JPS62152138A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To automatically select nondefective or defective chips by simple processes and to send them to the following process by a method wherein chips are tested by a tester to discriminate whether they are good or bad, the test result is recorded in the memory as map data, the wafer is cut chip by chip after the test and the nondefective chips are selected corresponding to the map data. CONSTITUTION:An address to correspond to the prescribed X-Y coordinates is given to each chip 7 arranged on a wafer 3 and information on nondefective chips 8 and defectives 9 is recorded in a memory (d) as map data on the basis of the test result to be performed by a tester (c). The test ended wafer 3 is cut by a cutting unit in every chip 7. The nondefective chips 8 alone are selected by a pickup mechanism (f) for chip and are installed on a die-bonding substrate 11. The test result is sent from a wafer prober (b) through a communication circuit 10 as map data according to requested data from a die-bonding unit (die-bonder) 5. The selection of the nondefectives is performed using the test data.

Description

DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" This invention is directed to the use of ICs in each chip arranged in large numbers on a wafer.
The present invention relates to a method for manufacturing a semiconductor device that can automatically test the circuit operation of a semiconductor device and, based on the test results, distinguish between good and defective chips without marking defective chips among each chip.

[Prior Art] As is well known, a large number of TC chips are simultaneously formed on a silicon wafer, but generally a silicon wafer has a portion where crystals are broken, and chips containing this defective portion are defective. Therefore, the wafer after the IC forming process is usually
It is run through an automatic testing machine called a wafer prober, etc.
Tests are conducted to determine whether the ICs within each chip operate normally, and defective chips are marked.

The general structure of a wafer prober consists of a chuck that holds the wafer horizontally, and a chuck that holds the wafer horizontally.
an x-Y drive device for moving in the Y direction; a lifting device for moving the chuck up and down; It consists of a test head that collectively holds fine needles of Through this control, adjacent chips are sequentially scanned and whether they are good or bad is automatically determined.

As shown in Figure 2, according to the above test results,
A defective chip (F) is marked with an in-force or a laser marker (A). The silicon wafer (W) is then cut by a cutting device called a dicing saw.
It is identified by reading the information of good and bad written on each chip (C), and only good chips (P) are sent to the next process such as a die bonder. Finally, a tester performs a final inspection and the product is completed.

"Problems to be Solved by the Invention" In the marking process described above, the fact that the chip is defective has conventionally been written on the defective chip (F) using an input force or a laser marker (A). In that case, for example, in the case of input power, the following drawbacks have been pointed out.

i) Ink splashes onto the probe needle and other chips (C), resulting in defective chips.

ji) After the wafer is cut into chips, it is necessary to read the mark indicating a defective chip, which has to be done manually or by a reading device.

iii) In a type of wafer prober in which a plurality of probe needles are installed, the input force cannot be set.

iv) It is difficult to automate input input operations.

Therefore, it was difficult to speed up the line, which hindered mass production.

This invention was made to solve the above-mentioned problems in the manufacturing method of semiconductor devices, and its purpose is to simplify the process and to automatically sort out good and bad chips. An object of the present invention is to provide a method for manufacturing a semiconductor device that can be sent to the next process.

3.Means for Solving Problems 1. In other words, in the present invention, first, the XY coordinates of a base point chip (TEG chip, etc.) on a wafer are stored by an optical device installed on a stage base of a wafer blobber. Next, on the wafer prober, a tester tests the circuit operation of the TC in each chip arranged on the wafer through a test needle to determine whether the chip is good or bad. At the same time, predetermined coordinates are given to each chip, and information on whether the chips are good or bad is recorded in the storage device as map data based on the test results.

Thereafter, the tested wafer is cut into individual chips by a chip dicing process. In the next die bonding process, each chip is sorted according to the map data of the results from Nasu 1 above, and an automated pick-up mechanism selects only the chips whose test results are good, and then supplies them to the first process. do.

The automated pickup mechanism described above is controlled based on a predetermined control mechanism, and in this case, the selection of objects to be picked up is performed using the des1-results recorded as the map data. That is, an automated pickup mechanism is controlled based on predetermined XY coordinates given to each chip in correspondence with the XY coordinates of the base chip, and a pickup arm or the like is moved to the coordinates where the good chip 8 is located. It is sufficient to grasp a good chip 8 and set it on a predetermined substrate ll mounted on a die bonder.

At this time, the map data collected in the wafer probing process is sent to the die bonding process through a communication line. Since the communication data in this case is composed of the following data, it is accurately sent as data for the corresponding wafer.

Communication data: (1) Lot Nα (2) Product name (3) Wafer Nα (4) Map data (test results for XY coordinates and xy coordinates of base chip) Map data can be transferred separately using a floppy disk, magnetic cassette tape, etc. Handling may also be done manually.

"action" Next, the operation of the present invention will be explained.

As described above, since the defective chip is not marked, the defective chip can be repaired and reused.

