JP2007142095A - Manufacturing method for semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a collision with a collet for an attraction of an air-core coil in an attraction chamber in a bulk feeding section for a bulk feeder. <P>SOLUTION: The side wall 37a of the attraction chamber 37 for the bulk feeder rises at an angle larger than 90° to the side of the base 39, and an upper opening surface is widened. According to such a constitution; a nozzle made of a diamond for the collet 40a used for attracting the air-core coil 14d differs from a time when the side wall 37a of the attraction chamber 37 rises at 90° up to that time, and does not collide with the side wall 37a of the attraction chamber 37 made of a metal or a resin. Consequently, the imperfection of the attraction caused by the deformation of the side wall 37a and the imperfection of a supply can be prevented. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a technique for manufacturing a semiconductor device, and is particularly effective when applied to a bulk feeder used for supplying air core coil components.

  The technology described below has been studied by the present inventors in researching and completing the present invention, and the outline thereof is as follows.

  In a high frequency module used in an amplifying unit such as a mobile phone, an inductor is provided for adjusting circuit impedance. Among such inductors, the use of an air-core coil is particularly excellent in terms of high performance and low cost.

For example, Patent Document 1 discloses such an air-core coil. Further, Patent Document 2 discloses a semiconductor device using an air-core coil, a manufacturing method thereof, an air-core coil supply device configured in a bulk feeder, and the like.
JP 2002-170710 A International Publication Number WO2002 / 052589

  The present inventor has found that the apparatus used for supplying the air-core coil has the following problems.

  That is, when supplying the air-core coil, a device called a bulk feeder is used, a large number of air-core coils are aligned, and parts are supplied by being attracted by a collet one by one.

  However, there suddenly occurred a phenomenon in which the air-core coil was not attracted at all by the collet. Alternatively, in the bulk feeder, a plurality of air-core coils are sequentially supplied to the suction chamber to be sucked by the collet, but a phenomenon has occurred in which supply of the air-core coils to the suction chamber cannot be suddenly performed. As a result, the bulk feeder stopped one after another, causing a reduction in work efficiency.

  As a result of investigating the cause, it was found that the collet hits the wall of the adsorption chamber of the bulk feeder and the wall is deformed to cause the above-mentioned adsorption failure or supply failure. The walls of the adsorption chamber are made of metal or synthetic resin, while the collet is made of diamond and has a very different hardness. For this reason, it was confirmed that when the collet hits the wall of the adsorption chamber, the hit location is deformed and the above-mentioned adsorption failure or supply failure occurs.

  An object of the present invention is to appropriately correspond the component supply device side so that supply components can be reliably sucked in a component supply device such as a bulk feeder.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  That is, when the component provided by the component supply device is adsorbed by the adsorbing device, the opening of the entrance / exit through which the adsorbing device enters / exits is formed wider than the standby area of the adsorbing component.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  In the present invention, in a component supply device such as a bulk feeder, the entrance / exit of the suction device for the component waiting in the suction chamber is made wider than the standby location for the suction component, so that the suction component collides with the suction chamber. Lost. By comprising in this way, the adsorption failure by the deformation | transformation of an adsorption | suction chamber and the supply failure of components can be eliminated.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof may be omitted.

  In the present invention, when supplying an air-core coil with a bulk feeder, the disadvantage at the time of adsorption by a collet is solved. However, the present invention described below is not limited to the combination of the bulk feeder, the air-core coil, and the collet. The component supply device, the suction component, and the suction component having the same configuration at the time of component suction Of course, it can be applied to the device.

(Embodiment 1)
FIG. 1 is a cross-sectional view schematically showing the entire configuration of a semiconductor device manufactured by the method for manufacturing a semiconductor device of the present invention. 2A, 2B, and 2C are a side view, a cross-sectional view, and a front view schematically showing an air-core coil as an example of a component used in the present invention. FIG. 3 is an explanatory view schematically showing the overall configuration of a bulk feeder as a semiconductor manufacturing apparatus used in the method for manufacturing a semiconductor device of the present invention. 4A and 4B are partial cross-sectional views schematically showing the state of the bulk supply unit of the bulk feeder.

  As shown in FIG. 1, a semiconductor device 10 according to the present invention is configured in an RF (Radio Frequency) module 10a or the like. Such a semiconductor device 10 is manufactured as follows.

