JP2007076183A - Boring method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a machining method for efficiently boring a hole by using a machine in a hard and brittle material such as quartz, glass and a ceramic material with favorable accuracy. <P>SOLUTION: The boring method for boring a hole comprises steps of bonding a piezoelectric plate to a buffer material, then mounting them on the work table of a boring machine and oscillating a drill of the boring machine while oscillating the work table. As the boring machine, a so-called NC machine equipped with a numerical control mechanism is used, and in order to ensure the accuracy of the hole shape to be processed, the machine has a mechanism which recognizes the oscillation range of the drill or the table by image recognition and controls it. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention is for performing an efficient machining operation using a processing machine in order to precisely drill a hard and fragile workpiece (particularly brittle material) such as quartz material, glass, ceramic and the like. It relates to a processing method.

  Most quartz crystal units are processed using artificially produced quartz materials as raw materials. The growth of artificial quartz incorporates so-called artificial quartz crystal growth technology, in which seed crystal, scrap quartz (Raska) and growth liquid are filled in the autoclave, and the crystal is artificially grown on the seed crystal by temperature and pressure. . Crystal devices of various shapes and dimensions will be processed based on the lumbard that has been end-machined with artificial quartz grown here.

  In the processing method, there is a cutting process based on a predetermined cutting angle that determines a cut angle that determines frequency characteristics and temperature characteristics as a crystal resonator, and there is a step of determining a crystal external shape, in order to obtain a desired frequency. What performed the thickness grinding | polishing process of the quartz plate etc. can be mentioned as a processing process of a general crystal oscillator.

  In the cutting process and the polishing process, a special processing machine is used for each, and the quartz crystal industry uses a processing technique elaborated by each company to process a crystal resonator to obtain a desired frequency. Machining is the main process in general, but in the process up to the crystal unit, crystal processing is performed by performing chemical treatment (etching) process as necessary to finish the surface of the crystal material with high accuracy. At present, the processing of the vibrator is realized.

  As described above, the conventional crystal resonator has a process of obtaining desired characteristics and frequency by the process up to the final outer dimensions and thickness. As a result, crystal oscillators can be obtained by carrying out excitation electrodes and packaging, for example, in the shape of round plates or strips, whose processing shape and supply shape are determined according to the product type and application. It becomes.

  The above-described crystal resonator is mainly used as a clock signal source for communication equipment and control equipment as an electronic component, and is used in a wide range of applications from industrial communication equipment to personally owned mobile phones and game machines.

  By the way, in recent years, the field of application is also used for physical measurement such as displacement, mass, pressure, etc. from electronic equipment centering on the communication equipment mentioned above, or in combination with GPS (global positioning system) Currently, it is widely deployed in fields such as gyro (yaw rate) sensors that are mounted on automobiles, such as recognition of the state of mounted automobiles.

In the field of automobiles, the use of crystal units is also being promoted for various types of sensing with an emphasis on safety and driving performance, and there is an increasing demand for satisfying shapes and specifications different from those of conventional crystal units. is there. In addition, in order to satisfy the above specifications, we are currently developing products that incorporate general machining instead of the conventional quartz crystal processing method.
JP 2001-054802 A

  As described above, in the current crystal processing, machining that processes a metal material is increasingly used for processing a part of a crystal resonator. As one example, an operation of processing a crystal plate in a ring shape is seen as a sensing component incorporated in an automobile. This machining is to process a predetermined hole shape in a quartz plate using a machine tool such as a so-called vertical milling machine.

  The vertical milling machine has an end mill drill and a work table that can be moved up and down, east, west, south, and north, and cuts and cuts the workpiece attached to the work table. Attempts have been made to process a hard and brittle material (brittle material) called a quartz plate. For this reason, the quartz plate is processed using a drill with a diamond material attached. However, because the quartz material is very hard, it is very difficult to ensure the desired drilling accuracy. is there.

  In addition, as described in the background art, the characteristics of quartz materials change greatly depending on the external dimensions and thickness dimensions. Therefore, in the above-described drilling, the drilling is continued with high accuracy and stability due to the wear of the drill. Because it is difficult, hard and brittle quartz material, the drill itself needs frequent dressing, so there are problems of processing accuracy and man-hours during processing.

  In order to solve the above-described problems, the present invention is a hole drilling method for drilling, and after attaching a piezoelectric plate to a cushioning material, it is mounted on a work table of a hole drilling machine, and the work table is swung. This is a drilling method in which the drill portion of the drilling machine is swung. Also, this processing machine uses NC, which is equipped with Numerical Control, a so-called numerical calculation control mechanism, and the rocking range of the drill part or work table part is recognized by image recognition in order to ensure the accuracy of the hole shape to be processed. It is a hole drilling method characterized by having a control mechanism.

  In short, the present invention feeds back the dimensions at the time of drilling, which has not been managed in the past, in order to efficiently and precisely drill hard and brittle materials such as piezoelectric materials, glass materials and ceramic materials. Therefore, it is possible to obtain a stable and highly accurate hole drilling in consideration of the wear condition of the drill used for the hole drilling.

