搭載部１ｃ、保護素子４の搭載部１ｄおよび配線導体５の酸化腐食を有効に防止するとともに、発光素子３と発光素子３の搭載部１ｃおよび保護素子４と保護素子４の搭載部１ｄとの接続を強固にする。従って、発光素子３の搭載部１ｃ、保護素子４の搭載部１ｄおよび配線導体５の露出する表面には、例えば、厚さ１〜10μｍ程度のＮｉメッキ層と厚さ0.1〜３μｍ程度のＡｕメッキ層が順次被着されているのが好ましい。   The surface of the mounting portion 1c of the light emitting element 3, the mounting portion 1d of the protective element 4 and the exposed conductor layer of the wiring conductor 5 is made of a metal having excellent corrosion resistance such as nickel (Ni) or Au with a thickness of about 1 to 20 μm. The mounting portion 1c of the light emitting element 3, the mounting portion 1d of the protective element 4, and the wiring conductor 5 are effectively prevented from oxidative corrosion, and the light emitting element 3 and the mounting portion 1c of the light emitting element 3 The connection between the protection element 4 and the mounting portion 1d of the protection element 4 is strengthened. Therefore, for example, the Ni plating layer having a thickness of about 1 to 10 μm and the Au plating having a thickness of about 0.1 to 3 μm are formed on the exposed surface of the mounting portion 1 c of the light emitting element 3, the mounting portion 1 d of the protection element 4 and the wiring conductor 5. It is preferred that the layers are applied sequentially.

また、絶縁基体１は、一主面側（発光素子３の搭載部１ｃおよび保護素子４の搭載部１ｄを形成している面側）に反射部材２が、発光素子３の搭載部１ｃを取り囲むように、半田、Ａｇロウ等のロウ材やエポキシ樹脂接合材等の接合材により取着される。   In addition, in the insulating substrate 1, the reflecting member 2 surrounds the mounting portion 1 c of the light emitting element 3 on one main surface side (the surface side on which the mounting portion 1 c of the light emitting element 3 and the mounting portion 1 d of the protection element 4 are formed). Thus, it is attached by a bonding material such as solder, a brazing material such as Ag brazing, or an epoxy resin bonding material.

反射部材２は、金属板，セラミックスまたは樹脂を切削加工や金型成型を行なうことによって逆円錐台状に形成され、内周面が発光素子３の光を効率よく反射する光反射面２ａとされている。この構成により、発光素子３から出る光は上方に効率よく反射されるとともに、絶縁基体１による光の吸収や透過が効果的に抑制されるため、放射光強度や輝度を著しく向上できる。また、内周面を光反射面２ａとして形成するには、反射部材２をアルミニウム（Ａｌ）、Ａｇ、Ａｕ、白金（Ｐｔ）、チタン（Ｔｉ）、クロム（Ｃｒ）、Ｃｕ等の高反射率を有する金属板や白色等のセラミックス、白色等の樹脂で構成するか、または、反射部材２の内周面にＡｌ、Ａｇ、Ａｕ等の金属を蒸着法や鍍金法等により金属薄膜を形成してもよい。なお、光反射面２ａがＡｇ、Ｃｕ等の酸化により変色しやすい金属からなる場合は、その表面に所望の波長領域にわたり透過率の優れる低融点ガラス、ゾル−ゲルガラス、シリコーン樹脂、エポキシ樹脂等を被着しても良い。その結果、光反射面２ａに形成された光反射面の耐腐食性、耐薬品性、耐候性が向上する。   The reflecting member 2 is formed in an inverted truncated cone shape by cutting or molding a metal plate, ceramics or resin, and the inner peripheral surface is a light reflecting surface 2a that efficiently reflects the light of the light emitting element 3. ing. With this configuration, light emitted from the light emitting element 3 is efficiently reflected upward and absorption and transmission of light by the insulating substrate 1 are effectively suppressed, so that the emitted light intensity and luminance can be remarkably improved. Further, in order to form the inner peripheral surface as the light reflecting surface 2a, the reflecting member 2 has a high reflectivity such as aluminum (Al), Ag, Au, platinum (Pt), titanium (Ti), chromium (Cr), Cu or the like. Or a metal thin film formed by depositing a metal such as Al, Ag, or Au on the inner peripheral surface of the reflecting member 2 by vapor deposition or plating. May be. In addition, when the light reflecting surface 2a is made of a metal that is easily discolored by oxidation such as Ag or Cu, low melting point glass, sol-gel glass, silicone resin, epoxy resin, or the like having excellent transmittance over a desired wavelength region is formed on the surface. It may be attached. As a result, the corrosion resistance, chemical resistance, and weather resistance of the light reflecting surface formed on the light reflecting surface 2a are improved.

また、光反射面２ａは、上側に向かうに伴って外側に開口面を広げるように傾斜しているのが良い。これにより、発光素子３から出た光を効率良く上方に反射することができる。   Further, the light reflecting surface 2a is preferably inclined so as to widen the opening surface toward the upper side as it goes upward. Thereby, the light emitted from the light emitting element 3 can be efficiently reflected upward.

また、光反射面２ａにおける表面の算術平均粗さＲａは、４μｍ以下とするのが良く、これにより発光素子３から出た光の光反射面２ａによる反射損失を小さくして良好に上側に反射することができる。Ｒａが４μｍを超える場合、光反射面２ａで発光素子３の光を反射させて上方に出射させることが困難になるとともにパッケージ内部で乱反射しやすくなる。その結果、パッケージ内部における光の伝搬損失が大きくなりやすく、所望の放射角度で外部に高効率な光を出射するのが困難になる。   In addition, the arithmetic average roughness Ra of the surface of the light reflecting surface 2a is preferably 4 μm or less, so that the reflection loss due to the light reflecting surface 2a of the light emitted from the light emitting element 3 is reduced and reflected to the upper side. can do. When Ra exceeds 4 μm, it becomes difficult to reflect the light of the light emitting element 3 by the light reflecting surface 2a and to emit the light upward, and to easily diffuse the light inside the package. As a result, the propagation loss of light inside the package tends to increase, making it difficult to emit highly efficient light outside at a desired radiation angle.

また、光反射面２ａは、Ｒａが0.004μｍ未満の場合、このような面を安定かつ効率よく形成することが困難になるとともに、製品コストが高くなりやすい。したがって、光反射面２ａのＲａは0.004〜４μｍとするのがよく、このような光反射面２ａは従来周知の電解研磨加工、化学研磨加工もしくは切削研磨加工または金型の面精度を利用した転写加工により形成すれば良い。   On the other hand, when Ra is less than 0.004 μm, it is difficult to form such a surface stably and efficiently, and the product cost tends to increase. Therefore, the Ra of the light reflecting surface 2a is preferably 0.004 to 4 [mu] m. Such a light reflecting surface 2a can be transferred by using a conventionally well-known electrolytic polishing process, chemical polishing process or cutting polishing process or surface accuracy of a mold. What is necessary is just to form by processing.

また、光反射面２ａは、その縦断面形状が円弧面（曲線状）であってもよく、円弧面とする場合、発光素子３の光をまんべんなく反射させて指向性の高い光を上方により均一に放射することができる。   In addition, the light reflecting surface 2a may have an arcuate surface (curved shape) in its longitudinal cross-sectional shape. When the light reflecting surface 2a is an arcuate surface, the light from the light emitting element 3 is uniformly reflected so that highly directional light is more uniform upward. Can be emitted.

図１に示される本発明のパッケージにおいて、保護素子４の搭載部１ｄは、発光素子３の搭載部１ｃと同一面上に形成されているとともに反射部材２の光反射面２ａより外側に配置されるように形成される。これにより、発光素子３から出た光が外部まで伝搬する領域（光伝搬経路）内に、保護素子４が載置されることがないため、保護素子４の表面で反射することにより発生する光の反射損失や、あるいは保護素子４の表面で発生する光の吸収損失によって生じる発光効率の低下を無くすことが可能となる。これにより、発光素子３から出る光を上方に低損失で出射させることができ、発光効率が高いパッケージとすることができる。   In the package of the present invention shown in FIG. 1, the mounting portion 1 d of the protection element 4 is formed on the same plane as the mounting portion 1 c of the light emitting element 3 and is disposed outside the light reflecting surface 2 a of the reflecting member 2. It is formed so that. Thereby, since the protective element 4 is not placed in a region (light propagation path) where light emitted from the light emitting element 3 propagates to the outside, light generated by reflection on the surface of the protective element 4 It is possible to eliminate a reduction in luminous efficiency caused by a reflection loss of light or a light absorption loss generated on the surface of the protective element 4. Thereby, the light emitted from the light emitting element 3 can be emitted upward with low loss, and a package with high light emission efficiency can be obtained.

また、配線導体５は、絶縁基体１の内部に配線されて発光素子３の搭載部１ｃおよび保護素子４の搭載部１ｄに導出されているので、反射部材２の側壁を切り欠いて、保護素子４の電極と発光素子３の電極とを接続導体を通して接続する必要がないため、発光素子３から出る光を反射させる光反射面２ａの領域を減らすことなく発光素子３と外部回路とを電気的に接続することができ、発光素子３から出る光を効率良く外部へ取り出すことが可能である。その結果、発光素子３から出た光の反射部材２による損失を低減し、外部への発光効率が高く、かつ長期にわたり安定動作の可能な信頼性の高い発光素子収納用パッケージを作製できる。   Further, since the wiring conductor 5 is wired inside the insulating base 1 and led out to the mounting portion 1c of the light emitting element 3 and the mounting portion 1d of the protection element 4, the side wall of the reflecting member 2 is cut out, and the protection element 4 and the electrode of the light emitting element 3 do not need to be connected through a connection conductor, so that the light emitting element 3 and the external circuit are electrically connected without reducing the area of the light reflecting surface 2a that reflects the light emitted from the light emitting element 3. The light emitted from the light emitting element 3 can be efficiently extracted to the outside. As a result, a loss of light emitted from the light emitting element 3 due to the reflecting member 2 can be reduced, and a highly reliable light emitting element storage package with high light emission efficiency to the outside and stable operation over a long period can be manufactured.

