JPH088219A - Method and apparatus for cleaning board for mounting semiconductor device thereon - Google Patents

Abstract

PURPOSE:To provide a method for cleaning a board for mounting a semiconductor device thereon, which can thoroughly clean a socket for the test of the semiconductor device. CONSTITUTION:A cleaning head 8 is provided on a socket 4. Then, cleaning fluid K is sprayed on the socket 4. At the same time, the sprayed cleaning fluid K is sucked, and the foreign matter adhering to the socket 4 is cleaned. Thus, the inside of the socket 4 is thoroughly cleaned.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention removes foreign matter such as dust adhering to a circuit board or a burn-in board by spraying a cleaning fluid onto a circuit board of a semiconductor device, a burn-in board which is a mounting board of the semiconductor device, or the like. The present invention relates to a method for cleaning a mounting board for a semiconductor device and a cleaning device therefor.

[0002]

2. Description of the Related Art A semiconductor device (hereinafter referred to as an IC) is shown in FIG.
As shown by 6, when the assembly of the semiconductor device is completed, a pre-test is performed and then a burn-in process is performed. The burn-in process includes an IC insertion process, a burn-in test process, and an IC removal process. That is, in the burn-in process, as shown in FIG. 17, first, the IC 1 in the storage tray 2 is inserted into the socket 4 on the burn-in board main body 3 of the burn-in board, and then the burn-in board is placed in the burn-in furnace 5 at a predetermined temperature. Then, the IC 1 is energized in a high temperature environment for a predetermined time to perform a burn-in test. Next, after taking out the burn-in board from the burn-in furnace 5, the IC 1 in the burn-in board is stored in the storage tray 2 to complete the burn-in process. After the burn-in process is completed,
The IC1 is subjected to a test after burn-in, and a good product and a defective product of the IC1 are selected.

FIG. 18 is a sectional view of the main part of a burn-in board which is a mounting board composed of the burn-in board body 3 and the socket 4. In the figure, 20 is a mounting portion 20a on which the IC 1 is mounted in the central portion of the socket 4.
And a lead supporting portion 20 for supporting the leads 1a of the IC1
b is a socket main body having b, 21 is connected to the circuit of the burn-in board main body 3, the upper terminal portion 21a is a contact terminal biased toward the lead supporting portion 20b side of the socket main body 20, and 22 is an opening in the central portion. With the portion 22a,
A socket cover, which is arranged above the socket body 20 so as to be able to move up and down, engages with the protrusion 21b of the contact terminal 21 when descending, and separates the terminal portion 21a of the contact terminal 21 from the lead support portion 20b of the socket body 20. Is. In addition,
The socket cover 22 is supported by the socket body 20 via an elastic member (not shown) and is normally in a raised position.

In this socket 4, the socket cover 22
The IC 1 is mounted on the mounting portion 20a of the socket body 20 in a state where is pressed and is pressed downward. Then, when the pressing of the contact terminal 21 on the protrusion 21b of the socket cover 22 is released and the socket cover 22 is lifted, the terminal portion 21a of the contact terminal 21 is moved to the socket main body 2
0 of the lead support portion 20b, the terminal portion 21
a presses the lead 1a of the IC 1 on the lead support portion 20b. Therefore, the IC 1 in the socket 4 is
Is electrically connected to the circuit of the burn-in board main body 3 via. Burn-in board is burn-in furnace 5 in this state.
Then, the burn-in board 3 is energized at a high temperature in the burn-in furnace 5, and the IC 1 is subjected to a burn-in test.

When a foreign substance G such as dust adheres to the inside of the socket 4 on the burn-in board body 3 during the burn-in process, the foreign substance G is attached to, for example, the lead 1a of the IC 1 as shown in FIG. As shown in FIG. 20, the foreign matter G is attached to the leads 1a of the IC 1 when the foreign matter G is pressed. Therefore, in the post-burn-in test after the burn-in process, the leads 1a of the IC 1 to which the foreign substance G adheres as shown in FIG.
When the lead portion 1a of the IC 1 is pressed by the terminal portion 6a and the lead retainer 6b, the foreign substance G attached to the lead 1a
There is a problem that electrical continuity between the test socket 6 and the test socket 6 is lost, or a contact failure occurs, and an accurate post-burn-in test cannot be performed after the burn-in process. Also,
Even when the user mounts such an IC1 on a circuit board, which is a mounting board, due to the adhered foreign matter G, the IC1
There is a problem that poor contact occurs between the circuit board and the circuit board.

