JP2007137933A5 - - Google Patents
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- JP2007137933A5 JP2007137933A5 JP2005329834A JP2005329834A JP2007137933A5 JP 2007137933 A5 JP2007137933 A5 JP 2007137933A5 JP 2005329834 A JP2005329834 A JP 2005329834A JP 2005329834 A JP2005329834 A JP 2005329834A JP 2007137933 A5 JP2007137933 A5 JP 2007137933A5
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- JP
- Japan
- Prior art keywords
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- resin
- heat
- resin composition
- residue
- Prior art date
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- 229920001721 polyimide Polymers 0.000 claims description 18
- 229920006015 heat resistant resin Polymers 0.000 claims description 14
- 125000004427 diamine group Chemical group 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 10
- 125000003700 epoxy group Chemical group 0.000 claims description 10
- 239000011342 resin composition Substances 0.000 claims description 10
- 230000009477 glass transition Effects 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000009719 polyimide resin Substances 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 125000006159 dianhydride group Chemical group 0.000 claims description 3
- SKKKJNPBIGQNEJ-UHFFFAOYSA-N 9h-fluorene-1,9-diamine Chemical compound C1=CC(N)=C2C(N)C3=CC=CC=C3C2=C1 SKKKJNPBIGQNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 5
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims 3
- 125000000217 alkyl group Chemical group 0.000 claims 3
- 125000004432 carbon atom Chemical group C* 0.000 claims 3
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims 2
- 125000003545 alkoxy group Chemical group 0.000 claims 2
- 150000004984 aromatic diamines Chemical class 0.000 claims 2
- 229910002091 carbon monoxide Inorganic materials 0.000 claims 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 2
- 125000004093 cyano group Chemical group *C#N 0.000 claims 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 claims 2
- 229910052736 halogen Inorganic materials 0.000 claims 2
- 150000002367 halogens Chemical class 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims 2
- 229910052760 oxygen Inorganic materials 0.000 claims 2
- 125000001174 sulfone group Chemical group 0.000 claims 2
- 229910052717 sulfur Inorganic materials 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims 1
- SUAKHGWARZSWIH-UHFFFAOYSA-N N,N‐diethylformamide Chemical compound CCN(CC)C=O SUAKHGWARZSWIH-UHFFFAOYSA-N 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 1
- 229940116333 ethyl lactate Drugs 0.000 claims 1
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 7
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229910016847 F2-WS Inorganic materials 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005329834A JP2007137933A (ja) | 2005-11-15 | 2005-11-15 | 樹脂組成物、これを用いた耐熱性樹脂積層フィルム、及び金属層付き積層フィルム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005329834A JP2007137933A (ja) | 2005-11-15 | 2005-11-15 | 樹脂組成物、これを用いた耐熱性樹脂積層フィルム、及び金属層付き積層フィルム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007137933A JP2007137933A (ja) | 2007-06-07 |
| JP2007137933A5 true JP2007137933A5 (https=) | 2009-01-08 |
Family
ID=38201216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005329834A Withdrawn JP2007137933A (ja) | 2005-11-15 | 2005-11-15 | 樹脂組成物、これを用いた耐熱性樹脂積層フィルム、及び金属層付き積層フィルム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007137933A (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015104843A (ja) * | 2013-11-29 | 2015-06-08 | 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． | 積層体とその製造方法、及び該積層体を用いた電子デバイスの製造方法 |
| JP6555006B2 (ja) * | 2015-08-21 | 2019-08-07 | 東レ株式会社 | エポキシ樹脂組成物、樹脂硬化物、プリプレグおよび繊維強化複合材料 |
| KR102251517B1 (ko) * | 2015-09-30 | 2021-05-12 | 코오롱인더스트리 주식회사 | 폴리아믹산 용액, 폴리이미드 필름, 및 이를 포함하는 영상 표시 소자 |
| WO2019009259A1 (ja) * | 2017-07-03 | 2019-01-10 | 日産化学株式会社 | フレキシブルデバイス基板形成用組成物 |
| US11898009B2 (en) * | 2018-04-20 | 2024-02-13 | Ube Corporation | Polyimide, laminate, and electronic device including same |
| EP4026867B1 (en) | 2019-09-06 | 2023-12-06 | Resonac Corporation | Polyamideimide resin, resin composition, and semiconductor device |
| JP7726265B2 (ja) * | 2021-03-04 | 2025-08-20 | 株式会社レゾナック | ポリアミドイミド樹脂、樹脂組成物、及び半導体装置 |
| KR20250027743A (ko) * | 2022-06-24 | 2025-02-27 | 가부시키가이샤 가네카 | 폴리아미드산 조성물, 폴리이미드의 제조 방법, 적층체의 제조 방법 및 전자 디바이스의 제조 방법 |
| KR20250172543A (ko) * | 2023-04-12 | 2025-12-09 | 가부시키가이샤 피아이 기쥬츠 켄큐쇼 | 폴리이미드 수지 및 점착 필름 |
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2005
- 2005-11-15 JP JP2005329834A patent/JP2007137933A/ja not_active Withdrawn
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