JP2001210682A - Semiconductor-sorting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To automatically put defect marks on chips that are located around a defective chip, when a continuous defect distribution is generated in measurement of a wafer. SOLUTION: A data file obtained by acquiring measurement result, with reference to the coordinates of each chip on a wafer, is converted to generate data, based on which failure marks are put.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer prober, and more particularly to a technique for grasping and selecting potential defects in advance.
For example, the present invention relates to a technique which is effective for use in selecting non-defective products and defective products in a group of pellets on a wafer in a semiconductor device manufacturing process.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, as a semiconductor sorting device for sorting and inspecting non-defective products and defective products in a group of pellets on a wafer, a wafer prober, probing for a probe needle pellet, an integrated circuit built in the pellet, and the like. Test communication with the tester, calculation of the total number of good and defective test results per wafer and their printing, and automatic interruption of inspection and alarm when a defective product occurs continuously in the probe. In some cases, the marking is performed using a marker for a non-defective product or a defective product as a test result.

[0003] An example of a wafer prober is described in "Electronic Materials Separate Volume 1984 Edition Ultra LSI Manufacturing and Test Equipment Guidebook" published by the Industrial Research Institute, November 1, 1983.
There are P195-P198, issued on the 5th.

[0004]

In such a semiconductor sorting apparatus, when defective products continuously and frequently occur in the wafer surface or when a local defective distribution occurs, the pellets around the defective products are removed. There is a problem that a potential defect is inherent, or the screening result is just before the screening standard and the screening result may be regarded as a good product.

It is an object of the present invention to provide a semiconductor sorting apparatus capable of sorting out potential defects (including pellets that are barely at the end of the sorting standard and subsequently defective).

[0006]

In order to solve the above-mentioned problems and to achieve the object, a first sorting is performed from position coordinate data of a pellet in a wafer and sorting result data of the pellet corresponding to the position coordinate data. The resulting pellet and the first
Is marked on the pellets of the second sorting result around the pellets of the sorting result.

[0007] According to this, by marking the pellets of the first sorting result and the pellets of the second sorting result around the pellet of the first sorting result, the potential of the first sorting result is marked. The pellet can be marked.

[0008] Further, based on the position coordinate data of the pellets in the wafer and the pellet selection result data corresponding to the position coordinate data, the first selection result pellets are present in the form of islands; The resulting pellet is marked on a second sorted pellet adjacent to the island-shaped pellet.

[0009] According to this, the pellets of the first sorting result are marked on the pellets of the second sorting result adjacent to the pellets present in the form of islands, whereby the potential of the first sort is obtained.
Can be marked on the pellets of the sorting result.

[0010] Further, based on the position coordinate data of the pellets in the wafer and the pellet selection result data corresponding to the position coordinate data, the first selection result pellet and the first selection result are obtained.
Are marked on the pellets of the second sorting result surrounded by the pellets of the sorting result.

According to this, by marking the pellets of the first sorting result and the pellets of the second sorting result surrounded by the pellet of the first sorting result, the potential pellets of the first sorting result are marked. Can be marked.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a semiconductor sorting apparatus according to the present invention will be described below in detail with reference to the accompanying drawings.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention uses the coordinate information of pellets and the information of non-defective or defective products as information of each pellet in the wafer surface at the time of electrical characteristic inspection of a semiconductor device, for example, using a floppy disk or a hard disk of another computer through a network. Stored in the storage device,
Further, the marking is performed when the measurement of one wafer is completed or the measurement of the lot is completed.

In FIG. 4, the stage 7 of the prober device
The wafer 6 is set on the wafer, and each pellet in the wafer 6 is selected and inspected by the IC inspection apparatus 2 using a probe card provided with the contacts 4 and 5, and the coordinates and the selected inspection result corresponding to each pellet are obtained. The acquired data file 9 is created, and a file obtained by performing coordinate conversion on the data according to a certain rule so that the area around the defective pellet becomes defective is created. From this data, the stage unit 15, the XY coordinate control unit 16, the mark unit The marking device 12 provided with a mark 13 marks a defective peripheral pellet on the wafer 14 based on a certain rule. Then, the wafer 6 is placed on the stage unit 7, and the pellets are sequentially measured by the connected IC inspection apparatus 2, and data is obtained which has obtained the measurement results corresponding to the wafer pellet coordinates (X, Y).

