JP2007088333A - Method for manufacturing electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique by which air core coils can be reliably received in accommodation chambers of embossed tape without delay. <P>SOLUTION: Air nozzles 91 and 92 for blowing out air are arranged near the end of a multifeeder 81. The air nozzle 91 blows away a second air core coil 9d following the head air core coil 9 fixed to a stopper 81B to the lower stage of the multifeeder 81 by blowing of air and spaces the head air core coil 9 and the second air core coil 9d. In this way, a collet is prevented from adsorbing two air core coils by mistake. The air nozzle 92 blows away an air core coil 9e out of the air core coils 9 which is transferred in a standing position to the lower stage of the multifeeder 81 by blowing of air. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a technique for manufacturing an electronic device, and particularly to a technique effective when applied to the manufacture of a high-frequency power amplifier.

International Publication No. WO2002 / 052589 (Patent Document 1) discloses a bulk feeder that can stably supply an air-core coil in the air-core coil mounting process in manufacturing a high-frequency power amplifier.
International Publication No. WO2002 / 052589 Pamphlet

  Electronic devices such as RF (Radio Frequency) power modules are formed by mounting various electronic components such as semiconductor chips and passive components on a wiring board. In recent years, there has been an increasing demand for downsizing and thinning of such electronic devices. Passive components such as a resistor element, a capacitor element, and an inductor element can be reduced in size and thickness by making the element into a chip such as a chip resistor, a chip capacitor, and a chip inductor. However, since a chip inductor has a relatively small allowable current, it is preferable to use an air-core coil as an inductor element used in a circuit through which a large current flows. For this reason, various types of electronic components such as a semiconductor chip, a chip component as a passive component, and an air-core coil are used in the RF power module.

  The air core coil is a mounting machine that mounts an air core coil on a wiring board in a state of being stored in a paper tape (hereinafter referred to as an embossed tape) having a plurality of storage chambers each storing an air core coil. Set. The present inventors are examining a parts feeder that houses an air-core coil in the embossed tape. Among them, the present inventors have found the following problems. The problem will be described with reference to FIGS.

  FIG. 19 to FIG. 27 are diagrams for explaining each part of a main part of a bulk feeder which is a parts feeder examined by the present inventors. As shown in FIG. 19, the bulk feeder studied by the present inventors was taken in from a storage case 110 that accommodates an air-core coil, a hopper 111 provided at the bottom of the storage case 110, and the hopper 111. And a transport rail 113 for guiding the air core coil to the air core coil supply unit 112 at the tip.

  The storage case 110 has a thin box structure, and the inner bottom is an inclined body 114 that collects air-core coils from both sides toward the center. A hopper 111 that is arranged so as to penetrate the center of the inclined body 114 and takes out the air-core coils collected on the inner bottom portion of the inclined body 114 from the storage case 110 in a line is shown in FIG. A supply shaft 118 is formed of a guide 116 having a base recess 115 and a square pipe having a guide hole 117 that passes through the guide 116 and guides one air-core coil along the central axis. The guide 116 is configured to vibrate up and down so that the air-core coil enters the guide hole 117 from the upper end of the supply shaft 118. For example, it vibrates with an amplitude about three times the length of the air-core coil (1 stroke: 1st). Further, as shown in FIG. 21, the guide hole 117 has a rectangular cross section and is provided at the center of the supply shaft 118 having a circular cross section.

  When supplying the air-core coil 109 with such a bulk feeder, as shown in FIG. 20 and FIG. 21, some supply defects occur.

  One is a supply failure A (see FIGS. 20 and 21) that the cylindrical supply shaft 118 is thick and the air-core coil 109 gets on the upper end of the supply shaft 118 and does not enter the guide hole 117. is there.

  First, when the guide 116 is lowered, a gap 119 is generated between the inclined surface of the truncated cone recess 115 and the outer peripheral surface of the supply shaft 118, and the supply defect in which the air-core coil 109 is sandwiched in the gap 119. B (see FIG. 20).

  One is the supply failure C (see FIGS. 20 and 21) that is clogged by being caught in the horizontal direction in the middle of the guide hole 117 because the air-core coil 109 also varies in size.

  Further, as shown in FIG. 19, the bulk feeder transport rail 113 has a seam D in the middle, and the air core coil 109 is caught at the seam, which may cause a supply failure.

  The air-core coil supply unit 112 has a structure as shown in FIG. 22 and operates as shown in FIGS. That is, as shown in FIG. 22, on the front end side of the transport rail 113, the top surface side of the front end of the transport rail main body 125 is lowered by one step, and the slider 126 reciprocates along the transport direction of the air-core coil 109 in this lower portion. It is mounted in a movable state.

  A rail 127 provided with a guide hole 117 for guiding the air-core coil 109 extends to the stepped portion of the transport rail body 125. The transport rail body 125 has a stopper portion 128 that stops the front end of the air-core coil 109 that has moved into the guide hole 117 of the rail 127. The stopper portion 128 comes into contact with the upper side of the air-core coil 109, but its lower portion is a partially opened space. This forms a vacuum suction passage 130 </ b> A for vacuum suction of the air core coil 109 to contact the stopper portion 128.

  The left end surface of the slider 126 is in contact with the side surface of the stepped portion by the spring 129. The state where the left end surface of the slider 126 is in contact with the side surface of the stepped portion forms the positioning position of the air-core coil 9 of the stopper portion 128, that is, the positioning reference surface.

  A shutter 131 overlaps on the slider 126 and is movable with respect to the slider 126. The shutter 131 reciprocates along the transfer direction of the air core coil 109 and covers a distance portion slightly longer than the length of the leading air core coil 109 moving in the guide hole 117 of the rail 127. .

