JP2007080867A - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
JP2007080867A
JP2007080867A JP2005262929A JP2005262929A JP2007080867A JP 2007080867 A JP2007080867 A JP 2007080867A JP 2005262929 A JP2005262929 A JP 2005262929A JP 2005262929 A JP2005262929 A JP 2005262929A JP 2007080867 A JP2007080867 A JP 2007080867A
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main body
base member
led chip
light emitting
emitting device
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Yasutaka Arii
康孝 有井
Kenichiro Tanaka
健一郎 田中
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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Priority to JP2005262929A priority Critical patent/JP2007080867A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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Abstract

<P>PROBLEM TO BE SOLVED: To efficiently conduct heat generating from an LED chip to a main body from a base member and radiate it. <P>SOLUTION: Heat generating from an LED chip 2 is conducted to a base member 3 through a submount member 4, and it is conducted from the base member 3 to a main body 10 through an insulating layer 12 and it is radiated. In this case, a facing area between the base member 3 and the main body 10 via the insulating layer 12 becomes larger because of a recess 11 formed in the main body 10 and the projection 3a of the base member 3, so that heat generating from the LED chip 2 can be efficiently conducted from the base member 3 to the main body 10 and it can be radiated therefrom. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、ＬＥＤチップ（発光ダイオードチップ）を利用した発光装置に関するものである。   The present invention relates to a light emitting device using an LED chip (light emitting diode chip).

従来、ＬＥＤチップとＬＥＤチップから放射された光によって励起されてＬＥＤチップとは異なる発光色の光を放射する波長変換材料としての蛍光体（蛍光顔料、蛍光染料など）とを組み合わせてＬＥＤチップの発光色とは異なる色合いの光を発する発光装置の研究が各所で行われている。この種の発光装置としては、例えば、青色光あるいは紫外光を放射するＬＥＤチップと蛍光体とを組み合わせて白色の光（白色光の発光スペクトル）を得る白色発光装置（一般的に白色ＬＥＤと呼ばれている）の商品化がなされている。   Conventionally, an LED chip is combined with a fluorescent substance (fluorescent pigment, fluorescent dye, etc.) as a wavelength conversion material that emits light of a light emission color different from that of the LED chip when excited by light emitted from the LED chip. Research on light-emitting devices that emit light of a color different from the emission color has been conducted in various places. As this type of light-emitting device, for example, a white light-emitting device (generally called a white LED) that obtains white light (white light emission spectrum) by combining an LED chip that emits blue light or ultraviolet light and a phosphor. Has been commercialized.

また、かかる発光装置では、光出力の高出力化のために入力電力を大きくする必要があるが、そのためにはＬＥＤチップのジャンクション温度の上昇を抑制しなければならない。そこで従来は、熱の良導体である金属製の本体表面にシート状の絶縁層を介して金属製のベース部材を設け、このベース部材の上にＬＥＤチップを搭載することによって、ＬＥＤチップで発生した熱をベース部材から絶縁層を介して本体に放熱する構造が提案されていた（例えば、特許文献１参照）。
特開２００３−１６８８２９号公報 Further, in such a light emitting device, it is necessary to increase the input power in order to increase the light output. For this purpose, it is necessary to suppress an increase in the junction temperature of the LED chip. Therefore, conventionally, a metal base member is provided on the surface of a metal main body, which is a good heat conductor, via a sheet-like insulating layer, and the LED chip is mounted on the base member, thereby generating the LED chip. A structure has been proposed in which heat is radiated from a base member to a main body through an insulating layer (see, for example, Patent Document 1).
JP 2003-168829 A

しかしながら、上記特許文献１に開示されている放熱構造においては、ベース部材の平坦な底面が絶縁層を介して本体に接触しており、ベース部材と本体との絶縁層を介した対向面積が狭いために効率よく熱を伝導することができなかった。   However, in the heat dissipation structure disclosed in Patent Document 1, the flat bottom surface of the base member is in contact with the main body through the insulating layer, and the facing area between the base member and the main body through the insulating layer is small. Therefore, heat could not be conducted efficiently.