  For example, as shown in FIG. 1, a plurality of insulator plates (in this embodiment, five ceramic substrates 11a to 11e will be described as an example) are prepared, and a plurality of such ceramic substrates 11a to 11e are prepared. The via 12 is formed. The via 12 is filled with a conductive material such as copper (Cu) or silver.

  Next, a surface conductor pattern made of a conductive material such as copper or silver is printed on the surface of each of the ceramic substrates 11a to 11e. Thereafter, these five ceramic substrates 11a to 11e are sequentially laminated and fired at a temperature of, for example, about 800 to 900 ° C., thereby forming the laminated substrate 11 as shown in FIG.

  After cleaning the multilayer substrate 11 formed in this way, a conductive paste made of a conductive material, for example, copper or silver, is printed on the back surface of the multilayer substrate 11. Subsequently, the back surface conductor pattern is formed on the back surface of the multilayer substrate 11 by baking the conductor paste at a temperature of 150 ° C. or less, for example.

Further, as shown in FIG. 1, surface-mounted components such as a semiconductor chip 13 having active elements and a chip component 14 having passive elements are mounted on the component mounting surface of the multilayer substrate 11. Then, the RF module 10a is completed by covering these surface-mounted components with an insulating resin 15. The semiconductor chip 13 and the chip component 14 are mounted via solder 16.

  The semiconductor chip 13 is formed in a field effect transistor 13a such as a Si-MOSFET, for example. A plurality of pads (also referred to as bonding pads, electrodes, etc.) formed on the main surface of the semiconductor chip 13 and the corresponding surface conductor pattern formed on the component mounting surface of the multilayer substrate 11 are connected by a bonding material. ing. Here, wire bonding 17 made of, for example, gold (Au) wire 17a is used as the bonding material.

  The chip component 14 is configured as a passive element such as a capacitor 14a, a chip coil 14b, a resistor 14c, and an air core coil 14d. The connection terminals formed at both ends of the chip component 14 are connected to the surface conductor pattern formed on the component mounting surface of the multilayer substrate 11 via the solder 16.

  Here, for example, as shown in FIG. 2A, the air-core coil 14d has a configuration in which a wire is spirally wound a plurality of times and an insulating portion 21 and non-insulating portions 22 are formed on both sides thereof. Yes. As shown in FIG. 2B, the insulating portion 21 is configured such that the core wire 23 is covered with the insulating film 24, and the non-insulating portion 22 is not covered with the insulating film 24. FIG. 2C shows such a configuration as viewed from the front.

  In the air-core coil 14d configured as described above, the insulating portion 21 is used as an inductance portion, and the non-insulating portions 22 provided on both ends thereof are used as electrode portions. As the core wire 23, for example, a copper (Cu) wire or a conductive wire made of a Cu-based alloy material is used. For example, the insulating film 24 is formed of a resin made of a polyester material having excellent heat resistance and insulating properties.

  Since the air-core coil 14d having such a configuration is a taller component than the capacitor 14a or the like, the component is attached after a shorter component such as the capacitor 14a is attached.

  The air core coil 14d is attached using a semiconductor manufacturing apparatus 30 configured in a bulk feeder 30a as a component supply apparatus as shown in FIG.

  The bulk feeder 30a includes a bulk storage case 31 that stores a bulk configured in a cylindrical member such as a cylindrical member such as an air-core coil 14d. Further, a hopper 32 connected to the bulk storage case 31 and a transport rail 34 connected to the hopper 32 and guiding the air-core coil 14 d to the bulk supply section 33 at the tip are provided at the lower part of the bulk storage case 31.

  The bulk storage case 31 is formed in a box structure with a thin bottom skirt toward the center on the bottom side, and a large number of stored air-core coils 14d are collected at the center on the bottom side. The air-core coils 14d collected at the center on the bottom side are passed through a hopper 32 configured in a cylindrical shape having a passage cross-sectional area for the vertical direction of one air-core coil 14d, and are conveyed in a vertically aligned state. It is sent to the bulk supply unit 33 via the rail 34.

  Here, the longitudinal direction of the air-core coil 14d is a direction along the direction in which the core wire 23 is spirally wound, as shown in FIG.

  When the air-core coil 14d is transported, although not shown, the transport is performed by controlling vacuum suction from the bulk supply unit 33 side.