For this reason, conventionally, as shown in FIGS. 22 and 23, before the burn-in process, the compressed air K1 is used by using the air nozzle 7 in the socket 4 of the burn-in board.
The foreign matter G in the socket 4 is blown outward by the compressed air K1 to clean the inside of the socket 4.

[0007]

However, even if the foreign matter G in the socket 4 on the burn-in board body 3 is blown off by the compressed air K1, the scattered foreign matter G is reattached to the socket 4 again. there were. Further, as shown in FIG. 24, even if the compressed air K1 is blown in a state where the terminal portion 21a of the contact terminal 21 is pressed against the lead supporting portion 20b of the socket body 20, the terminal portion 21a and the lead supporting portion 20b are There was a problem that it was difficult to remove the foreign substance G sandwiched between the two.

Even when the IC 1 is mounted on the circuit board, if the circuit board is to be cleaned by using the air nozzle 7, the same problem as in the burn-in board occurs.

The present invention has been made to solve the above problems, and provides a method for cleaning a mounting board of a semiconductor device and a cleaning device therefor capable of reliably removing foreign matter from the mounting board. The purpose is to do.

[0010]

According to a first aspect of the present invention, there is provided a method for cleaning a mounting board for a semiconductor device, wherein the cleaning fluid is sprayed onto the mounting board on which the semiconductor device is mounted at the same time. The cleaning fluid is sucked together with the foreign matter in the mounting board.

According to a second aspect of the present invention, there is provided a cleaning device for a mounting board for a semiconductor device, wherein a cleaning head is provided on the mounting board on which the semiconductor device is mounted and has a blowing hole and a suction hole, and the cleaning head. The cleaning fluid supply means connected to the head for supplying the cleaning fluid to the cleaning head through the spray hole, the cleaning fluid connected to the cleaning head and sprayed on the mounting board, and the foreign matter in the mounting board And a suction device for sucking through the suction hole.

According to a third aspect of the present invention, there is provided a cleaning device for a mounting board for a semiconductor device, wherein the tip of the static elimination electrode of the static eliminator is provided in the blowing hole of the cleaning head. There is a static eliminator for ionizing the cleaning fluid to electrically neutralize the inner surface of the mounting board.

According to a fourth aspect of the present invention, there is provided a semiconductor device mounting board cleaning device according to the second or third aspect.
The cleaning head is provided with a vibration generator that comes into contact with the mounting board to generate vibration.

According to a fifth aspect of the present invention, there is provided a cleaning device for a mounting board for a semiconductor device according to the second to fourth aspects.
In any one of the cleaning heads described above, a dust sensor for detecting the amount of foreign matter passing through the suction hole is provided in the suction hole.

According to a sixth aspect of the present invention, there is provided a cleaning device for a mounting board for a semiconductor device, wherein the second aspect is the second to fifth aspects.
The cleaning head described in any one of the above 1 to 6 is provided with an inspection terminal that comes into contact with a terminal of the mounting board to inspect a circuit failure of the mounting board.

According to a seventh aspect of the present invention, there is provided a semiconductor device mounting board cleaning device according to the second to sixth aspects.
The cleaning head according to any one of the above 1 to 5 is attached to a transfer unit that holds the semiconductor device by the holding head and transfers the semiconductor device to the mounting board.

According to the eighth aspect of the present invention, there is provided a cleaning device for a mounting board for a semiconductor device, wherein the second aspect is the second to sixth aspects.
The cleaning head described in any one of the above 1 to 5 is attached to a moving unit that is movable with respect to the mounting board.

[0018]

In the method of cleaning the mounting board of the semiconductor device according to claim 1 of the present invention, the cleaning fluid is sprayed into the mounting board to blow up the foreign matters adhering to the mounting board together with the cleaning fluid. afterwards,
Since this cleaning fluid is sucked together with the foreign matter by the suction device and discharged to the outside of the mounting board, the cleaning of the mounting board is ensured.

According to another aspect of the present invention, there is provided a cleaning device for a mounting board for a semiconductor device, wherein the cleaning fluid is blown into the mounting board from the cleaning fluid supply means through the blowing hole of the cleaning head. Foreign matter together with the cleaning fluid,
Suction is made to the suction device through the suction hole of the cleaning head.