次に、本発明のパッケージの第二の実施形態について説明する。図２は本発明の第二の実施形態によるパッケージの一例を示し、図２（ａ）はパッケージの平面図、図２（ｂ）はパッケージの断面図である。図２において、絶縁基体１、発光素子３、発光素子３の搭載部１ｃ、保護素子４、保護素子４の搭載部１ｄ、配線導体５については、前述の第一の発明と同じであるため、詳細な説明は省略する。   Next, a second embodiment of the package of the present invention will be described. FIG. 2 shows an example of a package according to the second embodiment of the present invention. FIG. 2 (a) is a plan view of the package, and FIG. 2 (b) is a cross-sectional view of the package. In FIG. 2, the insulating substrate 1, the light emitting element 3, the mounting portion 1c of the light emitting element 3, the protective element 4, the mounting portion 1d of the protective element 4, and the wiring conductor 5 are the same as in the first invention described above. Detailed description is omitted.

本実施形態のパッケージにおいて、反射部材２は、例えば、略円柱状であってその中心に発光素子３の搭載部１ｃ側より上面側に向かって開口部が広がっていくような略逆円錐台形状の貫通孔が形成される。なお、略円柱状の中心に逆円錐台形上の貫通孔に限らず、多角柱状に逆多角錐形状の貫通孔を形成してもよいし、多角柱状の内側に多角柱状の貫通孔を形成してもよい。このように反射部材２を形成することにより、反射部材２と絶縁基体１との接合面積を大きくすることが可能となり、絶縁基体１と反射部材２との接着をより強固にすることができる。   In the package of the present embodiment, the reflecting member 2 is, for example, a substantially cylindrical shape, and has a substantially inverted truncated conical shape in which an opening expands from the mounting portion 1c side of the light emitting element 3 toward the upper surface side at the center. Through-holes are formed. In addition, not only the through hole on the inverted frustoconical shape at the center of the substantially cylindrical shape, but a reverse polygonal pyramid shaped through hole may be formed in a polygonal column shape, or a polygonal column shaped through hole is formed inside the polygonal column shape. May be. By forming the reflecting member 2 in this manner, the bonding area between the reflecting member 2 and the insulating substrate 1 can be increased, and the adhesion between the insulating substrate 1 and the reflecting member 2 can be further strengthened.

保護素子４の搭載部は、反射部材２の光反射面２ａより外側の位置に設けられ、反射部材２は、その下面に保護素子４の搭載部１ｄを覆うように凹部８が形成される。そして、保護素子４および発光素子３を搭載部１ｄに実装した後に、反射部材２が絶縁基体１に半田、Ａｇロウ等のロウ材やエポキシ樹脂接合材等の接合材により接合される。   The mounting portion of the protection element 4 is provided at a position outside the light reflection surface 2a of the reflection member 2, and the reflection member 2 has a recess 8 formed on the lower surface thereof so as to cover the mounting portion 1d of the protection element 4. Then, after the protective element 4 and the light emitting element 3 are mounted on the mounting portion 1d, the reflecting member 2 is bonded to the insulating base 1 with a bonding material such as solder, a brazing material such as Ag brazing, or an epoxy resin bonding material.

本実施の形態例においても、保護素子４の搭載部１ｄは絶縁基体１の一主面上に設けられるので、発光素子３から放射状に絶縁基体１の他主面側に向けて放熱される放熱経路を凹部８が遮ることがない。したがって、絶縁基体１の放熱効率を損なうことがない。   Also in the present embodiment, the mounting portion 1d of the protection element 4 is provided on one main surface of the insulating base 1, so that heat is radiated from the light emitting element 3 radially toward the other main surface of the insulating base 1. The recess 8 does not block the path. Therefore, the heat dissipation efficiency of the insulating substrate 1 is not impaired.

絶縁基体１にはその内部に配線導体５が形成されて発光素子３の搭載部１ｃおよび保護素子４の搭載部１ｄに導出されているので、保護素子４の電極を接続するボンディングワイヤ等の線路導体を通すために、反射部材２の側壁部を貫通する孔や切り欠き部を必要としない。このため、光反射面２ａの内側に反射部材２と熱膨張係数の異なる透光性部材６を充填した場合でも、熱膨張差による反射部材２の変形が発生せず、うねりを持たない安定した光反射面２ａを形成することができ、発光素子３から出る光を効率良く外部へ取り出し、配光分布も安定させることが可能である。   Since a wiring conductor 5 is formed inside the insulating base 1 and led out to the mounting portion 1c of the light emitting element 3 and the mounting portion 1d of the protection element 4, a line such as a bonding wire connecting the electrodes of the protection element 4 In order to pass the conductor, no hole or notch that penetrates the side wall of the reflecting member 2 is required. For this reason, even when the translucent member 6 having a coefficient of thermal expansion different from that of the reflecting member 2 is filled inside the light reflecting surface 2a, the reflecting member 2 is not deformed due to a difference in thermal expansion, and is stable without waviness. The light reflecting surface 2a can be formed, and the light emitted from the light emitting element 3 can be efficiently extracted to the outside and the light distribution can be stabilized.

また、保護素子４の搭載部１ｄは、絶縁基体１の発光素子３の搭載部１ｃの裏面側（他主面側）に設けられていないので、発光素子３に電圧を印加したときに発生する熱は、空気より熱伝導率の高い絶縁基体１を介して、効率よく外部へ伝導させることが可能となる。これによって、発光素子３から発生する熱による発光効率の低下を抑制し、発光装置外部への発光効率が高く、かつ長期にわたる安定動作の可能な信頼性の高いパッケージを作製できる。   Further, since the mounting portion 1 d of the protection element 4 is not provided on the back surface side (other main surface side) of the mounting portion 1 c of the light emitting element 3 of the insulating base 1, it occurs when a voltage is applied to the light emitting element 3. Heat can be efficiently conducted to the outside through the insulating substrate 1 having a higher thermal conductivity than air. Accordingly, a reduction in light emission efficiency due to heat generated from the light emitting element 3 can be suppressed, and a highly reliable package capable of high light emission efficiency to the outside of the light emitting device and stable operation over a long period can be manufactured.

また、図３の断面図に示すように、絶縁基体１側にも第１の凹部８ａを設け、その底面部に保護素子４の搭載部１ｄを配置し、さらに、反射部材２の下面の第１の凹部８ａと対向する位置に、第２の凹部８ｂを設け、第１の凹部８ａおよび第２の凹部８ｂによって凹部８を形成してもよい。これにより、保護素子４の搭載部１ｄが形成される面に対して、絶縁基体１と反射部材２との接合面が高さ方向で異なる面となるため、保護素子４を接合するときや反射部材２を接合する際に、接合材が互いの接合領域に流入することが無い。   Further, as shown in the cross-sectional view of FIG. 3, the first recess 8 a is also provided on the insulating base 1 side, the mounting portion 1 d of the protection element 4 is disposed on the bottom surface thereof, and the lower surface of the reflecting member 2 is The second recess 8b may be provided at a position facing the one recess 8a, and the recess 8 may be formed by the first recess 8a and the second recess 8b. As a result, the bonding surface of the insulating base 1 and the reflecting member 2 is different in the height direction with respect to the surface on which the mounting portion 1d of the protection element 4 is formed. When the members 2 are joined, the joining material does not flow into the joining regions.

本実施の形態例においては、保護素子４の搭載部１ｄは絶縁基体１の一主面より下方に凹部８ａが設けられることになるが、凹部８ａの深さを深くする必要が無いので、発光素子３から放射状に絶縁基体１の他主面側に向けて放熱される放熱経路を凹部８が遮ることにより、絶縁基体１の放熱効率を損なうことがない。   In the present embodiment, the mounting portion 1d of the protection element 4 is provided with the recess 8a below the one main surface of the insulating base 1, but it is not necessary to increase the depth of the recess 8a. The recess 8 blocks the heat dissipation path that radiates heat from the element 3 toward the other main surface side of the insulating base 1, so that the heat dissipation efficiency of the insulating base 1 is not impaired.

また、発光素子３の搭載部１ｃや保護素子４の搭載部１ｄに対し、発光素子３および保護素子４が上側に配置され、反射部材２の接合面も発光素子３の搭載部１ｃと同一平面上に形成されるので、保護素子４の搭載部１ｄが絶縁基体１の裏面側に設けられている場合に、反射部材２および発光素子３を半田や導電性ペースト等の接合材で絶縁基体１の表面側に固着した後、保護素子４の搭載部１ｄが上側となるようにパッケージを反転させて、保護素子４を同様の方法で絶縁基体１の裏面側に固着するような複雑な工程を経る必要がなく、反射部材２，発光素子３，保護素子４等を絶縁基体１の同じ側に実装することができ、製造コストを抑えたパッケージを作製することができる。   Further, the light emitting element 3 and the protective element 4 are arranged on the upper side with respect to the mounting part 1c of the light emitting element 3 and the mounting part 1d of the protective element 4, and the joint surface of the reflecting member 2 is also flush with the mounting part 1c of the light emitting element 3. Since it is formed above, when the mounting portion 1d of the protection element 4 is provided on the back side of the insulating substrate 1, the reflecting member 2 and the light emitting device 3 are bonded to the insulating substrate 1 with a bonding material such as solder or conductive paste. After being fixed to the front surface side, the package is inverted so that the mounting portion 1d of the protective element 4 is on the upper side, and a complicated process is performed in which the protective element 4 is fixed to the back surface side of the insulating substrate 1 in the same manner. There is no need to go through, and the reflecting member 2, the light emitting element 3, the protective element 4 and the like can be mounted on the same side of the insulating base 1, and a package with reduced manufacturing costs can be manufactured.