  The air-core coils 14d conveyed to the bulk supply unit 33 are sucked one by one by a suction device 40 configured in a collet 40a or the like, and configure, for example, the RF module 10a described above as shown in FIG. Then, it is transferred onto the laminated substrate 11 and fixed by soldering by reflow.

  More specifically, as shown in FIG. 4A, the transport rail 34 is configured by forming a guide hole 34a in the transport rail main body 34b so that, for example, the air-core coils 14d can pass in series. ing. The guide hole 34 a reaches the bulk supply unit 33. In this way, a plurality of air-core coils 14 d aligned in the vertical direction in the guide hole 34 a are continuously supplied so as to be connected to the bulk supply unit 33.

  In the transport rail body 34b, as shown in FIG. 4A, a recess 35 is formed on the bulk supply unit 33 side. Therefore, the guide hole 34a reaches the bulk supply unit 33 in the transport rail body 34b and ends at the concave portion 35.

  A slider 36 is incorporated in the recess 35 and is provided to be movable back and forth along the rail direction of the transport rail 34. A suction chamber 37 formed in a recess into which one air-core coil 14d can be dropped is provided on the side contacting the guide hole 34a on the upper left end side of the slider 36. The tip portion of the air-core coil 14 d dropped into the suction chamber 37 is brought into contact with a stopper portion 38 provided on the slider 36.

  On the other hand, the upper surface of the guide hole 34 a is opened slightly before reaching the recess 35 of the bulk supply unit 33. The opened upper surface portion is covered with a shutter 51 that moves back and forth along the rail direction of the transport rail 34 so as to be freely opened and closed. As shown in FIG. 4A, the shutter 51 is provided between the slider 36 having a frame structure via a spring 52, and the shutter 51 is urged by the spring 52 so that the shutter 51 is moved to the guide hole 34a. It is comprised so that the upper surface open | release part of can be covered.

  In the bulk supply unit 33 having such a configuration, as shown in FIG. 4B, the slider 36 and the shutter 51 move in the right direction on the paper surface, so that one air-core coil 14d is dropped. The upper part of the chamber 37 is opened. In accordance with such an open state, the air core coil 14d in the suction chamber 37 is sucked from above by the collet 40a so that the air core coil 14d can be transferred onto the laminated substrate 11 constituting the RF module 10a. It has become.

  Thus, the air-core coil 14d provided by the bulk feeder 30a is attracted and transferred by the collet 40a, and the air-core coil 14d is moved in the bulk feeder 30a based on a vacuum suction mechanism.

  As shown in FIG. 4A, a vacuum suction passage 60 a is provided below the stopper portion 38, and a vacuum suction passage 60 b is provided between the slider 36 and the shutter 51. Furthermore, each of the slider 36, the shutter 51, and the transport rail body 34b is provided with holes, which are configured as vacuum suction passages 60c, 60d, and 60e. Among these, the vacuum suction passage 60e is pipe-connected to a vacuum suction mechanism (not shown).

  Furthermore, a spherical body 61 that rolls in the concave portion 35 is provided in the concave portion 35 of the transport rail main body 34b. The shutter 51 includes a sphere control surface 62 that can contact the sphere 61.

  As shown in FIG. 4A, when the slider 36 and the shutter 51 are close to the guide hole 34a at the left end, the sphere 61 is pushed to the left by the sphere control surface 62 provided in the shutter 51. Become. The sphere 61 is removed from the hole of the vacuum suction passage 60d that has been closed up to that point. As a result, the vacuum suction passage 60d communicating with the vacuum suction passage 60e connected to the vacuum suction mechanism is in a vacuum suction state. In addition, the vacuum suction passage 60d is communicated with the vacuum suction passage 60a via the vacuum suction passages 60c and 60b, and the air-core coil 14d is vacuum-sucked.

  Thereafter, when the slider 36 and the shutter 51 are moved in the right direction on the paper surface, for example, as shown in FIG. 4B, the spherical body control surface 62 provided on the shutter 51 is also moved to the right side. In accordance with this, the sphere 61 is moved to the vacuum suction passage 60d side by the vacuum suction force, and the vacuum suction passage 60d is closed. In this way, the vacuum suction action on the air-core coil 14d is stopped, and the vacuum suction action is stopped and the collet 40a is attracted and transferred.