According to a third aspect of the present invention, in the cleaning device for a mounting board for a semiconductor device, the static elimination electrode of the static eliminator ionizes the cleaning fluid flowing into the mounting board from the spray hole to dispose the cleaning fluid. Electrically neutralize the inner surface of the board.

In the cleaning device for a mounting board of a semiconductor device according to a fourth aspect of the present invention, the vibration is applied to the mounting board by the vibration generator, and the foreign matter adheres to the inner surface of the mounting board. To make it easier to leave.

In the cleaning device for a semiconductor device mounting board according to a fifth aspect of the present invention, the dust sensor detects the amount of foreign matter passing through the suction hole, and the value can be used to know the end of cleaning.

According to a sixth aspect of the present invention, there is provided a cleaning device for a mounting board for a semiconductor device, wherein at the same time when the mounting board is cleaned, the inspection terminals come into contact with the terminals of the mounting board for mounting. It is possible to carry out circuit failure inspection of the board.

In the apparatus for cleaning a mounting board for a semiconductor device according to a seventh aspect of the present invention, the cleaning head can be moved together with the holding head of the conveying means to provide the cleaning head on a predetermined mounting board. .

In the cleaning device for a mounting board of the semiconductor device according to the eighth aspect of the present invention, the cleaning head can be provided on a predetermined mounting board by driving the moving means.

[0026]

Embodiments of the present invention will be described below with reference to the drawings. Example 1. 1 and 2 show a cleaning device for a mounting board of a semiconductor device according to a first embodiment of the present invention. The same or corresponding parts as those shown in FIGS. 16 to 24 are designated by the same reference numerals, and the description thereof will be omitted.

In the figure, 8 is a burn-in board body 3
A cleaning head provided on the upper surface of the upper socket 4, 9 is a hose for supplying compressed air K1 into the cleaning head 8 through a joint portion 9a, 10 is a duct for sucking air from the inside of the cleaning head 8, and 11 is air. Is a suction hose for connecting the duct 10 and the suction device 11, and compressed air K1 which is a cleaning fluid in the socket 4 by the cleaning fluid supply means.
And the foreign matter G together with the compressed air K1 (hereinafter referred to as the injection air K) blown into the socket 4.
Is also sucked by the suction device 11.

The cleaning device for the burn-in board of the semiconductor device comprises a cleaning head 8, a hose 9, a duct 10, a suction device 11, a suction hose 12 and the like. In addition, the compressed air K1 is assumed to be clean air from which components that damage the socket 4 or the like to be cleaned have been removed.

The cleaning head 8 will be further described. Reference numeral 30 is a suction hole for the jetting air K formed in the central portion of the cleaning head 8 so as to vertically penetrate therethrough. The duct 10 is attached to the upper part of the cleaning head 8 so as to connect to the suction hole 30. Reference numeral 31 is a blow hole that is formed around the suction hole 30 and blows the compressed air K1 into the socket 4. This spray hole 3
1 has a large number of ejection ports 31a on the lower surface of the cleaning head 8 and a supply port 31b on the side surface of the cleaning head 8, for example. The hose 9 is attached to the side surface of the cleaning head 8 so as to be connected to the supply port 31b.

Next, the operation of this cleaning device will be described. The cleaning head 8 is placed on the socket 4 of the burn-in board body 3, and the cleaning head 8 is pressed downward. As a result, the suction hole 30 of the cleaning head 8 and the ejection port 31a of the spray hole 31 are provided.
Are positioned so as to face the opening 22a of the socket cover 22, and the socket cover 22 is lowered.
The terminal portion 21a of the contact terminal 21 is positioned so as to be separated from the lead support portion 20b of the socket body 20.

Subsequently, the compressed air K1 is supplied into the cleaning head 8 from the cleaning fluid supply means through the hose 9 and the suction device 11 is operated to move the inside of the cleaning head 8 through the suction hose 12 and the duct 10. The air is sucked into the suction device 11. As a result, the compressed air K1 is sprayed into the socket 4 through the spray port 31a of the spray hole 31, the sprayed air K reaches the mounting portion 20a of the socket body 20, the lead support portion 20b, and the like, and the foreign matter adhered to them. As G is blown upward, the air in the socket 4 is sucked from the suction hole 30 of the cleaning head 8, so that the foreign substance G in the socket 4
The blast air K that has blown up the foreign matter G is sucked into
Through the suction device 11.