  Therefore, the rail 127 portion on the upper surface of the guide hole 117 is removed from the tip portion of the rail 127. A vacuum suction passage 130 </ b> B is formed between the shutter 131 and the slider 126. The shutter 131, the slider 126, and the transport rail body 125 are each provided with holes to form vacuum suction passages 130C, 130D, and 130E. When the slider 126 is moved to the left end and the shutter 131 covers the upper side of the guide hole 117, these three holes overlap, and the air core coil 109 is vacuum-sucked as shown in FIG. The coil 109 is brought into contact with the stopper portion 128. With this vacuum suction, the subsequent air-core coils 109 are also arranged in a line in the guide hole 117 as shown in FIG.

  As shown in FIG. 24, when the shutter 131 is opened to the right side, that is, away from the end of the guide hole 117, a slight length portion of the leading portion of the leading air core coil 109 and the leading portion of the second air core coil 109 is obtained. Will be exposed. Moreover, since the vacuum suction passage 130D is blocked by the shutter 131 by the opening operation at this time, the vacuum suction operation is stopped. The shutter 131 is moved, for example, about three times (3st) the length of the air-core coil 109. FIG. 25 is an enlarged cross-sectional view showing these relationships.

  Next, as shown in FIG. 26, the collet 132 moves and the leading air-core coil 109 is held by vacuum suction and carried to the embossed tape, and the air-core coil 109 is accommodated in the embossed tape. FIG. 27 is an enlarged view of the main part of FIG.

  In the bulk feeder having the above-described structure, the air-core coil 109 is entangled with each other due to variations in the shape of the tip of the air-core coil 109, and the air-core coil 109 is clogged in the guide hole 117. May cause problems. Further, since the dimensions of the guide hole 117 are fixed, it is necessary to prepare a bulk feeder having the guide holes 117 suitable for the dimensions of the air core coil 109 for the air core coils 109 having different dimensions. There are challenges.

  FIGS. 28 to 30 are diagrams for explaining a process of separating the air core coil 109 from the collet 132 using the shutter 133 and housing the air core coil 109 in the housing chamber 135 of the embossed tape 134. 29 and 30 show a cross-sectional view of the main part in a direction perpendicular to the paper surface of FIG. 28. FIG. 29 is a cross-sectional view of the main part in the process following FIG. 28, and FIG. It is principal part sectional drawing at the time of a process.

  When the collet 132 adsorbing the air core coil 109 reaches the accommodation chamber 135 (see FIG. 28), the shutter 133 is hooked on both ends of the air core coil 109 protruding from the tip of the collet 132 (see FIG. 29). The coil 109 is separated from the collet 132 by the operation of the shutter 133 and dropped into the accommodation chamber 135. However, when the air-core coil 109 is downsized, there is a problem that both ends of the air-core coil 109 do not protrude from the tip of the collet 132 and the shutter 133 cannot be hooked.

  In order to solve the problem in the case of using the shutter 133 as described above, the present inventors examined other means that do not use the shutter 133. FIG. 31 and FIG. 32 are main part sectional views for explaining other means.

  When the shutter 133 is not used, as shown in FIG. 31, the collet 132 on the storage chamber 135 is lowered and a predetermined amount of gap S1 (for example, about 0.1 mm) between the embossed tape 134 and the collet 132. The collet 132 is stopped from descending while the air core coil 109 is maintained, and a part of the air-core coil 109 adsorbed on the collet 132 is put into the storage chamber 135. The reason why the gap S1 is maintained between the embossed tape 134 and the collet 132 is to prevent the embossed tape 134 from being damaged by the contact between the embossed tape 134 and the collet 132. At this time, when the radius R1 or more of the cross section shown in FIG. 31 is included in the accommodation chamber 135 among the air core coils 109, the air core coil 109 is moved to the side wall of the accommodation chamber 135 by transferring the embossed tape 134. The embossed tape 134 continues to be transported and pulled away from the collet 132 and falls into the storage chamber 135. However, when the air-core coil 109 is downsized and the radius R1 or more does not enter the storage chamber 135, the air-core coil 109 adsorbed by the collet 132 is transferred to the collet 132, the embossed tape 134, and the embossed tape 134. Not only cannot be accommodated in the accommodation chamber 135 but also deformed if the air-core coil 109 is soft.

  Therefore, the present inventors correspond to a downsized air-core coil 109 by removing the tip portion of the collet 132 and making the collet 132 attract the air-core coil 109 shallowly as shown in FIG. The means were examined. As a result, the air-core coil 109 has a radius R1 or more entering the accommodation chamber 135, and is pulled away from the collet 132 and dropped into the accommodation chamber 135 by continuing to transfer the embossed tape 134. However, since the gap S1 is maintained between the embossed tape 134 and the collet 132, the vacuum suction by the collet 132 also acts on the other air-core coil 109 already accommodated in the other accommodating chamber 135. There is a problem that the stored air-core coil 109 jumps out of the storage chamber 135.

  One object of one typical invention disclosed in the present application is to provide a technique capable of securely and reliably accommodating an air-core coil in an embossed tape accommodating chamber.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

The method for manufacturing an electronic device according to the present invention includes the following steps:
(A) The component supply apparatus including: a component carrying-out unit; a vacuum suction unit; a first tape having a plurality of storage chambers; and a loading error detection cover that closes the opening of the storage chamber as necessary. A plurality of electronic components are arranged in a row in a component carry-out portion, and the plurality of electronic components are transferred along the arrangement direction by vibrating the component carry-out portion, and the leading electronic component is transferred to the component carry-out portion Transferring to the take-out position at
(B) blowing off the second electronic component continuous to the leading electronic component that has reached the first blowing position in the component unloading section, and separating the leading electronic component from the other electronic components;
(C) Under the condition that the leading electronic component is separated from the other electronic components, the leading electronic component is taken out from the take-out position by the vacuum suction means, and the leading electronic component is placed in the plurality of storage chambers. A step of arranging the first storage chamber in the first storage chamber,
(D) In the step (c), when the electronic component is already arranged in the second storage chamber adjacent to the first storage chamber among the plurality of storage chambers, the vacuum suction means Closing the opening of the second storage chamber with the loading error detection cover before placing the leading electronic component in the first storage chamber;
(E) repeating the steps (a) to (d),
(F) After the step (e), the step of transferring the first tape to a mounting device, taking out the electronic component from the storage chamber, and mounting the electronic component on a wiring board.

