JP2007035802A - Light-emitting device - Google Patents

Light-emitting device Download PDF

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JP2007035802A
JP2007035802A JP2005214986A JP2005214986A JP2007035802A JP 2007035802 A JP2007035802 A JP 2007035802A JP 2005214986 A JP2005214986 A JP 2005214986A JP 2005214986 A JP2005214986 A JP 2005214986A JP 2007035802 A JP2007035802 A JP 2007035802A
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led chip
color
light
conversion member
color conversion
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Takuya Nakatani
Kenichiro Tanaka
卓也 中谷
健一郎 田中
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Matsushita Electric Works Ltd
松下電工株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device capable of reducing color irregularities as compared with a conventional example, where an LED chip is combined with a dome-like color conversion member that is uniformly thick, has a uniform concentration of a fluorescent material, and is made of a molding.
SOLUTION: The light-emitting device comprises the LED chip 10 for radiating blue light; a packaging substrate 20 that is a base member in which the LED chip 10 is packaged via a submount member 30; and the dome-like color conversion member 40 made of a molding, where a yellow phosphor that is a fluorescent material surrounding the LED chip 10 and radiating light with a color that differs from the luminescent color of the LED chip 10 while being excited by light radiated from the LED chip 10 is formed along with a transparent material, such as a silicone resin. The color conversion member 40 is formed so that the thickness (wall thickness) becomes uniform, but the concentration distribution of the fluorescent material is given so that color irregularities in compound color light emitted from the color conversion member 40 can be eliminated according to the intensity distribution of light radiated from the LED chip 10.
COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、LEDチップ(発光ダイオードチップ)を利用した発光装置に関するものである。 The present invention relates to a light emitting device utilizing a LED chip (light-emitting diode chip).

従来から、LEDチップとLEDチップから放射された光によって励起されてLEDチップとは異なる発光色の光を放射する波長変換材料としての蛍光材料とを組み合わせてLEDチップの発光色とは異なる色合いの混色光を出す発光装置の研究開発が各所で行われている(例えば、特許文献1)。 Conventionally, the different shades to the light emitting color of the LED chip by combining the fluorescent material as a wavelength converting material emits light having a light emission color different from the LED chip and excited by the LED chip by the light emitted from the LED chip research and development of light-emitting device issuing the mixed light have been made in various places (for example, Patent Document 1). なお、この種の発光装置としては、例えば、青色光あるいは紫外光を放射するLEDチップと蛍光体とを組み合わせて白色の光(白色光の発光スペクトル)を得る白色発光装置(一般的に白色LEDと呼ばれている)の商品化がなされている。 As the light emitting apparatus of this type, for example, white light emitting device to obtain a combination of the LED chip and a phosphor that emits blue light or ultraviolet light white light (light emission spectrum of white light) (generally white LED commercialization of called are) and have been made.

上記特許文献1には、例えば、図3に示すように、LEDチップ10'と、LEDチップ10'が実装されるベース部材たる実装基板20'と、実装基板20'におけるLEDチップ10'の実装面側でLEDチップ10'を囲みLEDチップ10'から放射された光によって励起されてLEDチップ10'の発光色とは異なる色の光を放射する蛍光材料を透明材料とともに成形した成形品からなるドーム状の色変換部材40'とを備えた発光装置が開示されている。 The aforementioned Patent Document 1, for example, as shown in FIG. 3, 'and, LED chip 10' LED chip 10 'and the mounting substrate 20' the base member serving as a mounting substrate 20 which is mounted implementation of LED chip 10 'in made from the molded article where the fluorescent material is molded with a transparent material to emit light of a different color from the emission color of excited by light emitted from the 'LED chip 10 surrounds the' LED chip 10 LED chip 10 'in side emitting device is disclosed that includes a color conversion member 40 shaped dome '.