Therefore, the foreign matter G in the socket 4 is sucked into the suction device 11 via the cleaning head 8 and the inside of the socket 4 is cleaned in a clean state. When the cleaning of one socket 4 is completed, the cleaning head 8 is moved to another socket 4 and the same work is repeated.

As described above, in this cleaning device, the socket 4 is pressed by the cleaning head 8 and the compressed air K1 is blown into the socket 4 from the cleaning fluid supply means, and the jetted air K is also blown.
At the same time, the foreign substance G in the socket 4 is sucked into the suction device 11 through the suction hole 30, so that the socket 4 can be cleaned. Also in this case,
Since the cleaning head 8 presses the socket cover 22 downward, the contact terminal 21 of the socket 4
The foreign substance G is not caught between the socket body 20 and the socket body 20, and the inside of the socket 4 is reliably cleaned.

FIG. 3 shows the IC1 in the test after burn-in.
Shows the change in the defect rate due to the disconnection. For example, according to the conventional cleaning method described above, in the post-burn-in test, when the index of the defective rate found when the inside of the socket 4 is cleaned by the conventional method is set to 100, as indicated by reference numeral S1, The index when this cleaning device was used was 33, as indicated by symbol S2, and the defect occurrence rate due to disconnection was reduced to 1/3 that of the conventional one. That is, by using this cleaning device, I
It is considered that the foreign matter G adhering to C1 was significantly reduced, and the failure occurrence rate due to disconnection due to the foreign matter G was significantly reduced in the post-burn-in test.

Example 2. Here, as shown in FIG. 4, the cleaning head 8 covers the side surface of the socket 4 and the blowing hole 31 is provided on the side portion of the cleaning head 8 to blow the compressed air K1 from the side surface of the socket 4. You may do it. In this case, the injection air K
After passing through the space between the contact terminals 21 and reaching the mounting portion 20a and the lead supporting portion 20b of the socket body 20 and then heading for the suction hole 30 in front of the spray hole 31, the injection is performed as compared with the first embodiment. The flow of the air K becomes smooth, and the effect of cleaning the foreign matter G by the jet air K is improved.

Example 3. Also, as shown in FIG.
A nozzle 32 having a static elimination electrode 32a is attached in the blowing hole 31 of the cleaning head 8, and compressed air K1
May be sprayed after being ionized by the static elimination electrode 32a through the nozzle 32. Although static electricity may be generated on the inner surface of the socket 4 due to the friction caused by the spraying of the compressed air K1, the charge on the inner surface of the socket 4 is neutralized by ionizing the compressed air K1 by the static elimination electrode 32a. It prevents the generation of static electricity. Further, this also effectively prevents the foreign matter G from reattaching to the inner surface of the socket 4. In the above case, the static elimination electrode 32a is assumed to be attached to the static eliminator (not shown) via the cable 33. As the nozzle 32 provided with the static elimination electrode 32a, for example, an air nozzle manufactured by Simco Co. can be used.

Embodiment 4 FIG. Further, as shown in FIG. 6, a vibration generator 34 having a spring 34a and a vibrating portion 34b may be attached to the lower portion of the suction hole 30 of the cleaning head 8. In this case, the socket 4 is covered with the cleaning head 8 so that the lower surface of the vibration generator 34 and the IC mounting portion 20a of the socket 4 are brought into contact with each other, and the socket 4 is inserted through the vibration portion 34b of the vibration generator 34 during cleaning. Vibration is applied to. As a result of the vibration being applied to the socket 4, the foreign matter G adhering to the inside of the socket 4 is easily blown up by the jet air K, and the jet air K and the foreign matter G pass through holes (not shown) provided in the vibration generator 34. And is sucked to the suction device 11 side.

Embodiment 5 FIG. Also, as shown in FIG.
A pair of dust sensors 35 are provided so as to face the suction holes 30 of the cleaning head 8, and the amount of the foreign matter G in the jet air K passing through the suction holes 30 is detected by the dust sensors 35, and this detected value is obtained. Based on this, the operating time of the cleaning device for the socket 4 may be set. Since the amount of the foreign matter G in the jet air K is constantly detected by the dust sensor 35, as shown in FIG. 8, the cleaning device can be operated until there is no foreign matter G in the jet air K, and the socket 4 The inside can be reliably cleaned. The dust sensor 35 is attached to the control device 13 of FIG. 9 via a cable 36.

