CN103295928A - Method for rapidly finding wafer scratch unfilled-corner contamination - Google Patents
Method for rapidly finding wafer scratch unfilled-corner contamination Download PDFInfo
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- CN103295928A CN103295928A CN2012100524756A CN201210052475A CN103295928A CN 103295928 A CN103295928 A CN 103295928A CN 2012100524756 A CN2012100524756 A CN 2012100524756A CN 201210052475 A CN201210052475 A CN 201210052475A CN 103295928 A CN103295928 A CN 103295928A
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Abstract
The invention provides a method for rapidly finding wafer scratch unfilled-corner contamination. The method comprises the following steps that the name and the hardware size of equipment which is confirmed to cause the wafer scratch unfilled-corner contamination are gathered to form a data base 1; the names and the hardware sizes of all equipment contacted with wafers are counted in a wafer manufacturing process, all the hardware sizes and the contacting positions of the wafers are made into a united data base 2; the wafers are divided according to 0.5-mm pixels; the starting point and the terminal pint of scratch of the divided wafers are confirmed; a curve most similar to the scratch is selected; corresponding data are selected from the data base 2 according to the shape and the length of the curve, and the selected data and data in the data base 1 are compared; confirmed result data are input to the data base 1 to serve as reference frames of follow-up problem judging.
Description
Technical field
The present invention relates to semiconductor fabrication process, scratch the method that unfilled corner is stain in particular to a kind of wafer of searching fast.
Background technology
In semiconductor fabrication, because unit exception or manual operation mistake can cause wafer to scratch the generation that unfilled corner is stain, and then cause the product yield to descend, serious meeting causes scrapping of whole wafer.
At present, mainly search by artificial online method of searching and cause wafer to scratch the reason that unfilled corner is stain, namely do not search the person with reference to device name and hardware size that whole semiconductor fabrication adopts, by virtue of experience judge the root that produces the problems referred to above.The shortcoming of this lookup method is: the correlation experience difference that the different persons of searching has, thereby for the different persons of searching, there is bigger difference in the result of its searching speed and judgement, is unfavorable for solving quickly and accurately the problem of described appearance.
Therefore the platform of searching for the generation reason that scratches the unfilled corner contamination of a unification, needs to propose a kind of method, can be provided for the different persons of searching.
Summary of the invention
At the deficiencies in the prior art, the invention provides a kind of wafer of searching fast and scratch the method that unfilled corner is stain, comprising: will confirmedly cause wafer to scratch the title of equipment of unfilled corner contamination and hardware size and gather and make database 1; Add up title and the hardware size of all devices that comes in contact with described wafer in the wafer manufacture process, and above-mentioned all hardware size and the contact position of wafer are made unified database 2; Pixel according to 0.5mm is divided described wafer; In the described wafer of dividing, determine starting point and the terminal point of scuffing; Choose and curve like the described scuffing recently; Shape and length according to described curve are chosen corresponding data from described database 2, and the data in selected data and the described database 1 are compared; The result data of confirming is imported described database 1, with the reference frame as follow-up decision problem.
Further, the hardware size in the described database 1 comprises the size of the scuffing that the size at position of described equipment and described wafer generation actual contact and described equipment cause described wafer.
Further, the hardware size in the described database 2 comprises the size at the position of described equipment and described wafer generation actual contact.
Further, choose and curve like the described scuffing recently by changing the similarity value.
Further, by described contrast, can not cause title and the hardware size of the equipment of described scuffing with further eliminating.
According to the present invention, the platform of searching for the generation reason that scratches the unfilled corner contamination of a unification can be provided for the different persons of searching, and exception record is filed; By this platform, anyone is decision problem rapidly, reduces the coverage to product.
Description of drawings
Following accompanying drawing of the present invention is used for understanding the present invention at this as a part of the present invention.Embodiments of the invention and description thereof have been shown in the accompanying drawing, have been used for explaining principle of the present invention.