ここにおいて、上記特許文献1に開示された発光装置では、色変換部材40'の厚み(肉厚)を一様とするとともに、色変換部材40'内に蛍光材料を均一に分布させてある。 Here, the light emitting device disclosed in Patent Document 1, 'as well as the thickness of the (thickness) and uniform, the color conversion member 40' the color conversion member 40 are uniformly distributed fluorescent material within.
特開2004−273798号公報 JP 2004-273798 JP

しかしながら、一般的にLEDチップ10'からの光は図4中に矢印で示すようにほぼ等方的に放射され、放射方向によって強度が異なる(例えば、LEDチップ10'において実装基板20'側とは反対側の一表面から放射される光の強度に比べてLEDチップ10'の側面から放射される光の強度が小さくなり、上記一表面から放射される光であっても放射角によって強度が異なる)ので、LEDチップ10'から放射される光の強度分布に起因して混色光の色むらが生じてしまう。 In general, however, the LED chip 10 'light from being radiated approximately isotropically as shown by arrows in FIG. 4, the radial intensity is different (e.g., LED chip 10' and the mounting substrate 20 'side in intensity by opposite intensity of the light emitted from the side surface of the LED chip 10 'is smaller than the intensity of the light emitted from the one surface side, the radiation angle even light emitted from the first surface has since different), there arises a color unevenness of the mixed light due to the intensity distribution of light emitted from the LED chip 10 '.

本発明は上記事由に鑑みて為されたものであり、その目的は、LEDチップと厚みが一様で蛍光材料の濃度が一様なドーム状の成形品からなる色変換部材とを組み合わせた従来例に比べて色むらを低減できる発光装置を提供することにある。 The present invention has been made in view of the above circumstances, and its object is, LED chip and thickness concentration of uniform fluorescent material combining the color conversion member made of a uniform dome shaped molded article prior It is to provide a light emitting device capable of reducing the color unevenness as compared with examples.

請求項1の発明は、LEDチップと、LEDチップが実装されたベース部材と、ベース部材におけるLEDチップの実装面側でLEDチップを囲みLEDチップから放射された光によって励起されてLEDチップの発光色とは異なる色の光を放射する蛍光材料を透明材料とともに成形した成形品からなるドーム状の色変換部材とを備え、色変換部材は、LEDチップから放射される光の強度分布に応じて、当該色変換部材から出射される混色光の色むらをなくすように蛍光材料の濃度分布が付与されてなることを特徴とする。 The invention according to claim 1, LED chip and a base member on which the LED chip is mounted, is excited by the light emitted from the LED chip surrounds the LED chip mounting surface of the LED chip in the base member emission of the LED chip and a dome-shaped color conversion member made of a molded article and the fluorescent material was molded with a transparent material to emit light of a color different from the color, the color conversion member in response to the intensity distribution of light emitted from the LED chip , and a concentration distribution of the fluorescent material so as to eliminate the color unevenness of the mixed color light emitted from the color conversion member is granted.

この発明によれば、色変換部材が、LEDチップから放射される光の強度分布に応じて当該色変換部材から出射される混色光の色むらをなくすように蛍光材料の濃度分布が付与されているので、LEDチップから放射される光の強度分布に起因して混色光の色むらが生じるのを抑制することができ、LEDチップと厚みが一様で蛍光材料の濃度が一様なドーム状の成形品からなる色変換部材とを組み合わせた従来例に比べて色むらを低減できる。 According to the present invention, the color conversion member, the concentration distribution of the fluorescent material so as to eliminate the color unevenness of the mixed color light emitted from the color conversion member is granted in accordance with the intensity distribution of light emitted from the LED chip are so due from the LED chip to the intensity distribution of the light emitted can be prevented from color irregularity of the color mixing light generated, the LED chip and the thickness of density uniform domed uniform fluorescent material It can reduce color unevenness as compared with the color conversion member made of a molded article of the prior art that combines.

請求項2の発明は、LEDチップと、LEDチップが実装されたベース部材と、ベース部材におけるLEDチップの実装面側でLEDチップを囲みLEDチップから放射された光によって励起されてLEDチップの発光色とは異なる色の光を放射する蛍光材料を透明材料とともに成形した成形品からなるドーム状の色変換部材とを備え、色変換部材は、LEDチップから放射される光の強度分布に応じて、当該色変換部材から出射される混色光の色むらをなくすように厚み分布が設けられてなることを特徴とする。 The invention according to claim 2, LED chips and a base member on which the LED chip is mounted, is excited by the light emitted from the LED chip surrounds the LED chip mounting surface of the LED chip in the base member emission of the LED chip and a dome-shaped color conversion member made of a molded article and the fluorescent material was molded with a transparent material to emit light of a color different from the color, the color conversion member in response to the intensity distribution of light emitted from the LED chip characterized by comprising thickness distribution is provided to eliminate the color unevenness of the mixed color light emitted from the color conversion member.

