CN107741513A - Probe card for test wafer - Google Patents
Probe card for test wafer Download PDFInfo
- Publication number
- CN107741513A CN107741513A CN201710932056.4A CN201710932056A CN107741513A CN 107741513 A CN107741513 A CN 107741513A CN 201710932056 A CN201710932056 A CN 201710932056A CN 107741513 A CN107741513 A CN 107741513A
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- China
- Prior art keywords
- probe
- probe card
- pinpoint
- hollow tube
- cleaning solution
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
This disclosure relates to the probe card for test wafer.A kind of probe card for test wafer, including：Probe pinpoint, for contacting wafer；And bringing device, for cleaning solution to be applied into the probe pinpoint.
Description
Technical field
This disclosure relates to the probe card for test wafer.
Background technology
Semiconductor technology is advanced by leaps and bounds in recent years.Current product is stressed compact, and IC volumes are less and less, function is got over
Come that stronger, pin number is more and more.In order to reduce the area shared by chip package with improving IC efficiency, such as upside-down mounting core is generally used
The modes such as piece (flip chip).These advanced packaged type unit prices are high.In order to carry out chip testing before packaging, mark
Substandard products chip in wafer, so as to abandon these substandard products chips in encapsulation process, so as to save packaging cost.
Test for chip on wafer, generally use probe card are carried out.Probe in probe card can directly and wafer
The testing cushion of upper chip to be measured forms electric signal with tester table and is connected.Element under test test terminate after by lift probe card or
Person reduces the separation that wafer realizes probe card and chip to be measured.Then next chip to be measured is navigated to by probe station, and led to
Cross reduction probe card or raise the electrical contact that wafer realizes probe card and chip to be measured.Above-mentioned test process can be repeated until brilliant
All chips to be measured are tested on circle completes.
The content of the invention
According to the first aspect of the disclosure, there is provided a kind of probe card for test wafer, including：Probe pinpoint, it is used for
Contact wafer；And bringing device, for cleaning solution to be applied into the probe pinpoint.
Using the application probe card, preferably probe card can be cleaned.
By referring to the drawings to the detailed description of the exemplary embodiment of the disclosure, the further feature of the disclosure and its
Advantage will be made apparent from.
Brief description of the drawings
The accompanying drawing of a part for constitution instruction describes embodiment of the disclosure, and is used to solve together with the description
Release the principle of the disclosure.
Referring to the drawings, according to following detailed description, the disclosure can be more clearly understood, wherein：
Fig. 1 is the diagram for the probe card for showing one embodiment according to the disclosure.
Fig. 2 is the profile for showing the feeler arm in Fig. 1.
Fig. 3 is the schematic diagram for showing to clean the probe of probe card.
Fig. 4 is the schematic diagram for showing the probe card according to another embodiment of the disclosure.
Fig. 5 is the schematic diagram for showing the probe card according to another embodiment of the disclosure.
Fig. 6 is the schematic diagram for showing the probe card according to another embodiment of the disclosure.
Fig. 7 is the schematic diagram for showing the probe card according to another embodiment of the disclosure.
Fig. 8 is the schematic diagram for showing the probe card according to another embodiment of the disclosure.
Pay attention to, in embodiments described below, be used in conjunction with same reference between different accompanying drawings sometimes
Come the part for representing same section or there is identical function, and omit its repeat specification.In this manual, using similar mark
Number and letter represent similar terms, therefore, once be defined in a certain Xiang Yi accompanying drawing, then in subsequent accompanying drawing do not need pair
It is further discussed.
In order to make it easy to understand, position, size and scope of each structure shown in accompanying drawing etc. etc. does not indicate that reality sometimes
Position, size and scope etc..Therefore, disclosed invention is not limited to position, size and scope disclosed in accompanying drawing etc. etc..
Embodiment
The various exemplary embodiments of the disclosure are described in detail now with reference to accompanying drawing.It should be noted that：Unless have in addition
Body illustrates that the unlimited system of part and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
Scope of disclosure.
The description only actually at least one exemplary embodiment is illustrative to be never used as to the disclosure below
And its application or any restrictions that use.
It may be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as authorizing part for specification.
In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, the other examples of exemplary embodiment can have different values.