Based on the test results with the wafer prober, information on good and bad wafers is recorded in the storage device as map data. By using this stored information, the automated pick-up mechanism can immediately select the wafer after cutting. Furthermore, whereas conventionally all good and defective chips were subjected to a reading device, in the present invention only good chips are sorted, so that sorting can be carried out efficiently.

"Example" The present invention will be explained in detail below based on examples.

FIG. 1 is a diagram for explaining the acquisition of map data in the wafer probe process in terms of the positional relationship on the stage.

The wafer 3 is attracted onto an XY stage, moves under an optical device 5 fixed to a stage base, detects the base chip 1 on the wafer 3, and recognizes its position. The data is preset and stored as XY coordinate data for the origin 6 of the XY coordinates. Next, the wafer 3 is moved under the test card needle, that is, to the position 2, and tested. At this time, the position of the chip 2 under test and the positional relationship of the optical device 5 are fixed, and the relative distance data is stored in advance. Therefore, the XY coordinates of the chip 2 under test with respect to the base chip 1 on the wafer 3 are recognized and stored.

In this way, each test result (bus, fail) for the XY coordinates of the chip 2 under test is stored for all chips. This data group is called map data.

FIG. 2 is a process diagram showing an embodiment of the method for manufacturing a semiconductor device according to the present invention.

In FIG. 2, 3 indicates a wafer to be tested, and map data for all chips 7 on wafer 3 are stored. That is, each chip 7 arranged on the wafer 3 is given an address corresponding to a predetermined xY coordinate, and based on the above test results, information on good chips 8 and defective chips 9 is stored as map data in a separately prepared storage device. to be recorded.

Thereafter, the wafer 3 that has been tested is sent to a cutting device such as a dicing saw, and is cut into chips 7 by chip. however,
It is sufficient that each chip is separable and maintained in its original arrangement.

Next, out of each chip 7, only good chips 8 are selected by an automated pick-up mechanism and placed on the substrate 1 of the die bonder.
1. To select the good chips 8 in the above pickup, the base chip 1 is detected by the optical device 5 installed on the die bonding stage, and only the good chips 8 are selected based on the X and Y coordinate data in the map data. Then, it is taken out by an automated pickup mechanism and set on the substrate 11.

The automated pick-up mechanism described in Section 2 is controlled based on a predetermined control mechanism, and at that time, the selection of objects to be picked up is performed using the test results recorded as the above-mentioned map data as described above. It is done.

The test results are sent as map data from the wafer probe process through the communication line IO in accordance with request data from the die bonding device. Furthermore, this map data can be used as appropriate by recording it on an external storage device such as a floppy disk and inputting it to a disk drive unit set in the dicing apparatus.

In the present invention, the wafer 3 cut into chips 7 by a dicing saw is held in its original arrangement in a state where each chip 7 can be separated. Therefore, since the test results recorded in the storage device are map data written in accordance with the arrangement, the automated pick-up mechanism allows smooth comparison with the arrangement of the wafer 3 itself.

Pick-up operations can be performed accurately and quickly.

"Effects of the Invention" As described above, in the semiconductor device manufacturing method of the present invention, the test results recorded as the map data as described above are used to select good chips 8 to be picked up and sent to the next process. Let's do it.

Therefore, compared to the conventional marking of defective chips to classify good and defective chips, the labor of marking and identifying the presence or absence of markings are no longer required, and semiconductors can be manufactured quickly through a very simple process. Ta.

Furthermore, since there is no marking on the chip, there is no problem such as contamination of the chip due to marking.

Furthermore, the automated pick-up mechanism is controlled using the test results recorded as map data as described above. Therefore, there is a process of testing the circuit operation of the IC in each chip, a process of cutting the tested wafer into individual chips, and a process of selecting only good chips from the cut chips, and then using an automated pick-up mechanism to select the next chip. It is possible to easily automate each step up to the process of sending the product to the die bonder.

In the above automated pickup mechanism used in the present invention, since the test results recorded in the storage device are map data written according to the arrangement,
It is easy to check the arrangement of the wafer itself, and it is very convenient in terms of pick-up operation.

[Brief explanation of drawings]

FIG. 1 is a plan view for explaining the acquisition of map data in the wafer probe process in terms of the positional relationship on the stage, FIG. 2 is a process diagram showing an embodiment of the semiconductor device manufacturing method of the present invention, and FIG. 1 is a process diagram showing an example of a conventional method for manufacturing a semiconductor device. 1... Base chip 2... Chip under test 3... Wafer 4... Stage origin 5
...Position of optical device 6...Origin of xy coordinates7.
...Chip 8...Good chip 9...
Defective chip 10... Communication line 11... Board

Claims (1)

[Claims] 1. On the wafer prober, a tester tests the circuit operation of the ICs in each chip arranged on the wafer through a test needle to determine whether the chips are good or bad, and converts the test results into map data. The wafer after the test is recorded in a storage device, the wafer that has been tested is cut into individual chips, each chip is sorted in correspondence with the map data of the test results, and then supplied to the next process by an automated pick-up mechanism. A method for manufacturing a semiconductor device, characterized in that: