JPH116863A - Method and equipment for electrical inspection of base - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely remove a contaminant sticking to the tip portion of a contact pin of a probe for electrical inspection of a base by one cleaning operation by utilizing a moving motion of the probe. SOLUTION: A conveying device 51 which conveys a base toward the downstream side sequentially, so that the surface of a base 30 whereon a component is mounted comes to the top for electrical inspection of the base and electrical inspection and jigs 10 and 11 which position the base and move a probe 4 for electrical inspection of the base so that the tip portion of a contact pin of the probe may come into direct contact with the surface of the base whereon the component is mounted, are provided. A moving motion of the tip portion of the contact pin is utilized so that a contaminant including a flux be caught surely in an elastic body sheet 100 by thrusting the tip portion of the contact pin into the sheet, and then the tip portion be extracted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board electrical inspection method and a board electrical inspection apparatus. For example, the present invention relates to a method for mounting a board on a printed wiring board after mounting electronic components such as an IC, a resistor, and a capacitor. The present invention relates to a technique for removing dirt from a tip portion of a contact pin of an electrical inspection probe of a test device for testing an electrical mounting state, which is in direct contact with a conductive pattern on a substrate.

[0002]

2. Description of the Related Art Conventionally, as a mounting technique of a printed wiring board, a method generally called SMT has been used in which a cream solder is printed and reflow soldering is performed, and a method of soldering an electric component by a solder reflow bath is used. However, in each case, Freon or 1.1.1 trichloroethane was used to wash and remove the solder flux used at the time of soldering from the solder surface of the component.

However, it has been found that the cause of environmental pollution in recent years has been the use of these fluorocarbons or 1.1.1 trichloroethane, and as a result, it has become impossible to use them. Then, the physical properties of the flux are improved, the corrosiveness is improved, and the flux is not required to be cleaned.

[0004] Alternatively, manufacturers are actively promoting the use of a cleaning agent that does not cause environmental pollution or the cleaning and removal of the flux by washing with water.

However, when a cleaning agent or water washing is used, it is considered that the treatment of the washing water may cause new environmental pollution, and it is presently considered that it is best to eliminate the flux from the viewpoint of cost reduction. Have been.

However, in the case where the flux is not cleaned as described above, the flux adheres to the tip of the contact pin to be inspected at the time of the electrical inspection after soldering, and gradually grows, thereby causing a conduction failure at the time of the inspection. It has been known.

FIG. 16 is a flowchart of mounting a printed wiring board, showing steps from mounting electronic components on a printed circuit board 30 to shipping.

In FIG. 1, a printed circuit board 30 is prepared in step S1, and the process proceeds to step S2 to print cream solder. Thereafter, the process proceeds to step S3, where electronic components mounted on the surface are mounted by a chip mounter device or the like, and reflow soldering is performed in step S4. Thereafter, the in-circuit test in the next step S5 is performed without cleaning the flux generated by the soldering, and only the substrates that pass this test are subjected to the subsequent step S5.
The board is tested by the function test of No. 6 and the board that passes this test is shipped (step S7).

If cream solder is not used, the process proceeds to step S8 after step S1 to insert an electronic component into a mounting portion including a through hole for mounting a component, or place the component on a pad portion and use an adhesive to attach the component. After fixing and mounting, the electric components are soldered by dipping in the molten solder of the solder flow soda in step S9, and the in-circuit test in the next step S10 is performed.
Only the boards that pass this test are tested in the subsequent function test in step S11, and the boards that pass this test are shipped (step S7).

FIG. 17 is an external perspective view of the in-circuit tester of the above-described steps S5 and S10, in which a main part of a conventional board electrical inspection probe is cut away. FIG. 18 is an enlarged view of a main part of FIG.

In FIGS. 17 and 18, a plurality of probes 4
Is configured so that the contact pin 5 is positioned with respect to the solder fillet portion at the tip of the QFP lead mounted on the printed wiring board 30, and the contact pin 5 is moved up and down so that the contact pin 5 is a QFP of a QFP which is an IC package. The in-circuit test after mounting (steps S5 and S10 in FIG. 16) is performed by making contact with the solder fillet at the tip of the lead to secure electrical conduction.

With the recent increase in mounting density, it has become difficult to secure a space for providing an inspection pad for dropping the contact pin 5 of the inspection probe 4, and the QFP
For inspection at a solder fillet at the tip of a package lead or a solder fillet at a soldering land (not shown in the figure) of a chip component, where flux F remains thick at the time of solder reflow. It is necessary to move the contact pin 5 to make contact. For this reason, as shown in FIG. 18, the flux F adheres to the tip of the contact pin 5 in the inspection more than before, and as a result, conduction failure during the in-circuit inspection is more likely to occur.

The characteristic point of the occurrence of such a conduction failure is that when the conduction failure occurs for the first time, the second time,
By moving the contact pin 5 again for the third time, the flux F may fall off and the conduction failure may be recovered. However, the method of dropping out the flux F by moving many times in this way cannot be adopted because it is unstable. For this reason, once a conduction failure occurs, not a test for an original soldering failure or an element failure, but an erroneous one which should be originally determined to be a non-defective product is also determined to be defective.

As a result, the efficiency of the production line is greatly reduced. Therefore, when a defect which seems to be likely to be caused by contamination of the flux F at the tip of the contact pin 5 occurs frequently, the upper plate 10 provided with the inspection probe 4 is rotated about 180 degrees in the direction of arrow K. After the contact pin 5 is turned upward, the flux F adhered to the tip of the contact pin near the portion considered to be defective.
After cleaning with a brush or the like, the inspection is performed again. Similarly, for the contact pins 5 provided on the lower plate 11, the flux F attached to the tips of the contact pins is cleaned with a brush or the like.