なお、凹部８の長さ，幅，高さは、保護素子４の搭載部１ｄに重ならないように、かつ保護素子４およびボンディングワイヤ７と接触しないように適切に設定すればよい。反射部材２および凹部８は、切削加工や放電加工等により形成することで作製ができる。あるいは、金型成型等により一体形成しても良い。なお、図２および図３に示す凹部８の上面は、その断面形状が半円状、放物線状、円弧状（曲線状）であってもよい。   Note that the length, width, and height of the recess 8 may be set appropriately so as not to overlap the mounting portion 1d of the protection element 4 and not to contact the protection element 4 and the bonding wire 7. The reflecting member 2 and the concave portion 8 can be produced by forming by cutting or electric discharge machining. Alternatively, they may be integrally formed by mold molding or the like. 2 and 3 may have a semicircular, parabolic, or arcuate (curved) cross-sectional shape.

また、図４の断面図に示すように、絶縁基体１側にのみ凹部８を設け、その底面部に保護素子４の搭載部１ｄを配置してもよく、これにより、反射部材２に保護素子４を収納するエリアを必要としないため、変形等に強い安定した光反射面２ａを提供することができ、発光効率の高いパッケージを提供することができる。なお、図３および図４には、図１と同様に発光素子３、保護素子４およびボンディングワイヤ７は図示していない。   Further, as shown in the cross-sectional view of FIG. 4, the concave portion 8 may be provided only on the insulating base 1 side, and the mounting portion 1 d of the protective element 4 may be disposed on the bottom surface thereof. Since an area for storing 4 is not required, it is possible to provide a stable light reflecting surface 2a resistant to deformation and the like, and to provide a package with high luminous efficiency. 3 and 4 do not show the light emitting element 3, the protective element 4, and the bonding wire 7 as in FIG.

また、図２，図３，図４に示すパッケージは、凹部８が絶縁基体１および反射部材の少なくとも一方に設けられ、保護素子４の搭載部１ｄが絶縁基体１および反射部材２により密閉状態にされるから、保護素子４の周辺部に凹部８の空隙を介し、空隙より熱伝導率の高い絶縁基体１および反射部材２で形成することが可能となり、保護素子４に発光素子３から出る熱を伝導させにくくすることができ、保護素子４の温度上昇による破壊や特性の変動を抑制できる。また、発光素子３の搭載部１ｃと絶縁基体１の他主面側とを結ぶ放熱経路から外れた位置に設けられた凹部８から絶縁基体１または反射部材２を介して保護素子４の発する熱を外部へ効率よく伝導させることができる。その結果、長期安定動作可能な信頼性の高いパッケージを提供することが可能となる。   2, 3, and 4, the recess 8 is provided in at least one of the insulating base 1 and the reflecting member, and the mounting portion 1 d of the protection element 4 is sealed by the insulating base 1 and the reflecting member 2. Therefore, it becomes possible to form the insulating base 1 and the reflecting member 2 having higher thermal conductivity than the gap through the gap of the recess 8 in the peripheral portion of the protection element 4, and the heat emitted from the light emitting element 3 to the protection element 4. Can be made difficult to conduct, and the destruction of the protection element 4 due to the temperature rise and the fluctuation of the characteristics can be suppressed. Further, the heat generated by the protection element 4 from the recess 8 provided at a position deviating from the heat dissipation path connecting the mounting portion 1c of the light emitting element 3 and the other main surface side of the insulating base 1 through the insulating base 1 or the reflecting member 2. Can be efficiently conducted to the outside. As a result, it is possible to provide a highly reliable package capable of long-term stable operation.

次に、本発明の第三の発明のパッケージについて説明する。図５は本発明の第三の実施形態によるパッケージの一例を示し、図５（ａ）はパッケージの平面図、図５（ｂ）はパッケージの断面図である。図５において、絶縁基体１、反射部材２、発光素子３の搭載部１ｃ、保護素子４の搭載部１ｄ、配線導体５については、前述の第二の実施形態と同じであるため、詳細な説明は省略する。   Next, the package of the third invention of the present invention will be described. FIG. 5 shows an example of a package according to the third embodiment of the present invention. FIG. 5A is a plan view of the package, and FIG. 5B is a cross-sectional view of the package. In FIG. 5, the insulating substrate 1, the reflecting member 2, the mounting portion 1c of the light emitting element 3, the mounting portion 1d of the protective element 4, and the wiring conductor 5 are the same as those in the second embodiment described above, and therefore will be described in detail. Is omitted.

本発明の第三の実施形態のパッケージにおいて、凹部８は、発光素子３の搭載部１ｃ側の内側面のうち、開口部側の部位が底面側の部位より発光素子３の搭載部１ｃ側寄りとなるように傾斜させて形成されている。これにより、凹部８を発光素子３の搭載部１ｃ側寄りに形成しても、発光素子３の搭載部１ｃ側の凹部８の内側面が、発光素子３を起点に放射状に広がる熱が伝導する熱経路を遮らないように傾斜させて形成されているので、凹部８を形成する空隙部により熱経路が遮断されることを最小限にでき、発光素子３から発生した熱を安定して放熱させることが可能となる。その結果、発光素子３の熱による発光効率の低下を抑制し、外部への発光効率が高く、かつ長期にわたる安定動作の可能な信頼性の高いパッケージを作製できる。また、熱経路の遮断を最小限にできることによって、保護素子４の搭載位置を発光素子３の搭載位置に近く配置できるので、急峻なサージ等を保護素子４に吸収させやすくできる。   In the package according to the third embodiment of the present invention, the concave portion 8 has an opening side portion closer to the mounting portion 1c side of the light emitting element 3 than a bottom side portion of the inner surface of the light emitting element 3 on the mounting portion 1c side. It is formed so as to be inclined. As a result, even if the recess 8 is formed closer to the mounting portion 1 c side of the light emitting element 3, heat spreading radially from the inner surface of the recess 8 on the mounting portion 1 c side of the light emitting element 3 is conducted. Since it is formed to be inclined so as not to block the heat path, it is possible to minimize the heat path being blocked by the gaps forming the recesses 8 and to stably dissipate the heat generated from the light emitting element 3. It becomes possible. As a result, a reduction in light emission efficiency due to heat of the light emitting element 3 can be suppressed, and a highly reliable package with high light emission efficiency to the outside and stable operation over a long period can be manufactured. Further, since the interruption of the heat path can be minimized, the mounting position of the protection element 4 can be arranged close to the mounting position of the light emitting element 3, so that a steep surge or the like can be easily absorbed by the protection element 4.

また、図６に示すように、凹部８の構成を底面側の穴の大きさより上面側の穴の大きさが大きい段差状としてもよい。すなわち、発光素子３搭載部１ｃ側の内側面を、開口部側の部位が底面側の部位より発光素子３搭載部１ｃ側よりとなるように段差状に形成してもよい。この場合、例えば凹部８の穴の深さを保護素子４の高さと略同一に形成し、凹部８内の段差部上に、保護素子４とボンディングワイヤ７により接続可能な配線導体５を導出することで、ボンディングワイヤ７の配線を凹部８内に収め、凹部８をより小さく形成することが可能となる。なお、平面視において凹部８の段差部が設けられている部位の幅は、段差部のない保護素子４が載置される凹部８の幅より小さくしてもよい。このような形状とすることにより、保護素子４の搭載位置を発光素子３の搭載位置により近く配置しながら、発光素子３からの熱経路を確保し、良好な放熱性能を有するパッケージとすることができる。また、この場合においても、発光素子３から出る熱の放射状の熱経路を確保することができ、熱による発光素子３の効率低下を抑制でき、外部への発光効率の高い、安定動作可能なパッケージを作製できる。   Further, as shown in FIG. 6, the configuration of the recess 8 may be a stepped shape in which the size of the hole on the upper surface side is larger than the size of the hole on the bottom surface side. That is, the inner surface on the light emitting element 3 mounting portion 1c side may be formed in a stepped shape so that the portion on the opening side is closer to the light emitting element 3 mounting portion 1c side than the portion on the bottom surface side. In this case, for example, the depth of the hole of the recess 8 is formed substantially the same as the height of the protection element 4, and the wiring conductor 5 that can be connected by the protection element 4 and the bonding wire 7 is led out on the stepped portion in the recess 8. Thus, the wiring of the bonding wire 7 can be accommodated in the recess 8 and the recess 8 can be formed smaller. Note that the width of the portion where the step portion of the recess 8 is provided in plan view may be smaller than the width of the recess 8 on which the protection element 4 without the step portion is placed. By adopting such a shape, it is possible to secure a heat path from the light emitting element 3 while arranging the mounting position of the protective element 4 closer to the mounting position of the light emitting element 3, and to obtain a package having good heat dissipation performance. it can. Also in this case, a radial heat path for the heat emitted from the light emitting element 3 can be secured, a decrease in the efficiency of the light emitting element 3 due to heat can be suppressed, and a stable operation with high light emission efficiency to the outside. Can be produced.

また、絶縁基体１は、図７または図８に示すように、保護素子の搭載部１ｄと発光素子の搭載部１ｃとの間における絶縁基体１の一主面または他主面に溝９を設けることができる。このように、平面視において発光素子３の搭載部１ｃと保護素子４の搭載部１ｄとの間に溝９が設けられていることにより、発光装置を作動させる際に発光素子３から発生する熱が、絶縁基体１を介して保護素子の搭載部１ｄおよび保護素子４に伝導しにくくすることができる。すなわち、発光素子３の搭載部１ｃから保護素子４の搭載部１ｄに至る絶縁基体１の一主面または他主面に溝９を設けて断熱層を形成し、絶縁基体１の溝９と絶縁基体１の他主面または一主面との間の厚みを薄くすることにより、発光素子３の搭載部１ｃから保護素子４に至る絶縁基体１の熱抵抗を著しく増加させることができる。その結果、発光装置を作動させる際の保護素子４の温度上昇をより確実に抑制することができ、熱による保護素子４の動作特性が安定し、保護素子４の動作温度を規格値内に保持することができる。   Further, as shown in FIG. 7 or FIG. 8, the insulating base 1 is provided with a groove 9 on one main surface or the other main surface of the insulating base 1 between the protective element mounting portion 1d and the light emitting element mounting portion 1c. be able to. As described above, since the groove 9 is provided between the mounting portion 1c of the light emitting element 3 and the mounting portion 1d of the protection element 4 in plan view, heat generated from the light emitting element 3 when the light emitting device is operated. However, it is possible to make it difficult to conduct the protection element mounting portion 1d and the protection element 4 through the insulating base 1. That is, a groove 9 is provided on one main surface or the other main surface of the insulating substrate 1 from the mounting portion 1c of the light emitting element 3 to the mounting portion 1d of the protective element 4 to form a heat insulating layer, and the groove 9 of the insulating substrate 1 is insulated. By reducing the thickness between the other main surface or one main surface of the base body 1, the thermal resistance of the insulating base body 1 from the mounting portion 1c of the light emitting element 3 to the protection element 4 can be remarkably increased. As a result, the temperature rise of the protective element 4 when operating the light emitting device can be more reliably suppressed, the operating characteristics of the protective element 4 due to heat are stabilized, and the operating temperature of the protective element 4 is kept within the standard value. can do.