The controller 13 of this cleaning device is
After receiving the signal from the dust sensor 35, the cleaning head moving device 14 that moves the cleaning head 8 according to the signal value, the suction device 11, and the compressed air operating device 15 that is a component of the cleaning fluid supply means. And control.

Example 6. Further, as shown in FIG. 10, the inspection terminal 37 is provided so as to project to the inner surface side of the cleaning head 8 so that the circuit disconnection or short-circuit state of the burn-in board body 3 can be detected before the burn-in test. Good. The inspection terminals 37 are provided by the number of the contact terminals 21 of the socket 4, and the cleaning head 8 is provided.
When is pressed and placed on the socket 4, the tip portion of the socket is pressed against the contact terminal 21. The other end of the inspection terminal 37 is connected to, for example, an ammeter or a voltmeter (not shown) via a cable 38 and is grounded. The external terminals (not shown) of the burn-in board body 3 connected to the contact terminals 21 of the socket 4 are connected to a predetermined power source (not shown).

Next, the operation of this cleaning device will be described focusing on the operation of the inspection terminal 37. First, a power supply is connected to the external terminals of the burn-in board body 3. Continuing,
The cleaning head 8 is provided on the socket 4 of the burn-in board body 3, and the upper part of the socket 4 is pressed by the cleaning head 8. As a result, the terminal portion 21a of the contact terminal 21 of the socket 4 rises and the inspection terminal 37 of the cleaning head 8 is electrically connected to the contact terminal 21. Thereafter, the compressed air K1 is jetted into the cleaning head 8 through the hose 9, the suction device 11 is operated, and the jet air K inside the cleaning head 8 is sucked through the suction hose 12 and the duct 10.
The foreign matter G in the socket 4 is cleaned.

In this case, at the same time as the cleaning of the foreign matter G, a constant current is applied to the circuit of the burn-in board body 3 from the power source, and the voltage value at this time is measured by the voltmeter through the inspection terminal 37 and the like. As a result, the state of disconnection or short circuit of the circuit of the burn-in board body 3 or the circuit of the socket 4 is detected. When a constant voltage is applied to the circuit of the burn-in board body 3 from the power source, the current value at this time is measured by an ammeter through the inspection terminal 37 or the like, and the circuit of the burn-in board body 3 or the socket 4 is measured. A disconnection or short circuit condition of the circuit is detected. The details of the method for detecting the broken or short-circuited state of the burn-in board body 3 or the socket 4 are described in, for example, Shokai 61.
No. 6,536,67.

As described above, with this cleaning device, the inside of the socket 4 can be cleaned before the burn-in test, and at the same time as the cleaning, the socket 4 and the circuit of the burn-in board body 3 can be inspected for broken or short-circuited states. The processing can be performed properly and quickly, and the productivity of the IC 1 can be improved.

Example 7. In FIG. 11, 16 is IC1
A pair of IC holding heads having a holding portion 16a of the cleaning head 8, 17 is an IC
The carrying device serves as a carrying means for carrying the IC 1 between the storage tray 2 and the socket 4 of the burn-in board using the holding head 16. The transfer device 17 includes a motor, a rail (not shown), and a moving table 17a having a ball screw for converting the rotation of the motor into a linear motion. By the operation of the movable table 17a, the front-rear movable table 17b and the vertical movable table 1
7c and 7c are moved in the direction of arrow a, and a front-rear moving table 17b having a motor, a rail and a ball screw (not shown)
The vertical moving table 17c is moved in the direction of arrow B by the operation of, and the vertical moving table 17c having a motor, a rail, and a ball screw (not shown) is operated.
c itself is moved in the direction of arrow c. A holding table 17d of the IC holding head 16 is attached to an end of the vertical moving table 17c.

Next, the operation of this cleaning device will be described.
The operation will be described in relation to the operations of the C holding head 16 and the transport device 17. First, the transfer device 17 is operated to move the pair of cleaning heads 8 attached to one side of the IC holding head 16 onto, for example, the pair of sockets 4A on the front end side of the burn-in board main body 3 to move the sockets 4A. Perform cleaning. Subsequently, the carrier device 17 is operated to move the IC holding head 16 to the train side in which the IC 1 is stored, hold the IC 1 in the IC holding head 16, and then hold the IC holding head 16 in the burn-in board socket. Move to 4A. Then, the IC is dropped and inserted from the IC holding head 16 into the socket 4A. In this case, the cleaning head 8 is located on the socket 4B next to the socket 4A, and the interior of the socket 4B is cleaned by the cleaning head 8. Thereafter, similarly, the socket 4 on the burn-in board body 3 is cleaned and the IC 1 is inserted.