[0015]

However, when cleaning is performed with a brush in this way, the cleaning method varies depending on the operator and cannot be uniformly cleaned, so that the contaminants caused by the cleaning are always removed. There was no guarantee that it was uncertain.

[0016] Therefore, after the cleaning with the brush, the inspection is performed again and reconfirmed. If the conduction failure recurs, the cleaning must be performed again, which is very troublesome.

On the other hand, in recent years, the circuit scale of a printed wiring board has become large, and it is not uncommon that the number of contact pins 5 of the probe 4 of the inspection machine exceeds 1000 or 2000 or more. Even when brush cleaning is performed, there is a problem that it takes much time and effort.

In the flowchart shown in FIG. 16, each of the steps S1 to S11 is automated. That is, in step S1, a plurality of printed circuit boards 30 are prepared, and cream solder is printed while being automatically conveyed to an automation line. In step S3, a chip component or device, which is a surface mount component, is placed at a predetermined position by a chip mounter. After being placed and temporarily bonded, the solder is melted and soldered in a reflow step (step S4), and then the in-circuit test and the function test (steps S5 and S6) are performed without washing the flux. Only acceptable products are shipped (step S7).

Alternatively, after soldering in the solder flow tank (step S9), an in-circuit test and a function test (steps S10 and S11) are performed.
Only acceptable products are shipped (step S7).

In such an automation line, only the brush cleaning work of the contact pins 5 of the probe 4 of the inspection machine in the in-circuit test (steps S5 and S10) is an obstacle to the full automation. That is, in FIG. 17, it is almost impossible to automate the process of cleaning all the 1000 to 2000 or more probes after rotating the upper plate 10 by 180 degrees. Even if it can be realized, there is a problem that it becomes very large.

Accordingly, the present invention has been made in view of the above problems, and has been made in order to clean contaminants adhering to tip portions of contact pins of a board electrical inspection probe used in a board testing apparatus including an in-circuit test. It is an object of the present invention to provide a board electrical inspection method, a board electrical inspection apparatus, and a board electrical inspection cleaning that can be reliably performed by a single cleaning operation using the movement operation of a board electrical inspection probe.

It is another object of the present invention to provide a board electrical inspection method, a board electrical inspection apparatus, and a board electrical inspection cleaning that can easily achieve full automation in a substrate manufacturing line without flux cleaning.

[0023]

Means for Solving the Problems The above-mentioned problems are solved,
In order to achieve the object, according to the board electrical inspection method of the present invention, a board electrical inspection method for performing electrical inspection of a board including an in-circuit test, wherein the component mounting surface of the board is exposed. A transporting step of sequentially transporting the substrate one by one downstream, and a board electrical inspection probe of the electrical inspection with respect to the component mounting surface by performing positioning of the substrate during transportation of the substrate in the transporting step. An electrical inspection step in which the tip portion of the contact pin is moved so that the tip portion of the contact pin comes into direct contact to perform the electrical inspection, and the tip portion of the contact pin is formed by dispersing a fine metal oxide at a predetermined weight%. By piercing the elastic sheet, the contaminant including the solder flux attached at the tip portion is reliably captured in the elastic sheet,
A cleaning step utilizing a moving operation of a tip end portion of the contact pin for pulling out the contact pin.

Also, there is provided a board electrical inspection method for performing electrical inspection of a board including an in-circuit test, wherein a transporting step of sequentially transporting the board one by one downstream so that the component mounting surface of the board is exposed. During the transfer of the board in the transfer step, the board is positioned and moved so that the tip end portions of the contact pins of the board electrical inspection probe of the electrical inspection directly contact the component mounting surface. An electrical inspection step of performing the electrical inspection, and in the electrical inspection step, when a failure of the substrate is detected, a defective substrate discharging step of discharging the defective substrate from the transport path of the transport; The tip portion of the contact pin was attached to the tip portion by piercing the elastic sheet formed by dispersing a fine metal oxide at a predetermined weight%. Contaminants including field flux from securely trapped in the elastic body sheet, and wherein said by comprising a cleaning step of utilizing the movement of the distal end portion of the contact pins to be pulled out.

Also, there is provided a board electrical inspection method for performing electrical inspection of a board including an in-circuit test, comprising: a transporting step of sequentially transporting the board one by one downstream so that the component mounting surface of the board appears. During the transfer of the board in the transfer step, the board is positioned and moved so that the tip end portions of the contact pins of the board electrical inspection probe of the electrical inspection directly contact the component mounting surface. An electrical inspection step of performing the electrical inspection, and in the electrical inspection step, when a failure of the substrate is detected, a defective substrate discharging step of discharging the defective substrate from the transport path of the transport; The tip portion of the contact pin was attached to the tip portion by piercing the elastic sheet formed by dispersing a fine metal oxide at a predetermined weight%. The surface of the elastic sheet is exposed so that the contaminants including the field flux can be reliably caught in the elastic sheet and then the movement of the tip portion of the contact pin can be used so as to be pulled out. A cleaning step of sequentially transporting one substrate for every predetermined number of the substrates toward the downstream, and automatically discharging the substrate from the transport path of the transport after the cleaning.