この発明によれば、色変換部材が、LEDチップから放射される光の強度分布に応じて、当該色変換部材から出射される混色光の色むらをなくすように厚み分布が設けられているので、LEDチップから放射される光の強度分布に起因して混色光の色むらが生じるのを抑制することができ、LEDチップと厚みが一様で蛍光材料の濃度が一様なドーム状の成形品からなる色変換部材とを組み合わせた従来例に比べて色むらを低減できる。 According to the present invention, the color conversion member in response to the intensity distribution of light emitted from the LED chip, since the thickness distribution is provided to eliminate the color unevenness of the mixed color light emitted from the color conversion member , due from the LED chip to the intensity distribution of the light emitted can be prevented from color irregularity of the color mixing light generated, forming concentrations of uniform domed LED chip and uniform fluorescent material thickness It can reduce color unevenness as compared with the conventional example of a combination of a color conversion member made goods.

請求項1,2の発明では、LEDチップと厚みが一様で蛍光材料の濃度が一様なドーム状の成形品からなる色変換部材とを組み合わせた従来例に比べて色むらを低減できるという効果がある。 That in the invention of claim 1, 2, it is possible to reduce the color irregularity in comparison with the conventional example concentrations combining the color conversion member made of a uniform domed molded article of the LED chip and the thickness uniform fluorescent material effective.

(実施形態1) (Embodiment 1)
本実施形態の発光装置は、図1(a),(b)に示すように、LEDチップ10と、LEDチップ10が実装されたベース部材たる実装基板20と、実装基板20におけるLEDチップ10の実装面側でLEDチップ10を囲みLEDチップ10から放射された光によって励起されてLEDチップ10の発光色とは異なる色の光を放射する蛍光材料(例えば、蛍光体など)を透明材料(例えば、シリコーン樹脂など)とともに成形した成形品からなるドーム状の色変換部材40とを備えている。 The light emitting device of the present embodiment, as shown in FIG. 1 (a), (b), the LED chip 10, the LED base member serving as a mounting substrate 20 where the chip 10 is mounted, the LED chip 10 on the mounting board 20 fluorescent materials (e.g., phosphors) to transparent material that emits light of a different color from the excited by light emitted from the LED chip 10 surrounds the LED chip 10 in mounting surface emission color of the LED chip 10 (e.g. , and a color conversion member 40 domed consisting molded article molded with a silicone resin).

実装基板20は、金属板21上に絶縁層22を介して対となる導体パターン23,23が形成された金属基板を採用しており、LEDチップ10で発生した熱が金属板21に伝熱されるようになっている。 Mounting substrate 20, a metal substrate on which the conductor pattern 23 is formed as a pair through the insulating layer 22 on the metal plate 21 is adopted, heat transfer of heat generated in the LED chip 10 to the metal plate 21 It has become as to be. なお、金属板21の材料としてはCuを採用しているが、熱伝導率の比較的高い金属材料であればよく、Cuに限らず、Alなどを採用してもよい。 Although the material of the metal plate 21 is adopted Cu, may be a relatively high metal material thermal conductivity, is not limited to Cu, may be employed, such as Al.

LEDチップ10は、青色光を放射するGaN系青色LEDチップであり、サファイア基板からなる結晶成長用基板11の主表面側にGaN系化合物半導体材料により形成されて例えばダブルへテロ構造を有する積層構造部からなる発光部12がエピタキシャル成長法(例えば、MOVPE法など)により成長されている。 LED chip 10 is a GaN-based blue LED chip that emits blue light, a laminated structure having a heterostructure is formed, for example, a double by GaN-based compound semiconductor material on the main surface of the crystal growth substrate 11 made of sapphire substrate emitting portion 12 is the epitaxial growth method consisting of parts (for example, MOVPE method) is grown by.