When the IC 1 is taken out from the socket 4 of the burn-in board after the burn-in test is completed, first, for example, the socket 4 is removed by the cleaning head 8.
After cleaning A, the IC holding head 16 is raised to move the front-rear moving table 17b of the carrying device 17 backward by one pitch of the socket 4. Then, the IC holding head 16 is positioned on the socket 4A, and the IC 1 in the socket 4A is held by the IC holding head 16.
In this case, since the cleaning head 8 is located on the socket 4B, the cleaning head 8 cleans the inside of the socket 4B. In addition, socket 4
The reason why cleaning is performed even when the IC1 is placed inside is that dust is floating in the burn-in furnace 5 and it is necessary to remove foreign matters on the IC1 in the socket 4 after the burn-in test. .

Subsequently, the IC holding head 16 is conveyed to the storage tray 2 side, the IC 1 in the IC holding head 16 is stored on the storage tray 2, and then the IC holding head 16 is again moved to the burn-in board body 3 side. Transport. In this case, the IC holding head 16 is positioned on the socket 4B and the cleaning head 8 is positioned on the socket 4C so that the IC holding head 16 holds the IC 1 and the cleaning head 8 cleans the inside of the socket 4 at the same time. To do.

As described above, in this cleaning device, the cleaning head 8 is moved together with the IC holding head 16 by the carrying device 17,
When the IC 1 is transferred, the socket 4 on the burn-in board body 3 can be cleaned, and the burn-in process can be speeded up and the cleaning device itself can be easily handled.

Example 8. Here, as shown in FIG. 12, the cleaning head 8 is attached to the vertical moving table 17c of the transfer device 17 via the second holding table 17e, and the cleaning head 8 is moved vertically with respect to the second holding table 17e. You may allow it. In this case, since the cleaning head 8 can move up and down separately from the IC holding head 16, the cleaning head 8 can easily press the socket 4 and the like, and the cleaning device can easily clean the inside of the socket 4. Become.

Example 9. Further, as shown in FIG. 13, the cleaning head 8 may be attached to the moving device 18 having the vertical moving table 18a and the forward / backward moving table 18b and separated from the IC holding head 16. in this case,
The burn-in board body 3 is located on one side of the moving device 18, and the socket 4 on the burn-in board body 3 is
Cleaning is continuously performed by the pair of cleaning heads 8 that are moved up and down and back and forth by the moving device 18. Then, the burn-in board main body 3 for which the cleaning of the socket 4 has been completed is carried to the transfer device 17 side, and the IC 1 is inserted into the socket 4 on the burn-in board main body 3. Even after the burn-in test is completed, the burn-in board body 3 is positioned on one side of the moving device 18, and the cleaning head 8 cleans the inside of the socket 4. IC1 in socket 4
May be taken out.

Example 10. Further, as shown in FIG. 14, the cleaning head 8 having the inspection terminals 38 is attached to the transfer device 17 side to inspect the circuit of the burn-in board main body 3 and the circuit of the socket 4 for disconnection or short-circuit, and It is also possible to clean the inside of the IC card 4 and insert the IC 1 into the socket 4. In this case, since the IC 1 is inserted into the socket 4 of the burn-in board body 3 which is free from disconnection or short circuit, the burn-in process can be further speeded up. In this case, a power source or the like needs to be connected to the external terminal of the burn-in board body 3.

Example 11. Further, as shown in FIG. 15, an inspection socket terminal 19 connected to the external terminal 3 a of the burn-in board body 3 is provided, and an I socket is provided in the socket 4.
After the C1 is inserted and before the burn-in test, the external terminal 3a may be used to inspect the circuit of the burn-in board main body 3 and the circuit of the socket 4 for disconnection or short circuit. In this case, it is assumed that a necessary inspection tool is attached to the other end of the socket terminal 19.
Note that the drawing of the cleaning head 8 is omitted in FIG.