Also, there is provided a board electrical inspection apparatus for performing an electrical inspection of a board including an in-circuit test, wherein the transport means sequentially transports one by one downstream so that a component mounting surface of the board is exposed. During the transfer of the board by the transfer means, the board is positioned and moved so that the tip end portions of the contact pins of the board electrical inspection probe of the electrical inspection directly contact the component mounting surface. An electrical inspection means for performing the electrical inspection, and piercing a tip portion of the contact pin into an elastic sheet formed by dispersing a fine metal oxide at a predetermined weight%, thereby After the contaminant including the solder flux attached at the tip end portion is securely caught in the elastic sheet, the moving operation of the tip end portion of the contact pin is performed in order to pull it out. It is characterized by comprising a cleaning means for use.

Further, there is provided a board electrical inspection apparatus for performing an electrical inspection of a board including an in-circuit test, wherein the transport means sequentially transports one by one downstream so that the component mounting surface of the board is exposed. During the transfer of the board by the transfer means, the board is positioned and moved so that the tip end portions of the contact pins of the board electrical inspection probe of the electrical inspection directly contact the component mounting surface. An electrical inspection means for performing the electrical inspection, and a defective board discharging means for discharging the defective substrate from the transport path of the transport when a defect of the substrate is detected in the electrical inspection means; The tip portion of the contact pin was attached to the tip portion by piercing the elastic sheet formed by dispersing a fine metal oxide at a predetermined weight%. Contaminants including field flux from securely trapped in the elastic body sheet is characterized by comprising a cleaning means for utilizing the movement of the distal end portion of the contact pins to be pulled out.

Further, there is provided a board electrical inspection apparatus for performing an electrical inspection of a board including an in-circuit test, wherein a transport means for sequentially transporting each board toward a downstream so that a component mounting surface of the board is exposed. During the transfer of the board by the transfer means, the board is positioned and moved so that the tip end portions of the contact pins of the board electrical inspection probe of the electrical inspection directly contact the component mounting surface. An electrical inspection means for performing the electrical inspection, and a defective board discharging means for discharging the defective substrate from the transport path of the transport when a defect of the substrate is detected in the electrical inspection means; The tip portion of the contact pin was attached to the tip portion by piercing the elastic sheet formed by dispersing a fine metal oxide at a predetermined weight%. The surface of the elastic sheet is exposed so that the contaminants including the field flux can be reliably captured in the elastic sheet, and then the movement of the tip portion of the contact pin can be used so as to be pulled out. A cleaning means for sequentially transporting one of the substrates for each predetermined number of substrates downstream and automatically discharging the substrate from the transport path for the transport after the cleaning is provided.

[0029]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. First, FIG. 1 shows an essential part of a board electrical inspection probe of an inspection jig in an in-circuit test machine. FIG. 3 is an external perspective view cut away.

FIG. 2 is an enlarged view of a main part of FIG.

1 and 2, a plurality of probes 4 are provided on an upper plate 10 and a solder fillet portion 3 at the tip of a QFP lead 32 mounted on a printed wiring board 30.
3 is configured such that the contact pin 5 is located. Similarly, the lower plate 11 has a plurality of probes 4.
(Not shown) is provided, and the contact pins 5 are configured so as to be positioned with respect to the solder fillet portion at the tip of the lead of the electronic component mounted on the back surface of the electronic component.

The upper plate 10 and the lower plate 11 thus configured
Are moved in the direction of arrow D along the guides 20, respectively, so that the urging force generated when the coil spring built in the probe 4 is appropriately compressed causes the flux to be cleaned without being cleaned. To ensure that the sharp end of the contact pin 5 comes into contact with the solder fillet 33 at the end of the QFP lead 32 of the IC package so as to break through the residual flux F. Thus, the in-circuit test after mounting (steps S5 and S10 in FIG. 12) is performed. The printed wiring board 30 is positioned by guide pins, and each probe 4 is positioned on each solder fillet 33.

The above is the schematic configuration of the in-line circuit tester.

Next, the structure of the cleaning sheet, which is an elastic sheet, which is the most significant feature of the present invention, will be described.

FIG. 3 is a sectional view of the cleaning sheet 1. In this drawing, the cleaning sheet 1 is formed into a sheet from an industrial rubber material containing a silicone elastomer having a rubber hardness of 20 to 80 degrees (Hs Shore A scale).
Thickness t so that only the tip of
(1 mm). Further, the area is the same as the area of the printed wiring board 30 or has an area covering at least the entire arrangement position of the probe 4.
The cleaning sheet 1 is set to have a rubber hardness of 20 to 80 degrees in order to obtain a restoring force after piercing only the tip of the contact pin 5.

The cleaning sheet 1 is a metal oxide having a random shape as shown in FIG.
Aluminum oxide or magnesium oxide in the range of 0 to 40 μm is uniformly dispersed in the rubber molding portion 3 in an amount of 40 to 70% by weight. By molding in this way, repeated use is enabled.

Next, FIGS. 4 to 6 show the in-circuit tester described with reference to FIG.
FIG. 4 is an operation explanatory view showing a state in which a cleaning sheet 1 is set. That is, the flux F attached to the tip of the contact pin 5 is cleaned by appropriately setting the cleaning sheet 1 instead of the printed board. Therefore, the use of the cleaning sheet 1 eliminates the necessity of the conventional cleaning with a brush. In addition, since it can be handled in the same manner as the printed circuit board 30, there is the greatest advantage that the test process is not affected at all.

In FIG. 4, the contact pin 5 of the probe 4 is provided with a slit portion 5b and a step portion 5a as shown in the figure. For example, after the 50th test, the flux F adheres as shown in the figure. doing.