本発明は上記事情に鑑みて為されたものであり、その目的は、ＬＥＤチップで発生した熱をベース部材から本体へ効率よく伝導して放熱させることができる発光装置を提供することにある。   The present invention has been made in view of the above circumstances, and an object thereof is to provide a light-emitting device that can efficiently conduct and dissipate heat generated in an LED chip from a base member to a main body.

請求項１の発明は、上記目的を達成するために、熱の良導体からなる本体と、本体表面に電気的な絶縁層を介して搭載される発光ダイオードとを備え、発光ダイオードは、ＬＥＤチップと、ＬＥＤチップが発する熱を絶縁層を介して本体に伝導する金属製のベース部材とを具備し、本体に凹部が設けられるとともに該凹部と嵌合する凸部がベース部材に設けられたことを特徴とする。   In order to achieve the above object, the invention of claim 1 includes a main body made of a good thermal conductor, and a light emitting diode mounted on the surface of the main body via an electrical insulating layer. A metal base member that conducts heat generated by the LED chip to the main body through the insulating layer, and the main body has a concave portion and a convex portion that fits into the concave portion. Features.

請求項２の発明は、上記目的を達成するために、請求項１の発光装置において、凹部に代えて本体に貫通孔が設けられるとともに、ベース部材に設けられる凸部が貫通孔に嵌合し且つ凸部の先端に放熱フィンが設けられたことを特徴とする。   In order to achieve the above object, according to a second aspect of the present invention, in the light emitting device of the first aspect, a through hole is provided in the main body instead of the concave portion, and a convex portion provided in the base member is fitted into the through hole. And the heat-radiation fin was provided in the front-end | tip of the convex part, It is characterized by the above-mentioned.

請求項３の発明は、請求項１又は２の発明において、本体の凹部又は貫通孔の周面が凹凸形状に形成されるとともに該凹凸形状の周面と嵌合する凹凸形状が凸部の周面に形成されたことを特徴とする。   According to a third aspect of the present invention, in the first or second aspect of the invention, the concave surface of the main body or the peripheral surface of the through-hole is formed in a concave-convex shape, and the concave-convex shape fitted to the peripheral surface of the concave-convex shape is the circumference of the convex portion. It is formed on a surface.

本発明によれば、本体に凹部又は貫通孔を設けるとともに凹部又は貫通孔に嵌合する凸部をベース部材に設けることでベース部材と本体との絶縁層を介した対向面積が広くなるので、ＬＥＤチップで発生した熱をベース部材から本体へ効率よく伝導して放熱させることができるという効果がある。   According to the present invention, the opposing area through the insulating layer between the base member and the main body is widened by providing the base member with the concave portion or the through hole in the main body and providing the convex portion that fits into the concave portion or the through hole. There is an effect that heat generated in the LED chip can be efficiently conducted from the base member to the main body to be dissipated.

（実施形態１）
本実施形態の発光装置は、図１に示すように熱の良導体からなる本体１０と、本体１０表面に電気的な絶縁層１２を介して搭載される発光ダイオード１とを備える。 (Embodiment 1)
As shown in FIG. 1, the light-emitting device of the present embodiment includes a main body 10 made of a good heat conductor and a light-emitting diode 1 mounted on the surface of the main body 10 via an electrical insulating layer 12.

本体１０は熱伝導率が高い金属（例えば、アルミや銅など）製の板材からなり、表面には球面形状の凹部１１が設けられている。本体１０表面の凹部１１とその周囲にグリーンシートからなる絶縁層１２を介して発光ダイオード１が実装される。但し、絶縁層１２はグリーンシートのようなシート状に形成したセラミックスの未焼結体に限らず、例えば、熱伝導性のよい熱硬化性の固着材（シリコーン樹脂など）を用いてもよい。   The main body 10 is made of a plate material made of a metal (for example, aluminum or copper) having a high thermal conductivity, and a spherical recess 11 is provided on the surface. The light emitting diode 1 is mounted via a recess 11 on the surface of the main body 10 and an insulating layer 12 made of a green sheet around it. However, the insulating layer 12 is not limited to an unsintered ceramic body formed in the form of a sheet such as a green sheet. For example, a thermosetting fixing material (silicone resin or the like) having good thermal conductivity may be used.