By the way, in the cleaning device of each of the above-mentioned embodiments, the inside of the socket 4 on the burn-in board body 3 is cleaned, but this is also applied to the circuit board which is a mounting board of the general IC 1. By using the cleaning device, the circuit board can be reliably cleaned. That is, after covering a required portion of the circuit board with a predetermined cleaning head, compressed air K1 is blown to the circuit board from the blowing hole of the cleaning head, and then the jet air K is sucked together with the dust G from the suction hole. This circuit board can be reliably cleaned. In this case, a dust sensor, a charge eliminating electrode, an inspection terminal, or the like may be provided in the cleaning head, and the cleaning head is
You may make it attach to the conveyance apparatus of C1.

The cleaning fluid is compressed air K1.
In addition to such a gas as described above, a liquid such as pure water may be used.

[0055]

As described above, according to the method of cleaning the mounting board of the semiconductor device according to claim 1 of the present invention, after the cleaning head is provided on the mounting board, the mounting board is mounted. At the same time as the cleaning fluid is sprayed onto the substrate, the sprayed cleaning fluid is sucked together with the foreign matter on the mounting board, so that the foreign matter inside the mounting board can be reliably removed.

According to the second aspect of the present invention, there is provided a cleaning device for a mounting board for a semiconductor device, wherein the cleaning head is provided on the mounting board on which the semiconductor device is mounted and has a blowing hole and a suction hole. A cleaning fluid supply unit connected to the cleaning head for supplying a cleaning fluid to the cleaning head through the spray hole, and a suction device connected to the cleaning head for sucking foreign matter in the mounting board through the suction hole. As a result, the same effect as the invention of claim 1 can be obtained.

According to the third aspect of the present invention, there is provided a cleaning device for a mounting board for a semiconductor device, wherein the tip of the static elimination electrode of the static eliminator is provided facing the spray hole of the cleaning head. The inner surface of the mounting board can be electrically neutralized by ionization, the generation of static electricity on the inner surface of the mounting board is prevented, and foreign substances will not be reattached to the inner surface of the mounting board. The effect of the invention of claim 1 can be obtained more reliably.

According to the fourth aspect of the present invention, there is provided the cleaning device for the mounting board of the semiconductor device, wherein the cleaning head is provided with the vibration generator which comes into contact with the mounting board to generate vibration. The foreign matter in the mounting board is more easily blown up by the cleaning fluid flowing in from, and the effect of the invention of claim 1 can be more reliably obtained.

According to a fifth aspect of the present invention, there is provided a cleaning device for a mounting board for a semiconductor device, wherein the suction hole of the cleaning head is provided with a dust sensor for detecting foreign matter passing through the suction hole. In addition to being able to obtain the effect of the first aspect of the invention, it is possible to know whether or not the foreign matter in the mounting board has been eliminated, and it is possible to efficiently perform cleaning.

According to the sixth aspect of the present invention, there is provided a cleaning device for a mounting board of a semiconductor device. The cleaning head is in contact with a terminal of the mounting board to inspect a circuit defect of the mounting board. Since the above-mentioned structure is provided, it is possible to obtain the effect of the invention of claim 1, and it is possible to inspect for circuit defects in the mounting board at the same time as cleaning the inside of the mounting board. There is also an effect that a certain burn-in board can be supplied to the burn-in furnace and the burn-in process can be appropriately performed.

According to the seventh aspect of the present invention, there is provided the semiconductor device mounting board cleaning apparatus. The cleaning head is attached to the conveying means for conveying the semiconductor device to the mounting board. In addition to the above effect, cleaning of the mounting board can be performed at the same time when the semiconductor device is transferred, which improves the work efficiency.

According to the eighth aspect of the present invention, there is provided the semiconductor device mounting board cleaning apparatus, wherein the cleaning head is attached to the moving means that is movable with respect to the mounting board. And the effect of improving the efficiency of the cleaning work.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a state in which a cleaning head of a cleaning device according to a first exemplary embodiment of the present invention is provided on a socket.

FIG. 2 is a perspective view of the cleaning device and the burn-in board of FIG.

FIG. 3 is an explanatory diagram of an effect of the cleaning device of FIG.

FIG. 4 is a sectional view showing a state in which a cleaning head of a cleaning device according to a second embodiment of the present invention is provided on a socket.

FIG. 5 is a cross-sectional view showing a state in which a cleaning head of a cleaning device according to a third embodiment of the present invention is provided on a socket.

FIG. 6 is a cross-sectional view showing a state in which a cleaning head of a cleaning device according to a fourth exemplary embodiment of the present invention is provided on a socket.

