JP2007120961A - Prober apparatus, probe stylus cleaning method, and apparatus and method for inspecting semiconductor chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To satisfactorily clean probe styluses; to clean them in real time; to improve inspection reliability and inspection quality; and to reduce inspection costs. <P>SOLUTION: While semiconductor chips are being repeatedly inspected, air from an air feed part 15 is fed inward from the periphery of a probe stylus 14 on a probe card 13 to disperse dust such as shavings adhering to each probe stylus 14 in inward directions of the location at which the probe stylus 14 is arranged. Dust dispersed in inward directions of the location at which the probe stylus 14 is arranged is recovered to the outside of the apparatus by drawing the duct by suction by a vacuum part 16 arranged at a center part of the probe card 13. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a prober device used for inspecting a semiconductor chip on a semiconductor wafer, a probe stylus cleaning method in the prober device, a semiconductor chip inspection device using the prober device, and a semiconductor chip inspection method.

  In recent years, high integration, multi-functionalization, and low cost of semiconductor integrated circuits have become essential. In this case, how to efficiently reduce packaged assemblies rather than reducing the chip size. The issue is whether to make a chip.

  Further, the inspection cost of an assembly as a semiconductor device is also an unavoidable matter for a sold product, and is an important issue particularly from the viewpoint of maintaining quality and reliability.

  However, since the inspection is focused on the inspection contents and the reliability of the inspection, the inspection cost is not considered much in the inspection apparatuses and facilities.

In addition, when a prober device is used in this inspection apparatus or facility, dust such as shavings generated at the contact point between the probe stylus and the electrode on the wafer is removed to stabilize the inspection operation by the probe stylus. However, techniques relating to the cleaning have been proposed (see, for example, Patent Documents 1 and 2).
JP-A-5-41424 JP 2000-174080 A

  By the way, in a conventional inspection apparatus for semiconductor wafers using a prober apparatus, it is necessary to temporarily stop the inspection apparatus and related equipment during cleaning.

  Further, in the conventional technique in which a down flow of air is generated at the time of cleaning, there is a possibility that dust such as shavings removed will adhere to the probe stylus or the wafer again by the continuous inspection operation.

  The real-time property of cleaning as described above and the complete removal of dust are major issues for reducing the cost of inspection.

  The present invention solves the above-mentioned conventional problems, enables good cleaning of the probe stylus, enables real-time cleaning, improves the reliability and quality of the inspection itself, and reduces the inspection cost. An object of the present invention is to provide a prober device, a probe stylus cleaning method, a semiconductor chip inspection device, and a semiconductor chip inspection method.

  In order to achieve the above object, the invention according to claim 1 is a prober apparatus having a probe card provided with a plurality of probe styluses that perform electrical inspection by contacting an object to be inspected. An air sending part for sending air to remove dust adhering to the probe stylus from the side periphery to the probe stylus, and the removed dust from the central portion of the probe stylus in the probe card. It is characterized in that a suction part for suction is provided. With this configuration, it is possible to satisfactorily perform cleaning for removing scraps from the probe stylus without scattering to other parts.

  The invention according to claim 2 is characterized in that, in the prober device according to claim 1, the air sending part is arranged based on the fluidity of dust, and the suction part is arranged based on the fluidity. By configuring the air delivery unit and the suction unit according to the expected type of dust, good cleaning is performed.

  According to a third aspect of the present invention, there is provided a probe stylus cleaning method for cleaning the probe stylus in a prober apparatus having a probe card provided with a plurality of probe styluses that are in contact with an object to be inspected for electrical inspection. In this case, air for removing dust adhering to the probe stylus is sent from the periphery of the probe stylus to the probe stylus, and the air is removed from a central portion of the probe stylus on the probe card. In this method, cleaning for removing shavings and the like from the probe stylus can be performed satisfactorily without scattering to other parts.

  The invention according to claim 4 is connected to the prober device according to claim 1 or 2, a memory unit storing a program for inspecting a function of a semiconductor chip of a semiconductor wafer as an object to be inspected, and the prober device, A semiconductor chip inspection apparatus including a tester that performs an inspection process on the semiconductor chip with a probe stylus of the prober device according to a program, and with this configuration, an inspection process using the probe stylus, cleaning of the probe stylus, It is possible to control both.

  According to a fifth aspect of the invention, the probe probe cleaning method according to the third aspect is executed by the prober apparatus according to the first or second aspect together with the inspection processing by the semiconductor chip inspection apparatus according to the fourth aspect. In this method, the inspection process using the probe stylus and the cleaning of the probe stylus can be controlled with good timing, and real-time cleaning can be realized.