なお、溝９の形状は、絶縁基体１の熱伝導率や絶縁基体１から発光装置駆動回路基板への放熱性、および発光素子３から絶縁基体１を介して保護素子４の搭載部１ｄおよび保護素子４に至る熱抵抗を考慮し、適宜選定された形状に成形される。   The shape of the groove 9 is such that the heat conductivity of the insulating base 1, the heat dissipation from the insulating base 1 to the light emitting device drive circuit board, and the mounting portion 1 d of the protection element 4 and the protection from the light emitting element 3 through the insulating base 1. In consideration of the thermal resistance reaching the element 4, it is molded into a shape selected as appropriate.

また、溝９は、図７（ｂ）に示すように絶縁基体１の一主面に凹部８を設け、その底面部に保護素子４の搭載部１ｄを配置するとともに、絶縁基体１の一主面の凹部８と発光素子３の搭載部１ｃとの間に溝９を形成する場合、溝９の深さは凹部８の深さより深いことが好ましい。溝９の深さが凹部８の深さより浅い場合、発光素子３から発生した熱が絶縁基体１を介して短距離経路で凹部８に伝熱されやすくなる。   Further, the groove 9 is provided with a recess 8 on one main surface of the insulating base 1 as shown in FIG. 7B, and the mounting portion 1d of the protection element 4 is disposed on the bottom surface thereof, and the main portion of the insulating base 1 is provided. When the groove 9 is formed between the concave portion 8 on the surface and the mounting portion 1 c of the light emitting element 3, the depth of the groove 9 is preferably deeper than the depth of the concave portion 8. When the depth of the groove 9 is shallower than the depth of the recess 8, the heat generated from the light emitting element 3 is easily transferred to the recess 8 through the insulating base 1 through a short distance path.

さらにまた、図８（ｂ）に示すように絶縁基体１の一主面に凹部８を設け、その底面部に保護素子４の搭載部１ｄを配置するとともに、絶縁基体１の他主面の凹部８と発光素子３の搭載部１ｃとの間に溝９を形成する場合、溝９の底面は凹部８の底面部より高い位置にすることが好ましい。溝９の底面が凹部８の底面部より低い場合、発光素子３から発生した熱が絶縁基体１を介して凹部８に伝熱されやすくなる。   Furthermore, as shown in FIG. 8 (b), a recess 8 is provided on one main surface of the insulating base 1, and the mounting portion 1d of the protection element 4 is disposed on the bottom thereof, and the recess on the other main surface of the insulating base 1 is provided. When the groove 9 is formed between the light emitting element 3 and the mounting portion 1 c of the light emitting element 3, the bottom surface of the groove 9 is preferably higher than the bottom surface portion of the recess 8. When the bottom surface of the groove 9 is lower than the bottom surface portion of the recess 8, heat generated from the light emitting element 3 is easily transferred to the recess 8 through the insulating substrate 1.

また、溝９の幅は、発光素子３の側面から外側へ４５°に広がる仮想線より外側に配置されるように形成されることが好ましい。溝９の幅が発光素子３から外側へ４５°に広がる仮想線より内側に配置されるように形成すると、発光素子３から発生した熱が絶縁基体１内で拡散され難くなるとともに、放熱経路が遮断されることになって絶縁基体１の他主面側へ伝熱されにくくなり、発光素子３に対する放熱性が著しく低下する。   Moreover, it is preferable that the width of the groove 9 is formed so as to be disposed outside the imaginary line extending from the side surface of the light emitting element 3 to the outside by 45 °. If the groove 9 is formed so that the width of the groove 9 is arranged on the inner side of the imaginary line extending 45 ° outward from the light emitting element 3, the heat generated from the light emitting element 3 is not easily diffused in the insulating substrate 1, and the heat dissipation path is As a result, the heat is not easily transferred to the other main surface side of the insulating substrate 1, and the heat dissipation performance for the light emitting element 3 is significantly reduced.

なお、溝９は、図９（ａ）の上視平面図のように絶縁基体１の側面１ｅから対向する側面１ｆにわたって形成されてもよく、図９（ｂ）の上視平面図のように保護素子４の搭載部１ｄの一部または周囲を取り囲むように形成されもよい。図９（ｂ）においては、保護素子４の搭載部１ｄの周囲を取り囲むよう連続して溝９が形成されているが、溝９は必ずしも連続していなくてもよい。これにより、上記と同様に発光装置を作動させる際の保護素子４の温度上昇を抑制でき、保護素子４の熱による動作特性の変動や破損、半田が溶融されることにより生じる、保護素子４と保護素子の搭載部１ｄに導出された配線導体１ｄとの電気的な接続不良を抑制できる。   The groove 9 may be formed from the side surface 1e of the insulating base 1 to the opposite side surface 1f as shown in the plan view of FIG. 9A, and as shown in the plan view of FIG. 9B. The protective element 4 may be formed so as to surround a part or the periphery of the mounting portion 1d. In FIG. 9B, the groove 9 is continuously formed so as to surround the periphery of the mounting portion 1d of the protection element 4, but the groove 9 does not necessarily have to be continuous. Thereby, similarly to the above, the temperature rise of the protective element 4 when operating the light emitting device can be suppressed, and the protective element 4 and the protective element 4 caused by fluctuations or breakage of operating characteristics due to heat of the protective element 4 and melting of the solder It is possible to suppress poor electrical connection with the wiring conductor 1d led out to the protective element mounting portion 1d.

また、絶縁基体１は、図１０乃至図１５に示す断面図および上視平面図のように凹部８の底面、すなわち保護素子４の搭載部１ｄが設けられる面と絶縁基体１の他主面との間に空隙部１０が設けられていることがより好ましい。これにより、発光装置を作動させる際に発光素子３から発生する熱や、発光装置が実装される発光装置駆動回路基板からの熱が、絶縁基体１を介して保護素子の搭載部１ｄおよび保護素子４に伝導しにくくすることができる。すなわち、絶縁基体１に空隙部１０を設けることによって、この空隙部１０が設けられた絶縁基体１の部位を薄くすることにより、発光素子の搭載部１ｃから保護素子の搭載部１ｄに至る絶縁基体１の熱抵抗を増加させることができ、また、絶縁基体１の他主面側に配置される発光装置駆動回路基板から保護素子の搭載部１ｄに至る絶縁基体１の部位に断熱層を配置することにより、発光装置駆動回路基板から保護素子の搭載部１ｄに至る絶縁基体１の熱抵抗を増加させることができる。その結果、発光装置を作動させる際の保護素子４の温度上昇が抑制され、熱による保護素子４の動作特性が安定するとともに、保護素子４の動作温度を規格値内に維持することができる。   In addition, the insulating substrate 1 includes a bottom surface of the concave portion 8, that is, a surface on which the mounting portion 1d of the protection element 4 is provided, and another main surface of the insulating substrate 1, as shown in the cross-sectional views and the top plan views shown in FIGS. It is more preferable that a gap 10 is provided between them. Thereby, the heat generated from the light emitting element 3 when the light emitting device is operated and the heat from the light emitting device driving circuit board on which the light emitting device is mounted are applied to the protective element mounting portion 1d and the protective element via the insulating base 1. 4 can be made difficult to conduct. That is, by providing the gap 10 in the insulating base 1 and thinning the portion of the insulating base 1 provided with the gap 10, the insulating base from the light emitting element mounting portion 1c to the protective element mounting portion 1d is obtained. 1 can be increased, and a heat insulating layer is disposed at a portion of the insulating substrate 1 extending from the light emitting device drive circuit substrate disposed on the other main surface side of the insulating substrate 1 to the protective element mounting portion 1d. As a result, the thermal resistance of the insulating substrate 1 extending from the light emitting device drive circuit board to the protection element mounting portion 1d can be increased. As a result, the temperature rise of the protection element 4 when operating the light emitting device is suppressed, the operation characteristics of the protection element 4 due to heat are stabilized, and the operation temperature of the protection element 4 can be maintained within the standard value.

なお、空隙部１０の高さは、図１０（ａ）または図１１（ａ）に示すように反射部材２に凹部８を設け、基体１に保護素子４の搭載部１ｄを配置する場合、または図１０（ｂ）または図１１（ｂ）に示すように絶縁基体１に凹部８を設け、その底面部に保護素子４の搭載部１ｄを配置する場合、絶縁基体１の熱伝導率や絶縁基体１から発光装置駆動回路基板への放熱性、および発光素子３から絶縁基体１を介して保護素子の搭載部１ｄおよび保護素子４に至る熱抵抗を考慮し、適宜選定されて形成される。   Note that the height of the gap 10 is set when the concave portion 8 is provided in the reflecting member 2 and the mounting portion 1d of the protective element 4 is disposed on the base 1, as shown in FIG. As shown in FIG. 10 (b) or FIG. 11 (b), when the recess 8 is provided in the insulating base 1 and the mounting portion 1d of the protective element 4 is disposed on the bottom surface thereof, the thermal conductivity of the insulating base 1 or the insulating base In consideration of the heat dissipation from 1 to the light emitting device drive circuit board and the thermal resistance from the light emitting element 3 to the protection element mounting portion 1d and the protection element 4 through the insulating base 1, it is appropriately selected and formed.