During test wafer, because the testing cushion of contact measured chip will be repeated several times in the probe of probe card, visit
The friction of needle point and testing cushion can form residual charge in detecting probe surface.In addition, electric signal transmission in test process also can be
Detecting probe surface introduces residual charge, and these residual charges can cause small granular absorption in detecting probe surface, so as to influence probe
With the electrical contact of chip to be measured.Finally, above-mentioned residual charge and bad electrical contact can cause the test of wafer abnormal, especially
Carry out in low current test process, molecule largely comes from process or the board environment of probe engaged test pad.
The rising of probe temperature is also resulted in addition, contact is repeated several times and rubs.The temperature of probe can also influence the test to wafer.
At present, people generally remove the molecule adhered on probe using cleaning paper.For example, probe is set to penetrate cleaning
Paper, so as to remove molecule.But this mode effect is unsatisfactory, while the friction of probe and abrasive material on cleaning paper can also
Cause the breakage of detecting probe surface, shorten the service life of probe, and add the noise in test process.In addition, probe
On residual charge generally removed by being grounded.Due to the potential very little on probe pinpoint, can not be removed completely by ground connection residual
Remaining electric charge.
In order to one of solve the above problems, present disclose provides a kind of new probe card, the probe card in addition to probe,
Also include bringing device, cleaning solution can be applied on probe pinpoint when cleaning probe.It is detailed below in conjunction with specific embodiment
The probe card of the thin description disclosure.
Fig. 1 shows a kind of schematic diagram of probe card 100 according to the disclosure.As shown in figure 1, probe card 100 includes visiting
Pin and circuit board 105.Wherein, probe includes probe pinpoint 102 and feeler arm 103.Probe passes through the through hole 108 in circuit board 105
And it is electrically connected to the opposite side of circuit board.Fixture 104 is provided with circuit board, for fixing the feeler arm 103 of probe.
In addition, as shown in figure 1, the probe card 100, which is additionally provided with woven hose 106, is used as bringing device.Wherein, woven hose
106 can convey cleaning solution to probe.Cleaning solution in the disclosure preferably readily volatilizees, does not have what is corroded to probe card and board
Liquid.For example, cleaning solution can use electrostatic remove liquid, liquid antistatic, or by dilution dilution agent electrostatic remove liquid or
Liquid antistatic.
Fig. 2 shows the profile of feeler arm 103.As shown in Fig. 2 in the present embodiment, it is clear in order to apply to probe pinpoint
Clean liquid, feeler arm 103 are provided with guiding gutter 109.Cleaning solution from woven hose 106 can be introduced in guiding gutter 109, example
Such as, one end of woven hose 106 is arranged in the top of guiding gutter 109 so that the cleaning solution flowed out from woven hose 106 drops onto guiding gutter
In 109.So, cleaning solution can flow to probe pinpoint 102 along guiding gutter 109.
Fig. 1 is returned to, according to an optional the present embodiment, probe card 100 is also provided with appendix 107, appendix
107 can also be as a part for the bringing device of the probe card of the disclosure.Appendix 107 can convey dry to probe pinpoint 102
Pathogenic dryness body, such as dry air, nitrogen, the inert gas (such as helium, argon gas etc.) of drying of drying.From appendix
107 dry gas can make the cleaning solution rapid draing on probe pinpoint 102.
In addition, Fig. 1 is illustrated that schematic diagram when probe card 100 is tested wafer 101.When having carried out a period of time
Test, it is necessary to when cleaning probe, wafer can be left with traveling probe card 100.
Fig. 3 shows the schematic diagram cleaned to the probe of probe card 100.As shown in figure 3, the probe of probe card is moved
Move the top of pallet 110.Pallet 110 can accommodate the cleaning solution 111 to be dripped from probe pinpoint 102.This way it is possible to avoid pollution is brilliant
Circle.
The main process cleaned to the probe of probe card 100 comprises the following steps：
First, probe card 100 is moved to above pallet 110 above tested wafer 101.
Then, woven hose 106 is opened, and cleaning solution is exported from woven hose 106.Guiding gutter of the cleaning solution along feeler arm 103
109 flow to probe pinpoint 102, and are dropped onto along probe pinpoint 102 in pallet 110, so as to realize the cleaning to probe pinpoint 102.
Next, woven hose 106 is closed, cleaning solution is no longer exported.Appendix 107 is opened, and exports dry gas, to visiting
The cleaning solution remained on needle point 102 is dried.