  When the air core coil 14d is attracted by the collet 40a, the opening corresponding to the entrance / exit of the collet 40a in the suction chamber 37 is configured wider than before. FIG. 5A shows the bulk supply unit 33 in an enlarged manner. FIG. 5B is a plan sectional view schematically showing the bulk supply unit 33, and the dotted line portion shows the adsorption chamber 37. FIG. 5C schematically shows a state in which the adsorption chamber 37 is cut by XX.

  As shown in FIG. 5C, in the suction chamber 37, the air-core coil 14d stands by at that position until the suction operation by the collet 40a is performed. That is, the adsorption chamber 37 is used as a standby place until the air-core coil 14d is adsorbed by the collet 40a.

  Incidentally, the collet 40a shown in the figure is formed in an arc shape in accordance with the air-core coil 14d to be adsorbed by the adsorbing portion. However, the present invention has nothing to do with the shape of the suction portion of the collet 40a, and it does not matter if it is not formed in an arc.

  The suction chamber 37 is open on the upper side so that the air core coil 14d can be sucked by the collet 40a. As described above, the upper opening is closed when the shutter 51 is moved to the left, but is opened when the slider 36 and the shutter 51 are moved in the right direction.

  When the air core coil 14d is attracted, the collet 40a reaches the upper part of the air core coil 14d and descends to some extent in accordance with the opening of the suction chamber 37. The air-core coil 14d is adsorbed by vacuuming in the lowered state.

  During this suction operation, the collet 40a causes a certain amount of error in the stop position in accordance with the stop accuracy of the rotary head that is the driving source. Moreover, the mounting accuracy of the bulk feeder also varies within a certain range. The balance between the stopping accuracy of the rotary head and the mounting accuracy of the bulk feeder causes the air core coil 14d of the collet 40a to swing within a certain range, and in some cases, contact with the suction chamber 37.

  Therefore, by expanding the place where the collet 40a enters and exits for the suction of the air core coil 14d from the standby place of the air core coil 14d as shown in FIG. The collision was prevented. By increasing the rising angle of the side wall 37a of the suction chamber 37 with respect to the bottom surface 39 side, for example, larger than 90 degrees, the rising angle of the entrance / exit 41 is larger than that in the case of the conventional rising angle of 90 degrees (indicated by a broken line). The opening can be widened.

  Therefore, the diamond nozzle of the collet 40a does not collide with the metal part such as aluminum constituting the adsorption chamber 37 or the side wall 37a of the resin part, and the adsorption failure due to deformation due to the collision of the part, or Supply failure has been resolved. Incidentally, the resin side wall 37a is configured as a cover.

  As shown in an enlarged view in FIG. 6A, the rising angle of the side wall 37a with respect to the bottom surface 39 side of the suction chamber 37 is basically larger than 90 degrees and smaller than 180 degrees. May be 100 degrees or more and 115 degrees or less. If the rising angle is within such a range, it is possible to provide sufficient clearance for the shake during the suction operation of the collet 40a in consideration of the bulk feeder mounting accuracy and the rotary head stop accuracy. A collision with the side wall 37a of the suction chamber 37 can be avoided.

  Up to now, as shown in an enlarged view in FIG. 6 (b), the rising angle of the side wall 37a of the suction chamber 37 has been configured to be 90 degrees, that is, vertical, so the bulk feeder mounting accuracy and the rotary head stopping accuracy are improved. It was not possible to provide sufficient clearance.

  Therefore, for example, as schematically shown in FIG. 7, the collet 40a collides with the metal side of the side wall 37a, and a failure that prevents the air-core coil 14d from being attracted occurs. Or the collet 40a collided with the resin-made side wall 37a, and the obstacle which cannot carry out the air-core coil 14d adsorb | sucked with the collet 40a in the state attracted | sucked from the adsorption chamber 37 safely generate | occur | produced.

  About this adsorption | suction mistake, the mode seen from the side was typically shown as sectional drawing in FIG. Or the failure which cannot supply the succeeding air-core coil 14d to the adsorption | suction chamber 37 anew occurred. The insufficiency of supplying the air-core coil 14d to the adsorption chamber 37 is schematically shown in FIG.