また、空隙部１０は、図１１乃至図１３の絶縁基体１に示すように少なくとも保護素子の搭載部１ｄの直下に配置されるよう、絶縁基体１の他主面または側面１ｇの一部を切り欠いたり（図１１および図１２参照）、絶縁基体１内に空隙が設けられたりするように形成されてもよく（図１３参照）、上記と同様に発光素子の搭載部１ｃから保護素子４の搭載部１ｄに至る絶縁基体１の熱抵抗を増加させることができるとともに、発光装置駆動回路基板から保護素子４の搭載部１ｄに至る絶縁基体１に断熱層が配置されることにより、発光装置駆動回路基板から保護素子４の搭載部１ｄに至る絶縁基体１の熱抵抗を増加させることができる。   Further, as shown in the insulating substrate 1 of FIGS. 11 to 13, the gap 10 cuts a part of the other main surface or side surface 1g of the insulating substrate 1 so as to be disposed at least directly below the protective element mounting portion 1d. (See FIG. 11 and FIG. 12), or may be formed so that a gap is provided in the insulating substrate 1 (see FIG. 13). Similarly to the above, from the light emitting element mounting portion 1c to the protective element 4 The thermal resistance of the insulating base 1 reaching the mounting portion 1d can be increased, and the heat insulating layer is disposed on the insulating base 1 extending from the light emitting device driving circuit board to the mounting portion 1d of the protective element 4, thereby driving the light emitting device. The thermal resistance of the insulating substrate 1 from the circuit board to the mounting portion 1d of the protection element 4 can be increased.

また、空隙部１０の幅は、少なくとも保護素子４の直下の部位を含むように形成されるとともに、上記溝９の場合と同様に、発光素子３から外側へ４５°に広がる仮想線より外側に配置されるように形成されることが好ましい。   Further, the width of the gap portion 10 is formed so as to include at least a portion immediately below the protective element 4, and as in the case of the groove 9, the width of the gap portion 10 is outside the imaginary line extending 45 ° outward from the light emitting element 3. It is preferable to be formed so as to be arranged.

なお、空隙部１０は、図１４または図１５の上視平面図に示すように絶縁基体１の側面１ｅから対向する側面１ｆにわたって形成されてもよく（図１４（ａ）参照）、絶縁基体１の側面１ｇを切り欠くように形成されもよく（図１４（ｂ）参照）、絶縁基体１の他主面の一部を切り欠いて形成されてもよい（図１５参照）。これにより、本発明の発光装置は、発光装置を作動させる際の保護素子４の温度上昇を抑制でき、保護素子４の熱による動作特性を安定させることができる。   The gap 10 may be formed from the side surface 1e of the insulating substrate 1 to the side surface 1f facing the insulating substrate 1 as shown in the top plan view of FIG. 14 or 15 (see FIG. 14A). The side surface 1g may be cut out (see FIG. 14B), or the other main surface of the insulating substrate 1 may be cut out (see FIG. 15). Thereby, the light-emitting device of this invention can suppress the temperature rise of the protection element 4 at the time of operating a light-emitting device, and can stabilize the operating characteristic by the heat | fever of the protection element 4. FIG.

また、溝９または空隙部１０は、所望の形状に成形できる金型を用いた金型成型、平板状の絶縁基体１に所望の形状に形成する切削加工、研磨加工等の成形技術を用いて形成できる。   In addition, the groove 9 or the gap 10 is formed by using a molding technique such as mold molding using a mold that can be molded into a desired shape, cutting processing that forms a desired shape on the flat insulating base 1, and polishing processing. Can be formed.

また、溝９および空隙部１０は、平面視において絶縁基体１の反射部材２が接合されている面内に配置されるのがよい。溝９または空隙部１０が設けられることによって絶縁基体１が薄肉となっても、反射部材２が接合されて補強されるので、絶縁基体１の強度が低下するのを補うことができる。さらに、絶縁基体１および反射部材２には熱膨張特性が同じ部材を組み合わせるのが好ましい。   Further, the groove 9 and the gap 10 are preferably arranged in a plane where the reflecting member 2 of the insulating base 1 is joined in a plan view. Even if the insulating substrate 1 becomes thin due to the provision of the groove 9 or the gap portion 10, the reflection member 2 is joined and reinforced, so that the strength of the insulating substrate 1 can be compensated for. Further, it is preferable to combine the insulating base 1 and the reflecting member 2 with members having the same thermal expansion characteristics.

なおまた、上記本発明のパッケージにおいて、発光素子３と保護素子４とが各々単数の場合のみについて記載をしたが、発光素子３および保護素子４が複数個配置されたものであってもよく、例えば、図１６（ａ）、（ｂ）（図１６（ａ）は平面図、図１６（ｂ）は断面図を示す）に示すように、12個の発光素子３を４素子直列接続したものを３並列に構成し、各々の直列接続したものに対し保護素子４を並列となるように接続する場合、保護素子４の搭載部１ｄを適切な間隔を保ちながら凹部８内に設ければよい。また、保護素子４の数に応じて凹部８を複数設けてもよいことは言うまでもない。なお、図１６においては、本発明の図４の実施形態例のパッケージを基にしているが、図３の実施形態例のように絶縁基体１側に第１の凹部８ａと反射部材２側に第２の凹部８ｂにより凹部８を形成してもよい。もちろん、本発明の第三の実施形態例のパッケージを基にしてもよい。   In addition, in the package of the present invention, only the case where each of the light emitting element 3 and the protective element 4 is single is described, but a plurality of the light emitting element 3 and the protective element 4 may be arranged, For example, as shown in FIGS. 16 (a) and 16 (b) (FIG. 16 (a) is a plan view and FIG. 16 (b) is a cross-sectional view), four 12 light emitting elements 3 are connected in series. When the protective element 4 is connected in parallel to each of those connected in series, the mounting portion 1d of the protective element 4 may be provided in the recess 8 while maintaining an appropriate interval. . It goes without saying that a plurality of recesses 8 may be provided according to the number of protection elements 4. 16 is based on the package of the embodiment of FIG. 4 according to the present invention. However, as shown in the embodiment of FIG. 3, the first recess 8a and the reflecting member 2 are provided on the insulating base 1 side. The concave portion 8 may be formed by the second concave portion 8b. Of course, it may be based on the package of the third embodiment of the present invention.

また、図１７（ａ），（ｂ）（図１７（ａ）は平面図、図１７（ｂ）は断面図を示す）に示すように、凹部８を反射部材２の下面内に収まるように環状の溝として絶縁基体１の上面に設け、凹部８の任意の位置に保護素子４の搭載部１ｄを複数箇所設けてもよい。その結果、複数個の保護素子４が必要な場合においても、保護素子４を実装するエリアを確保するために絶縁基体１の面積を大きくする必要がなく、それぞれの発光素子３において、過電圧による破壊を有効に防止することができ、信頼性の高いパッケージを作製できる。なお、凹部８の発光素子３の搭載部１ｃ側の内側面において、開口部側の部位が底面側の部位より発光素子３の搭載部１ｃ側寄りとなるように形成するとより好ましいことは言うまでもない。また、図２の実施形態例のように、凹部８を反射部材２の下面に環状の溝として形成してもよい、あるいは、図３の実施形態例のように、絶縁基体１の上面に第１の凹部８ａと反射部材２の下面に第２の凹部８ｂとして環状の溝を各々形成してもよい。   Further, as shown in FIGS. 17A and 17B (FIG. 17A is a plan view and FIG. 17B is a cross-sectional view), the concave portion 8 is accommodated in the lower surface of the reflecting member 2. It may be provided on the upper surface of the insulating substrate 1 as an annular groove, and a plurality of mounting portions 1 d of the protection element 4 may be provided at arbitrary positions of the recess 8. As a result, even when a plurality of protection elements 4 are required, it is not necessary to increase the area of the insulating base 1 in order to secure an area for mounting the protection elements 4, and each light emitting element 3 is destroyed by overvoltage. Can be effectively prevented, and a highly reliable package can be manufactured. Needless to say, it is more preferable to form the concave portion 8 on the inner side surface of the light emitting element 3 on the mounting portion 1c side so that the opening side portion is closer to the mounting portion 1c side of the light emitting element 3 than the bottom surface side portion. . Further, the concave portion 8 may be formed as an annular groove on the lower surface of the reflecting member 2 as in the embodiment of FIG. 2, or on the upper surface of the insulating substrate 1 as in the embodiment of FIG. An annular groove may be formed in each of the first recess 8a and the lower surface of the reflecting member 2 as the second recess 8b.

図１８は、本発明の光源の実施の形態の一例を示しており、図１８（ａ）は光源の平面図、図１８（ｂ）は光源の断面図である。図１８において、パッケージは前述の図２に示す第二の実施形態のパッケージを例に用いている。   18A and 18B show an example of an embodiment of a light source of the present invention. FIG. 18A is a plan view of the light source, and FIG. 18B is a cross-sectional view of the light source. In FIG. 18, the package uses the package of the second embodiment shown in FIG. 2 as an example.

図１８において、発光素子３は、絶縁基体１に形成された発光素子３の搭載部１ｃの所定の場所にＡｕ−Ｓｎ半田やＰｂ−Ｓｎ半田等の半田材やエポキシ樹脂接合材等の接合材を用いて載置固定される。さらに、発光素子３の上面に形成された電極（図示せず）と発光素子３の搭載部１ｃに設けられた導体部とがボンディングワイヤ７にて電気的に接続される。   In FIG. 18, the light emitting element 3 is a bonding material such as a solder material such as Au—Sn solder or Pb—Sn solder, or an epoxy resin bonding material at a predetermined position of the mounting portion 1 c of the light emitting element 3 formed on the insulating substrate 1. It is mounted and fixed using. Further, an electrode (not shown) formed on the upper surface of the light emitting element 3 and a conductor portion provided on the mounting portion 1 c of the light emitting element 3 are electrically connected by a bonding wire 7.