Then, the upper plate 10 and the lower plate 11 are moved in the direction of arrow D1, and as shown in FIG.
The flux F at the tip of the pin is captured by the metal oxide particles 2 from the front and back sides, for example, of the silicone rubber sheet. Thereafter, as shown in FIG. 6, the upper plate 10 and the lower plate 11 are moved in the direction of arrow D2 to complete the cleaning and leave the flux F in the sheet 1.

The metal oxide particles 2 are made of MgO and have a particle size of 3
It is about 0 μm. As a material of the metal oxide, Al2
Abrasives such as O3 and the like are effective. In addition, the thickness t of the sheet 1 is set to 0.45 mm when used for a single-sided printed wiring board, and is set to 0.9 mm when used for a double-sided printed wiring board. Since it is thicker than the depth of the slot 5b at the tip and thinner than the height from the tip of the contact pin to the step 5a, there is no problem even if there is a slight difference from the thickness of the substrate 30 to be inspected.

Since the substrate 30 to be inspected is a double-sided mounting substrate, the contact pins 5 are provided on the upper and lower sides. The contact pins are lowered as in the case of the electrical inspection, and the leading end of the contact pins is slotted into the cleaning sheet. By piercing the contact pin 5b and further piercing the contact pin, raising the contact pin makes it possible to remove the flux attached to the tip.

After the contact pins are stabbed, the stab marks are closed by the elasticity of the sheet 1 and the same effect can be obtained even when the sheet 1 is used again until the sheet 1 is chipped. Also, sheet 1
The material used is one or a combination of silicone rubber, styrene rubber, butadiene rubber, ethylene rubber, urethane rubber, butyl rubber, and ethylene propylene rubber.

On the other hand, if the sheet 1 is chipped,
By slightly shifting the piercing position, the same effect can be obtained again, and repetitive use is possible, so that the economy is excellent.

According to the results of experiments on the correlation between the presence / absence of cleaning, the frequency of cleaning, and the erroneous determination rate described above, the erroneous determination rate was 23% when no cleaning was performed, and cleaning with the sheet 1 was reduced by 1%.
When the test was performed once for each test of zero substrates, the erroneous determination rate was 0%.

In the following, when the cleaning with the sheet 1 is performed once for each test of the 20 substrates, the erroneous determination rate is 0% and 30%.
When the test is performed once for each of the substrates, the erroneous determination rate is 0%,
The erroneous determination rate is 0 when the test is performed once for each test of 50 substrates.
%, When the cleaning with the sheet 1 is performed once for each test of 60 substrates, the erroneous determination rate becomes 1%, and the sheet 1
It was found that the erroneous determination rate was 12% when cleaning was performed once every 70 substrates by the test.

From the above results, when cleaning is performed regularly,
By performing cleaning once every 50 substrate inspections, it is possible to prevent erroneous determination in the inspection process. Next, FIG. 7 shows a state in which the cleaning sheet 1 is set on an inspection jig, the tip of the contact pin 5 is pierced and cleaned, and then the contact pin 5 is raised. FIG. 3 is a diagram illustrating a state in which a cleaning sheet is adhered to a pressing unit.

In this drawing, although it is possible to reduce the erroneous determination rate of the electrical inspection by cleaning the contact pins, the cleaning sheet itself is required to be 0.45 to 0.9.
If it is as thin as mm and has low tackiness, it will be difficult to handle.

More specifically, at the end of cleaning, the surface 1a of the cleaning sheet 1 adheres to the holding portion 12 of the printed wiring board provided on the upper plate 10 provided with the contact pins of the inspection device, and the work is removed every time. Occurs.

Therefore, handling is facilitated by using the silicone rubber sheet, which is the cleaning sheet 1, on the front and back surfaces, or on one surface, on the base material serving as a base sheet having a certain degree of hardness.

FIG. 8 is a cross-sectional view of the double-sided sheet body 100 in which the sheet 1 is attached to both sides of the base sheet 7 serving as a base. To catch from. The double-sided sheet body 100 has a hardness of about 60 ° and an adhesive on both sides of a base sheet 7 made of a plastic plate or the like having a thickness of 1.2 mm, in which the above-mentioned sheet 1 having a thickness of 0.45 mm becomes a conductive adhesive layer. 6 are attached to each.

The double-sided sheet body 100 thus configured
Using the sheet member 1 as shown in FIGS.
00 is set on the inspection device, and the tip of the contact pin 5 is stabbed and cleaned.

A general abrasive can be used as the metal oxide body. For example, MgO having a particle size of about 30 μm is used, and the hardness is set to 35 ° using silicone rubber. The thickness of the base sheet 7 is 1.2 mm
And the hardness of the material is 70-80 °. The material of the base sheet 7 may be a glass epoxy substrate or a hard rubber substrate having a hardness of 40 ° or more. In addition, if the cleaning sheet 1 is an insulator and is likely to be charged with static electricity,
It is preferable that the base sheet 7 is made of a base material corresponding to a conductive material or a material in which a conductive material, for example, carbon, Ni particles, or the like is dispersed, to secure a path for discharging static electricity.

The thickness of the base sheet 7 must be changed depending on the thickness of the substrate to be inspected. However, the thickness of the silicone rubber sheet 1 is 0.45 mm, which is larger than the slit depth at the tip of the contact pin. There is no problem if there is a slight difference from the thickness.

Furthermore, since the substrate to be inspected is a double-sided mounting substrate, the contact pins 5 are provided on the upper and lower sides. Sheet 7
A silicone rubber sheet is stuck on both sides with an adhesive or double-sided tape.

In the above configuration, in order to ensure the electrical contact state of the inspection device, the double-sided sheet body 100 is set in place of the substrate, and the contact pins 5 are lowered as in the normal inspection. The tip of the pin is pierced to clean the flux F at the tip of the pin.