  However, by forming the entrance / exit 41 of the collet 40a widely as described above in consideration of the stopping accuracy of the collet 40a, as shown in FIGS. 10 (a) and 10 (b), after the entrance / exit 41 is changed. The collet 40a and the side wall 37a do not collide. For this reason, there was no deformation that caused an adsorption error (adsorption failure) or supply failure, and the failure was resolved.

  It was examined how much mistakes related to adsorption were reduced by actually changing the opening of the entrance / exit 41 widely. The results are shown in FIG. The total mistakes related to adsorption including adsorption mistakes were 0.64% before the change, but decreased to 0.48% after the change. This corresponds to a reduction of 0.16%.

  On the other hand, the adsorption error was reduced from 0.48% before the change to 0.32% after the change. The reduction effect is 0.16%. When both results are compared, it can be seen that the effect of reducing adsorption mistakes is directly reflected in the effect of reducing total errors. Although the ratio of adsorption mistakes has such a great influence that the ratio of total mistakes cannot be ignored, the countermeasure for widening the entrance / exit 41 of the collet 40a for reducing the adsorption mistakes is extremely simple, It was confirmed that it was effective.

(Embodiment 2)
In this embodiment, a modified example related to the present invention described in Embodiment 1 will be described.

  In the first embodiment, the side wall 37a is deformed due to the collision between the collet 40a and the adsorption chamber 37, and due to the deformation, the adsorption failure by the collet 40a or the supply failure of the air-core coil 14d occurs. For this reason, as shown in FIG. 6A, measures are taken to widen the portion corresponding to the entrance / exit 41 of the collet 40 a located above the adsorption chamber 37. In short, it is only necessary that the collet 40a and the adsorption chamber 37 are not in contact with each other when the collet 40a enters and exits the adsorption chamber 37 when the air-core coil 14d is adsorbed.

  Therefore, as a configuration for preventing the collet 40a and the adsorption chamber 37 from contacting each other, the configuration shown in FIG. 12A may be used in addition to the case described in the first embodiment. That is, in the configuration shown in FIG. 12A, the opening of the entrance / exit 41 is configured to be widened in a range where the collet 40 a enters and exits the adsorption chamber 37.

  At the place where the air core coil 14d is placed, the side wall 37a is raised in the same size as the suction chamber 37 as before, and the step portion 42 is formed from the middle of the air core coil 14d around where the collet 40a enters and exits. Thus, the upper frontage was formed large. This is a case of opening in a so-called reverse convex shape.

  In the configuration shown in FIG. 12B, the configuration of the stepped portion 42 shown in FIG. 12A is formed on an arc surface. This is a case where the so-called inverted flask type is opened. The configuration shown in FIG. 12 (c) is a case where the shape of the side wall 37a described in the first embodiment is changed to an arc shape and is configured as a so-called reverse semicircular shape.

  Actually, the shape shown in the first embodiment is preferable in terms of ease of processing, but the configuration described in the second embodiment is the same as the configuration described in the first embodiment. Has an effect.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  In the description of the above embodiment, for example, the case where the present invention is grasped by the semiconductor device manufacturing method has been described, but the present invention can also be grasped as a semiconductor manufacturing apparatus such as a bulk feeder. Furthermore, the present invention can also be understood as a semiconductor device manufactured by such a semiconductor manufacturing apparatus or a semiconductor device manufacturing method.

  In the above-described embodiment, the entrance / exit is formed wide enough to correspond to at least the length of the collet. However, depending on the part to be adsorbed, the collet may be only a part of the part length. However, even in such a case, it is necessary to form a wide entrance for the length of the collet.

  In the above-described embodiment, the case where the part feeder is configured as a bulk feeder has been described as an example. However, the present invention is provided with a suction chamber-like part having a part standby function similar to that of the bulk feeder, and the part. Of course, the present invention can be applied to any device having a structure in which an adsorbing device such as a collet enters and exits.

  In the above embodiment, the air core coil has been described as an example of the component supplied from the component supply device, but other components other than the air core coil may be used. For example, a cylindrical part different from the air-core coil or a non-cylindrical part may be used. In short, it is only necessary that the entrance / exit is wide so that collision between the adsorption chamber and the adsorption device can be prevented during adsorption by an adsorption device such as a collet.

  The present invention can be effectively used in the field of manufacturing semiconductor devices, particularly in the field of supplying parts using a bulk feeder.