なお、発光素子３はフリップチップボンディング方式（図示せず）によって接続してもよく、この場合、発光素子３に形成された電極を下面にして、発光素子３の搭載部１ｃの導体部を所望の形状に発光素子３の直下に位置させ、Ａｕ−Ｓｎ半田やＰｂ−Ｓｎ半田等の半田材やＡｇペースト等の導電性部材によって電気的に接続する。これにより、発光素子３周辺の絶縁基体１上面にボンディングワイヤ７を接続する導体部エリアを設ける必要が無く、発光素子３から出る光が、絶縁基体１上面の発光素子３の搭載部１ｃや配線導体５によって吸収されることによる放射光強度の低下を抑制することができる。さらに、発光素子３で発生する熱は、発光素子３の搭載部１ｃを介して絶縁基体１に効率よく伝導されることにより、光源の作動時における発光素子３の温度上昇を有効に抑制することができ、発光効率の低下や発光波長の変動を抑制することができ、外部への発光効率が高く、安定動作する光源を作製できる。   The light emitting element 3 may be connected by a flip chip bonding method (not shown). In this case, the conductor portion of the mounting portion 1c of the light emitting element 3 is desired with the electrode formed on the light emitting element 3 as the bottom surface. And is electrically connected by a solder material such as Au-Sn solder or Pb-Sn solder or a conductive member such as Ag paste. Thus, it is not necessary to provide a conductor area for connecting the bonding wire 7 on the upper surface of the insulating substrate 1 around the light emitting element 3, and light emitted from the light emitting element 3 is mounted on the mounting portion 1 c of the light emitting element 3 on the upper surface of the insulating substrate 1 and wiring. A decrease in the intensity of the emitted light due to absorption by the conductor 5 can be suppressed. Furthermore, the heat generated in the light emitting element 3 is efficiently conducted to the insulating base 1 through the mounting portion 1c of the light emitting element 3, thereby effectively suppressing the temperature rise of the light emitting element 3 during the operation of the light source. Thus, a decrease in light emission efficiency and fluctuations in light emission wavelength can be suppressed, and a light source with high light emission efficiency outside and stable operation can be manufactured.

保護素子４は、絶縁基体１に形成された保護素子４の搭載部１ｄの所定の場所にＡｕ−Ｓｎ半田やＰｂ−Ｓｎ半田等の半田材やＡｇペースト等の導電性部材によって載置固定され、保護素子４の上面に形成された電極（図示せず）と、保護素子４の搭載部１ｄに導出された導体部とがボンディングワイヤ７にて電気的に接続される。   The protective element 4 is placed and fixed at a predetermined position of the mounting portion 1d of the protective element 4 formed on the insulating substrate 1 by a solder material such as Au-Sn solder or Pb-Sn solder, or a conductive member such as Ag paste. The electrodes (not shown) formed on the upper surface of the protection element 4 and the conductor portion led out to the mounting portion 1 d of the protection element 4 are electrically connected by the bonding wire 7.

保護素子４は、発光素子３にかかる逆電圧やサージ電圧を防止する素子であり、ツェナーダイオード等がよく用いられる。ツェナーダイオードは、ある逆電圧以上がかかった場合、ツェナー効果により大きな電流が流れる特性を持つ半導体素子であり、発光素子３と逆方向に、かつ電気的に並列接続となるよう配線された配線導体５に接続される。また、ツェナーダイオードの他にバリスタやサイリスタ等のように、ある一定の電圧以上が端子間にかかった場合、導通抵抗が小さくなるような素子であってもよい。また、発光素子３に直列になるように抵抗を、並列にキャパシタンスを接続することで構成される、いわゆるＲＣフィルタ（ＲＣ回路）であってもよい。なお、本発明の光源において、上記本発明の第二の実施形態のパッケージを用いた場合について説明を行なったが、上記本発明の第一または第三の発明のパッケージを用いた場合についても同様であるため、説明は省略する。   The protection element 4 is an element that prevents reverse voltage and surge voltage applied to the light emitting element 3, and a Zener diode or the like is often used. The Zener diode is a semiconductor element having a characteristic that a large current flows due to a Zener effect when a reverse voltage or more is applied, and is a wiring conductor that is wired in the opposite direction to the light emitting element 3 and electrically connected in parallel. 5 is connected. In addition to a Zener diode, an element such as a varistor or a thyristor may be used that has a low conduction resistance when a certain voltage or more is applied between the terminals. Further, a so-called RC filter (RC circuit) configured by connecting a resistor in series with the light emitting element 3 and a capacitance in parallel may be used. In the light source of the present invention, the case of using the package of the second embodiment of the present invention has been described, but the same applies to the case of using the package of the first or third invention of the present invention. Therefore, the description is omitted.

また、図１９に示すように、発光素子３を被覆するように透光性部材６を配してもよい。透光性部材６は、発光素子３との屈折率差が小さく、紫外光領域から可視光領域に含まれる光に対して透過率の高いシリコーン樹脂、エポキシ樹脂、ユリア樹脂等の透明樹脂や、低融点ガラス、ゾル−ゲルガラス等の透明ガラスから成るのがよい。これにより、発光素子３と透光性部材６との屈折率差により発光素子３と透光性部材６との界面における光の反射損失が発生するのを抑制することが可能となり、発光素子３から出る光の外部への光取り出し効率が上がり、放射光強度の高い光源とすることができる。なお、透光性部材６は、絶縁基体１や反射部材２の材質や熱膨張係数等を考慮して適切に選定すればよく、特に限定されるものではない。また、図１０においては、本発明の第二の実施形態例のパッケージを基にしている。   Further, as shown in FIG. 19, a translucent member 6 may be disposed so as to cover the light emitting element 3. The translucent member 6 has a small refractive index difference from the light emitting element 3 and has a high transmittance with respect to light contained in the visible light region from the ultraviolet light region, such as a transparent resin such as a silicone resin, an epoxy resin, a urea resin, It is good to consist of transparent glass, such as low melting glass and sol-gel glass. Accordingly, it is possible to suppress the occurrence of light reflection loss at the interface between the light emitting element 3 and the light transmissive member 6 due to the difference in refractive index between the light emitting element 3 and the light transmissive member 6. The light extraction efficiency of the light emitted from the light increases, and a light source having high radiated light intensity can be obtained. The translucent member 6 may be appropriately selected in consideration of the material of the insulating base 1 and the reflecting member 2, the thermal expansion coefficient, and the like, and is not particularly limited. FIG. 10 is based on the package of the second embodiment of the present invention.

また、図２０に示すように、反射部材２の開口内側に透光性部材６を充填してもよい。なお、図１９および図２０において、透光性部材６は単一種類の形態を一例として記載したが、複数（２種類以上）種類を用いてもよく、例えば、図２１に示すように、発光素子３側には発光素子３の屈折率に近い屈折率を有する透光性部材６を被覆し、その上面に発光素子３側の透光性部材６より屈折率の小さい透光性部材６’を順次積層してもよい。これにより、透光性部材６と外部空間との界面で屈折率差により生じる反射損失が低減し、発光装置の光出力が向上する。また、積層順位を変えて、発光素子３側に屈折率が小さい透光性部材６を配置し、その上面に屈折率の大きい透光性部材６’を配置してもよい。これにより、最上層の透光性部材６’と外部空間との界面にて反射された光が透光性部材６との界面によって上方に反射できることから、絶縁基体１や発光素子３に反射することによって発生する光の反射損失を有効に抑制でき、外部への光取り出し効率の高い光源を作製できる。なお、透光性部材６を複数種類用いる場合は、透光性部材６の屈折率や熱膨張係数等を考慮して適切に選定すればよく、特に限定されるものではない。   As shown in FIG. 20, the translucent member 6 may be filled inside the opening of the reflecting member 2. In FIGS. 19 and 20, the translucent member 6 is described as an example of a single type, but a plurality of types (two or more types) may be used. For example, as shown in FIG. The light-transmitting member 6 having a refractive index close to that of the light-emitting element 3 is coated on the element 3 side, and the light-transmitting member 6 ′ having a lower refractive index than the light-transmitting member 6 on the light-emitting element 3 side is coated on the upper surface. May be sequentially laminated. Thereby, the reflection loss caused by the difference in refractive index at the interface between the translucent member 6 and the external space is reduced, and the light output of the light emitting device is improved. In addition, the order of stacking may be changed, and the translucent member 6 having a low refractive index may be disposed on the light emitting element 3 side, and the translucent member 6 'having a large refractive index may be disposed on the upper surface thereof. As a result, the light reflected at the interface between the uppermost translucent member 6 ′ and the external space can be reflected upward by the interface with the translucent member 6, and is reflected by the insulating substrate 1 and the light emitting element 3. Therefore, it is possible to effectively suppress the reflection loss of light generated by the above, and it is possible to manufacture a light source having high light extraction efficiency. In addition, when using multiple types of the translucent member 6, what is necessary is just to select suitably considering the refractive index, the thermal expansion coefficient, etc. of the translucent member 6, and it does not specifically limit.

また、図２２に示すように、発光素子３の側方や上方に蛍光体もしくは蛍光体を含有した透明部材９を塗布した後、発光素子３を被覆するように透光性部材６を載置もしくは反射部材２の開口内側に充填してもよい。これにより、発光素子３の光を蛍光体により波長変換し所望の波長スペクトルを有する光を取り出すことができる光源となる。   In addition, as shown in FIG. 22, after applying a phosphor or a transparent member 9 containing a phosphor on the side or upper side of the light emitting element 3, a translucent member 6 is placed so as to cover the light emitting element 3. Alternatively, the inside of the opening of the reflecting member 2 may be filled. Thereby, it becomes a light source which can take out the light which has a desired wavelength spectrum by wavelength-converting the light of the light emitting element 3 with a fluorescent substance.

あるいは、図２３に示すように、発光素子３を被覆するように透光性部材６を載置もしくは反射部材２の内側に充填し、透光性部材６の上方に、蛍光体を含有した透明部材９、あるいはシート状に形成した透明部材９を設置しても、所望の波長スペクトルを有する光源１０１とすることができる。   Alternatively, as shown in FIG. 23, a translucent member 6 is placed or filled inside the reflective member 2 so as to cover the light emitting element 3, and a transparent material containing a phosphor is disposed above the translucent member 6. Even if the member 9 or the transparent member 9 formed in a sheet shape is installed, the light source 101 having a desired wavelength spectrum can be obtained.

