CN103295928B - A kind of fast finding wafer scratches the method that unfilled corner is stain - Google Patents
A kind of fast finding wafer scratches the method that unfilled corner is stain Download PDFInfo
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Abstract
The invention provides a kind of method that fast finding wafer scratches unfilled corner contamination, comprising: the title of the confirmed equipment causing wafer scuffing unfilled corner to stain and hardware size are gathered and makes database 1; The title of all devices come in contact with described wafer in statistics wafer manufacturing process and hardware size, and the contact position of above-mentioned all hardware size and wafer is made unified database 2; According to the pixel of 0.5mm, described wafer is divided; Starting point and the terminal of scuffing is determined in divided described wafer; Choose the curve closest with described scuffing; From described database 2, choose corresponding data according to the shape of described curve and length, and the data in selected data and described database 1 are contrasted; The result data of confirmation is inputted described database 1, using the reference frame as follow-up decision problem.
Description
Technical field
The present invention relates to semiconductor fabrication process, scratch the method for unfilled corner contamination in particular to a kind of fast finding wafer.
Background technology
In semiconductor fabrication, because unit exception or manual operation mistake can cause wafer to scratch the generation of unfilled corner contamination, and then cause product yield to decline, serious meeting causes scrapping of whole wafer.
Namely at present, the method mainly through manually searching online searches the reason causing wafer to scratch unfilled corner to stain, and does not search device name and hardware size that person adopts with reference to whole semiconductor fabrication, by virtue of experience judges the root producing the problems referred to above.The shortcoming of this lookup method is: the correlation experience that the different persons of searching has is different, and thus for the different persons of searching, the result of its speed of searching and judgement exists larger difference, is unfavorable for solving described produced problem quickly and accurately.
Therefore, need to propose a kind of method, with can for the different persons of searching provide a unification for scratch unfilled corner stain producing cause search platform.
Summary of the invention
For the deficiencies in the prior art, the invention provides a kind of method that fast finding wafer scratches unfilled corner contamination, comprising: the title of the confirmed equipment causing wafer scuffing unfilled corner to stain and hardware size are gathered and makes database 1; The title of all devices come in contact with described wafer in statistics wafer manufacturing process and hardware size, and the contact position of above-mentioned all hardware size and wafer is made unified database 2; According to the pixel of 0.5mm, described wafer is divided; Starting point and the terminal of scuffing is determined in divided described wafer; Choose the curve closest with described scuffing; From described database 2, choose corresponding data according to the shape of described curve and length, and the data in selected data and described database 1 are contrasted; The result data of confirmation is inputted described database 1, using the reference frame as follow-up decision problem.
Further, the hardware size in described database 1 comprises described equipment and described wafer and the size at the actual position contacted and described equipment occurs to the size of the scuffing that described wafer causes.
Further, the hardware size in described database 2 comprises the size that the actual position contacted occurs for described equipment and described wafer.
Further, the curve closest with described scuffing is chosen by changing Similarity value.
Further, by described contrast, to get rid of title and the hardware size of the equipment that can not cause described scuffing further.
According to the present invention, what can provide a unification for the different persons of searching searches platform for what scratch producing cause that unfilled corner stains, and is filed by exception record; By this platform, anyone can decision problem rapidly, reduces the coverage to product.
Accompanying drawing explanation
Following accompanying drawing of the present invention in this as a part of the present invention for understanding the present invention.Shown in the drawings of embodiments of the invention and description thereof, be used for explaining principle of the present invention.
In accompanying drawing:
Fig. 1 is the schematic diagram divided wafer according to the pixel of 0.5mm;
Fig. 2 is the schematic diagram of similarity search button;
Fig. 3 is the flow chart of the method for the fast finding wafer scuffing unfilled corner contamination that the present invention proposes.
Embodiment
In the following description, a large amount of concrete details is given to provide more thorough understanding of the invention.But, it is obvious to the skilled person that the present invention can be implemented without the need to these details one or more.In other example, in order to avoid obscuring with the present invention, technical characteristics more well known in the art are not described.
In order to thoroughly understand the present invention, by following description, detailed step is proposed, to explain the method for the fast finding wafer scuffing unfilled corner contamination that the present invention proposes.Obviously, the specific details that the technical staff that execution of the present invention is not limited to semiconductor applications has the knack of.Preferred embodiment of the present invention is described in detail as follows, but except these are described in detail, the present invention can also have other execution modes.
Should be understood that, " comprise " when using term in this manual and/or " comprising " time, it indicates exists described feature, entirety, step, operation, element and/or assembly, but does not get rid of existence or additional other features one or more, entirety, step, operation, element, assembly and/or their combination.
For the weak point of existing artificial online lookup method, the present invention propose a unification for the method scratching producing cause that unfilled corner stains and carry out searching.
With reference to Fig. 1, illustrated therein is the flow chart of the method for the fast finding wafer scuffing unfilled corner contamination that the present invention proposes, for schematically illustrating the flow process of whole lookup method.Below in conjunction with Fig. 1, method of the present invention is described in detail.
Perform step 101, the title of the confirmed equipment causing wafer scuffing unfilled corner to stain and hardware size are gathered and makes database 1.Described equipment comprises the equipment lifting or capture described wafer, the equipment etc. grinding described wafer.Described hardware size comprises described equipment and described wafer and the size at the actual position contacted and described equipment occurs to the size of the scuffing that described wafer causes.
Perform step 102, the title of all devices come in contact with described wafer in statistics wafer manufacturing process and hardware size, and the contact position of above-mentioned all hardware size and wafer is made unified database 2.Described hardware size comprises the size that the actual position contacted occurs for described equipment and described wafer.