また、LEDチップ10は、上述の金属板21に、LEDチップ10のチップサイズよりも大きなサイズの矩形板状に形成されたサブマウント部材30を介して搭載されており、アノード電極(図示せず)およびカソード電極(図示せず)それぞれが金属細線(例えば、金細線、アルミニウム細線など)からなるボンディングワイヤ14を介して導体パターン23,23と電気的に接続されている。 Furthermore, LED chip 10, the metal plate 21 described above, LED chip 10 is mounted through a sub-mount member 30 formed in a rectangular plate shape having a size larger than the chip size, without anode electrode (shown ) and a cathode electrode (not shown), each metal thin wire (e.g., gold thin wire, via a bonding wire 14 made of aluminum thin wire, etc.) are electrically connected to the conductor pattern 23. ここにおいて、サブマウント部材30は、熱伝導率が比較的高く且つ絶縁性を有する材料(例えば、AlN、複合SiCなど)により形成されている。 Here, the sub-mount member 30 is made of a material the thermal conductivity has a relatively high and insulation (e.g., AlN, complex SiC or the like) is formed by. なお、LEDチップ10とサブマウント部材30とは、AuSn、SnAgCuなどの鉛フリー半田を用いて接合されている。 Note that the LED chip 10 and the sub-mount member 30, AuSn, are joined by using lead-free solder such as SnAgCu.

色変換部材40は、シリコーン樹脂のような透明材料とLEDチップ10から放射された青色光によって励起されてブロードな黄色系の光を放射する粒子状の黄色蛍光体からなる蛍光材料とを混合した混合物の成形品により構成されている。 The color conversion member 40, a mixture of a fluorescent material comprising a particulate yellow phosphor which is excited by blue light emitted from a transparent material such as silicone resin and the LED chip 10 emits light of broad yellow It is constituted by a molded article of the mixture. したがって、本実施形態の発光装置は、LEDチップ10から放射された青色光と黄色蛍光体から放射された光との混色光が色変換部材40から出射されることとなり、白色光を得ることができる。 Accordingly, the light emitting device of this embodiment, that the mixed light of the light emitted from the blue light and the yellow phosphor emitted from the LED chip 10 becomes to be emitted from the color conversion member 40 to obtain white light it can. なお、色変換部材40の材料として用いる透明材料は、シリコーン樹脂に限らず、例えば、アクリル樹脂、エポキシ樹脂、ガラス、有機材料と無機材料とを複合化した材料などを採用してもよい。 The transparent material used as the material of the color conversion member 40 is not limited to the silicone resin, e.g., acrylic resin, epoxy resin, glass, an organic material and an inorganic material may be employed such as composite materials. また、色変換部材40の材料として用いる透明材料に混合する蛍光材料も黄色蛍光体に限らず、例えば、LEDチップ10が青色LEDチップである場合には、赤色蛍光体と緑色蛍光体とを混合しても白色光を得ることができるし、黄色蛍光体と赤色蛍光体とを混合しても白色光を得ることができる。 The fluorescent material to be mixed with the transparent material used as the material of the color conversion member 40 is not limited to the yellow phosphor, for example, when the LED chip 10 is a blue LED chip, mixing a red phosphor and a green phosphor it can also obtain a white light, it can be mixed with a yellow phosphor and the red phosphor produce white light. また、色変換部材40における蛍光材料は、LEDチップ10が紫〜近紫外LEDチップである場合には、赤色蛍光体と緑色蛍光体と青色蛍光体とを混合しても白色光を得ることができる。 The fluorescent material in the color conversion member 40, when the LED chip 10 is violet and near-ultraviolet LED chip, but also a mixture of a red phosphor and a green phosphor and a blue phosphor produce white light it can. また、色変換部材40は、開口部の周縁を実装基板20に対して、例えば接着剤(例えば、シリコーン樹脂、エポキシ樹脂など)を用いて接着すればよい。 The color conversion member 40, the periphery of the opening with respect to the mounting substrate 20, for example, an adhesive (e.g., silicone resin, epoxy resin) may be bonded using. なお、色変換部材40と実装基板20とで囲まれる空間には、LEDチップ10を封止する封止樹脂(例えば、シリコーン樹脂など)からなる封止部を設けてもよく、封止部と色変換部材40とは密着するようにしてもよいし、封止部と色変換部材40との間に空気層が形成されるようにしてもよい。 Note that the color conversion member 40 in the space surrounded by the mounting substrate 20, the sealing resin (e.g., silicone resin) that seals the LED chip 10 may be provided with a sealing portion made of a sealing portion it may be in close contact to the color conversion member 40, may be an air layer is formed between the sealing portion and the color conversion member 40.