In the accompanying drawing:
The schematic diagram of Fig. 1 for according to the pixel of 0.5mm wafer being divided;
Fig. 2 is the schematic diagram of similarity inquire button;
Fig. 3 is the flow chart of the method for searching the contamination of wafer scuffing unfilled corner fast of the present invention's proposition.
Embodiment
In the following description, a large amount of concrete details have been provided in order to more thorough understanding of the invention is provided.Yet, it is obvious to the skilled person that the present invention can need not one or more these details and implemented.In other example, for fear of obscuring with the present invention, be not described for technical characterictics more well known in the art.
In order thoroughly to understand the present invention, will in following description, detailed steps be proposed, so that the wafer of searching fast that explaination the present invention proposes scratches the method that unfilled corner is stain.Obviously, execution of the present invention is not limited to the specific details that the technical staff of semiconductor applications has the knack of.Preferred embodiment of the present invention is described in detail as follows, yet except these were described in detail, the present invention can also have other execution modes.
Should be understood that, when using term " to comprise " in this manual and/or when " comprising ", it indicates and has described feature, integral body, step, operation, element and/or assembly, does not exist or additional one or more other features, integral body, step, operation, element, assembly and/or their combination but do not get rid of.
At the weak point of existing artificial online lookup method, the present invention propose a unification for scratching the method that generation reason that unfilled corner stains is searched.
With reference to Fig. 1, wherein show the flow chart of the method for searching the contamination of wafer scuffing unfilled corner fast of the present invention's proposition, be used for schematically illustrating the flow process of whole lookup method.Below in conjunction with Fig. 1 method of the present invention is described in detail.
Execution in step 101 causes title that wafer scratches the equipment that unfilled corner stains and hardware size to gather to make database 1 with confirmed.Described equipment comprises the equipment of lifting or grasp described wafer, the equipment that grinds described wafer etc.Described hardware size comprises the size of the scuffing that the size at position of described equipment and described wafer generation actual contact and described equipment cause described wafer.
Execution in step 102, title and the hardware size of all devices that comes in contact with described wafer in the statistics wafer manufacture process, and above-mentioned all hardware size and the contact position of wafer made unified database 2.Described hardware size comprises the size at the position of described equipment and described wafer generation actual contact.
Execution in step 103, pixel according to 0.5mm is divided described wafer, as shown in Figure 2, the described wafer of dividing is made software, wherein said database 2 is linked to described software, and namely described database 2 can be linked on the described wafer of dividing intuitively.In the present embodiment, adopt C#.net to realize the making of described software.The making of described database 1 and database 2 can adopt method known in those skilled in the art to realize.
Execution in step 104, in wafer (being the described wafer of dividing) as shown in Figure 2, determine starting point and the terminal point of scuffing, described software will be dynamically connected described starting point and terminal point certainly being depicted as line, and title and the hardware size of choosing the equipment that may cause described scuffing according to position and the length of described line from described database 2;
Execution in step 105 is chosen and curve like the described scuffing recently.Be provided with the similarity option in the described software, by regulating as shown in Figure 3 similarity button selecting different similarity values, and then the shape of line that changes the starting point that connects described scuffing and terminal point is to determine and curve like the described scuffing recently; Wherein, described similarity value is more big, the shape and size of selected curve and the shape and size of described scuffing are more approximate, and the title of the equipment that causes described scuffing that described software is chosen from described database 2 according to the shape and size of selected curve and the data of hardware size are more accurate.
Execution in step 106, described software is chosen the title of the equipment that most possibly causes described scuffing and the data of hardware size according to position and the length of described curve from described database 2, and the data in selected data and the described database 1 are compared, can not cause the title of equipment of described scuffing and the related data of hardware size with further eliminating.
Execution in step 107 is imported described database 1 with result's (namely causing the reason of scuffing) data of confirming, with the reference frame as follow-up decision problem.
According to the present invention, can for the different persons of searching provide a unification for the platform of searching that scratches generation reason that unfilled corner stains, and exception record filed, for the person of searching who newly advances provide problem analysis in a large number can reference data; By this platform, anyone is decision problem rapidly, reduces the coverage to product.