At this time, even if the printed circuit board is adhered to the side for holding the printed circuit board because it is adhered to the hard base material, it is not necessary to peel off the adhered portion when the pin is lifted when lifting the pin, so that cleaning is not necessary. The work can be performed efficiently.

Further, in order to adhere to the member for holding the printed wiring board to be inspected by fixing the upper pin of the probe 4 for electrical inspection with the adhesiveness of the cleaning sheet 1, the cleaning sheet body is attached to the holding member side of the substrate. The cleaning sheet body according to the present invention may also be provided with a push pin for facilitating the removal of the cleaning sheet body by providing a push pin for facilitating automatic peeling, and after the cleaning is completed, the push pin pushes the cleaning sheet body and peels the cleaning sheet body from the inspection device side. It is also effective as a method for making it easier to use.

In the case of the automatic inspection process, the double-sided sheet member 100 is inserted for every several substrates in a cassette, which will be described later, in which the substrate to be inspected is inserted, and the tip of the contact pin 5 can be cleaned without manual operation. As a result, the operation rate of the inspection process can be improved.

As described above, the elastic sheet containing 40 to 70% by weight of the metal oxide particles 2, for example, Al203, MgO or the like is set in the inspection apparatus, and the contact pins are lowered in the same manner as in the normal inspection. By piercing the contact pins into the elastic sheet, it is possible to simultaneously clean dirt such as flux F adhered to the tips of the plurality of contact pins, thereby improving the work efficiency, which is a conventional manual cleaning operation using a brush or the like. Work with many deterministic elements can be eliminated, and work can be performed reliably.

As a result, it is possible to periodically perform the cleaning of the contact pins for the first time after the occurrence of the contact failure due to the time required for the conventional operation. As a result, the erroneous determination that has reduced the efficiency of the conventional inspection is eliminated, and the rectification rate of the process is improved, and the cost can be reduced.

Further, according to the thickness of the substrate on which the electric component is mounted and the arrangement of the contact pins of the inspection device,
As shown in FIG. 12, a single-sided cleaning sheet 200 in which the cleaning sheet 1 is stuck on one side of a glass epoxy substrate or a plastic plate having an appropriate thickness and a rubber plate 7 having an appropriate hardness is prepared on one of the upper and lower sides. The contact pins are set in the inspection apparatus, contacted with the contact pins in the same manner as in a normal inspection, and the contact pins are pierced into the cleaning sheet body, so that a plurality of contact pin tips can be cleaned.

At this time, as compared with the operation using only the cleaning sheet 1, the adhesion of the inspection device to the printed wiring board 30 side is suppressed, and the operation efficiency is further improved. Cleaning can be performed more easily.

FIG. 13 is an external perspective view of an automated line for in-circuit testing of a substrate. In this figure, the same components as those already described are denoted by the same reference numerals, and description thereof will be omitted.

First, a plurality of printed circuit boards 30 are stored in the supply cassette 50 on the upstream side such that the front side of the component mounting surface is exposed as shown in the figure. The printed circuit board 30 has at least two holes 30h for positioning.
Are formed so that the relative distance from the printed pattern for component surface mounting is accurate.
Is inserted into the positioning pins 53 provided on the holder 52, whereby the substrate 30 is positioned relative to the four corners of the holder 52.

The substrates 30 thus fixed and prepared on the holders 52 are supplied to the supply cassette 5 as shown in FIG.
It is prepared in a loaded state within 0. In the cassette 50, the double-sided sheet 100 is stretched so as to cover the opening 52a (shown by a broken line in the figure) of the holder 52. Have been. More specifically, the holder 52 in which the double-sided sheet body 100 is stretched on the fifty-first sheet of the holder 52 to which the substrate 30 is fixed is set in the cassette 50 in advance.

The supply cassette 50 is a cassette supply device 90
The first conveyor 51 serving as a conveying means is set on each of the holders 52 through the opening 50a.
It is comprised so that it may supply above sequentially. The first conveyor 51 has a number of conveyor rollers 55 as shown in the figure.
2 is provided with an opening corresponding to the area of the substrate 30 in a movable manner in the direction of the arrow D1 shown in FIG.
Of the board jig of the above-mentioned inspection jig.
The jig provided with is provided. The drive sprocket 55 on the most upstream side is configured to be intermittently driven by a drive motor 56 composed of a stepping motor.

Further, each of the upper plate 10 and the lower plate 11 provided with a large number of the above-described board electrical inspection probes 4 is moved in the direction of the arrow D3 shown in the figure by four guide shafts 20 suspended from a base (not shown). The upper and lower plates 10 and 11 are vertically movable by an air cylinder 70 for vertical movement.

A positioning air cylinder 57 fixed to the base is fixed in the vicinity of the guide shaft 20, and the actuator 757a moves so as to come into contact with the corner of the holder 52 and is sequentially fed. The holder 52 is positioned and fixed to the base.

With the configuration described above, the substrate 30 is positioned relative to the probe 4. Behind the upper plate 10 and the lower plate 11, the substrate 30
A discharge air cylinder 61 is provided to push the cleaning sheet to the front second conveyor 60, so that the cleaning sheet can be discharged as described later.

The configuration of the second conveyor 60 can be substantially the same as that of the first conveyor 51 as shown in the figure. Therefore, the description is omitted only with reference numerals, but the defective substrate 30 and the cleaning sheets 100 and 200 are omitted. In the direction of arrow D2.