ところで、色変換部材40は、厚み(肉厚)が一様となるように成形してあるが、LEDチップ10から放射される光の強度分布に応じて、当該色変換部材40から出射される混色光の色むらをなくすように蛍光材料の濃度分布が付与されている。 Meanwhile, the color conversion member 40 is the thickness (wall thickness) is are shaped so as to be uniform, depending from the LED chip 10 to the intensity distribution of the light emitted, are emitted from the color conversion member 40 concentration distribution of the fluorescent material so as to eliminate the color unevenness of the mixed color light is given. ここにおいて、LEDチップ10からの光は等方的に放射され放射方向によって強度が異なる(LEDチップ10において実装基板20側とは反対側の一表面(図1(a)における上面)から放射される光の強度に比べてLEDチップ10の側面から放射される光の強度が小さくなり、上記一表面から放射される光であっても放射角によって強度が異なる)ので、色変換部材40は、LEDチップ10の上記一表面の前方に位置する中心部から離れるにつれて蛍光材料の濃度が低くなるように濃度分布を付与してある。 Here, the light from the LED chip 10 is emitted from the isotropically emitted by the radiation intensity in the direction different (opposite the one surface to the mounting substrate 20 side in the LED chip 10 (the upper surface in FIG. 1 (a)) that the intensity of light emitted from the side surface of the LED chip 10 as compared to the intensity of light is reduced, even light emitted from the one surface strength differs depending radiation angle), so the color conversion member 40, the concentration of the fluorescent material moves away from the center located in front of the first surface of the LED chip 10 are assigned the density distribution to be lower. つまり、色変換部材40は、LEDチップ10の上記一表面の前方に位置する中心部の濃度がLEDチップ10の側方に位置する周辺部の濃度に比べて高くなっており、中心部から周辺部に向って濃度が徐々に低くなっている。 That is, the color conversion member 40, the concentration of the central portion located in front of the first surface of the LED chip 10 has become higher than the density of the peripheral portion positioned on the side of the LED chip 10, the peripheral from the center gradually decreases the concentration toward the part. 色変換部材40に上述の濃度分布を付与しておくことにより、色変換部材40の中心部から出射される混色光と周辺部から出射される混色光との色ばらつきを少なくできる。 By the color conversion member 40 keep applying the density distribution described above, it can be reduced color variations in the mixed color light emitted from the mixed light and a peripheral portion which is emitted from the center of the color conversion member 40.

しかして、本本実施形態の発光装置では、LEDチップ10から放射される光の強度分布に起因して混色光の色むらが生じるのを抑制することができ、図3のようにLEDチップ10'と厚みが一様で蛍光材料の濃度が一様なドーム状の成形品からなる色変換部材40'とを組み合わせた従来例に比べて白色の色むらを低減できる。 Thus, in light emitting device of the present embodiment, due from the LED chip 10 to the intensity distribution of the light emitted can be prevented from color irregularity of the color mixing light generated, LED chip 10 as shown in FIG. 3 ' and it can reduce the white color unevenness as compared with the conventional example concentrations combining the color conversion member 40 'of homogeneous domed molded article of uniform fluorescent material thickness.

(実施形態2) (Embodiment 2)
本実施形態の発光装置の基本構成は実施形態1と略同じであって、図2(a),(b)に示すように色変換部材40の形状などが相違する。 The basic configuration of the light-emitting device of the present embodiment is substantially the same as the embodiment 1, FIG. 2 (a), the like are different shapes of the color conversion member 40 as shown in (b). なお、実施形態1と同様の構成要素には同一の符号を付して説明を省略する。 Incidentally, the same components as in Embodiment 1 will not be described are denoted by the same reference numerals.

