CN110473772A - A method of establishing backside of wafer graphic data base - Google Patents
A method of establishing backside of wafer graphic data base Download PDFInfo
- Publication number
- CN110473772A CN110473772A CN201910777051.8A CN201910777051A CN110473772A CN 110473772 A CN110473772 A CN 110473772A CN 201910777051 A CN201910777051 A CN 201910777051A CN 110473772 A CN110473772 A CN 110473772A
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- wafer
- board
- backside
- establishing
- data base
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
- G06F16/50—Information retrieval; Database structures therefor; File system structures therefor of still image data
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
Abstract
The present invention provides a kind of method for establishing backside of wafer graphic data base, includes at least: providing bare silicon wafer, grows layer of silicon dioxide at the back side of wafer；Wafer is sent into board, so that the component inside the silica contact board of the backside of wafer, and by whole operating paths of the board；The back side of wafer is scanned, the pattern data information of board component is obtained；Pattern data information is established into database, the wafer problem occurred on production line is compared with the pattern data information in the database, obtains problematic board.The present invention can fast and safely obtain the operation conditions of board by the graph data in backside of wafer inscription rubbing board, convenient for searching problematic board rapidly, avoid bringing further pollution to wafer, improve the yield of product.
Description
Technical field
The present invention relates to field of semiconductor manufacture, more particularly to a kind of method for establishing backside of wafer graphic data base.
Background technique
In wafer production process, the back side of wafer constantly by film growth, wet-cleaning and with board cavity,
Brilliant injury of back is caused after the contact of wafer adsorption disk etc..In higher technology platform, often process window also becomes smaller therewith, In
The lesser back side situation of processing procedure influence of 55nm is worse, often will cause very serious plane defect in 28nm technology platform, and
There are the alarms of technique board back pressure, can not be worked normally, lead to wafer loss；Or due to photoetching process defect and
The source of grain defect causes the yield of product to reduce, and the Macroscopic Anomalies situation of brilliant back, influences normal shipment.
It is, therefore, desirable to provide a kind of new method solves the above problems.
Summary of the invention
In view of the foregoing deficiencies of prior art, backside of wafer figure number is established the purpose of the present invention is to provide a kind of
According to the method in library, lead to wafer report since backside of wafer is contaminated in the manufacturing process of wafer in the prior art for solving
The problem of useless, yield loss and influence normal shipment.
In order to achieve the above objects and other related objects, the present invention provides a kind of side for establishing backside of wafer graphic data base
Method, this method at least include the following steps: Step 1: providing bare silicon wafer, growing layer of silicon dioxide at the back side of the wafer；
Step 2: the wafer is sent into board, so that the component inside the silica contact board of the backside of wafer, and pass through
Cross whole operating paths of the board；Step 3: being scanned to the back side of the wafer, the graph data of board component is obtained
Information；Step 4: the pattern data information is established database, by the wafer problem occurred on production line and the database
In pattern data information be compared, obtain problematic board.
Preferably, in step 1 the backside of wafer growth silica with a thickness of 500 angstroms.
Preferably, the board being sent into the wafer in step 2 is tester table.
Preferably, whole operating paths that wafer described in step 2 passes through in the tester table include: manipulator
Arm grabs wafer, board alignment measures, main measurement.
Preferably, the pattern data information of board component is obtained in step 3 to open up after backside of wafer and board component contact
The size of the board component of print on silica.
Preferably, the pattern data information that board component is obtained in step 3 includes at least: the size of mechanical arm, wafer
It is directed at size.
Preferably, the size of the mechanical arm includes the length and width of mechanical arm；The wafer alignment size packet
Include the radius size of alignment, the number of the contact feet of the number and main measurement of lines and concentric circles.
Preferably, the board being sent into the wafer in step 2 is technique board.
Preferably, whole operating paths that wafer described in step 2 passes through in the technique board include: alignment, delay
Rush chamber, vacuum chamber, process cavity, cooling chamber, cleaning chamber, drying chamber, etch chamber.
As described above, the method for establishing backside of wafer graphic data base of the invention, has the advantages that the present invention
By the graph data in backside of wafer inscription rubbing board, the operation conditions of board can be obtained, fast and safely convenient for looking into rapidly
Problematic board is looked for, avoids bringing further pollution to wafer, improves the yield of product.
Detailed description of the invention
Fig. 1 is shown as the flow diagram of the method for establishing backside of wafer graphic data base of the invention；
Fig. 2 is shown as in the present invention in the schematic diagram of backside of wafer growth silica；
Fig. 3 is shown as in the present invention schematic diagram of mechanical arm in tester table；
Fig. 4 is shown as in the present invention schematic diagram of main measurement unit in tester table；
Fig. 5 is shown as the schematic diagram of the pattern data information obtained in the present invention to backside of wafer scanning.
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Other advantages and efficacy of the present invention can be easily understood for disclosed content.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from
Various modifications or alterations are carried out under spirit of the invention.