At the most downstream side of the first conveyor 51, there is provided a cassette storage device 91 for mounting the cassette 50 so as to be detachable, as shown in FIG. At the same time, the sheets are stored in a stacked state so that they can be transported in cassette units in the next function test (steps S5 and S6 in FIG. 16).

FIG. 14 is a block diagram of the apparatus configuration shown in FIG. 13, and includes a jig composed of a cassette supply device 90, a first conveyor 51, upper and lower plates 10 and 11 provided with a probe 4, and a jig. 2 conveyor 60 and cassette storage device 91
Are connected to an automatic inspection line controller 80, respectively, while an inspection device 71 provided with a cable 72 individually connected to the probe 4 is connected as shown.

In the above configuration, when the automation line is activated, the supply device 90 is activated in step S 1 of FIG. 15, and one of the holders 52 to which the substrates 30 are fixed is supplied onto the first conveyor 51. Drive motor 5
6, is transported downstream (in the direction of arrow D1),
The test is stopped at a test position sandwiched between the upper plate 10 and the lower plate 11. Thereafter, in step S2, all the four positioning air cylinders 57 are driven, and the four corners of the holder 52 are regulated to perform positioning. Subsequently, in step S3, the air cylinder 7 for vertical drive is used.
0 is performed, and as shown in FIG. 2, the contact pin 5 of each probe 4 penetrates the flux F remaining on the solder fillet 33 due to the no-cleaning of the flux, so that the sharp tip of the contact pin 5 is formed. The part is the solder fillet 3 at the tip of the QFP lead 32 of the IC package.
3. Make sure that it is in contact with 3.

Thereafter, an in-circuit test (steps S5 and S10 in FIG. 12) is performed in step S4. If no abnormality is detected in the inspection result, the process proceeds to step S5, in which the air cylinder 70 is driven in the opposite direction to
0, the lower plate 11 is separated from the substrate 30. next,
By driving the air cylinder 57 in the reverse direction, the positioning is released, the transport of the first conveyor 51 is restarted, and the inspected substrate 30 is transported to the cassette 50 on the downstream side.

As described above, when the holder 52 provided with the substrate 30 is dropped into the cassette 50, the elevating mechanism of the storage device 30 is lowered to operate so as to always maintain the same level (step S8).

On the other hand, if it is determined in step S4 that the inspection result is defective, the air cylinder 70 is driven in the reverse direction so that the upper plate 10 and the lower plate 11 are separated from the substrate 30. In step S10, the defective substrate 30 is discharged together with the holder 52 by driving the air cylinder 61 to press and move the end surface of the holder 52 by the pressing member 62 so as to push it onto the second conveyor 60.

Thereafter, the second conveyor 60 is conveyed by one sheet of the holder 52, and the process ends. By providing a defective board discharging step for discharging the defective board forward from the transport path of the first conveyor 51 when the defective board is detected in this way, defective products can be eliminated. .

On the other hand, the flux F adhering at the tip of the contact pin 5 can be reliably cleaned by the double-sided cleaning sheet 100 which is stretched and set on the holder 52 in advance.

That is, a fine metal oxide is
The upper plate 10 is moved downward by the drive of the air cylinder 70 so as to pierce the elastic sheet formed by dispersing the contaminants including the solder flux attached at the front end portion. After the air cylinder 70 is securely caught in the inside, the air cylinder 70 can be reversely driven to pull out the tip end portion of the contact pin.

Therefore, the moving operation of the tip portion of the contact pin can be used as it is for cleaning.

At this time, since the base sheet 7 and the adhesive layer 6 are conductive, conduction is detected by all the probes.
Can be discharged onto the conveyor 60 of the cassette 5.
It can be used repeatedly by setting it to 0 again.

Therefore, in the case of the automatic inspection process of the fully automatic line, cleaning can be performed as long as the cleaning sheet members 100 and 200 are set for every several substrates of the cassette containing the inspection substrates. This means that the tip of the contact pin can be cleaned without any special modification for cleaning the contact pin, which is indispensable in an automated line for performing flux-free cleaning.

[0083]

As described above, according to the present invention,
Cleaning of contaminants adhering to the tip of the contact pin of the board electrical inspection probe used in the board test equipment including in-circuit testing is ensured by a single cleaning operation using the movement operation of the board electrical inspection probe. The present invention can provide a board electrical inspection method and a board electrical inspection apparatus that can be performed at a time. In addition, there is an effect that full automation in a substrate manufacturing line without flux cleaning can be easily achieved.

[0084]

[Brief description of the drawings]

FIG. 1 is an external perspective view of a board inspection jig.

FIG. 2 is an enlarged perspective view of an essential part of FIG. 1;

FIG. 3 is a cross-sectional view of the cleaning sheet 1.

FIG. 4 is an operation explanatory view showing a state in which the tip of a contact pin 5 is cleaned by a cleaning sheet 1.

FIG. 5 is an operation explanatory view showing a state in which the tip of a contact pin 5 is cleaned with a cleaning sheet 1;

FIG. 6 is an operation explanatory view showing a state where the tip of the contact pin 5 is cleaned by the cleaning sheet 1.

FIG. 7 is a diagram illustrating the operation of the cleaning sheet 1.

FIG. 8 is a cross-sectional view of the double-sided sheet member 100.

FIG. 9 is an operation explanatory view showing a state where the tip of the contact pin 5 is cleaned by the double-sided sheet member 100.

FIG. 10 is an operation explanatory view showing a state in which the tip of the contact pin 5 is cleaned by the double-sided sheet member 100.

FIG. 11 is an operation explanatory view showing a state in which the tip of the contact pin 5 is cleaned by the double-sided sheet member 100.