そして、本発明の光源１０１は、光源１０１を駆動するための電気配線を有する駆動部１０２と配線導体５とが、ＡｕやＡｌ等のボンディングワイヤあるいはリボン線により、電気的に接続され、光源から出射される光を所望の強度および指向性等の光学特性を有するように任意の形状に光学設計された光反射手段１０３が配置されることにより本発明の発光装置となる。これにより、従来の発光装置より高発光効率を有し、信頼性の高い、動作安定可能な発光装置とすることができる。   In the light source 101 of the present invention, the drive unit 102 having the electrical wiring for driving the light source 101 and the wiring conductor 5 are electrically connected by a bonding wire or ribbon wire such as Au or Al, and the light source 101 By arranging the light reflecting means 103 optically designed in an arbitrary shape so that the emitted light has optical characteristics such as desired intensity and directivity, the light emitting device of the present invention is obtained. Accordingly, a light-emitting device that has higher light emission efficiency than a conventional light-emitting device, high reliability, and stable operation can be obtained.

図２４、図２５は本発明の発光装置の実施の形態の一例を模式的に示すもので、１０１は本発明の光源、１０２は駆動部、１０３は光反射手段を示す。   24 and 25 schematically show an example of an embodiment of a light-emitting device according to the present invention, where 101 is a light source according to the present invention, 102 is a drive unit, and 103 is a light reflecting means.

駆動部１０２は、酸化アルミニウム，窒化アルミニウム，窒化珪素，ムライト等を主成分とするセラミック材料，ガラス，あるいはガラスとセラミックフィラーとの混合物を焼成して形成されたガラスセラミック材料，エポキシ樹脂，ポリイミド樹脂，四フッ化エチレン樹脂を始めとするフッ素系樹脂等の有機樹脂系材料，有機樹脂−セラミック（ガラスも含む）複合系材料等の絶縁板の一主面側にＷ，Ｍｏ，Ａｕ，Ａｇ，Ｃｕ等を主成分とするメタライズ、あるいはＡｕ，Ａｇ，Ｃｕ，Ａｌ等を主成分とする金属箔等の導体を形成し、その一端側を光源１０１が搭載される直下に延伸させ、光源１０１の外部電極（第１の配線導体５ａ）と接続できる端子部とし、他端側を外部電源と接続する端子部として形成された電気配線を有する。また、光源１０１の電圧，電流をコントロールする電気回路等を設けてもよい。   The driving unit 102 is made of a ceramic material mainly composed of aluminum oxide, aluminum nitride, silicon nitride, mullite, or the like, glass, or a glass ceramic material formed by firing a mixture of glass and ceramic filler, epoxy resin, polyimide resin. , W, Mo, Au, Ag, etc. on one main surface side of an insulating plate such as organic resin material such as fluororesin such as tetrafluoroethylene resin, organic resin-ceramic (including glass) composite material, etc. A conductor such as metallization mainly composed of Cu or the like, or a metal foil mainly composed of Au, Ag, Cu, Al or the like is formed, and one end side thereof is extended immediately below where the light source 101 is mounted. It has an electrical wiring formed as a terminal portion that can be connected to an external electrode (first wiring conductor 5a) and the other end side as a terminal portion that is connected to an external power source. Further, an electric circuit for controlling the voltage and current of the light source 101 may be provided.

光反射手段１０３は、Ａｌ、Ａｇ、Ａｕ、Ｐｔ、Ｔｉ、Ｃｒ、Ｃｕ等の高反射率を有する金属板や白色等のセラミックス、白色等の樹脂で構成するか、または、内周面にＡｌ、Ａｇ、Ａｕ等の金属を蒸着法や鍍金法等により金属薄膜を形成し、任意の光強度分布、任意の指向特性となるように縦断面における内周面形状が直線状や円弧状（曲面状）を持つように設計されたものであり、駆動部１０２上に載置された光源１０１を、その内周面で囲むように配置することで、光源１０１から出た光を上方へ所望の配光特性となるように取り出すことを可能とする。   The light reflecting means 103 is made of a highly reflective metal plate such as Al, Ag, Au, Pt, Ti, Cr, Cu, ceramics such as white, resin such as white, or Al on the inner peripheral surface. A metal thin film is formed from a metal such as Ag, Au or the like by vapor deposition or plating, and the inner peripheral surface shape in the longitudinal section is linear or arcuate (curved surface) so as to have an arbitrary light intensity distribution and arbitrary directivity The light source 101 placed on the driving unit 102 is arranged so as to be surrounded by the inner peripheral surface thereof, so that the light emitted from the light source 101 can be desired upward. It can be taken out so as to have light distribution characteristics.

本発明の発光装置において、一個のものを光源１０１として所定の配置となるように設置したり、または、複数個を、例えば、格子状や千鳥状、放射状等の所定の配置となるように設置したりしてもよい。あるいは、複数の光源１０１から成る円形状や多角形状の光源１０１群を同心状に複数群形成したもの等を所定の配置となるように設置してもよい。これにより、従来の複数個配置型光源１０１よりも強度ムラの抑制された発光装置とすることができる。   In the light emitting device of the present invention, one light source 101 is installed so as to have a predetermined arrangement, or a plurality of light emitting apparatuses are installed so as to have a predetermined arrangement such as a lattice shape, a staggered shape, a radial shape, or the like. You may do it. Or you may install so that it may become predetermined arrangement | positioning etc. which formed multiple groups of the circular shape and polygonal light source 101 group which consists of the several light source 101 concentrically. Thereby, it can be set as the light-emitting device by which intensity nonuniformity was suppressed rather than the conventional multiple arrangement type light source 101. FIG.

例えば、図２４（ａ）の平面図、（ｂ）の断面図に示すように複数個の光源１０１が光源１０１を駆動するための駆動部１０２上に複数列に配置され、光源１０１の周囲に任意の形状に光学設計された光反射手段１０３が設置されてなる発光装置の場合、隣り合う光源１０１との間隔が最短にならない配置、例えば一列に配置された複数個の光源１０１の間に隣り合う列の光源１０１が配置された配置、いわゆる千鳥状の配置とすることが好ましい。即ち、光源１０１が格子状に配置される場合には、光源１０１が縦横直線上に配列されることによりグレアが強くなり、このような光源１０１が人の視覚に入ってくることにより、不快感を起こしやすくなるのに対し、千鳥状とすることにより、グレアが抑制され人の眼に対する不快感を低減することができる。さらに、隣り合う光源１０１間の距離が長くなることにより、隣接する光源１０１間の熱的な干渉が有効に抑制され、光源１０１が実装された駆動部１０２内における熱のこもりが抑制され、光源１０１の外部に効率よく熱が放散される。その結果、人の眼に対して不快感が小さく、長期間にわたって光学特性の安定した長寿命の発光装置を作製することができる。   For example, as shown in the plan view of FIG. 24A and the cross-sectional view of FIG. 24B, a plurality of light sources 101 are arranged in a plurality of rows on a drive unit 102 for driving the light sources 101, and around the light sources 101. In the case of a light emitting device in which the light reflecting means 103 optically designed in an arbitrary shape is installed, an arrangement in which the distance between adjacent light sources 101 is not the shortest, for example, between a plurality of light sources 101 arranged in a row. It is preferable to use an arrangement in which the light sources 101 of matching rows are arranged, that is, a so-called staggered arrangement. That is, when the light sources 101 are arranged in a grid pattern, the glare is strengthened by arranging the light sources 101 on vertical and horizontal straight lines. In contrast to the staggered pattern, glare is suppressed and discomfort to the human eye can be reduced. Furthermore, since the distance between the adjacent light sources 101 is increased, thermal interference between the adjacent light sources 101 is effectively suppressed, heat accumulation in the drive unit 102 in which the light sources 101 are mounted is suppressed, and the light source Heat is efficiently dissipated to the outside of 101. As a result, it is possible to manufacture a light-emitting device with a long life with less discomfort to human eyes and stable optical characteristics over a long period of time.

また、発光装置が、図２５（ａ）の平面図、（ｂ）の断面図に示すような駆動部１０２上に複数の光源１０１からなる円形状や多角形状の光源１０１群を、同心状に複数群形成した発光装置の場合、一つの円形状や多角形状の光源１０１群における光源１０１の配置数を発光装置の中央側より外周側ほど多くすることが好ましい。これにより、光源１０１同士の間隔を適度に保ちながら光源１０１をより多く配置することができ、発光装置の照度をより向上させることができる。また、発光装置の中央部の光源１０１の密度を低くして駆動部１０２の中央部における熱のこもりを抑制することができる。その結果、駆動部１０２内における温度分布が一様となり、発光装置を設置した外部電気回路基板やヒートシンクに効率よく熱が伝達され、光源１０１の温度上昇を抑制することができ、光源１０１は長期間にわたり安定して動作することができるとともに長寿命の発光装置を作製することができる。   In addition, the light-emitting device concentrically arranges a circular or polygonal light source 101 group composed of a plurality of light sources 101 on the driving unit 102 as shown in the plan view of FIG. 25A and the cross-sectional view of FIG. In the case of light emitting devices formed in a plurality of groups, it is preferable to increase the number of light sources 101 arranged in one circular or polygonal light source 101 group from the center side to the outer peripheral side of the light emitting device. Thereby, more light sources 101 can be arrange | positioned maintaining the space | interval of light sources 101 moderately, and the illumination intensity of a light-emitting device can be improved more. In addition, the density of the light source 101 at the center of the light emitting device can be lowered to suppress heat accumulation at the center of the drive unit 102. As a result, the temperature distribution in the drive unit 102 becomes uniform, heat is efficiently transmitted to the external electric circuit board or heat sink on which the light emitting device is installed, and the temperature rise of the light source 101 can be suppressed. A light-emitting device that can operate stably over a period of time and has a long lifetime can be manufactured.