Fig. 1 is please referred to Fig. 5.It should be noted that diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of invention, only shown in schema then with related component in the present invention rather than package count when according to actual implementation
Mesh, shape and size are drawn, when actual implementation kenel, quantity and the ratio of each component can arbitrarily change for one kind, and its
Assembly layout kenel may also be increasingly complex.
The present invention provides a kind of method for establishing backside of wafer graphic data base, as shown in Figure 1, Fig. 1 is shown as the present invention
The method for establishing backside of wafer graphic data base flow diagram.It is in the present embodiment method includes the following steps:
Step 1: providing bare silicon wafer, layer of silicon dioxide is grown at the back side of the wafer；What is provided in the step is described
Bare silicon wafer is chip when any process is not taken on surface, grows layer oxide film at the back side of the wafer later, also
It is to say it is to be aoxidized the back side of the wafer to obtain layer of silicon dioxide film in the present embodiment.The present invention further,
The silica oxide film with a thickness of 500 angstroms.Since the material is soft for the oxidation film of the backside of wafer, In
When wafer enters progress complete trails transmission in board, the silica compared with softwood matter can be opened up the component on the board contacted
It is imprinted on the oxidation film, facilitates the figure for scanning inscription rubbing, carry out the analysis of graph data.
As shown in Fig. 2, Fig. 2 is shown as in the schematic diagram of backside of wafer growth silica in the present invention, wherein wafer has
There are upper surface 01 and lower surface 02, the oxidation film (silica) 02 that a layer thickness is 500 angstroms is grown on the lower surface.
Then it carries out Step 2: the wafer is sent into board, so that the silica of the backside of wafer contacts machine
Component inside platform, and by whole operating paths of the board.The present invention further, the step of the present embodiment two will be described
The board that wafer is sent into is tester table.That is, wafer carries out in the tester table all through transmitting.The present invention is more into one
Step ground, whole operating paths that wafer described in step 2 passes through in the tester table include: mechanical arm crawl wafer,
Board alignment measurement, main measurement.Wherein as shown in figure 3, Fig. 3 is shown as in the present invention signal of mechanical arm in tester table
Figure.The wafer enters in the tester table, the rear-face contact of the mechanical arm and the wafer, in the backside of wafer
Oxidation film on can the inscription rubbing mechanical arm.Two mechanical arms that one is long and the other is short are shown in Fig. 3, and refer to Fig. 5, figure
5 are shown the schematic diagram of the pattern data information obtained in the present invention to backside of wafer scanning.It is scanned in the backside of wafer of Fig. 5
It is clear that two mechanical arms by inscription rubbing in figure.In Fig. 5, at the back side of the wafer, in addition to two manipulators
Arm further includes the pattern that wafer contacts in subsequent path with board other component by the figure of inscription rubbing.
Secondly, there are also boards to be aligned in whole operating paths that wafer described in step 2 passes through in the tester table
It measures.How is size of the path that alignment measures comprising wafer alignment.After measuring by alignment, wafer is gone back in measurement platform
By main measurement unit, wafer is contacted with the main measurement unit, and the member pattern on the back side meeting main measurement unit of inscription rubbing of wafer such as connects
The positions such as haptic element, size.As shown in figure 4, Fig. 4 is shown as in the present invention schematic diagram of main measurement unit in tester table, and refer to
Some small circular components are contact feet on main measurement unit in Fig. 5, Fig. 4, also be can be appreciated that in the backside of wafer scanning of Fig. 5 corresponding
Contact feet inscription rubbing figure.
Step 3: being scanned to the back side of the wafer, the pattern data information of board component is obtained.As shown in figure 5,
Fig. 5 is shown as the schematic diagram of the pattern data information obtained in the present invention to backside of wafer scanning.The present invention further, step
The pattern data information that board component is obtained in three is the machine of inscription rubbing on silica after backside of wafer and board component contact
The size of platform component.That is, the data information that the present invention finally needs is the inscription rubbing data of the size of board component, example
Such as the size of mechanical arm, the radius etc. of wafer alignment.It is therefore preferred that obtaining the graph data of board component in step 3
Information includes at least: size, the wafer alignment size of mechanical arm.It in addition to this, if need to be by other path transmissions, also
The pattern data information contacted including wafer with the other component of board.
The size packet of the mechanical arm in the pattern data information of board component is obtained in the present embodiment in step 3
Include the length and width of mechanical arm；Two mechanical arms different in size as shown in Figure 3, can pass through the wafer in Fig. 5
The length and width of two mechanical arms is obtained in back scan respectively.Board component is obtained in the step of the present embodiment three
The wafer alignment size in graphical information includes the radius size of alignment, the number of lines and concentric circles.In Fig. 5,
It can be seen that some concentric circles and various lines, can measure to obtain these scanning patters in backside of wafer scanning
Size.
Obtained in the step of the present embodiment three further include in the graphical information of board component the contact feet of main measurement number.