FIG. 12 is a cross-sectional view of the single-sided sheet member 200.

FIG. 13 is an external perspective view of a substrate automatic test process in a substrate automation line.

FIG. 14 is a block diagram of FIG.

FIG. 15 is a flowchart illustrating the operation of FIGS.

FIG. 16 is a flowchart of mounting a printed wiring board.

FIG. 17 is an external perspective view of a conventional board inspection jig.

FIG. 18 is an enlarged perspective view of a main part of FIG. 17;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 cleaning sheet 2 metal oxide particles (including abrasive) 3 rubber molded part 4 probe 5 contact pin 6 adhesive layer 7 base sheet 10 upper plate (test jig) 11 lower plate (test jig) 50 cassette 51 first (Conveying means) 52 Holder 60 Second conveyor (Defective substrate discharging means) 71 Electric tester 80 Automatic inspection line controller 90 Cassette supply device 91 Cassette storage device

Claims (22)

[Claims] 1. A board electrical inspection method for performing an electrical inspection of a board including an in-circuit test, comprising: a transporting step of sequentially transporting one board to another downstream so that a component mounting surface of the board appears. During the transfer of the board in the transfer step, the board is positioned and moved so that the tip end portions of the contact pins of the board electrical inspection probe of the electrical inspection directly contact the component mounting surface. An electrical inspection step of performing the electrical inspection, and piercing a tip portion of the contact pin into an elastic sheet formed by dispersing a fine metal oxide at a predetermined weight%. A moving operation of the contact pin at the tip portion is used to reliably remove contaminants including solder flux attached at the tip portion within the elastic sheet and then pull out the contaminant. And a cleaning step. 2. A board electrical inspection method for performing an electrical inspection of a board including an in-circuit test, comprising: a transporting step of sequentially transporting the components one by one downstream so that a component mounting surface of the substrate appears. During the transfer of the board in the transfer step, the board is positioned and moved so that the tip end portions of the contact pins of the board electrical inspection probe of the electrical inspection directly contact the component mounting surface. An electrical inspection step of performing the electrical inspection, and in the electrical inspection step, when a failure of the substrate is detected, a defective board discharging step of discharging the defective substrate from the transport path of the transport; The tip portion of the contact pin is pierced into an elastic sheet formed by dispersing a fine metal oxide at a predetermined weight% to form a half of the contact pin. Board electrical inspection method characterized by comprising a cleaning step of utilizing a contaminant containing flux from securely trapped in the elastic body sheet, the movement of the distal end portion of the contact pins to be pulled out. 3. A board electrical inspection method for performing an electrical inspection of a board including an in-circuit test, comprising: a transporting step of sequentially transporting one board to another downstream so that a component mounting surface of the board is exposed. During the transfer of the board in the transfer step, the board is positioned and moved so that the tip end portion of the contact pin of the board electrical inspection probe of the electrical inspection directly contacts the component mounting surface. An electrical inspection step of performing the electrical inspection, and in the electrical inspection step, when a failure of the substrate is detected, a defective substrate discharging step of discharging the defective substrate from the transport path of the transport; The tip portion of the contact pin is pierced into an elastic sheet formed by dispersing a fine metal oxide at a predetermined weight% to form a semi-adhered portion at the tip portion. To be able to use contaminant containing flux from securely trapped in the elastic body sheet, the movement of the distal end portion of the contact pin as withdrawn,
A cleaning step of sequentially transporting one of the substrates for each predetermined number of substrates in a downstream direction so that the surface of the elastic sheet is exposed, and automatically discharging the substrate from the transport path of the transport after the cleaning. A board electrical inspection method characterized by the above-mentioned. 4. The elastic sheet is formed from an industrial rubber material containing a silicone elastomer having a rubber hardness of 20 to 80 degrees (Hs Shore A scale) in order to obtain a restoring force after the piercing, and is used repeatedly. 4. The method according to claim 1, wherein the method is enabled. 5. The metal oxide is an abrasive having a particle size in the range of 10 to 40 μm, preferably aluminum oxide or magnesium oxide, and the predetermined weight% is 40 to 70. Claim 4
The board electrical inspection method according to 1. 6. An elastic sheet having a rubber hardness of 20 to 80.
(Hs Shore A scale) by molding from an industrial rubber material containing a silicone elastomer to obtain the restoring force after the piercing, and the metal oxide has an aluminum oxide having a particle size in the range of 10 to 40 μm. Or use magnesium oxide, and add 40% by weight.
To 70, and the rest to the industrial rubber material,
The board electrical inspection method according to claim 1, wherein the board electrical inspection method is used repeatedly. 7. The industrial rubber material includes silicone rubber, styrene rubber, butadiene rubber, ethylene rubber,
The substrate electrical inspection method according to any one of claims 1 to 6, wherein one or a combination of urethane rubber, butyl rubber, and ethylene propylene rubber is used. 8. The thickness of the elastic sheet is preferably set to 1 mm or less so that a crack portion at a tip end portion of the contact pin enters and a step portion is not buried. The board electrical inspection method according to claim 1. 9. Using a double-sided sheet body in which the elastic sheet is attached to both sides of a base sheet serving as a base, the contaminants adhering at the distal end portions of the contact pins are removed from the double-sided sheet body. 4. The board electrical inspection method according to claim 3, wherein the double-sided sheet body is stretched on a holder for accommodating the board so as to catch the board from both sides. 