FIG. 7 is a cross-sectional view showing a state in which a cleaning head of a cleaning device according to a fifth exemplary embodiment of the present invention is provided on a socket.

FIG. 8 is a flowchart for explaining the operation of the cleaning device of FIG.

9 is a control block diagram of the cleaning device in FIG. 7. FIG.

FIG. 10 is a sectional view showing a state in which a cleaning head of a cleaning device according to a sixth embodiment of the present invention is provided on a socket.

FIG. 11 is a perspective view of a cleaning device according to a seventh embodiment of the present invention.

FIG. 12 is a perspective view of a cleaning device according to an eighth embodiment of the present invention.

FIG. 13 is a perspective view of a cleaning device according to a ninth embodiment of the present invention.

FIG. 14 is a perspective view of a cleaning device according to a tenth embodiment of the present invention.

FIG. 15 is a perspective view of a cleaning device according to an eleventh embodiment of the present invention.

FIG. 16 is a flowchart illustrating a process after assembling an IC.

FIG. 17 is an explanatory diagram of burn-in processing.

FIG. 18 is a cross-sectional view of the socket on the burn-in board.

FIG. 19 is a diagram for explaining a situation in which foreign matter is attached to the leads of the IC in the socket on the burn-in board.

FIG. 20 is a diagram showing a state in which foreign matter is attached to the leads of the IC.

FIG. 21 is an explanatory diagram of a case where a test after burn-in is performed in a state where foreign matter is attached to the leads of the IC.

FIG. 22 is a diagram showing a state where foreign matter on the burn-in board is removed by a conventional method.

FIG. 23 is a diagram showing a state in which foreign matter in the socket on the burn-in board is removed by a conventional method.

FIG. 24 is a view showing a state in which a foreign matter is sandwiched between the socket body and the contact terminal.

[Explanation of symbols]

1 IC, 3 burn-in board body, 4 socket,
8 cleaning head, 11 suction device, 14 cleaning head moving device, 16 IC holding head, 17
Conveying device (conveying means), 18 moving device (moving means), 20 socket body, 21 contact terminal, 22 socket cover, 30 suction hole, 31 blowing hole, 32
a static elimination electrode, 34 vibration generator, 35 duct sensor, 37 inspection terminal, G foreign matter, K injection air (cleaning fluid), K1 compressed air (cleaning fluid).

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tetsuya Sakamoto 997 Miyoshi, Nishigoshi-cho, Kikuchi-gun, Kumamoto Mitsubishi Electric Corporation Kumamoto Factory

Claims (8)

[Claims] 1. A semiconductor device characterized in that a cleaning fluid is sprayed onto a mounting board on which the semiconductor device is mounted, and at the same time, the sprayed cleaning fluid is sucked together with foreign matter in the mounting board. How to clean the mounting board. 2. A cleaning head provided on a mounting board on which a semiconductor device is mounted and having a spray hole and a suction hole, and a cleaning head which is connected to the cleaning head and supplies a cleaning fluid to the cleaning head through the spray hole. A fluid supply means and a suction device that is connected to the cleaning head and suctions foreign matter in the mounting board together with the cleaning fluid sprayed onto the mounting board through the suction hole. Cleaning device for semiconductor device mounting board. 3. A static eliminator that faces the tip of the static eliminator electrode in the spray hole and electrically neutralizes the inner surface of the mounting board by ionizing the cleaning fluid. Item 3. A cleaning device for a semiconductor device mounting board according to item 2. 4. The mounting board for a semiconductor device according to claim 2, further comprising a vibration generator provided on the cleaning head and abutting against the mounting board to generate vibration. Cleaning device. 5. The mounting of the semiconductor device according to claim 2, further comprising a dust sensor provided in the suction hole of the cleaning head for detecting the amount of foreign matter passing through the suction hole. Cleaning device for mounting board. 6. The inspection terminal according to claim 2, further comprising an inspection terminal provided on the cleaning head, the inspection terminal being in contact with a terminal of the mounting board to inspect a circuit failure of the mounting board. A cleaning device for a mounting board for a semiconductor device according to item 1. 7. The cleaning head is attached to a carrying means for carrying a semiconductor device by a holding head and carrying the semiconductor device to a mounting board. Cleaning device for mounting board of semiconductor device. 8. The mounting of the semiconductor device according to claim 2, wherein the cleaning head is attached to a moving means that is movable with respect to the mounting board. Board cleaning device.