発光ダイオード１は、ＬＥＤチップ２と、ＬＥＤチップ２が発する熱を絶縁層１２を介して本体に伝導する金属製のベース部材３とを具備する。ＬＥＤチップ２は、青色光を放射するＧａＮ系青色ＬＥＤチップであり、サファイア基板からなる結晶成長用基板の主表面側にＧａＮ系化合物半導体材料により形成されて、例えばダブルへテロ構造を有する積層構造部からなる発光部がエピタキシャル成長法（例えば、ＭＯＶＰＥ法など）により成長させてある。   The light emitting diode 1 includes an LED chip 2 and a metal base member 3 that conducts heat generated by the LED chip 2 to the main body through the insulating layer 12. The LED chip 2 is a GaN-based blue LED chip that emits blue light, and is formed of a GaN-based compound semiconductor material on the main surface side of a crystal growth substrate made of a sapphire substrate, for example, a laminated structure having a double hetero structure A light-emitting portion composed of a portion is grown by an epitaxial growth method (for example, MOVPE method).

また、ＬＥＤチップ２は、ＬＥＤチップ２のチップサイズよりも大きなサイズの矩形板状に形成されたサブマウント部材４を介してベース部材３上に搭載されており、図示しないアノード電極並びにカソード電極がそれぞれボンディングワイヤ５を介してベース部材３上に形成されている導体パターン６，６と電気的に接続されている。ここで、サブマウント部材４は、熱伝導率が比較的に高く且つ絶縁性を有する材料（例えば、ＡｌＮや複合ＳｉＣなど）によって形成されている。なお、ＬＥＤチップ２とサブマウント部材４とは、ＡｕＳｎ、ＳｎＡｇＣｕなどの鉛フリー半田を用いて接合されている。   The LED chip 2 is mounted on the base member 3 via a submount member 4 formed in a rectangular plate shape larger than the chip size of the LED chip 2, and an anode electrode and a cathode electrode (not shown) are provided. Each is electrically connected to the conductor patterns 6 and 6 formed on the base member 3 through the bonding wires 5. Here, the submount member 4 is formed of a material having a relatively high thermal conductivity and an insulating property (for example, AlN, composite SiC, or the like). The LED chip 2 and the submount member 4 are bonded using lead-free solder such as AuSn or SnAgCu.

そして、ベース部材３上にはＬＥＤチップ２から放射される光を反射する反射部材（リフレクタ）７が搭載され、リフレクタ７の出射口が色変換部材８によって閉塞されている。色変換部材８は、シリコーン樹脂のような透明材料とＬＥＤチップ２から放射される青色光によって励起されてブロードな黄色系の光を放射する粒子状の黄色蛍光体からなる蛍光材料とを混合した混合物の成形品によって平板状に構成されている。したがって、ＬＥＤチップ２から放射された青色光と黄色蛍光体から放射された光との混色光が色変換部材８から出射されることとなり、白色光を得ることができる。   A reflective member (reflector) 7 that reflects light emitted from the LED chip 2 is mounted on the base member 3, and the exit of the reflector 7 is closed by the color conversion member 8. The color conversion member 8 is a mixture of a transparent material such as a silicone resin and a fluorescent material made of particulate yellow phosphor that is excited by blue light emitted from the LED chip 2 and emits broad yellow light. It is comprised in flat form by the molded article of the mixture. Therefore, mixed color light of the blue light emitted from the LED chip 2 and the light emitted from the yellow phosphor is emitted from the color conversion member 8, and white light can be obtained.

ベース部材３は、熱の良導体（例えば、アルミや銅などの金属）によって構成され、本体１０の凹部１１と嵌合する半球状の凸部３ａが中央から突出する矩形平板状に形成され、絶縁層１２を介して本体１０表面に結合される。   The base member 3 is made of a good heat conductor (for example, a metal such as aluminum or copper) and is formed in a rectangular flat plate shape in which a hemispherical convex portion 3a that fits into the concave portion 11 of the main body 10 protrudes from the center. It is bonded to the surface of the body 10 via the layer 12.