Then it carries out Step 4: the pattern data information is established database, the wafer problem that will occur on production line
It is compared with the pattern data information in the database, obtains problematic board.That is, above-mentioned steps three are obtained
To backside of wafer on the pattern data information of board component of inscription rubbing be established as database, if in the wafer unloaded goods in life
At encounter in the process as backside of wafer scratch or the contaminated situation of crystal column surface, the graph data in database can be believed
Breath takes out to compare therewith, if occurring same problem in the pattern data information of the database, may determine that
Which component of as which board occurs abnormal.It therefore, can be with the abnormal to reach further of effective monitoring board component
Improve the effect of the yield of product.
The present invention also provides another embodiments, and the embodiment is unlike the embodiments above, by the crystalline substance in step 2
The board that circle is sent into is technique board.That is, the wafer of back side growth silica film is admitted to technique board
Carry out the different processes, such as photoetching, etching, grinding, cleaning, drying etc. in various production processes.The present embodiment further,
Whole operating paths that wafer described in step 2 passes through in the technique board include: alignment, cushion chamber, vacuum chamber, work
Skill chamber, cooling chamber, cleaning chamber, drying chamber, etch chamber.
The wafer is after the All Paths of technical process, the pattern that will contact in different paths with board all parts
Inscription rubbing obtains the pattern data information of board component on the silicon oxide film of the backside of wafer.Later by these figure numbers
It is believed that breath is created as database, if being encountered in generating process in the wafer unloaded goods as backside of wafer scratches or wafer table
Pattern data information in database can be taken out and be compared therewith by the contaminated situation in face, if in the database
Pattern data information in there is same problem, then it is abnormal to may determine which component as which board occurs.Therefore,
It can be with the abnormal to achieve the effect that the yield for further increasing product of effective monitoring board component.
In conclusion the present invention can fast and safely obtain machine by the graph data in backside of wafer inscription rubbing board
The operation conditions of platform avoids bringing further pollution to wafer, improves the good of product convenient for searching problematic board rapidly
Rate.So the present invention effectively overcomes various shortcoming in the prior art and has high industrial utilization value.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (9)
1. a kind of method for establishing backside of wafer graphic data base, which is characterized in that this method at least includes the following steps:
Step 1: providing bare silicon wafer, layer of silicon dioxide is grown at the back side of the wafer；
Step 2: the wafer is sent into board, so that the component inside the silica contact board of the backside of wafer,
And by whole operating paths of the board；
Step 3: being scanned to the back side of the wafer, the pattern data information of board component is obtained；
Step 4: the pattern data information is established database, by the wafer problem occurred on production line and the database
In pattern data information be compared, obtain problematic board.
2. the method according to claim 1 for establishing backside of wafer graphic data base, it is characterised in that: in institute in step 1
State backside of wafer growth silica with a thickness of 500 angstroms.
3. the method according to claim 2 for establishing backside of wafer graphic data base, it is characterised in that: by institute in step 2
The board for stating wafer feeding is tester table.
4. the method according to claim 3 for establishing backside of wafer graphic data base, it is characterised in that: described in step 2
Whole operating paths that wafer passes through in the tester table include: mechanical arm crawl wafer, board alignment measurement, main amount
It surveys.
5. the method according to claim 4 for establishing backside of wafer graphic data base, it is characterised in that: obtained in step 3
The pattern data information of board component is the board component of inscription rubbing on silica after backside of wafer and board component contact
Size.
6. the method according to claim 5 for establishing backside of wafer graphic data base, it is characterised in that: obtained in step 3
The pattern data information of board component includes at least: size, the wafer alignment size of mechanical arm.
7. the method according to claim 6 for establishing backside of wafer graphic data base, it is characterised in that: the mechanical arm
Size include mechanical arm length and width；The wafer alignment size includes the radius size of alignment, lines and same
The number of the contact feet of the number and main measurement of heart circle.
8. the method according to claim 2 for establishing backside of wafer graphic data base, it is characterised in that: by institute in step 2
The board for stating wafer feeding is technique board.
9. the method according to claim 8 for establishing backside of wafer graphic data base, it is characterised in that: described in step 2
Whole operating paths that wafer passes through in the technique board include: alignment, cushion chamber, vacuum chamber, process cavity, cooling chamber,
Clean chamber, drying chamber, etch chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910777051.8A CN110473772B (en) | 2019-08-22 | 2019-08-22 | Method for establishing wafer back side graph database |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910777051.8A CN110473772B (en) | 2019-08-22 | 2019-08-22 | Method for establishing wafer back side graph database |
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| CN110473772A true CN110473772A (en) | 2019-11-19 |
| CN110473772B CN110473772B (en) | 2021-10-19 |
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| CN201910777051.8A Active CN110473772B (en) | 2019-08-22 | 2019-08-22 | Method for establishing wafer back side graph database |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111553875A (en) * | 2020-03-03 | 2020-08-18 | 上海华力集成电路制造有限公司 | Method and system for searching wafer production abnormal equipment |
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