JP2007123607A5 - - Google Patents

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Publication number
JP2007123607A5
JP2007123607A5 JP2005314757A JP2005314757A JP2007123607A5 JP 2007123607 A5 JP2007123607 A5 JP 2007123607A5 JP 2005314757 A JP2005314757 A JP 2005314757A JP 2005314757 A JP2005314757 A JP 2005314757A JP 2007123607 A5 JP2007123607 A5 JP 2007123607A5
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JP
Japan
Prior art keywords
cooling medium
cooling
passages
medium passages
inlet portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005314757A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007123607A (ja
JP4470857B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2005314757A external-priority patent/JP4470857B2/ja
Priority to JP2005314757A priority Critical patent/JP4470857B2/ja
Priority to DE112006002839T priority patent/DE112006002839B4/de
Priority to CN200680040186.7A priority patent/CN101297401B/zh
Priority to PCT/JP2006/321931 priority patent/WO2007049807A1/ja
Priority to US12/091,931 priority patent/US8789578B2/en
Publication of JP2007123607A publication Critical patent/JP2007123607A/ja
Publication of JP2007123607A5 publication Critical patent/JP2007123607A5/ja
Publication of JP4470857B2 publication Critical patent/JP4470857B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005314757A 2005-10-28 2005-10-28 電気機器の冷却構造 Expired - Fee Related JP4470857B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005314757A JP4470857B2 (ja) 2005-10-28 2005-10-28 電気機器の冷却構造
US12/091,931 US8789578B2 (en) 2005-10-28 2006-10-26 Cooling structure for electric device
CN200680040186.7A CN101297401B (zh) 2005-10-28 2006-10-26 用于电气器件的冷却结构
PCT/JP2006/321931 WO2007049807A1 (ja) 2005-10-28 2006-10-26 電気機器の冷却構造
DE112006002839T DE112006002839B4 (de) 2005-10-28 2006-10-26 Anordnung aus einer elektrischen Vorrichtung und einer Kühlstruktur für die elektrische Vorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005314757A JP4470857B2 (ja) 2005-10-28 2005-10-28 電気機器の冷却構造

Publications (3)

Publication Number Publication Date
JP2007123607A JP2007123607A (ja) 2007-05-17
JP2007123607A5 true JP2007123607A5 (enExample) 2008-01-31
JP4470857B2 JP4470857B2 (ja) 2010-06-02

Family

ID=37967908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005314757A Expired - Fee Related JP4470857B2 (ja) 2005-10-28 2005-10-28 電気機器の冷却構造

Country Status (5)

Country Link
US (1) US8789578B2 (enExample)
JP (1) JP4470857B2 (enExample)
CN (1) CN101297401B (enExample)
DE (1) DE112006002839B4 (enExample)
WO (1) WO2007049807A1 (enExample)

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JP2011134979A (ja) * 2009-12-25 2011-07-07 Fuji Electric Co Ltd 液体冷却式ヒートシンク
CN103477432B (zh) * 2011-05-16 2017-06-20 富士电机株式会社 半导体模块冷却器
CN102545723B (zh) * 2012-03-02 2014-09-17 杭州电子科技大学 半导体制冷片温差发电实验装置
JP5975110B2 (ja) * 2012-10-29 2016-08-23 富士電機株式会社 半導体装置
CN105075068B (zh) * 2013-09-10 2018-10-16 普罗蒂恩电子有限公司 电动机或发电机
US10257524B2 (en) * 2015-07-01 2019-04-09 Mediatek Inc. Residual up-sampling apparatus for performing transform block up-sampling and residual down-sampling apparatus for performing transform block down-sampling
JP2018093115A (ja) * 2016-12-06 2018-06-14 株式会社デンソー 冷却器
JP6698111B2 (ja) * 2018-01-09 2020-05-27 日本軽金属株式会社 液冷ジャケット
US10548245B2 (en) 2018-02-12 2020-01-28 Robert J Lipp Liquid cooled open compute project rack insert
JP2019057739A (ja) * 2019-01-07 2019-04-11 日本軽金属株式会社 液冷ジャケット
EP3836206B1 (en) * 2019-12-13 2025-05-07 Valeo eAutomotive Germany GmbH Cooling device for semiconductor switching elements, power inverter device, arrangement and manufacturing method
DE102021206107B4 (de) * 2021-06-15 2024-09-12 Bundesdruckerei Gmbh Vorrichtung und Verfahren zum Herstellen von Hologrammen im Kontaktkopierverfahren mit hoher Beugungseffizienz
CN117316895A (zh) * 2022-06-23 2023-12-29 中兴通讯股份有限公司 液冷封装结构、液冷散热系统和通信设备
CN118575268A (zh) * 2022-08-24 2024-08-30 富士电机株式会社 半导体装置

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