ところで、実施形態1では、色変換部材40の厚み(肉厚)を一様として色変換部材40に蛍光材料の濃度分布を付与しているのに対して、本実施形態における色変換部材40は、蛍光材料の濃度を全体にわたって一様とし、LEDチップ10から放射される光の強度分布に応じて、当該色変換部材40から出射される混色光の色むらをなくすように厚み分布が設けられている点が相違する。 Incidentally, in the embodiment 1, whereas it has granted the concentration distribution of the fluorescent material in the color conversion member 40 thickness of the color conversion member 40 (thickness) as a uniform, the color conversion member 40 in this embodiment , and uniform throughout the concentration of fluorescent material, depending from the LED chip 10 to the intensity distribution of the light emitted, thickness distribution is provided to eliminate the color unevenness of the mixed color light emitted from the color conversion member 40 and that point is different. ここにおいて、色変換部材40は、LEDチップ10の上記一表面の前方に位置する中心部から離れるにつれて厚みを薄くしてある。 Here, the color conversion member 40, are made thinner with distance from the center located in front of the first surface of the LED chip 10. つまり、色変換部材40は、LEDチップ10の上記一表面の前方に位置する中心部の肉厚がLEDチップ10の側方に位置する周辺部の肉厚に比べて厚くなっており、中心部から周辺部に向って肉厚が徐々に薄くなっている。 That is, the color conversion member 40 is thicker than the thickness of the peripheral portion thickness is centrally located in front of the first surface of the LED chip 10 is located on the side of the LED chip 10, the central portion wall thickness toward the peripheral portion is gradually thinned from. 色変換部材40に上述の厚み分布を設けておくことにより、色変換部材40の中心部から出射される混色光と周辺部から出射される混色光との色ばらつきを少なくできる。 By the color conversion member 40 preferably provided with the thickness distribution of the above, it can be reduced color variations in the mixed color light emitted from the mixed light and a peripheral portion which is emitted from the center of the color conversion member 40.

しかして、本実施形態の発光装置においても、LEDチップ10から放射される光の強度分布に起因して混色光の色むらが生じるのを抑制することができ、図3のようにLEDチップ10'と厚みが一様で蛍光材料の濃度が一様なドーム状の成形品からなる色変換部材40'とを組み合わせた従来例に比べて白色の色むら(色ばらつき)を低減できる。 Thus, also in the light-emitting device of the present embodiment, due from the LED chip 10 to the intensity distribution of the light emitted can be prevented from color irregularity of the color mixing light generated, LED chip 10 as shown in FIG. 3 It can be reduced white color unevenness (color variation) in comparison with the conventional example of a combination of a 'concentration color conversion member 40 of homogeneous domed molded article with uniform fluorescent material thickness'.

ところで、上記各実施形態において、実装基板20に実装するLEDチップ10の数は1つに限らず、複数でもよく、LEDチップ10ごとに色変換部材40を設ければよい。 Incidentally, in the above embodiments, the number of LED chips 10 mounted on the mounting substrate 20 is not limited to one, more in may, it may be provided a color conversion member 40 for each LED chip 10. また、上記各実施形態では、実装基板20がベース部材を構成しているが、ベース部材は、実装基板20に限らず、例えば、パッケージ本体が熱伝導率の比較的高い材料により形成されたパッケージでもよいし、金属(例えば、Al、Cuなどの熱伝導率の高い金属)製の器具本体などでもよく、金属製の器具本体に実装する場合には、例えばサブマウント部材30と器具本体との間にグリーンシートからなる絶縁層を介在させる形で実装すればよい。 Furthermore, the package above embodiments, the mounting board 20 constitute the base member, the base member is not limited to the mounting substrate 20, for example, the package body is formed by material having relatively high thermal conductivity But to good, metal (e.g., Al, metal having high thermal conductivity such as Cu) may be such as manufactured by the instrument body, when mounting on a metal fixture body, for example the sub-mount member 30 and the instrument body and the an insulating layer made from the green sheet between may be implemented in the intervention.