Finally, the top of wafer 101 to be measured can be moved back to by the probe card 100 for cleaning and drying, continued to wafer
101 are tested.
In addition, in a kind of alternative embodiment, the pallet 110 shown in Fig. 3 is also provided with opening 112.Pass through opening
12 can be the discharge tray 110 of cleaning solution 111.In another alternative embodiment, opening 112 can also be with pump (not shown) stream
Body connects.By pump, cleaning solution that can more quickly in discharge tray 110.In addition, the cleaning solution for being easy to volatilization, leads to
Crossing pump can also together discharge the steam of the cleaning solution in pallet, so as to avoid pollution and the corruption to probe card or test equipment
Erosion.
In each embodiment shown in Fig. 1-Fig. 3, probe pinpoint 102 is cleaned by cleaning solution, can not only be gone
Except the molecule adhered on probe pinpoint 102, and residual charge can be eliminated.In addition, cleaning solution can also be played to probe pinpoint
102 cooling effects, eliminate probe pinpoint 102 with the testing cushion on wafer to be measured rub repeatedly caused by temperature raise, it is ensured that
Test result it is accurate.
Fig. 4 shows the probe card 400 for test wafer according to another embodiment of the disclosure.As shown in figure 4,
The probe card 400 includes probe pinpoint 402, feeler arm 403, fixture 404, circuit board 405, woven hose 406 and circuit board 405
On through hole 408.These parts and structure are similar with the corresponding component and structure of the probe card 100 shown in Fig. 1 to Fig. 3, here
Just it is not repeated.The other parts and structure of probe card 400 are described in detail below.
As shown in figure 4, probe card 400 also includes hollow tube 420, such as hollow tube 420 can be insulating sleeve etc..It is hollow
A part for the bringing device of the probe card of pipe 420 and the disclosure.Feeler arm 403 is arranged in hollow tube 420.Hollow tube
420 one end is in fluid communication with woven hose 406, and the other end is located at the junction of probe pinpoint 402 and feeler arm 403.So, come from
The cleaning solution of woven hose 406 can be transported on probe pinpoint 402 by hollow tube 420, so as to realize to the clear of probe pinpoint 402
It is clean, the molecule and residual charge being attached on probe pinpoint 402 are removed, while the temperature of probe pinpoint 402 can also be reduced.
The cleaning equipment of probe card can also be provided with pallet 410, for receiving the cleaning solution dripped from probe pinpoint 402.
In an optional example, pallet 410 can be provided with opening 412, for discharging cleaning solution.In another optional example,
Opening 412 may be coupled to pump (not shown), so as to accelerate the discharge of cleaning solution, and can discharge the steam of cleaning solution, subtract
Small pollution and corrosion to probe card and tester table.
The mode cleaned to Fig. 4 probe card and the mode class of the probe card 100 described above with reference to Fig. 1-Fig. 3
Seemingly, just it is not repeated herein.
Fig. 5 shows the schematic diagram of the probe card according to another embodiment of the disclosure.As shown in figure 5, the spy in Fig. 5
Pin card and Fig. 4 probe card 400 are essentially identical, only difference is that adding appendix 507.Appendix 507 and the disclosure
Probe card bringing device a part.The effect of appendix 507 and the appendix 107 of the probe card 100 in Fig. 1 and Fig. 3
It is similar, for conveying the gas of drying, such as dry air, nitrogen, the inert gas of drying of drying to probe pinpoint 402
(such as argon gas, helium) etc..
Fig. 6 shows the schematic diagram of the probe card 600 according to another embodiment of the disclosure.As shown in fig. 6, the probe
Card 600 includes the through hole 608 on probe pinpoint 602, feeler arm 603, fixture 604, circuit board 605 and circuit board 605.These
Part and structure are similar with the corresponding component and structure of the probe card 100 shown in Fig. 1 to Fig. 3, are just not repeated here.It is detailed below
The thin other parts and structure for introducing probe card 600.