In FIG. 1, as an example, data such as a measurement result P for coordinates (B, e) on the wafer, a measurement result P for coordinates (C, c), and a measurement result 2 for coordinates (C, c) are shown. Are acquired in the order of measurement, and a data file 9 having contents such as 20, 21, and 22 in FIG. 3 is created.

The data file 9 describes the types of sorting results such as non-defective products and defective products with respect to the X and Y coordinates of the pellet. Next, when a defect 27 having a continuous defect distribution in a specific defect item occurs in the electrical characteristic test of the wafer, the defect item 2
Paying attention to the pellet coordinates (D, J) of No. 3, the pellet peripheral coordinates of the defective item + 1 (24 in FIG. 1) or the defective peripheral coordinates +
2 so that data file 9 (25 in FIG. 1) becomes defective.
Is converted. For this conversion, marking data is created using a program for automatically performing coordinate conversion for all the specified defective item pellets. The number of defects plus defect coordinates can be changed according to the degree of defect distribution.

Next, by marking this data file with the marking device 12, it is possible to uniformly mark the defect periphery regardless of the shape of the defect distribution as shown at 26 in FIG.

[0018]

According to the present invention, after a wafer electrical property test, when a defect distribution occurs in the wafer surface, a defective mark on a defective peripheral pellet of a specific defective measurement item is marked on the wafer, thereby mounting the package. This makes it possible to reduce the defective rate later.

[Brief description of the drawings]

FIG. 1 is a diagram of a wafer map by a semiconductor sorting device according to an embodiment of the present invention.

FIG. 2 is a diagram of a wafer map in which a defect mark is formed around a defective pellet by the semiconductor sorting device according to the embodiment of the present invention.

FIG. 3 is a table showing a data structure of marking data by the semiconductor sorting device according to the embodiment of the present invention.

FIG. 4 is a first schematic diagram of a semiconductor sorting device according to an embodiment of the present invention.

FIG. 5 is a second schematic diagram of the semiconductor sorting device according to the embodiment of the present invention.

FIG. 6 is a schematic diagram of a conventional semiconductor sorting device.

[Explanation of symbols]

1,28 Prober device 2,29 IC inspection device 3,30 Probe card 4,5,31,32 Contact 6,14,33 Wafer 7,15,35 Stage unit 8 XY coordinate control unit 9,17 Data file 10, 18 XY coordinate data 11 Measurement result data 12 Marking device 13 Marking unit 16 XY coordinate control unit, 19 Pellet measurement result data 20 Non-defective measurement result P 21 (C, c) Result of measurement of non-defective pellet P22 (C, d) Result of defective item of pellet 2 22 Result of defective pellet coordinate 24 Result of defective pellet around defective pellet (+1) 25 Result of defective pellet periphery (+2) Pellets with bad coordinates 26 Pellets marked around continuous defective pellets 27 Distribution of continuous defective pellets 34 Ink mark area

Claims (3)

[Claims] A first sorting result pellet and a first sorting result pellet peripheral portion based on the pellet sorting result data corresponding to the position coordinate data. 2. A semiconductor sorting device, wherein marking is performed on pellets obtained as a result of sorting. 2. A method according to claim 1, wherein the first and second pellets having a first sorting result in the form of an island are obtained from the position coordinate data of the pellets in the wafer and the sorting result data of the pellets corresponding to the position coordinate data. A semiconductor sorting apparatus, wherein the sorting result pellet is marked on a second sorting result pellet adjacent to the island-shaped pellet. 3. The method according to claim 1, wherein the position coordinate data of the pellets in the wafer and the pellet selection result data corresponding to the position coordinate data include a first selection result pellet and a first selection result pellet surrounded by the first selection result pellet. 2. A semiconductor sorting device, wherein marking is performed on pellets obtained as a result of sorting.