  According to the present invention, cleaning for removing shavings and the like from the probe stylus can be performed satisfactorily without scattering to other parts, and the inspection processing by the probe stylus and the cleaning of the probe stylus are timed. It becomes possible to control well, and real-time cleaning can be realized. This makes it possible to improve the reliability and quality of the inspection itself and reduce the inspection cost.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic configuration diagram of a semiconductor chip inspection apparatus for explaining an embodiment of the present invention. Reference numeral 10 denotes a program for inspecting the function of a semiconductor chip such as a system LSI chip in a semiconductor wafer as an object to be inspected. A test head 11 including a memory unit (not shown) and a tester (not shown) for performing an inspection process on a semiconductor chip according to a program, and 11 is a connection unit for connecting the test head 10 and the prober device 12.

  The prober device 12 includes a probe card 13, a plurality of probe styluses 14 provided on the probe card 13, and air from the four outer peripheral sides of the probe stylus 14 to the inside surrounded by the probe stylus 14. An air delivery unit 15 for feeding, a vacuum unit 16 which is a suction unit installed at a substantially central portion of the probe card 13 and sucks air, a wafer suction stage 18 for holding the semiconductor wafer 17 at a predetermined position, and the like.

  Next, the inspection operation of the semiconductor chip inspection apparatus having the above configuration will be described.

  In FIG. 1, when a semiconductor wafer 17 is inspected, the semiconductor wafer 17 is placed in the prober device 12, placed on the wafer suction stage 18, and held and fixed at a predetermined position by vacuum suction. At the same time, the probe card 13 is placed in the prober device 12 and placed on the wafer suction stage 18. In this state, the prober device 12 and the test head 10 including a tester for processing a program for inspection are electrically connected by the connection unit 11.

  Next, an inspection program is executed by a tester of the test head 10, the probe stylus 14 provided on the probe card 13 is brought into contact with the terminal portion of the semiconductor chip on the semiconductor wafer 17, and the electric power is changed according to the program processing content. Will carry out regular inspections. A large number of semiconductor chips are arranged on the semiconductor wafer 17, and each semiconductor chip is repeatedly contacted with the probe stylus 14 to inspect all the semiconductor chips.

  During repeated execution of the inspection, air is sent from the periphery of the probe stylus 14 on the probe card 13 to the inside from the air delivery unit 15, and scraps attached to each probe stylus 14. The dust is scattered inward. Dust scattered to the inside of the position where the probe stylus 14 is disposed is sucked up by the vacuum unit 16 disposed at the center of the probe card 13 and collected outside the apparatus.

  With reference to the explanatory views of FIGS. 2A to 2D, the operation flow of inspection and cleaning in the present embodiment will be described.

  FIG. 2A shows a state in which an inspection is performed. The probe stylus 14 contacts the semiconductor wafer 17 and a predetermined inspection is performed. When shifting from this inspection state to the inspection end state shown in FIG. 2 (b), the air delivery section 15 operates and air is ejected. By this air flow, the scraps adhering to the probe stylus 14 are blown off. This operation is continued until the probe stylus 14 shown in FIG. 2C is moved to the next semiconductor wafer 17 '. Then, when the inspection of the next semiconductor wafer 17 ′ shown in FIG. 2D is performed, the air delivery unit 15 stops operating and the air delivery is stopped. This operation is repeated.

  In this inspection and cleaning operation control, the air delivery unit 15 is operated and stopped in conjunction with the vertical movement of the wafer suction stage 18 on which the semiconductor wafer 17 is placed. The vacuum unit 16 is always in operation at the same time as the start of the inspection, and sucks up dust on the surface of the semiconductor wafer 17 as well as dust and constantly performs cleaning.

  FIG. 3 is a cross-sectional view for explaining the generation mechanism of the terminal shavings generated by the probe stylus. 20 is a shaving scraped by the probe stylus 14 being in contact with the terminal 21 on the semiconductor wafer 17, and 20 a is the shaving scrap 20. 21a is a shaved part of the terminal 21 of the semiconductor chip.

  In FIG. 3, the probe stylus 14 is pressed against the terminal 21 of the semiconductor chip, and the inspection is performed by sequentially moving to the next terminal. For this reason, the probe stylus 14 bends and slides toward the center of the semiconductor chip. By pressing the probe stylus 14 in this way, a cut portion 21a is formed on the surface of the terminal 21 of the semiconductor chip, and the scraped residue 20 remains on the terminal 21 of the semiconductor chip as a mountain 20a. This is repeated, for example, hundreds of times during the inspection process, and the scrap residue 20 adheres to the probe stylus 14.

  FIG. 4 and FIG. 5 are explanatory views of probe stylus cleaning for removing the adhered scraps in this embodiment, FIG. 4 is an explanatory view of air delivery, and FIG. 5 is an explanatory view of scrap scraps suction.

  In FIG. 4, the probe card 13 is provided with a plurality of probe styluses 14 (four in this example, four on each side). From the air delivery section 15 shown in FIG. Air is fed inwardly from the probe stylus 14 from the vertical and horizontal directions in FIG. As shown in FIG. 4, the semiconductor chip 22 is located in the central portion of the inner position of each probe stylus 14.