It is sectional drawing which shows typically a mode at the time of comprising the semiconductor device concerning one embodiment of this invention in RF module. (A) is a side view of an air-core coil, (b) is the sectional view, (c) is a front view. It is explanatory drawing which shows typically the whole structure of the bulk feeder used by this invention. (A), (b) is sectional explanatory drawing which expands the bulk supply part of a bulk feeder partially, and shows the operation | movement. (A) is a side view which shows the bulk supply part of a bulk feeder partially, (b) is the plane sectional drawing, (c) is the situation which cut | disconnected the adsorption chamber by the XX line of (b) FIG. (A) is sectional drawing of the adsorption | suction chamber of the bulk supply part which concerns on this invention, (b) is sectional drawing of the adsorption | suction chamber of the conventional bulk supply part. It is explanatory drawing which showed typically the process of the failure generation | occurrence | production in the adsorption chamber in the conventional bulk feeder. It is sectional drawing which showed typically the generation | occurrence | production process of the adsorption | suction mistake in the conventional bulk feeder. It is sectional drawing which showed typically the generation | occurrence | production process of the supply failure in the conventional bulk feeder. (A), (b) is sectional explanatory drawing which shows the improvement condition after the change of the adsorption chamber which concerns on this invention. It is explanatory drawing which showed the effect of this invention in the graph format. (A), (b), (c) is a fragmentary sectional view of the adsorption | suction chamber which shows the modification of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Semiconductor device 10a RF module 11 Laminated substrate 11a Ceramic substrate 11b Ceramic substrate 11c Ceramic substrate 11d Ceramic substrate 11e Ceramic substrate 12 Via 13 Semiconductor chip 13a Field effect transistor 14 Chip component 14a Capacitor 14b Chip coil 14c Resistor 14d Air core coil 15 Resin 16 Solder 17 Wire bonding 17a Gold wire 21 Insulating part 22 Non-insulating part 23 Core wire 24 Insulating film 30 Semiconductor manufacturing apparatus 30a Bulk feeder 31 Bulk storage case 32 Hopper 33 Bulk supply part 34 Conveying rail 34a Guide hole 34b Conveying rail body 35 Concave part 36 Sliding Moving element 37 Adsorption chamber 37a Side wall 38 Stopper portion 39 Bottom surface 40 Adsorption device 40a Collet 41 Entrance / exit 42 Step 5 Shutter 52 spring 60a vacuum suction passage 60b vacuum suction passage 60c vacuum suction passage 60d vacuum suction passage 60e vacuum suction passage 61 sphere 62 sphere control surface

Claims (5)

A method of manufacturing a semiconductor device comprising a step of adsorbing a component in an adsorption chamber of a component supply device with an adsorption device,
An opening of the suction chamber through which the suction device enters and exits is formed wider than a standby place of the suction chamber where the component is waited until the component is sucked by the suction device. Production method. A method of manufacturing a semiconductor device comprising a step of adsorbing a component provided by a component supply device with an adsorption device,
The entrance / exit provided at a position above the standby location where the suction device enters and exits to adsorb the component is formed wider than the standby location where the component is allowed to stand by before the adsorption by the adsorption device. A method for manufacturing a semiconductor device. A method of manufacturing a semiconductor device comprising a step of adsorbing a component provided by a component supply device with an adsorption device,
A manufacturing method of a semiconductor device, wherein a surrounding wall is raised at an angle larger than 90 degrees with respect to a standby place where the part is on standby until the component is picked up by the suction device. A method for manufacturing a semiconductor device comprising a step of adsorbing a cylindrical part provided by a bulk feeder with an adsorption device,
The entrance / exit provided at a position above the standby location from which the suction device enters / exits in order to adsorb the cylindrical component from the standby location where the cylindrical component waits until the cylindrical device is adsorbed by the adsorption device. A method of manufacturing a semiconductor device, wherein the semiconductor device is widely formed. A method for manufacturing a semiconductor device comprising a step of adsorbing an air-core coil provided by a bulk feeder with a collet,
2. A method of manufacturing a semiconductor device according to claim 1, wherein an entrance through which the collet enters and exits in order to adsorb the air-core coil is formed wider than a standby place where the air-core coil is adsorbed by the collet.

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