また、上記各実施形態では、LEDチップ10として、発光色が青色の青色LEDチップを採用しており、結晶成長用基板11として、サファイア基板を採用しているが、サファイア基板の代わりにSiC基板やGaN基板などを用いてもよい。 In the above embodiments, the LED chip 10, light emission color is adopted blue blue LED chip, a crystal growth substrate 11 adopts the sapphire substrate, SiC substrate instead of the sapphire substrate etc. and GaN substrate may be used. また、LEDチップ10の発光色は青色に限らず、例えば、赤色、緑色などでもよい。 Also, emission color of the LED chip 10 is not limited to blue, for example, red, or the like may be green. すなわち、LEDチップ10の発光部12の材料はGaN系化合物半導体材料に限らず、LEDチップ10の発光色に応じて、GaAs系化合物半導体材料やGaP系化合物半導体材料などを採用してもよい。 That is, the material of the light emitting portion 12 of the LED chip 10 is not limited to GaN-based compound semiconductor material, depending on the emission color of the LED chip 10, etc. may be employed GaAs-based compound semiconductor material or GaP-based compound semiconductor material. また、結晶成長用基板11も発光部12の材料に応じて、例えば、GaAs基板、GsP基板などから適宜選択すればよい。 The crystal growth substrate 11 is also in accordance with the material of the light-emitting portion 12, for example, GaAs substrate, may be selected from such GsP substrate.

実施形態1を示し、(a)は概略断面図、(b)は概略斜視図である。 It shows an embodiment 1, (a) is a schematic sectional view, (b) is a schematic perspective view. 実施形態2を示し、(a)は概略断面図、(b)は概略斜視図である。 It shows an embodiment 2, (a) is a schematic sectional view, (b) is a schematic perspective view. 従来例を示す概略断面図である。 It is a schematic sectional view showing a conventional example. LEDチップの動作説明図である。 Is a diagram for describing operation of the LED chip.

符号の説明 DESCRIPTION OF SYMBOLS

10 LEDチップ 14 ボンディングワイヤ 20 実装基板 21 金属板 22 絶縁層 23 導体パターン 30 サブマウント部材 40 色変換部材 10 LED chip 14 bonding wire 20 mounting substrate 21 the metal plate 22 insulating layer 23 conductive pattern 30 submount member 40 color conversion member

Claims (2)

  1. LEDチップと、LEDチップが実装されたベース部材と、ベース部材におけるLEDチップの実装面側でLEDチップを囲みLEDチップから放射された光によって励起されてLEDチップの発光色とは異なる色の光を放射する蛍光材料を透明材料とともに成形した成形品からなるドーム状の色変換部材とを備え、色変換部材は、LEDチップから放射される光の強度分布に応じて、当該色変換部材から出射される混色光の色むらをなくすように蛍光材料の濃度分布が付与されてなることを特徴とする発光装置。 An LED chip, a base member LED chip is mounted, light of a different color from the excited by the light emitted from the LED chip surrounds the LED chips LED chips of the light emitting color in the mounting surface side of the LED chip in the base member the a dome-shaped color conversion member made of a molded article and the fluorescent material was molded with a transparent material that emits color conversion member in response to the intensity distribution of light emitted from the LED chip, emitted from the color conversion member light emitting device and a concentration distribution of the fluorescent material, which are applied to eliminate the color unevenness of mixed color light.
  2. LEDチップと、LEDチップが実装されたベース部材と、ベース部材におけるLEDチップの実装面側でLEDチップを囲みLEDチップから放射された光によって励起されてLEDチップの発光色とは異なる色の光を放射する蛍光材料を透明材料とともに成形した成形品からなるドーム状の色変換部材とを備え、色変換部材は、LEDチップから放射される光の強度分布に応じて、当該色変換部材から出射される混色光の色むらをなくすように厚み分布が設けられてなることを特徴とする発光装置。 An LED chip, a base member LED chip is mounted, light of a different color from the excited by the light emitted from the LED chip surrounds the LED chips LED chips of the light emitting color in the mounting surface side of the LED chip in the base member the a dome-shaped color conversion member made of a molded article and the fluorescent material was molded with a transparent material that emits color conversion member in response to the intensity distribution of light emitted from the LED chip, emitted from the color conversion member the light emitting device characterized in that the thickness distribution is provided to eliminate the color unevenness of the mixed color light.
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