The present invention is illustrated by above-described embodiment, but should be understood that, above-described embodiment just is used for for example and illustrative purposes, but not is intended to the present invention is limited in the described scope of embodiments.It will be appreciated by persons skilled in the art that in addition the present invention is not limited to above-described embodiment, can also make more kinds of variants and modifications according to instruction of the present invention, these variants and modifications all drop in the present invention's scope required for protection.Protection scope of the present invention is defined by the appended claims and equivalent scope thereof.
Claims (5)
1. search the method that wafer scratches the unfilled corner contamination fast for one kind, comprising:
Cause title that wafer scratches the equipment that unfilled corner stains and hardware size to gather to make database 1 with confirmed;
Add up title and the hardware size of all devices that comes in contact with described wafer in the wafer manufacture process, and above-mentioned all hardware size and the contact position of wafer are made unified database 2;
Pixel according to 0.5mm is divided described wafer;
In the described wafer of dividing, determine starting point and the terminal point of scuffing;
Choose and curve like the described scuffing recently;
Shape and length according to described curve are chosen corresponding data from described database 2, and the data in selected data and the described database 1 are compared;
The result data of confirming is imported described database 1, with the reference frame as follow-up decision problem.
2. method according to claim 1 is characterized in that, the hardware size in the described database 1 comprises the size of the scuffing that the size at position of described equipment and described wafer generation actual contact and described equipment cause described wafer.
3. method according to claim 1 is characterized in that, the hardware size in the described database 2 comprises the size at the position of described equipment and described wafer generation actual contact.
4. method according to claim 1 is characterized in that, chooses and curve like the described scuffing recently by changing the similarity value.
5. method according to claim 1 is characterized in that, by described contrast, can not cause title and the hardware size of the equipment of described scuffing with further eliminating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210052475.6A CN103295928B (en) | 2012-03-02 | 2012-03-02 | A kind of fast finding wafer scratches the method that unfilled corner is stain |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210052475.6A CN103295928B (en) | 2012-03-02 | 2012-03-02 | A kind of fast finding wafer scratches the method that unfilled corner is stain |
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| Publication Number | Publication Date |
|---|---|
| CN103295928A true CN103295928A (en) | 2013-09-11 |
| CN103295928B CN103295928B (en) | 2016-04-06 |
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| CN201210052475.6A Active CN103295928B (en) | 2012-03-02 | 2012-03-02 | A kind of fast finding wafer scratches the method that unfilled corner is stain |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110473772A (en) * | 2019-08-22 | 2019-11-19 | 上海华力微电子有限公司 | A method of establishing backside of wafer graphic data base |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5206627A (en) * | 1990-11-21 | 1993-04-27 | Tokyo Electron Sagami Limited | Substrate detecting system with edge detection, such as wafer or base material of semiconductor device or LCD |
| US6111637A (en) * | 1995-12-29 | 2000-08-29 | Samsung Electronics Co., Ltd. | Apparatus and method for examining wafers |
| CN102054724A (en) * | 2009-11-11 | 2011-05-11 | 无锡华润上华半导体有限公司 | Method and device for detecting wafer surface defects |
-
2012
- 2012-03-02 CN CN201210052475.6A patent/CN103295928B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5206627A (en) * | 1990-11-21 | 1993-04-27 | Tokyo Electron Sagami Limited | Substrate detecting system with edge detection, such as wafer or base material of semiconductor device or LCD |
| US6111637A (en) * | 1995-12-29 | 2000-08-29 | Samsung Electronics Co., Ltd. | Apparatus and method for examining wafers |
| CN102054724A (en) * | 2009-11-11 | 2011-05-11 | 无锡华润上华半导体有限公司 | Method and device for detecting wafer surface defects |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110473772A (en) * | 2019-08-22 | 2019-11-19 | 上海华力微电子有限公司 | A method of establishing backside of wafer graphic data base |
| CN110473772B (en) * | 2019-08-22 | 2021-10-19 | 上海华力微电子有限公司 | Method for establishing wafer back side graph database |
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| Publication number | Publication date |
|---|---|
| CN103295928B (en) | 2016-04-06 |
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