In figure 6, probe card 600 also includes hollow tube 620.Feeler arm 603 is arranged in hollow tube 620.Hollow tube 620
One end be located at the junction of probe pinpoint 602 and feeler arm 603.The other end of hollow tube 620 by breeches joint 621 respectively with
Woven hose 606 connects with appendix 607.Hollow tube 620, breeches joint 621, woven hose 606 and appendix 607 together constitute
According to the bringing device of the probe card of the disclosure example.When the probe to probe card 600 cleans, with Fig. 3 institutes
Show similar, probe card 600 can also be moved to the top of pallet 610.Similar with the pallet 110 shown in Fig. 3, pallet 610 also may be used
To be provided with opening 612, opening 612 can also connect with pump (not shown), for the cleaning solution in discharge tray 610 and volatilization
Cleaning solution steam.
The key step cleaned to the probe of probe card 600 is as follows.
First, probe card 600 is moved to above tested wafer above pallet 610.
Then, woven hose 606 is opened, and cleaning solution is exported from woven hose 606.Cleaning solution flows to probe along hollow tube 620
Point 602, and dropped onto along probe pinpoint 602 in pallet 610, so as to realize the cleaning to probe pinpoint 602.
Next, woven hose 606 is closed, cleaning solution is no longer exported.Appendix 607 is opened, and exports dry gas.Dry
Gas probe pinpoint 602 is flow to by hollow tube 620, the cleaning solution remained on probe pinpoint 602 is dried.
Finally, it can be moved back to above wafer to be measured by the probe card 600 for cleaning and drying, continue to carry out wafer
Test.
In the embodiment shown in fig. 6, woven hose 606 and appendix 607 share hollow tube 620.Hollow tube 620 is in probe
Cleaning solution and the gas dried are transmitted during the cleaning of point successively.Further, since feeler arm 603 is arranged in hollow tube 620,
Feeler arm 603 can also be cleaned simultaneously.
In addition, in an optional embodiment, in order to prevent the interference between different pipelines, breeches joint 621 can be distinguished
It is connected by valve 622 and valve 623 with appendix 607 and woven hose 606.In an optional example, the He of valve 622
623 can be controlled valve, be opened or closed according to the control of peripheral control unit.In another optional example, valve
622 and 623 can be one-way cock, so as to ensure the one-way flow of cleaning solution and the gas dried to hollow tube 620.
Fig. 7 shows the schematic diagram of the probe card 700 according to another embodiment of the disclosure.As shown in fig. 7, probe card
700 include probe pinpoint 702, fixture 704, circuit board 705, woven hose 706, appendix 707, breeches joint 721, the and of valve 722
723.These parts are similar with the probe card 600 that Fig. 6 is described, and are just not repeated herein.
The part different from the probe card 600 shown in Fig. 6 of probe card 700 is described below.As shown in fig. 7, probe card 700 is wrapped
Containing feeler arm 703, feeler arm 703 is hollow tube in itself.So, feeler arm 703 is except making probe pinpoint 702 and the electricity of circuit board 705
, can also be cleaning solution and/or the gas transport of drying to probe pinpoint 702 outside connection.In addition, in an optional example
In, in order to avoid producing interference to test result in test wafer, breeches joint 721 can be electrically insulated with hollow feeler arm.
Using the probe card shown in Fig. 7, hollow feeler arm 703 can transmit cleaning solution and/or the gas of drying, so as to
Reduce the complexity of probe card configuration, reduce production and maintenance cost.
Fig. 8 shows the schematic diagram of the probe card 800 according to another embodiment of the disclosure.As shown in figure 8, probe card
800 include probe pinpoint 802, fixture 804 and circuit board 805.These parts and the corresponding component of the probe card 100 shown in Fig. 1
It is similar, therefore be just not repeated herein.
Other parts of probe card 800 are described below in detail.As shown in figure 8, probe card 800 also include feeler arm 803, in
Blank pipe 820, woven hose 806 and appendix 807.Wherein, feeler arm 803 is arranged in hollow tube 820, and feeler arm 803
It is hollow.Hollow feeler arm 803 is in fluid communication with transfusion fluid communication, hollow tube 820 with appendix 807.So, exist
When being cleaned to needle point 802, cleaning solution is flow on probe pinpoint 802 by hollow feeler arm 803, and probe pinpoint 802 is entered
Row cleaning, then, the gas of drying is conveyed to probe pinpoint 802 by hollow tube 820, can make to remain on probe pinpoint 802 clear
Clean liquid volatilization, so as to complete the cleaning treatment of probe card.