10. The use of a one-sided sheet body in which the elastic sheet is adhered to one side of a base sheet serving as a base, so that the contaminants attached at the tip end portions of the contact pins are removed from the one-sided sheet body. 4. The board electrical inspection method according to claim 3, wherein the one-sided sheet body is stretched on a holder for accommodating the board so that the board can be captured from one side. 11. The base sheet is made of a resin plate containing a conductive material containing carbon, a material electric conductor including a glass epoxy substrate, and the adhesive layer for attachment has conductivity, and The board electrical inspection method according to claim 9, wherein a failure is detected. 12. A board electrical inspection apparatus for performing an electrical inspection of a board including an in-circuit test, comprising: a transport unit for sequentially transporting one board to another downstream so that a component mounting surface of the board is exposed. During the transfer of the board by the transfer means, the board is positioned and moved so that the tip end portions of the contact pins of the board electrical inspection probe of the electrical inspection directly contact the component mounting surface. An electrical inspection means for performing the electrical inspection, and piercing a tip portion of the contact pin into an elastic sheet molded by dispersing a fine metal oxide at a predetermined weight%, In order to ensure that the contaminants including the solder flux adhered at the tip end portion are caught in the elastic sheet and then withdrawn, the moving operation of the tip end portion of the contact pin is used. And a cleaning means for use. 13. A board electrical inspection apparatus for performing an electrical inspection of a board including an in-circuit test, comprising: a transport unit for sequentially transporting one board to another downstream so that a component mounting surface of the board is exposed. During the transfer of the board by the transfer means, the board is positioned and moved so that the tip end portions of the contact pins of the board electrical inspection probe of the electrical inspection directly contact the component mounting surface. An electrical inspection means for performing the electrical inspection, and a defective board discharging means for discharging the defective substrate from the transport path when the failure of the substrate is detected in the electrical inspection means; The tip portion of the contact pin was attached to the tip portion by piercing the elastic sheet formed by dispersing a fine metal oxide at a predetermined weight%. Contaminants including field flux from capture to ensure the elastic body sheet, board electrical inspection apparatus characterized by comprising a cleaning means for utilizing the movement of the distal end portion of the contact pins to be pulled out. 14. A board electrical inspection apparatus for performing an electrical inspection of a board including an in-circuit test, comprising: transport means for sequentially transporting each board toward the downstream so that a component mounting surface of the board is exposed. During the transfer of the board by the transfer means, the board is positioned and moved so that the tip end portions of the contact pins of the board electrical inspection probe of the electrical inspection directly contact the component mounting surface. An electrical inspection means for performing the electrical inspection, and a defective board discharging means for discharging the defective substrate from the transport path when the failure of the substrate is detected in the electrical inspection means; The tip portion of the contact pin was attached to the tip portion by piercing the elastic sheet formed by dispersing a fine metal oxide at a predetermined weight%. Contaminants including field flux from securely trapped in the elastic body sheet, in order to be able to use the movement of the distal end portion of the contact pin as withdrawn,
Cleaning means for sequentially transporting one of the substrates for each predetermined number of substrates toward the downstream so that the surface of the elastic sheet is exposed, and automatically discharging the substrate from the transport path of the transport after the cleaning. A board electrical inspection device characterized by the above-mentioned. 15. The elastic sheet is molded from an industrial rubber material containing a silicone elastomer having a rubber hardness of 20 to 80 degrees (Hs Shore A scale) in order to obtain a restoring force after the piercing. 15. The board electrical inspection apparatus according to claim 12, wherein the board electrical inspection apparatus is enabled. 16. The metal oxide is an abrasive having a particle size in a range of 10 to 40 μm, preferably aluminum oxide or magnesium oxide, and the predetermined weight% is 40 to 70. The substrate electrical inspection apparatus according to claim 12, wherein 17. The elastic sheet may have a rubber hardness of 20-8.
By molding from an industrial rubber material containing a 0 degree (Hs Shore A scale) silicone elastomer, a restoring force after the piercing is obtained, and the metal oxide is oxidized in a particle size range of 10 to 40 μm. Use aluminum or magnesium oxide and add 4% by weight
2. The method according to claim 1, wherein the material is 0 to 70, and the remainder is made of the industrial rubber material so that the rubber material can be used repeatedly.
The board electrical inspection device according to any one of claims 2 to 14. 18. The industrial rubber material according to claim 12, wherein one or a combination of silicone rubber, styrene rubber, butadiene rubber, ethylene rubber, urethane rubber, butyl rubber, and ethylene propylene rubber is used. 15. The board electrical inspection device according to any one of 14. 19. The thickness of the elastic sheet is preferably set to 1 mm or less so that a crack portion at a tip end portion of the contact pin does not enter and a step portion is not buried. The board electrical inspection device according to claim 12. 20. The use of a double-sided sheet body in which the elastic sheet is adhered to both sides of a base sheet serving as a base, so that the contaminants adhering at the distal end portions of the contact pins can be removed from the double-sided sheet body. 15. The board electrical inspection apparatus according to claim 14, wherein the double-sided sheet body is stretched on a holder for accommodating the board so as to catch the board from both sides. 21. The use of a one-sided sheet body in which the elastic sheet is attached to one side of a base sheet serving as a base, so that the contaminants adhered at the tip end portions of the contact pins can be removed from the one-sided sheet body. 15. The board electrical inspection apparatus according to claim 14, wherein the one-sided sheet body is stretched on a holder for accommodating the board in order to catch the board from one side. 22. The base sheet is made of a resin plate containing a conductive material containing carbon, a material electric conductor including a glass epoxy substrate, and the adhesive layer for attaching has electrical conductivity. 22. The board electrical inspection apparatus according to claim 20, wherein failure detection is performed.