Further, other outlines disclosed in the present application will be briefly described as follows.
Item 1. A component unloading section; a vacuum suction means; a first tape having a plurality of storage chambers; and a loading error detection cover that closes the opening of the storage chamber as necessary. Manufacturing apparatus for storing electronic components in each of the plurality of storage chambers of the tape:
(A) The plurality of electronic components are supplied in a line to the component carrying-out portion, and the plurality of electronic components are transferred along the arrangement direction by vibrating the component carrying-out portion, so that the leading electronic component A step of transferring to a take-out position in the component carrying-out part,
(B) blowing off the second electronic component continuous to the leading electronic component that has reached the first blowing position in the component unloading section, and separating the leading electronic component from the other electronic components;
(C) Under the condition that the leading electronic component is separated from the other electronic components, the leading electronic component is taken out from the take-out position by the vacuum suction means, and the leading electronic component is placed in the plurality of storage chambers. A step of arranging the first storage chamber in the first storage chamber,
(D) In the step (c), when the electronic component is already arranged in the second storage chamber adjacent to the first storage chamber among the plurality of storage chambers, the vacuum suction means Closing the opening of the second storage chamber with the loading error detection cover before placing the leading electronic component in the first storage chamber;
(E) A step of repeating the steps (a) to (d).
Item 2. In the manufacturing apparatus according to Item 1,
The electronic component is an air-core coil in which a conductor wire whose surface is partially or entirely covered with an insulating film is spirally wound and both ends are electrodes.
Item 3. In the manufacturing apparatus according to Item 2,
The air-core coil is sized to fit within the suction surface of the vacuum suction means in a plane.
Item 4. In the manufacturing apparatus according to Item 2,
The component carry-out section can transfer a plurality of types of the air-core coils having different numbers of windings of the conductor wire.
Item 5. In the manufacturing apparatus according to Item 4,
The component supply device includes a plurality of vacuum suction means respectively corresponding to the number of turns of the plurality of types of air-core coils,
The vacuum suction means corresponding to the number of turns of the air-core coil supplied to the component carry-out section takes out the air-core coil from the take-out position.
Item 6. In the manufacturing apparatus according to Item 1,
Among the plurality of electronic components, those transferred in a first posture in which the vacuum suction means cannot be suctioned accurately are blown off at a second blow-off position in the component carry-out section.

  The effects obtained by one representative invention among the inventions disclosed in the present application will be briefly described as follows.

  That is, the air-core coil can be securely stored in the embossed tape storage chamber without stagnation.

  Before describing the present invention in detail, the meaning of terms in the present application will be described as follows.

  A parts feeder (component supply device) is a device that automatically aligns workpieces (electronic components in this application) and supplies them to an automatic machine, and is mainly composed of three elements: a vibration unit, a bowl, and a controller. . The vibration part is formed of, for example, an electromagnet and a leaf spring, and amplifies the force generated by turning on / off the electromagnet using the leaf spring to generate vibration. This vibration can be given directionality by adjusting the angle of the leaf spring, and the member (workpiece) thrown into the bowl is carried out in a certain direction. The amount of vibration varies depending on various factors such as the number of electromagnets, the shape and material of the leaf spring, the width of the electromagnet, and the width of the leaf spring. The bowl has a structure in which, for example, a spiral slide is provided on the inside of the pan. When a member is inserted into the bottom, the member moves the spiral slide upward from the bottom using the vibration generated in the vibration section. Go. The bowl includes a cylindrical type and a stepped type, and the cylindrical type has a spiral shape (dimension cylinder) with the same radius, and the radius increases as the stepped part becomes the upper part. (Mortar shape). Since the member that has just moved up the spiral slide by vibration is not aligned at this time, for example, a mechanism called an attachment is attached to take measures to align the member in a certain direction. The controller controls the vibration conditions of the parts feeder.

  An air-core coil is a coil in which a conductor wire is wound in a cylindrical shape and nothing is put in the cylinder, or the conductor wire is held by a nonmagnetic material such as bakelite. Mainly used for high frequency because of its high power resistance and low inductance.

  In the following embodiments, when it is necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments. However, unless otherwise specified, they are not irrelevant to each other. There are some or all of the modifications, details, supplementary explanations, and the like.

  Further, in the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), especially when clearly indicated and when clearly limited to a specific number in principle, etc. Except, it is not limited to the specific number, and may be more or less than the specific number.

  Further, in the following embodiments, the constituent elements (including element steps and the like) are not necessarily indispensable unless otherwise specified and apparently essential in principle. Needless to say. In addition, when referring to the constituent elements in the embodiments, etc., “consisting of A” and “consisting of A” do not exclude other elements unless specifically stated that only the elements are included. Needless to say.

  Similarly, in the following embodiments, when referring to the shapes, positional relationships, etc. of the components, etc., the shapes are substantially the same unless otherwise specified, or otherwise apparent in principle. And the like are included. The same applies to the above numerical values and ranges.

  Also, components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof is omitted.

  In the drawings used in the present embodiment, even a plan view may be partially hatched to make the drawings easy to see.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  The electronic device according to the present embodiment is, for example, a dual-band high-frequency power amplifier incorporated in a mobile phone in which two communication systems of a GSM (Global System for Mobile Communication) communication system and a DCS (Digital Cellular System) communication system are incorporated. Device.

  As shown in FIG. 1, the high-frequency power amplifying apparatus 1 of the present embodiment has a flat rectangular structure in appearance. The high-frequency power amplifying apparatus 1 includes a flat rectangular body structure package 7 including a module substrate (wiring substrate) 5 made of a ceramic wiring board and a cap 6 attached to be overlapped on one surface side (main surface side) of the module substrate 5. The structure is formed. The cap 6 is made of metal that plays an electromagnetic shielding effect, and is a molded product by pressing.

