JP2007096122A5 - - Google Patents
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- Publication number
- JP2007096122A5 JP2007096122A5 JP2005285483A JP2005285483A JP2007096122A5 JP 2007096122 A5 JP2007096122 A5 JP 2007096122A5 JP 2005285483 A JP2005285483 A JP 2005285483A JP 2005285483 A JP2005285483 A JP 2005285483A JP 2007096122 A5 JP2007096122 A5 JP 2007096122A5
- Authority
- JP
- Japan
- Prior art keywords
- mass
- ratio
- particle size
- average particle
- paste composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000002245 particle Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005285483A JP4959966B2 (ja) | 2005-09-29 | 2005-09-29 | 多層配線基板用層間接続ボンディングシート |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005285483A JP4959966B2 (ja) | 2005-09-29 | 2005-09-29 | 多層配線基板用層間接続ボンディングシート |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007096122A JP2007096122A (ja) | 2007-04-12 |
| JP2007096122A5 true JP2007096122A5 (cg-RX-API-DMAC10.html) | 2007-07-12 |
| JP4959966B2 JP4959966B2 (ja) | 2012-06-27 |
Family
ID=37981439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005285483A Expired - Fee Related JP4959966B2 (ja) | 2005-09-29 | 2005-09-29 | 多層配線基板用層間接続ボンディングシート |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4959966B2 (cg-RX-API-DMAC10.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4587974B2 (ja) * | 2006-02-21 | 2010-11-24 | 新日鐵化学株式会社 | 多層プリント配線板の製造方法 |
| JP6679082B1 (ja) * | 2019-04-16 | 2020-04-15 | 山下マテリアル株式会社 | フレキシブル配線板 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2608612B1 (fr) * | 1986-12-17 | 1989-03-31 | Rhone Poulenc Chimie | Polymeres a groupement imides a partir de bis-imides et d'alkenyloxyanilines |
| JPH03287680A (ja) * | 1990-04-03 | 1991-12-18 | Toagosei Chem Ind Co Ltd | 有機厚膜ペースト組成物 |
| EP0501587A1 (en) * | 1991-02-28 | 1992-09-02 | Shell Internationale Researchmaatschappij B.V. | Bisimide resin processing |
| JPH08302273A (ja) * | 1995-05-12 | 1996-11-19 | Toagosei Co Ltd | ワニスおよびその応用 |
| JP2000223836A (ja) * | 1999-01-28 | 2000-08-11 | Kyocera Corp | 多層配線基板およびその製造方法 |
| JP2000323804A (ja) * | 1999-05-07 | 2000-11-24 | Toagosei Co Ltd | プリント配線板用銅張り積層板 |
| JP4850356B2 (ja) * | 2000-10-23 | 2012-01-11 | イビデン株式会社 | 層間接続構造および製造方法 |
| JP2002280742A (ja) * | 2001-03-16 | 2002-09-27 | Hitachi Chem Co Ltd | 多層プリント配線板及びその製造法 |
| JP2003092467A (ja) * | 2001-09-19 | 2003-03-28 | Tatsuta Electric Wire & Cable Co Ltd | プリント配線基板およびその製法 |
| JP3922977B2 (ja) * | 2002-06-19 | 2007-05-30 | 三菱樹脂株式会社 | 半導体装置内蔵多層配線基板 |
| JP2005075866A (ja) * | 2003-08-29 | 2005-03-24 | Tomoegawa Paper Co Ltd | 半導体装置用接着シート |
| JP2005260012A (ja) * | 2004-03-12 | 2005-09-22 | Sony Chem Corp | 両面配線基板及び多層配線基板の製造方法 |
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2005
- 2005-09-29 JP JP2005285483A patent/JP4959966B2/ja not_active Expired - Fee Related