  In addition, changes in the drilling amount after a certain period of maintenance (dressing) processing for the drill are also managed by the finished work without causing the cutting ability of the drill. The problem is solved by improving the work efficiency by maintaining the state.

  By using the hole drilling method of the present invention, the machining accuracy is uniform and stable by realizing the drilling based on the desired hole shape regardless of the wear of the drill itself used for machining and the cutting efficiency. be able to. As a result, it is possible to reduce the processing man-hours such as improvement in processing efficiency, quality, and yield, so that the processing cost can be reduced.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. In each figure, the same numerals indicate the same objects. FIG. 1 shows the movement of the drill portion 3 when drilling according to the present invention. The drill shape shown here is shown as an example used for drilling, and is shown as a reverse concave shape, but is not limited to the shape of the drill portion 3. Further, although not specifically shown, the quartz material, the glass material, and the ceramic material can be ground by diamond or a component having hardness similar to diamond in the outer periphery of the drill portion 3 or the metal component constituting the drill portion 3. is there.

  FIG. 1 shows a conceptual diagram at the time of machining. FIG. 1 (a) shows the movement of the drill portion 3 at the time of machining as viewed from the side, and FIG. 1 (b) shows the drill direction rule. FIG. 1A is a plan view as viewed from the top of the page. Compared with the movement of the drill at the time of conventional machining in FIG. 3, it is obvious that the drill portion 3 is rotating at the same time as the workpiece to be drilled is rotating. There are features.

  In short, when drilling a workpiece, the machining accuracy is uniform by realizing the machining based on the desired hole shape, regardless of the wear and cutting efficiency of the drill itself used for machining. The aim is to obtain stability. By performing the movement of the drill portion 3 shown in FIG. 1 (b), it is possible to perform processing to a wider range than the drill diameter (shaded portion), and at the same time, maintaining the processing dimensions accurately, thereby improving processing efficiency. As a result, quality can be improved and yield can be improved. Furthermore, since the number of processing steps can be reduced, the processing cost can also be reduced.

  Further, in order to maintain a desired drilling dimension by the drill operation shown in FIG. 1, naturally, it is necessary to reflect the drilling status in the swing range of the drill portion 3. As an example of this control, In addition to controlling the machining position accuracy by numerical control, that is, NC method, by recognizing and controlling the current machining status and the rocking range of the drill part 3 or work table part 4 by image recognition in real time. In addition, it is possible to accurately finish the desired hole processing size.

  FIG. 1 illustrates that the object of the present invention is achieved by moving the drill, but it is arbitrarily selected whether to swing the drill part 3 of the hole drilling machine or the work table 4. It doesn't matter. Further, the working efficiency can be further increased by swinging the drill and the work table. Note that FIG. 1 does not show a state where the work table unit 4 is swung.

  FIG. 2 is a flowchart showing the setup of the present invention. In the hole machining method for machining holes according to the present invention, the piezoelectric plate 1 is bonded to a buffer material 2 such as a glass plate, and then mounted on the work table 4 of the hole drilling machine, and the work table 4 is shaken. Drilling is performed by swinging the drill part 3 of the drilling machine while moving. Although it overlaps here, in order to ensure the hole processing accuracy, the processing status is controlled by image recognition in real time.

  As described above, in the present invention, in order to achieve efficient and accurate drilling of hard and fragile materials such as piezoelectric materials, glass materials, and ceramic materials, the dimensions at the time of drilling that have not been controlled in the past have been set. By providing feedback, the wear condition of the drill used for drilling is considered, and the drill wear condition depends on whether the drill part 3 is swung, the table part 4 is swung, or both are swung. Irrespective of this, it is possible to obtain a stable and highly accurate hole drilling continuously.

  In this embodiment, the description will be made with a round hole shape. However, the hole shape is not limited, and it goes without saying that the same processing method can be applied to a quadrangle, a triangle, and an ellipse. In the description, two image recognition apparatuses are installed. However, the number of image recognitions is not limited, and at least one is sufficient. Although there is no restriction on the installation location of the image recognition device, considering that a transparent material is used for the cushioning material 2, it is considered that the direction from the lower part of the processing part is less affected by dirt and processing dust generated during processing. .

It is a conceptual diagram which shows the concept of the hole processing of this invention. It is a flowchart which shows the flow of a process of this invention. It is a conceptual diagram which shows the concept of the conventional hole processing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Piezoelectric plate 2 Buffer material 3 Drill part 4 Work table part

Claims (3)

  A hole processing method for performing hole processing, wherein a work piece is bonded to a cushioning material and then mounted on a work table of a hole processing machine, and a drill portion of the hole processing machine is swung while the work table is swung. A hole drilling method characterized by being made to do.   A hole drilling method according to claim 1, wherein a numerically controlled machine is used, and a rocking range of the drill part or the work table part is controlled by image recognition. 2. A hole drilling method according to claim 1, wherein the workpiece to be drilled is a piezoelectric material, a glass material, or a ceramic material.

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