  FIG. 2 is a block diagram showing a circuit configuration of the high-frequency power amplifying apparatus 1 of the present embodiment. The high-frequency power amplifying apparatus 1 includes, as external electrode terminals, a GSM input terminal (PinGSM (1)), a control terminal (Vapc (2)), one power supply voltage terminal (Vdd1 (3)) of the power supply voltage Vdd, and a GSM output. Terminal (PoutGSM (4)), DCS output terminal (PoutDCS (5)), the other power supply voltage terminal (Vdd2 (6)) of the power supply voltage Vdd, communication band switching terminal (Vctl (7)), DCS input It has a terminal (PinDCS (8)) and a ground potential terminal (GND) (not shown). As shown in FIG. 1, the terminal array is aligned with the terminals (1), (2), (3), and (4) from the front left to the right of the module substrate 5, and the terminals are arranged from the rear right to the left. (5) to (8).

  Both DCS and GSM have a three-stage amplification system. The DCS amplification system is formed by amplification stages (amp1, amp2, amp3) indicated by 1st, 2nd and 3rd, and the GSM amplification system is formed by amplification stages (amp4, amp5, amp6) indicated by 1st, 2nd and 3rd. Each amplification stage is formed by a field effect transistor (FET) that is formed based on a silicon substrate (not shown).

  Under such a configuration, PinDCS (8) is electrically connected to amp1, and PoutDCS (5) is electrically connected to amp3. PinGSM (1) is electrically connected to amp4, and PoutGSM (4) is electrically connected to amp6.

  Vapc (2) is connected to the bias circuit 2, and amp1 to amp6 are controlled by a signal input to the Vapc (2).

  Vdd1 (3) is connected to amp1 via the microstrip line MS1, connected to amp5 via the microstrip line MS4, and connected to amp6 via the inductor L2. In order to stabilize the high frequency characteristics, a capacitor C1 having one end grounded to GND is connected to Vdd1 (3).

  Vdd2 (6) is connected to amp4 via the microstrip line MS3, is connected to amp2 via the microstrip line MS2, and is connected to amp3 via the inductor L1. In order to stabilize the high frequency characteristics, a capacitor C2 having one end connected to the ground potential (GND) is connected to Vdd2 (6) externally.

  In this way, two terminals (Vdd1 (3), Vdd2 (6)) are prepared for the power supply voltage, and one power supply voltage terminal is the first stage amplification stage of one amplification system and the second and third stages of the other amplification system. The power supply voltage is supplied to the amplification stage, and the other power supply voltage terminal supplies a power supply voltage to the first amplification stage of the other amplification system and the second and third amplification stages of the one amplification system. Therefore, the feedback of leakage signals from the subsequent amplification stage (especially the final amplification stage) to the first amplification stage through the power supply line can be suppressed, so that the oscillation margin can be improved.

  Further, the inductors L1 to L3 have an inductance of 8 nH and a DC resistance of 20 mΩ, and an air core having a much smaller DC resistance than a conventional chip inductor having an inductance of 8 nH and a DC resistance of 100 mΩ. It is formed of a coil.

  Vctl (7) is connected to the band selection circuit 3. The band selection circuit 3 includes three n-channel field effect transistors Q8, Q9, and Q10 that are grounded at the source, and one resistor R1. The gate terminals of the field effect transistor Q8 and the field effect transistor Q9 are connected to Vctl (7). The gate terminal of the field effect transistor Q10 is connected to the drain terminal of the field effect transistor Q9, and the drain terminal is connected to the output side of amp5 through the resistor R2. The drain terminal of the field effect transistor Q9 is connected to Vdd2 (6) via the resistor R1. The drain terminal of the field effect transistor Q8 is connected to the input side of amp3 via the inductor L3. Band switching is performed by a signal supplied to Vctl (7), and amplification for DCS communication or amplification for GSM communication is performed.

  FIG. 3 is a plan view showing each electronic component mounted on the surface of the module substrate 5 made of a low-temperature fired ceramic wiring board laminated with, for example, glass ceramics.

  As shown in FIG. 3, on the surface of the module substrate 5, four semiconductor chips 8a to 8d, three air-core coils 9a to 9c, and a number of chip resistors and chip capacitors that are not labeled are mounted. ing.

  Conductors are selectively formed not only on the front and back surfaces of the module substrate 5 but also inside. And the wiring 4 is formed of these conductors. A part of the wiring 4 serves as a mounting pad 4a for fixing the semiconductor chips 8a to 8d. For fixing electrodes for fixing chip-type electronic components such as a chip resistor and a chip capacitor and air core coils 9a to 9c. A wire bonding pad 4c or the like is formed which becomes the pad 4b or connects the other end of the wire 20 whose one end is connected to an electrode (not shown) of the semiconductor chips 8a to 8d. On the back surface of the module substrate 5, surface mount type electrodes are formed by the wiring 4, and the external electrode terminals (1) to (8) described above are formed. These external electrode terminals have an LGA (land grid array) structure.

  The semiconductor chips 8 a to 8 d are fixed to a recess bottom provided on the main surface of the module substrate 5. In addition, in a semiconductor chip that generates a large amount of heat during operation, a via hole is formed in the module substrate 5 therebelow, and the via hole is filled with the conductor so as to transfer heat to the back surface of the module substrate 5. It has become.

  In the semiconductor chips 8a to 8d, 1st and 2nd semiconductor amplifying elements for DCS are incorporated in the semiconductor chip 8a, and 3rd semiconductor amplifying elements for DCS are incorporated in the semiconductor chip 8b. The semiconductor chip 8c incorporates 1st and 2nd semiconductor amplification elements for GSM, and the semiconductor chip 8d incorporates a 3rd semiconductor amplification element for GSM.

  Inductors L1 to L3 in high-frequency power amplifying apparatus 1 of the present embodiment are formed of air-core coils 9a to 9c as shown in FIG.

  FIG. 4 shows an air-core coil 9a (9) mounted on the module substrate 5. The air-core coil 9 includes an inductor portion 22 whose surface is covered with an insulating film, and electrodes 23 that are not covered with insulating films at both ends. In the air-core coil 9, the inductor portion 22 has 6 turns and the electrode 23 has 2 turns. The air-core coil 9 is mounted by fixing its electrode 23 to the wiring 4 b of the module substrate 5 by a solder 24. Note that the air-core coil 9 of FIG. 5 is an example of mounting when the inductor portion 22 has 8 turns and the electrode 23 has 1 turn.

  For example, the air-core coil 9 has a structure in which a copper wire (conductor wire) having a diameter of about 0.08 mm whose surface is covered with an insulating film (for example, a polyethylene film) is spirally wound and has an outer diameter of 0. .42 mm, the number of windings is 5 to 8 turns, and the length is about 0.78 mm to 1.14 mm. The insulating film at both end portions of the copper wire is removed by a certain length before being wound in a spiral, and the portion of the lining formed by the removed portion becomes the external electrode 23. The portion of the winding line covered with the insulating film becomes the inductor portion 22. The weight of the air-core coil 9 is also extremely light as 0.319 mg to 0.479 mg. Since this coil is manufactured by winding a copper wire, its cost is lower than that of a chip inductor (for example, a chip inductor having a current capacity of about 2.1 A, an inductance of 8 nH, and a DC resistance of about 100 mΩ). Becomes as low as 1/7. In addition, the cost of a chip inductor having a small current capacity is about ½.

  Next, a mobile phone incorporating the high frequency power amplifying apparatus 1 of the present embodiment will be described. FIG. 6 is a block diagram showing a system configuration of a mobile phone in which the high-frequency power amplifying apparatus 1 of the present embodiment is incorporated.

  FIG. 6 is a block diagram showing a part of the dual-band wireless communication device, and shows a part from a high-frequency signal processing IC (RFlinear) 50 to an antenna 51. In FIG. 6, the amplification system of the high-frequency power amplification device is shown separately as an amplification system for GSM and an amplification system for DCS, and the amplifiers are shown as PA (power amplifiers) 58a and 58b. is there.

  The antenna 51 is connected to the antenna terminal Antenna of the antenna transmission / reception switcher 52. The antenna transmission / reception switching device 52 has terminals Pout1 and Pout2 for receiving outputs of the PAs 58a and 58b, reception terminals RX1 and RX2, and control terminals control1 and control2.

  The GSM signal from the high frequency signal processing IC 50 is sent to the PA 58a and output to Pout1. The output of the PA 58a is detected by the coupler 54a, and this detection signal is fed back to the automatic output control circuit (APC circuit) 53. The APC circuit 53 operates based on the detection signal to control the PA 58a.

  Similarly, the DCS signal from the high-frequency signal processing IC 50 is sent to the PA 58b and output to Pout2. The output of the PA 58b is detected by the coupler 54b, and this detection signal is fed back to the APC circuit 53. The APC circuit 53 operates based on the detection signal to control the PA 58b.

  The antenna transmission / reception switch 52 has a duplexer 55. This duplexer 55 has a plurality of terminals, one terminal is connected to the antenna terminal Antena, one of the other two terminals is connected to the GSM transmission / reception selector switch 56a, and the other is connected to the DCS transmission / reception. It is connected to the changeover switch 56b.

  The contact a of the transmission / reception selector switch 56a is connected to Pout1 through the filter 57a. The b contact of the transmission / reception changeover switch 56a is connected to the reception terminal RX1 via the capacitor C1. The transmission / reception change-over switch 56a is switched in electrical connection with the a-contact or the b-contact by a control signal input to the control terminal control1.

  The contact a of the transmission / reception changeover switch 56b is connected to Pout2 through the filter 57b. The b contact of the transmission / reception changeover switch 56b is connected to the reception terminal RX2 via the capacitor C2. The transmission / reception change-over switch 56b is switched in electrical connection with the a-contact or the b-contact by a control signal input to the control terminal control2.

  A filter 60a and a low noise amplifier (LNA) 61a are sequentially connected between the reception terminal RX1 and the high frequency signal processing IC 50. A filter 60b and a low noise amplifier (LNA) 61b are sequentially connected between the reception terminal RX2 and the high frequency signal processing IC 50.

  Such a wireless communication device enables GSM communication and DCS communication.

  Next, a technique for mounting the air-core coil 9 in the manufacture of the high-frequency power amplifying device 1 will be described.

  The air core coil 9 is mounted after mounting other electronic components such as a chip resistor and a chip capacitor whose mounting height is lower than that of the air core coil 9. This is because if the air-core coil 9 is first mounted, it may come into contact with the air-core coil 9 on which the collet is mounted when an electronic component lower than the mounting height of the air-core coil 9 is mounted. Due to this contact, for example, a crack is generated in the portion of the solder 24 that connects the electrode 23 of the air-core coil 9 and the electrode fixing pad 4b, or a split occurs. This is to prevent this from happening.

  7 to 9 are schematic views showing the mounting state of the air-core coil 9. After the air-core coil 9 is vacuum-sucked and held on the suction surface at the lower end of the collet 71, it is carried to the mounting position of the air-core coil on the module substrate 5 as shown in FIG. The suction surface of the collet 71 is a suction surface having an arcuate cross section so as to correspond to the outer periphery of the cylindrical air-core coil.

  Next, as shown in FIG. 8, the air core coil 9 is positioned on the module substrate 5 by positioning so that the pair of electrodes 23 of the air core coil 9 overlap with the pair of electrode fixing pads 4b of the module substrate 5, respectively. Placed on.

  Next, the solder 24 previously provided on the electrode fixing pad 4b is temporarily melted by reflow to fix the electrode 23 on the solder 24, and the mounting is completed as shown in FIG.

  By the way, the air core coil (electronic component) 9 is housed (taped) in an embossed tape having a plurality of housing chambers for housing the air core coils 9 one by one, and the opening of the housing chamber in which the air core coil 9 is housed is It is conveyed to the mounting machine including the collet 71 while being covered with the cover tape. Here, FIG. 10 is an explanatory view of a taping device (component supply device) that accommodates the air-core coil 9 in the embossed tape.

  The taping device shown in FIG. 10 includes a multi-feeder (part carry-out part) 81, a rotary head unit 83 including a plurality of collets 82, a plurality of electromagnetic valves 84, a plurality of sensors 85, a seal unit 86, a bar code display 87, and the like. Is formed. The embossed tape (first tape) 88 is supplied from the supply-side reel 89, and after the air-core coil 9 is inserted into the accommodation chamber, the cover tape is stuck to the opening of the accommodation chamber by the seal unit 86. The embossed tape 88 packed with the air-core coil 9 and attached with the cover tape is wound around the storage-side reel 90.

  The multi-feeder 81 is a parts feeder that supplies air core coils 9 while automatically aligning them by fine vibration. The leading one of the air-core coils 9 aligned by the multi-feeder 81 moves to the pickup position by the collet 82 and stops. The tip of the multi-feeder 81 where the air-core coil 9 is picked up by the collet 82 has a structure that can be appropriately replaced with a standard that matches the number of turns of the air-core coil 9.

  The plurality of collets 82 are vacuum suction collets that are used to pick up the air-core coil 9 having a predetermined number of turns from the multi-feeder 81. That is, the collet 82 corresponding to the number of turns of the air-core coil 9 supplied from the multi-feeder 81 moves to the pickup position on the multi-feeder 81 by the rotation of the rotary head unit 83, and the air-core coil 9 at the pickup position. Is to pick up. The vacuum suction and release by the plurality of collets 82 can be controlled by the operation of a plurality of electromagnetic valves 84 that individually correspond to each other. Further, by providing the taping device with the rotary head 83 having the plurality of collets 82, the taping operation of the air-core coil 9 having a plurality of types of windings can be performed by a single taping device.

  Each of the plurality of sensors 85 detects, for example, the positional deviation of the air core coil 9 that has reached the pickup position, the presence or absence of the cover tape, and the collet 82 even after the air core coil 9 is inserted into the embossed tape 88 storage chamber. Detection of the air-core coil 9 remaining on the suction surface, detection of a plurality of air-core coils 9 being inserted into the accommodation chamber of the embossed tape 88, and the like are performed.

  The bar code display 87 displays the product name, lot number, standard, etc. of the air-core coil 9 supplied by the multi-feeder 81.

  11 is a plan view of the main part of the multi-feeder 81 near the pickup position, and FIG. 12 is a cross-sectional view of the main part along the line AA in FIG.

  As shown in FIGS. 11 and 12, a stopper 81 </ b> B containing a vacuum suction nozzle 81 </ b> A is attached to the tip of the multi-feeder 81. The air-core coil 9 transferred by the fine vibration of the multi-feeder 81 comes into contact with the stopper 81B and stops. This stopped position is the aforementioned pickup position (extraction position). The stopped air-core coil 9 is fixed to the stopper 81B by vacuum suction by the vacuum suction nozzle 81A so that the collet 82 does not shift when the air-core coil 9 is vacuum-sucked. Further, when the air-core coil 9 is fixed to the stopper 81B, the laser sensor 136 detects the air-core coil 9, the collet 82 is lowered in a vacuum state, and the bottom dead center (the point where the collet 82 has been lowered). When entering, the vacuum of the vacuum suction nozzle 81A is turned off, and the collet 82 is reliably suctioned without contact.

  FIG. 13 is an explanatory diagram showing the operation of the multi-feeder 81 and the air-core coil 9 in the vicinity of the tip of the multi-feeder 81.

  Near the front end of the multi-feeder 81, air nozzles 91 and 92 for ejecting air are provided. 14 is a cross-sectional view of the main part of the tip of the multi-feeder 81 (stopper 81A) at the position where the vacuum suction nozzle 81A is provided, and FIG. 15 is the main part of the multi-feeder 81 at the position where the air nozzle 91 is provided. FIG. 16 is a fragmentary sectional view of the multi-feeder 81 at a position where the air nozzle 92 is provided.

  When the second air-core coil 9d following the head air-core coil 9 fixed to the stopper 81B reaches the front of the air nozzle 91 (first blowing position), the air nozzle 91 blows out the air to the multi-feeder 81. The collet 82 is prevented from adsorbing the two air-core coils 9 by blowing away to the lower stage and separating the first air-core coil 9 and the second air-core coil 9 from each other. Thereby, the collet 82 can surely pick up only one air-core coil 9 at an accurate position (pickup position). The air-core coils 9 blown off to the lower stage of the multi-feeder 81 by the air nozzle 91 are arranged again by the fine vibration of the multi-feeder 81 and transferred to the pickup position.

  When the air core coil 9e transferred in the standing state (first posture) of the air core coil 9 reaches the front of the air nozzle 92 (second blowing position), the air nozzle 92 ejects air. Is blown off to the lower stage of the multi-feeder 81. The air-core coil 9e transferred in such a standing state may not be vacuum-sucked by the collet 82, and may not be suctioned at an accurate position even if it can be vacuum-sucked. Therefore, such an air core coil 9e is previously removed by the air nozzle 92. Thereby, it is possible to accurately pick up the air-core coil 9 by the collet 82.

  By the way, in the bulk feeder that transfers the air-core coil using vacuum suction, there is a problem that the air-core coil is clogged in the passage where the air-core coil is transferred and the operating rate of the bulk feeder is lowered. On the other hand, according to the multi-feeder 81 of the present embodiment as described above, since the air-core coil 9 is transferred by fine vibration, a problem that the air-core coil 9 is clogged as occurs in the bulk feeder can be prevented. Thereby, the operation rate of the taping apparatus including the multi-feeder 81 can be improved.

  17 and 18 are explanatory views showing a process in which the collet 82 accommodates the air-core coil 98 in the accommodation chamber (first accommodation chamber) 88a of the embossed tape 88. FIG. 18 is perpendicular to FIG. A cross-section in the direction is shown.

  The collet 82 that has attracted the air-core coil 9 starts to descend when it reaches the accommodation chamber 88a of the embossed tape 88, and a predetermined amount of gap S1 (for example, about 0.1 mm) between the embossed tape 88 and the collet 82. The descent is stopped in a state where the pressure is maintained, and a part of the air-core coil 9 adsorbed by the collet 82 is put into the accommodating chamber 88a. The reason why the gap S1 is maintained between the embossed tape 88 and the collet 82 is to prevent the embossed tape 88 from being damaged by the contact between the embossed tape 88 and the collet 82. At this time, if the air-core coil 9 is downsized and a radius of the cross section R1 or more (for example, about 0.25 mm or more) is contained in the accommodation chamber 88a, the embossed tape 88 is transferred so that the air-core coil 9 is moved. By being caught on the side wall of the storage chamber 88a and continuing to transfer the embossed tape 88, it is pulled away from the collet 82 and falls into the storage chamber 88a. By applying such means, even if the air-core coil 9 is flat and smaller than the attracting surface of the collet 82, a means for peeling the air-core coil 8 from the collet 82 using another jig should be used. Therefore, the air-core coil 9 can be accommodated in the accommodating chamber 88a. However, when the air-core coil 9 is downsized and the radius R1 or more (for example, about 0.25 mm or more) does not enter the accommodating chamber 88a, the air-core coil 9 adsorbed by the collet 82 is transferred to the embossed tape 88. As a result, the collet 82 is sandwiched between the embossed tape 88 and cannot be accommodated in the accommodating chamber 88a, and the air core coil 9 may be deformed if it is soft. Therefore, in the present embodiment, the tip portion of the collet 82 is removed, and the collet 82 is adapted to attract the air-core coil 9 shallowly, thereby corresponding to the air-core coil 9 that is reduced in size. As a result, the air core coil 9 has a radius R1 or more (for example, about 0.25 mm or more) entering the accommodation chamber 88a, and the air core coil 9 is separated from the collet 82 by continuing the transfer of the embossed tape 88. It can be dropped into the chamber 88a.

  Further, since the gap S1 is maintained between the embossed tape 88 and the collet 82, the vacuum suction by the collet 82 is another space already accommodated in another adjacent storage chamber (second storage chamber) 88a. It also acts on the core coil 9 and jumps out due to the vacuum of the collet 82 in the process in which the embossed tape 88 is transferred from the first storage chamber to the second storage chamber. Therefore, in the taping device of the present embodiment, before the collet 82 inserts the air-core coil 9 into the storage chamber 88a, a cover jig 93 that covers the opening of another storage chamber 88a adjacent to the collet 82 is provided. . The cover jig 93 is formed of a movable cover that is detected in the case of a loading error, for example. When the cover jig 93 covers the opening of the other storage chamber 88a adjacent to the cover jig 93 in advance, the air core coil 9 already stored in the other storage chamber 88a jumps out of the storage chamber 88a. It becomes possible to prevent malfunctions. The air core coil 9 already accommodated other than the adjacent chamber is provided with a fixed cover up to the front of the seal unit 86 so as not to jump out due to vibration when the embossed tape 88 is transferred.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  For example, in the above-described embodiment, the case where the taping device accommodates the air-core coil in the embossed tape accommodating chamber has been described. However, even when the electronic component such as a semiconductor chip other than the air-core coil is accommodated in the embossed tape, the above-described embodiment is implemented. A taping device of the form can be used.

  The electronic device manufacturing method of the present invention can be applied, for example, in a manufacturing process of a high-frequency power device including an air-core coil as a component.

1 is a perspective view of a high-frequency power amplifier that is an electronic device according to an embodiment of the present invention. It is a block diagram which shows the circuit structure of the high frequency power amplifier which is an electronic device of one embodiment of this invention. It is a top view which shows each electronic component mounted in the module board which forms the high frequency power amplifier which is an electronic device of one embodiment of this invention, and the surface of the module board. It is a side view of an example of an air core coil which forms a high frequency power amplification device which is an electronic device of one embodiment of the present invention. It is a side view of an example of an air core coil which forms a high frequency power amplification device which is an electronic device of one embodiment of the present invention. 1 is a block diagram showing a system configuration of a mobile phone in which a high-frequency power amplifier that is an electronic device according to an embodiment of the present invention is incorporated. It is explanatory drawing which shows the mounting state of the air-core coil which forms the high frequency power amplifier which is an electronic device of one embodiment of this invention. It is explanatory drawing which shows the mounting state of the air-core coil which forms the high frequency power amplifier which is an electronic device of one embodiment of this invention. It is explanatory drawing which shows the mounting state of the air-core coil which forms the high frequency power amplifier which is an electronic device of one embodiment of this invention. It is explanatory drawing of the taping apparatus used in the manufacturing process of the electronic device of one embodiment of this invention. It is a principal part top view of the multi-feeder contained in the taping apparatus shown in FIG. It is principal part sectional drawing along the AA in FIG. It is explanatory drawing which shows the operation | movement of the air-core coil in the multi feeder shown in FIG. It is principal part sectional drawing of the multi-feeder shown in FIG. It is principal part sectional drawing of the multi-feeder shown in FIG. It is principal part sectional drawing of the multi-feeder shown in FIG. It is explanatory drawing which showed the process in which a collet inserts an air-core coil in the storage chamber of an embossed tape in the manufacturing process of the electronic device of one embodiment of this invention. It is explanatory drawing which showed the process in which a collet inserts an air-core coil in the storage chamber of an embossed tape in the manufacturing process of the electronic device of one embodiment of this invention. It is explanatory drawing which shows the principal part of the parts feeder which the present inventors examined. It is principal part sectional drawing of the parts feeder which the present inventors examined. It is principal part sectional drawing of the parts feeder which the present inventors examined. It is principal part sectional drawing of the parts feeder which the present inventors examined. It is sectional drawing which expands and shows the principal part of FIG. It is principal part sectional drawing of the parts feeder which the present inventors examined. It is sectional drawing which expands and shows the principal part of FIG. It is principal part sectional drawing of the parts feeder which the present inventors examined. It is sectional drawing which expands and shows the principal part of FIG. It is principal part sectional drawing of the parts feeder which the present inventors examined. It is principal part sectional drawing of the parts feeder which the present inventors examined. It is principal part sectional drawing of the parts feeder which the present inventors examined. It is principal part sectional drawing of the parts feeder which the present inventors examined. It is principal part sectional drawing of the parts feeder which the present inventors examined.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 High frequency power amplifier 2 Bias circuit 3 Band selection circuit 4 Wiring 4a Mounting pad 4b Electrode fixing pad 4c Wire bonding pad 5 Module board (wiring board)
6 Cap 7 Package 8a-8d Semiconductor chip 9, 9a-9e Air-core coil 20 Wire 22 Inductor part 23 Electrode 24 Solder 50 High frequency signal processing IC
51 antenna 52 antenna transmission / reception switch 53 automatic output control circuit (APC circuit)
54a, 54b Coupler 55 Duplexer 56a, 56b Transmission / reception selector switch 57a, 57b Filter 58a, 58b PA
60a, 60b Filters 61a, 61b Low noise amplifier 71 Collet 81 Multi-feeder (part carry-out part)
81A Vacuum suction nozzle 81B Stopper 82 Collet 83 Rotary head unit 84 Solenoid valve 85 Sensor 86 Seal unit 87 Barcode display 88 Embossed tape (first tape)
88a storage room (first storage room, second storage room)
89 Supply Side Reel 90 Storage Side Reel 91, 92 Air Nozzle 109 Air Core Coil 110 Storage Case 111 Hopper 112 Air Core Coil Supply Unit 113 Conveying Rail 114 Inclined Body 115 Frustum Cavity 116 Guide 117 Guide Hole 118 Supply Shaft 119 Clearance 125 Conveyance Rail body 126 Slider 127 Rail 128 Stopper portion 129 Spring 130A to 130E Vacuum suction passage 131 Shutter 132 Collet 133 Shutter 134 Embossed tape 135 Storage chamber 136 Laser sensor C1, C2 Capacitance L1, L2 Inductors MS1 to MS4 Microstrip line RX1, RX2 receiving terminal

Claims (10)

An electronic device manufacturing method including the following steps:
(A) The component supply apparatus including: a component carrying-out unit; a vacuum suction unit; a first tape having a plurality of storage chambers; and a loading error detection cover that closes the opening of the storage chamber as necessary. A plurality of electronic components are arranged in a row in a component carry-out portion, and the plurality of electronic components are transferred along the arrangement direction by vibrating the component carry-out portion, and the leading electronic component is transferred to the component carry-out portion Transferring to the take-out position at
(B) blowing off the second electronic component continuous to the leading electronic component that has reached the first blowing position in the component unloading section, and separating the leading electronic component from the other electronic components;
(C) Under the condition that the leading electronic component is separated from the other electronic components, the leading electronic component is taken out from the take-out position by the vacuum suction means, and the leading electronic component is placed in the plurality of storage chambers. A step of arranging the first storage chamber in the first storage chamber,
(D) In the step (c), when the electronic component is already arranged in the second storage chamber adjacent to the first storage chamber among the plurality of storage chambers, the vacuum suction means Closing the opening of the second storage chamber with the loading error detection cover before placing the leading electronic component in the first storage chamber;
(E) repeating the steps (a) to (d),
(F) After the step (e), the step of transferring the first tape to a mounting device, taking out the electronic component from the storage chamber, and mounting the electronic component on a wiring board. In the manufacturing method of the electronic device of Claim 1,
The electronic component is an air-core coil in which a conductor wire whose surface is partially or entirely covered with an insulating film is spirally wound and both ends are electrodes. In the manufacturing method of the electronic device of Claim 2,
The air-core coil is sized to fit within the suction surface of the vacuum suction means in a plane. In the manufacturing method of the electronic device of Claim 2,
The component carry-out section of the component supply device can transfer a plurality of types of the air-core coils having different numbers of windings of the conductor wire. In the manufacturing method of the electronic device of Claim 4,
The component supply device includes a plurality of vacuum suction means respectively corresponding to the number of turns of the plurality of types of air-core coils,
The vacuum suction means corresponding to the number of turns of the air-core coil supplied to the component carry-out section takes out the air-core coil from the take-out position. In the manufacturing method of the electronic device of Claim 1,
Among the plurality of electronic components, those transferred in a first posture in which the vacuum suction means cannot be suctioned accurately are blown off at a second blow-off position in the component carry-out section. In the manufacturing method of the electronic device of Claim 2,
A plurality of semiconductor chips including one or more of an active element and a passive element are mounted on the wiring board to form a high-frequency power amplifier having a plurality of amplification stages. In the manufacturing method of the electronic device of Claim 7,
The plurality of amplification stages have an input terminal, an output terminal, and a power supply voltage terminal, are connected in cascade between the input terminal and the output terminal, and are supplied with a power supply voltage from the power supply voltage terminal,
The air-core coil is connected in series between a final amplification stage of the plurality of amplification stages and the power supply voltage terminal. The method of manufacturing an electronic device according to claim 8.
The high-frequency power amplifying device has a plurality of amplification systems including the plurality of amplification stages,
In each of the plurality of amplification systems, the plurality of amplification stages are cascade-connected, and the air-core coil is connected in series between the final amplification stage of the plurality of amplification stages and the power supply voltage terminal. . In the manufacturing method of the electronic device of Claim 7,
The high-frequency power amplifying apparatus has two amplification systems including the plurality of amplification stages and two power supply voltage terminals,
In each of the two amplification systems, the plurality of amplification stages are cascade-connected,
One of the two power supply voltage terminals includes an initial amplification stage of the plurality of amplification stages included in one of the two amplification systems and the other of the two amplification systems. Electrically connected to a plurality of amplification stages;
The other of the two power supply voltage terminals is connected to the initial amplification stage of the plurality of amplification stages included in the other of the two amplification systems and the one of the two amplification systems. Electrically connected to the plurality of amplification stages included;
In each of the two amplification systems, the air-core coil is connected in series between the final amplification stage of the plurality of amplification stages and the power supply voltage terminal.

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