而して、ＬＥＤチップ２で発生した熱がサブマウント部材４を介してベース部材３に伝わり、さらにベース部材３から絶縁層１２を介して本体１０に伝導して放熱されるのである。このとき、本体１０に設けた凹部１１とベース部材３に設けた凸部３ａとによってベース部材３と本体１０との絶縁層１２を介した対向面積が広くなるので、ＬＥＤチップ２で発生した熱をベース部材３から本体１０へ効率よく伝導して放熱させることができる。その結果、ＬＥＤチップ２のジャンクション温度の上昇を抑制して入力電力を大きくすることによって光出力の高出力化が図れる。   Thus, the heat generated in the LED chip 2 is transmitted to the base member 3 through the submount member 4, and further conducted from the base member 3 to the main body 10 through the insulating layer 12 to be radiated. At this time, since the opposing area of the base member 3 and the main body 10 through the insulating layer 12 is widened by the concave portion 11 provided in the main body 10 and the convex portion 3a provided in the base member 3, the heat generated in the LED chip 2 is increased. Can be efficiently conducted from the base member 3 to the main body 10 to dissipate heat. As a result, it is possible to increase the light output by suppressing the increase in the junction temperature of the LED chip 2 and increasing the input power.

（実施形態２）
本実施形態の発光装置は、図２に示すように凹部１１に代えて本体１０に貫通孔１３が設けられるとともに、ベース部材３に設けられる凸部３ａが貫通孔１３に嵌合し且つ凸部３ａの先端に放熱フィン３ｂが設けられた点に特徴がある。但し、その他の構成は実施形態１と共通であるから、共通の構成要素には同一の符号を付して説明を省略する。 (Embodiment 2)
In the light emitting device according to the present embodiment, as shown in FIG. 2, a through hole 13 is provided in the main body 10 instead of the concave portion 11, and the convex portion 3 a provided in the base member 3 is fitted into the through hole 13 and the convex portion. It is characterized in that a radiation fin 3b is provided at the tip of 3a. However, since other configurations are the same as those in the first embodiment, common components are denoted by the same reference numerals and description thereof is omitted.

貫通孔１３並びに凸部３ａは、円錐台形状若しくは角錐台形状に形成され、貫通孔１３に凸部３ａを挿通した状態で絶縁層１２を介して両者が嵌合している。また、凸部３ａの先端面には複数の放熱フィン３ｂが設けられている。   The through-hole 13 and the convex portion 3a are formed in a truncated cone shape or a truncated pyramid shape, and both are fitted through the insulating layer 12 with the convex portion 3a being inserted into the through-hole 13. A plurality of heat radiating fins 3b are provided on the tip surface of the convex portion 3a.

而して、本体１０に設けた貫通孔１３にベース部材３の凸部３ａを貫通させるとともに凸部３ａの先端に放熱フィン３ｂが設けられているので、実施形態１に比較してさらに効率よくＬＥＤチップ２の熱を放熱することができる。なお、図３に示すように本体１０の貫通孔１３の周面を凹凸形状に形成するとともに該凹凸形状の周面と嵌合する凹凸形状を凸部３ａの周面に形成しても同様に放熱の効率が向上できる。また、このような凹凸形状は実施形態１の凹部１１に設けてもよいし、凹凸形状と放熱フィン３ｂの双方を設けても構わない。   Thus, since the projection 3a of the base member 3 is passed through the through hole 13 provided in the main body 10 and the radiating fin 3b is provided at the tip of the projection 3a, it is more efficient than the first embodiment. The heat of the LED chip 2 can be dissipated. In addition, as shown in FIG. 3, even if the peripheral surface of the through-hole 13 of the main body 10 is formed in a concavo-convex shape and the concavo-convex shape that fits the peripheral surface of the concavo-convex shape is formed in the peripheral surface of the convex portion 3a, The efficiency of heat dissipation can be improved. Moreover, such uneven | corrugated shape may be provided in the recessed part 11 of Embodiment 1, and you may provide both an uneven | corrugated shape and the radiation fin 3b.