It described above is each embodiment of the probe card according to the disclosure.It should be appreciated that the disclosure is not limited to above-mentioned reality
Apply example.Various modification, modification and replacements can be carried out on the basis of the various embodiments described above.For example, for the probe card shown in Fig. 8
800, in an optional example, hollow feeler arm 803 can be made to be in fluid communication with appendix 807, make hollow tube 820 with
Woven hose 806 is in fluid communication.So, cleaning solution can be transmitted by hollow tube 820 to probe pinpoint 802, is passed by feeler arm 803
The air of defeated drying, probe pinpoint 802 is dried.
Word "front", "rear", " top ", " bottom " in specification and claim, " on ", " under " etc., if deposited
If, it is not necessarily used to describe constant relative position for descriptive purposes.It should be appreciated that the word so used
Language is interchangeable in appropriate circumstances so that embodiment of the disclosure described herein, for example, can with this institute
Those of description show or other are orientated in other different orientations and operated.
As used in this, word " exemplary " means " being used as example, example or explanation ", not as will be by
" model " accurately replicated.It is not necessarily to be interpreted than other implementations in any implementation of this exemplary description
Preferable or favourable.Moreover, the disclosure is not by above-mentioned technical field, background technology, the content of the invention or embodiment
Given in the theory that is any stated or being implied that goes out limited.
As used in this, word " substantially " mean comprising by design or manufacture the defects of, device or element appearance
Any small change caused by difference, environment influence and/or other factorses.Word " substantially " also allows by ghost effect, made an uproar
Caused by sound and the other actual Considerations being likely to be present in actual implementation with perfect or preferable situation
Between difference.
Foregoing description can indicate to be " connected " or " coupled " element or node or feature together.As used herein
, unless otherwise expressly noted, " connection " means an element/node/feature with another element/node/feature in electricity
Above, mechanically, in logic or otherwise it is directly connected (or direct communication).Similarly, unless otherwise expressly noted,
" coupling " mean an element/node/feature can with another element/node/feature in a manner of direct or be indirect in machine
On tool, electrically, in logic or otherwise link to allow to interact, even if the two features may be not direct
Connection is also such.That is, " coupling " is intended to encompass the direct link of element or further feature and linked indirectly, including profit
With the connection of one or more intermediary elements.
In addition, just to the purpose of reference, can also be described below it is middle use certain term, and thus not anticipate
Figure limits.For example, unless clearly indicated by the context, be otherwise related to the word " first " of structure or element, " second " and it is other this
Class numeral word does not imply order or sequence.
It should also be understood that the word of "comprises/comprising" one is as used herein, illustrate pointed feature, entirety, step be present
Suddenly, operation, unit and/or component, but it is not excluded that in the presence of or the one or more of the other feature of increase, entirety, step, behaviour
Work, unit and/or component and/or combinations thereof.
In the disclosure, therefore term " offer " " it is right to provide certain from broadly by covering obtain object all modes
As " including but not limited to " purchase ", " preparation/manufacture ", " arrangement/setting ", " installation/assembling ", and/or " order " object etc..
It should be appreciated by those skilled in the art that the border between aforesaid operations is merely illustrative.Multiple operations
Single operation can be combined into, single operation can be distributed in additional operation, and operate can at least portion in time
Divide and overlappingly perform.Moreover, alternative embodiment can include multiple examples of specific operation, and in other various embodiments
In can change operation order.But others are changed, variations and alternatives are equally possible.Therefore, the specification and drawings
It should be counted as illustrative and not restrictive.
In addition, the disclosure can also include the example below.
A kind of 1. probe card for test wafer, it is characterised in that including：
Probe pinpoint, for contacting wafer；And
Bringing device, for cleaning solution to be applied into the probe pinpoint.
2. the probe card according to 1, it is characterised in that
The probe card also includes feeler arm, and the probe pinpoint is located at one end of the feeler arm, and
The bringing device includes hollow tube, for conveying the cleaning solution to the probe pinpoint.
3. the probe card according to 2, it is characterised in that the feeler arm is disposed in the hollow tube.
4. the probe card according to 3, it is characterised in that the hollow tube is insulating sleeve.
5. the probe card according to 2, it is characterised in that the feeler arm by the hollow tubular into.