このような発光装置を用いた照明装置としては、例えば、室内や室外で用いられる、一般照明用器具、シャンデリア用照明器具、住宅用照明器具、オフィス用照明器具、店装、展示用照明器具、街路灯用照明器具、誘導灯器具および信号装置、舞台およびスタジオ用の照明器具、広告灯、照明用ポール、水中照明用ライト、ストロボ用ライト、スポットライト、電柱等に埋め込む防犯用照明、非常用照明器具、懐中電灯、電光掲示板等や、調光器、自動点滅器、ディスプレイ等のバックライト、動画装置、装飾品、照光式スイッチ、光センサ、医療用ライト、車載ライト等が挙げられる。   Examples of the lighting device using such a light emitting device include, for example, general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, and display lighting fixtures that are used indoors and outdoors. Street lighting fixtures, guide lights and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency use Examples include lighting fixtures, flashlights, electric bulletin boards, backlights such as dimmers, automatic flashers, displays, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, vehicle lights, and the like.

なお、本発明は上記の実施の形態に限定されず、本発明の要旨を逸脱しない範囲内で種々の変更を行なうことは何等支障ない。例えば、反射部材２の上面に光源１０１より出射される光を所要に集光し拡散させる光学レンズや平板状の透光性の蓋体を半田や樹脂接合剤等で接合することにより、所望する放射角度で光を取り出すことができる発光装置としてもよい。これにより、光源１０１への浸水性が改善され長期信頼性が向上する。   It should be noted that the present invention is not limited to the above-described embodiment, and various modifications are not hindered without departing from the gist of the present invention. For example, an optical lens for condensing and diffusing the light emitted from the light source 101 to the upper surface of the reflecting member 2 or a flat light-transmitting lid is bonded with solder, a resin bonding agent, or the like. A light emitting device that can extract light at a radiation angle may be used. Thereby, the water immersion to the light source 101 is improved and long-term reliability is improved.

また、上記実施の形態の説明において上下左右という用語は、単に図面上の位置関係を説明するために用いたものであり、実際の使用時における位置関係を意味するものではない。   In the description of the above embodiment, the terms “upper, lower, left and right” are merely used to describe the positional relationship in the drawings, and do not mean the positional relationship in actual use.

（ａ）は本発明の発光素子収納用パッケージの第一の実施の形態の一例を示す平面図、（ｂ）は（ａ）の断面図である。(A) is a top view which shows an example of 1st embodiment of the light emitting element storage package of this invention, (b) is sectional drawing of (a). （ａ）は本発明の発光素子収納用パッケージの第二の実施の形態の一例を示す平面図、（ｂ）は（ａ）の断面図である。(A) is a top view which shows an example of 2nd embodiment of the light emitting element storage package of this invention, (b) is sectional drawing of (a). 本発明の発光素子収納用パッケージの第二の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of 2nd embodiment of the light emitting element storage package of this invention. 本発明の発光素子収納用パッケージの第二の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of 2nd embodiment of the light emitting element storage package of this invention. （ａ）は本発明の発光素子収納用パッケージの第三の実施の形態の一例を示す平面図、（ｂ）は（ａ）の断面図である。(A) is a top view which shows an example of 3rd embodiment of the light emitting element storage package of this invention, (b) is sectional drawing of (a). 本発明の発光素子収納用パッケージの第三の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of 3rd embodiment of the light emitting element storage package of this invention. （ａ）および（ｂ）は本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。(A) And (b) is sectional drawing which shows the other example of embodiment of the light emitting element storage package of this invention. （ａ）および（ｂ）は本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。(A) And (b) is sectional drawing which shows the other example of embodiment of the light emitting element storage package of this invention. （ａ）および（ｂ）は図７および図８に示す本発明の発光素子収納用パッケージの実施の形態の例を示す平面図である。(A) And (b) is a top view which shows the example of embodiment of the light emitting element storage package of this invention shown to FIG. 7 and FIG. （ａ）および（ｂ）は本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。(A) And (b) is sectional drawing which shows the other example of embodiment of the light emitting element storage package of this invention. （ａ）および（ｂ）は本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。(A) And (b) is sectional drawing which shows the other example of embodiment of the light emitting element storage package of this invention. （ａ）および（ｂ）は本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。(A) And (b) is sectional drawing which shows the other example of embodiment of the light emitting element storage package of this invention. （ａ）および（ｂ）は本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。(A) And (b) is sectional drawing which shows the other example of embodiment of the light emitting element storage package of this invention. （ａ）および（ｂ）は図１０および図１２に示す本発明の発光素子収納用パッケージの実施の形態の例を示す平面図である。(A) And (b) is a top view which shows the example of embodiment of the light emitting element storage package of this invention shown to FIG. 10 and FIG. 図１１および図１３に示す本発明の発光素子収納用パッケージの実施の形態の例を示す平面図である。It is a top view which shows the example of embodiment of the light emitting element storage package of this invention shown to FIG. 11 and FIG. （ａ）は本発明の発光素子収納用パッケージの実施の形態の他の例を示す平面図、（ｂ）は（ａ）の断面図である。(A) is a top view which shows the other example of embodiment of the light emitting element storage package of this invention, (b) is sectional drawing of (a). （ａ）は本発明の発光素子収納用パッケージの実施の形態の他の例を示す平面図、（ｂ）は（ａ）の断面図である。(A) is a top view which shows the other example of embodiment of the light emitting element storage package of this invention, (b) is sectional drawing of (a). （ａ）は本発明の光源の実施の形態の一例を示す平面図、（ｂ）は（ａ）の断面図である。(A) is a top view which shows an example of embodiment of the light source of this invention, (b) is sectional drawing of (a). 本発明の光源の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light source of this invention. 本発明の光源の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light source of this invention. 本発明の光源の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light source of this invention. 本発明の光源の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light source of this invention. 本発明の光源の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light source of this invention. （ａ）は本発明の発光装置の実施の形態の一例を示す平面図、（ｂ）は（ａ）の断面図である。(A) is a top view which shows an example of embodiment of the light-emitting device of this invention, (b) is sectional drawing of (a). （ａ）は本発明の発光装置の実施の形態の他の例を示す平面図、（ｂ）は（ａ）の断面図である。(A) is a top view which shows the other example of embodiment of the light-emitting device of this invention, (b) is sectional drawing of (a). 従来の光源の一例を示す断面図である。It is sectional drawing which shows an example of the conventional light source. 従来の光源の他の例を示す断面図である。It is sectional drawing which shows the other example of the conventional light source.

符号の説明Explanation of symbols

１：絶縁基体
１ｃ：発光素子の搭載部
１ｄ：保護素子の搭載部
２：反射部材
２ａ：光反射面
３：発光素子
４：保護素子
５：配線導体
６：透光性部材
７：ボンディングワイヤ
８：凹部
９：透明部材 DESCRIPTION OF SYMBOLS 1: Insulation base | substrate 1c: Mount part of a light emitting element 1d: Mount part of a protective element 2: Reflective member 2a: Light reflection surface 3: Light emitting element 4: Protective element 5: Wiring conductor 6: Translucent member 7: Bonding wire 8 : Concave part 9: Transparent member

Claims (7)

一主面に、発光素子および該発光素子の過電圧印加を防止する保護素子の搭載部をそれぞれ有するとともに、前記発光素子および前記保護素子を接続する配線導体が形成された絶縁基体と、該絶縁基体の一主面に、内周面が光反射面とされるとともに前記発光素子の搭載部を取り囲むように取着された反射部材とを具備しており、前記保護素子の搭載部が前記光反射面より外側に配置されていることを特徴とする発光素子収納用パッケージ。 An insulating base having a light emitting element and a protective element mounting portion for preventing overvoltage application of the light emitting element on one main surface, and a wiring conductor for connecting the light emitting element and the protective element, and the insulating base And a reflecting member attached so as to surround the mounting portion of the light emitting element, and the mounting portion of the protection element is the light reflecting surface. A light-emitting element storage package, wherein the light-emitting element storage package is disposed outside the surface. 前記保護素子の搭載部は、前記保護素子を収納可能な凹部の内側に設けられていることを特徴とする請求項１記載の発光素子収納用パッケージ。 The light emitting element storage package according to claim 1, wherein the protection element mounting portion is provided inside a recess in which the protection element can be stored. 前記凹部は、前記発光素子搭載部側の内側面のうち、開口部側の部位が底面側の部位より前記発光素子搭載部側寄りとなるように形成されていることを特徴とする請求項２に記載の発光素子収納用パッケージ。 The concave portion is formed such that, of the inner surface on the light emitting element mounting portion side, the opening side portion is closer to the light emitting element mounting portion side than the bottom surface side portion. The light emitting element storage package described in 1. 前記保護素子の搭載部と前記発光素子の搭載部との間に溝が設けられていることを特徴とする請求項１乃至請求項３のいずれかに記載の発光素子収納用パッケージ。 The light emitting element storage package according to any one of claims 1 to 3, wherein a groove is provided between the protective element mounting portion and the light emitting element mounting portion. 前記保護素子の搭載部と前記絶縁基体の他主面との間に空隙部が設けられていることを特徴とする請求項１乃至請求項４のいずれかに記載の発光素子収納用パッケージ。 The light emitting element storage package according to claim 1, wherein a gap is provided between the protection element mounting portion and the other main surface of the insulating base. 請求項１乃至請求項５のいずれかに記載の発光素子収納用パッケージと、前記発光素子および前記保護素子の搭載部にそれぞれ搭載され、前記配線導体に接続された発光素子および保護素子とを具備していることを特徴とする光源。 A light emitting element storage package according to any one of claims 1 to 5, and a light emitting element and a protective element that are respectively mounted on mounting portions of the light emitting element and the protective element and connected to the wiring conductor. A light source characterized by 請求項６記載の光源と、前記光源が搭載され、前記光源を駆動する電気配線を有する駆動部と、前記光源から出射される光を反射する光反射手段とを含む発光装置。 7. A light emitting apparatus comprising: the light source according to claim 6; a driving unit on which the light source is mounted and having an electrical wiring that drives the light source; and a light reflecting unit that reflects light emitted from the light source.
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