Perform step 103, according to the pixel of 0.5mm, described wafer is divided, as shown in Figure 2, divided described wafer is made software, wherein said database 2 is linked to described software, and namely described database 2 can be linked on divided described wafer intuitively.In the present embodiment, C#.net is adopted to realize the making of described software.The making of described database 1 and database 2 can adopt method known in those skilled in the art to realize.
Perform step 104, starting point and the terminal of scuffing is determined in wafer (being divided described wafer) as shown in Figure 2, described software will be dynamically connected described starting point and terminal certainly to be depicted as line, and from described database 2, choose title and the hardware size of the equipment that may cause described scuffing according to the position of described line and length;
Perform step 105, choose the curve closest with described scuffing.Be provided with similarity option in described software, by regulating similarity button as shown in Figure 3 to select different Similarity value, and then change connect the starting point of described scuffing and the line of terminal shape to determine the curve closest with described scuffing; Wherein, described Similarity value is larger, the shape and size of selected curve and the shape and size of described scuffing more approximate, what described software was chosen from described database 2 according to the shape and size of selected curve causes the data of the title of the equipment of described scuffing and hardware size more accurate.
Perform step 106, described software chooses the title of the equipment most possibly causing described scuffing and the data of hardware size according to the position of described curve and length from described database 2, and the data in selected data and described database 1 are contrasted, with the related data of the title and hardware size of getting rid of the equipment that can not cause described scuffing further.
Perform step 107, result (namely causing the reason of the scuffing) data confirmed are inputted described database 1, using the reference frame as follow-up decision problem.
According to the present invention, what can provide a unification for the different persons of searching searches platform for what scratch producing cause that unfilled corner stains, and is filed by exception record, for the person of searching newly entered problem analysis is provided in a large number can the data of reference; By this platform, anyone can decision problem rapidly, reduces the coverage to product.
The present invention is illustrated by above-described embodiment, but should be understood that, above-described embodiment just for the object of illustrating and illustrate, and is not intended to the present invention to be limited in described scope of embodiments.In addition it will be appreciated by persons skilled in the art that the present invention is not limited to above-described embodiment, more kinds of variants and modifications can also be made according to instruction of the present invention, within these variants and modifications all drop on the present invention's scope required for protection.Protection scope of the present invention defined by the appended claims and equivalent scope thereof.
Claims (4)
1. fast finding wafer scratches the method that unfilled corner is stain, and comprising:
The title of the confirmed equipment causing wafer scuffing unfilled corner to stain and hardware size are gathered and makes database 1;
The title of all devices come in contact with described wafer in statistics wafer manufacturing process and hardware size, and the numerical value of the contact position of above-mentioned all hardware size and designation equipment and wafer is made unified database 2;
According to the pixel of 0.5mm, described wafer is divided;
In divided described wafer, determine the starting point that scratches and terminal, connect described starting point and terminal obtains initial curve;
The shape of described initial curve and described scuffing is compared, to determine the net shape of described initial curve;
From described database 2, choose corresponding data according to the net shape of described initial curve and length, and the data in selected data and described database 1 are contrasted;
The data obtained after the described contrast of enforcement are inputted described database 1, using the reference frame as follow-up decision problem.
2. method according to claim 1, is characterized in that, the hardware size in described database 1 comprises described equipment and described wafer and the size at the actual position contacted and described equipment occurs to the size of the scuffing that described wafer causes.
3. method according to claim 1, is characterized in that, the hardware size in described database 2 comprises the size that the actual position contacted occurs for described equipment and described wafer.
4. method according to claim 1, is characterized in that, by described contrast, to get rid of title and the hardware size of the equipment that can not cause described scuffing further.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210052475.6A CN103295928B (en) | 2012-03-02 | 2012-03-02 | A kind of fast finding wafer scratches the method that unfilled corner is stain |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210052475.6A CN103295928B (en) | 2012-03-02 | 2012-03-02 | A kind of fast finding wafer scratches the method that unfilled corner is stain |
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| Publication Number | Publication Date |
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| CN103295928A CN103295928A (en) | 2013-09-11 |
| CN103295928B true CN103295928B (en) | 2016-04-06 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110473772B (en) * | 2019-08-22 | 2021-10-19 | 上海华力微电子有限公司 | Method for establishing wafer back side graph database |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5206627A (en) * | 1990-11-21 | 1993-04-27 | Tokyo Electron Sagami Limited | Substrate detecting system with edge detection, such as wafer or base material of semiconductor device or LCD |
| US6111637A (en) * | 1995-12-29 | 2000-08-29 | Samsung Electronics Co., Ltd. | Apparatus and method for examining wafers |
| CN102054724A (en) * | 2009-11-11 | 2011-05-11 | 无锡华润上华半导体有限公司 | Method and device for detecting wafer surface defects |
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2012
- 2012-03-02 CN CN201210052475.6A patent/CN103295928B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5206627A (en) * | 1990-11-21 | 1993-04-27 | Tokyo Electron Sagami Limited | Substrate detecting system with edge detection, such as wafer or base material of semiconductor device or LCD |
| US6111637A (en) * | 1995-12-29 | 2000-08-29 | Samsung Electronics Co., Ltd. | Apparatus and method for examining wafers |
| CN102054724A (en) * | 2009-11-11 | 2011-05-11 | 无锡华润上华半导体有限公司 | Method and device for detecting wafer surface defects |
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| CN103295928A (en) | 2013-09-11 |
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