6. the probe card according to 2, it is characterised in that the bringing device is configured to by the hollow tube to institute
State probe pinpoint and apply dry gas.
7. the probe card according to 2, it is characterised in that the bringing device also includes：
Woven hose, for conveying the cleaning solution to the hollow tube.
8. the probe card according to 7, it is characterised in that the bringing device also includes：
Appendix, for conveying dry gas to the hollow tube.
9. the probe card according to 8, it is characterised in that the first valve is provided between the woven hose and the hollow tube
Door, is provided with the second valve between the appendix and the hollow tube.
10. the probe card according to 9, it is characterised in that first valve and second valve are all check valves
Door.
11. the probe card according to 1, it is characterised in that also include：
Feeler arm, the probe pinpoint are located at one end of the feeler arm,
Wherein described feeler arm has guiding gutter, and the cleaning solution is applied to by the bringing device by the guiding gutter
On the probe pinpoint.
12. the probe card according to 11, it is characterised in that the bringing device also includes appendix, the appendix
For applying dry gas to the probe pinpoint.
13. the probe card according to 1, it is characterised in that
The probe card also includes hollow feeler arm, for conveying the cleaning solution, the probe to the probe pinpoint
Point is located at one end of the feeler arm, and
The bringing device includes hollow tube, for conveying dry gas to the probe pinpoint.
Although some specific embodiments of the disclosure are described in detail by example, the skill of this area
Art personnel it should be understood that above example merely to illustrate, rather than in order to limit the scope of the present disclosure.It is disclosed herein
Each embodiment can in any combination, without departing from spirit and scope of the present disclosure.It is to be appreciated by one skilled in the art that can be with
A variety of modifications are carried out to embodiment without departing from the scope of the present disclosure and spirit.The scope of the present disclosure is limited by appended claims
It is fixed.
Claims (10)
- A kind of 1. probe card for test wafer, it is characterised in that including：Probe pinpoint, for contacting wafer；AndBringing device, for cleaning solution to be applied into the probe pinpoint.
- 2. probe card according to claim 1, it is characterised in thatThe probe card also includes feeler arm, and the probe pinpoint is located at one end of the feeler arm, andThe bringing device includes hollow tube, for conveying the cleaning solution to the probe pinpoint.
- 3. probe card according to claim 2, it is characterised in that the feeler arm is disposed in the hollow tube.
- 4. probe card according to claim 3, it is characterised in that the hollow tube is insulating sleeve.
- 5. probe card according to claim 2, it is characterised in that the feeler arm by the hollow tubular into.
- 6. probe card according to claim 2, it is characterised in that the bringing device is configured to by the hollow tube Apply dry gas to the probe pinpoint.
- 7. probe card according to claim 2, it is characterised in that the bringing device also includes：Woven hose, for conveying the cleaning solution to the hollow tube.
- 8. probe card according to claim 7, it is characterised in that the bringing device also includes：Appendix, for conveying dry gas to the hollow tube.
- 9. probe card according to claim 8, it is characterised in that is provided between the woven hose and the hollow tube One valve, the second valve is provided between the appendix and the hollow tube.
- 10. probe card according to claim 9, it is characterised in that first valve and second valve are all single To valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710932056.4A CN107741513A (en) | 2017-10-10 | 2017-10-10 | Probe card for test wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710932056.4A CN107741513A (en) | 2017-10-10 | 2017-10-10 | Probe card for test wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107741513A true CN107741513A (en) | 2018-02-27 |
Family
ID=61237075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710932056.4A Pending CN107741513A (en) | 2017-10-10 | 2017-10-10 | Probe card for test wafer |
Country Status (1)
| Country | Link |
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| CN (1) | CN107741513A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112122243A (en) * | 2020-09-02 | 2020-12-25 | 珠海泰坦新动力电子有限公司 | Cleaning device, formation device and cleaning method for cleaning current probe in situ |
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|---|---|---|---|---|
| CN112122243A (en) * | 2020-09-02 | 2020-12-25 | 珠海泰坦新动力电子有限公司 | Cleaning device, formation device and cleaning method for cleaning current probe in situ |
| CN112122243B (en) * | 2020-09-02 | 2023-09-08 | 珠海泰坦新动力电子有限公司 | Cleaning device, formation device and cleaning method for cleaning current probe in place |
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