本発明の実施形態１を示す断面図である。It is sectional drawing which shows Embodiment 1 of this invention. 本発明の実施形態２を示す断面図である。It is sectional drawing which shows Embodiment 2 of this invention. 同上の他の構成を示す断面図である。It is sectional drawing which shows the other structure same as the above.

符号の説明Explanation of symbols

１ 発光ダイオード
２ ＬＥＤチップ
３ ベース部材
３ａ 凸部
１０ 本体
１１ 凹部
１２ 絶縁層 DESCRIPTION OF SYMBOLS 1 Light emitting diode 2 LED chip 3 Base member 3a Convex part 10 Main body 11 Concave part 12 Insulating layer

Claims (3)

熱の良導体からなる本体と、本体表面に電気的な絶縁層を介して搭載される発光ダイオードとを備え、発光ダイオードは、ＬＥＤチップと、ＬＥＤチップが発する熱を絶縁層を介して本体に伝導する金属製のベース部材とを具備し、本体に凹部が設けられるとともに該凹部と嵌合する凸部がベース部材に設けられたことを特徴とする発光装置。   It has a main body made of a good heat conductor and a light emitting diode mounted on the surface of the main body through an electrical insulating layer. The light emitting diode conducts the LED chip and heat generated by the LED chip to the main body through the insulating layer. A light emitting device comprising: a base member made of metal, wherein a concave portion is provided in the main body, and a convex portion fitted to the concave portion is provided on the base member. 請求項１の発光装置において、凹部に代えて本体に貫通孔が設けられるとともに、ベース部材に設けられる凸部が貫通孔に嵌合し且つ凸部の先端に放熱フィンが設けられたことを特徴とする発光装置。   2. The light emitting device according to claim 1, wherein a through hole is provided in the main body instead of the concave portion, a convex portion provided in the base member is fitted into the through hole, and a heat radiation fin is provided at a tip of the convex portion. A light emitting device. 本体の凹部又は貫通孔の周面が凹凸形状に形成されるとともに該凹凸形状の周面と嵌合する凹凸形状が凸部の周面に形成されたことを特徴とする請求項１又は２記載の発光装置。   The peripheral surface of the concave portion or the through hole of the main body is formed in an uneven shape, and the uneven shape that fits the peripheral surface of the uneven shape is formed in the peripheral surface of the convex portion. Light-emitting device.
JP2005262929A 2005-09-09 2005-09-09 Light emitting device Pending JP2007080867A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011045968A1 (en) * 2009-10-15 2011-04-21 浜松ホトニクス株式会社 Led light source device
JP2011146611A (en) * 2010-01-18 2011-07-28 Stanley Electric Co Ltd Light-emitting element package, and linear light-emitting device and planar light-emitting device each using the same
KR101346801B1 (en) 2012-06-26 2014-01-03 서울반도체 주식회사 Light emitting diode having improved luminous efficiency
JP2016162860A (en) * 2015-02-27 2016-09-05 シチズン電子株式会社 Led light-emitting device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011045968A1 (en) * 2009-10-15 2011-04-21 浜松ホトニクス株式会社 Led light source device
JP5373920B2 (en) * 2009-10-15 2013-12-18 浜松ホトニクス株式会社 LED light source device
US9029814B2 (en) 2009-10-15 2015-05-12 Hamamatsu Photonics K.K. LED light source device
JP2011146611A (en) * 2010-01-18 2011-07-28 Stanley Electric Co Ltd Light-emitting element package, and linear light-emitting device and planar light-emitting device each using the same
KR101346801B1 (en) 2012-06-26 2014-01-03 서울반도체 주식회사 Light emitting diode having improved luminous efficiency
JP2016162860A (en) * 2015-02-27 2016-09-05 シチズン電子株式会社 Led light-emitting device

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