  Therefore, the air flow 23 from the air delivery unit 15 flows into the inside of the probe stylus 14, the shavings 20 attached to the probe stylus 14 are removed by the air flow 23, and the removed shavings 20 are removed. It scatters toward the center of the semiconductor chip 22, that is, toward the center of the probe card 13.

  In FIG. 5, the scrap residue 20 is scattered by the air flow 23 and gathers at the center of the semiconductor chip 22. The scrap scrap 20 collected together with the air 24 inside the probe stylus 14 by the vacuum portion 16. By sucking the probe card 13 upward, the scrap residue 20 can be removed and collected again without adhering to the probe stylus or semiconductor wafer.

  In the present embodiment, by taking into consideration the air flow and the fluidity of the shavings, the installation space, etc., the air sending unit 15 and the vacuum unit 16 are installed to efficiently clean the shavings adhering to the probe stylus 14. This can be carried out satisfactorily, and the reliability of the inspection of the probe stylus 14 and the improvement of the chip quality can be realized.

  Furthermore, since this cleaning method has a configuration in which the tester head 10 and the prober device 12 are connected, the inspection process is interrupted by programming so that the inspection and the cleaning are performed at an appropriate timing in synchronization. Therefore, cleaning can be performed in real time as one of the inspection processes, and the overall cost of the inspection can be reduced.

  6 and 7 are perspective views for explaining modifications of the air delivery unit in the present embodiment.

  The example shown in FIG. 6 has a configuration in which an air delivery unit 25 is provided for each of the plurality of probe styluses 14, and the shavings 20 can be removed at a pinpoint.

  The example shown in FIG. 7 has a configuration in which an air delivery unit 26 provided with a long air delivery port 26a on the side is installed so that the air flow is distributed over the entire probe stylus 14.

  6 and 7 are used together with the configuration of the vacuum unit 16 in the embodiment described with reference to FIGS. 1 to 5 to perform cleaning in the same manner, so that the air delivery unit shown in FIG. It is possible to remove the scraps 20 attached to the probe stylus 14 more efficiently and substantially completely than 15. As a result, the reliability of the inspection by the probe stylus and the chip quality can be improved while maintaining the cleaning of the prober device.

  INDUSTRIAL APPLICABILITY The present invention is applied to prober devices and semiconductor chip inspection devices. In particular, cleaning of shavings generated by contact between a semiconductor pad on a wafer surface and a probe stylus is ensured in real time without reducing inspection efficiency. It is useful as a prober device for

Schematic configuration diagram of a semiconductor chip inspection apparatus for explaining an embodiment of the present invention (A)-(d) is explanatory drawing which concerns on the operation | movement flow of the test | inspection and cleaning in this embodiment. Sectional drawing explaining the generation | occurrence | production mechanism of the terminal shaving residue by the probe stylus which concerns on this embodiment Explanatory drawing of air sending of probe stylus cleaning for removing adhesion scraps in this embodiment Explanatory drawing of the shavings suction of the probe stylus cleaning which removes the adhesion shavings in this embodiment The perspective view for demonstrating the modification of the air sending part in this embodiment The perspective view for demonstrating the modification of the air sending part in this embodiment

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Test head 11 Connection part 12 Prober device 13 Probe card 14 Probe stylus 15, 25, 26 Air sending part 16 Vacuum part 17 Semiconductor wafer 18 Wafer adsorption stage 20 Cutting residue 21 Terminal 22 Semiconductor chip 23 Air flow

Claims (5)

In a prober apparatus having a probe card provided with a plurality of probe styluses that perform electrical inspection in contact with an object to be inspected,
An air delivery section for sending air to remove dust adhering to the probe stylus from the side periphery of the probe stylus;
A prober device, comprising: a suction portion for sucking the removed dust from a central portion of the probe stylus in the probe card.   2. The prober device according to claim 1, wherein the air delivery unit is arranged based on the fluidity of the dust, and the suction unit is arranged based on the fluidity. In a probe stylus cleaning method for cleaning the probe stylus in a prober apparatus having a probe card provided with a plurality of probe styluses that are in contact with an object to be inspected for electrical inspection,
The air which removes the dust adhering to the probe stylus is sent from the periphery of the probe stylus to the probe stylus, and the removed dust from the central portion of the probe stylus in the probe card. A probe stylus cleaning method, wherein the probe is sucked. A prober device according to claim 1 or 2,
A memory unit for storing a program for inspecting a function of a semiconductor chip of a semiconductor wafer as an object to be inspected;
A semiconductor chip inspection apparatus comprising: a tester connected to the prober apparatus and performing an inspection process on the semiconductor chip with a probe stylus of the prober apparatus according to the program.   A probe chip cleaning method according to claim 3 is executed by the prober device according to claim 1 together with an inspection process by the semiconductor chip inspection device according to claim 4.

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