JP2007040090A - 高強度パネル - Google Patents

高強度パネル Download PDF

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Publication number
JP2007040090A
JP2007040090A JP2006110105A JP2006110105A JP2007040090A JP 2007040090 A JP2007040090 A JP 2007040090A JP 2006110105 A JP2006110105 A JP 2006110105A JP 2006110105 A JP2006110105 A JP 2006110105A JP 2007040090 A JP2007040090 A JP 2007040090A
Authority
JP
Japan
Prior art keywords
panel
edge
rib
lattice
circular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006110105A
Other languages
English (en)
Japanese (ja)
Inventor
Chae-Won Kim
チェ ウォン キム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hae Kwang Co Ltd
Original Assignee
Hae Kwang Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=37271098&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP2007040090(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hae Kwang Co Ltd filed Critical Hae Kwang Co Ltd
Publication of JP2007040090A publication Critical patent/JP2007040090A/ja
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
    • F24F3/16—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
    • F24F3/167—Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F2221/00—Details or features not otherwise provided for
    • F24F2221/40—HVAC with raised floors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Floor Finish (AREA)
JP2006110105A 2005-07-29 2006-04-12 高強度パネル Pending JP2007040090A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050069402A KR100649140B1 (ko) 2005-07-29 2005-07-29 고강도 패널

Publications (1)

Publication Number Publication Date
JP2007040090A true JP2007040090A (ja) 2007-02-15

Family

ID=37271098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006110105A Pending JP2007040090A (ja) 2005-07-29 2006-04-12 高強度パネル

Country Status (6)

Country Link
US (1) US20070022696A1 (ko)
JP (1) JP2007040090A (ko)
KR (1) KR100649140B1 (ko)
MY (1) MY144859A (ko)
SG (1) SG129346A1 (ko)
TW (1) TW200704857A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010018970A (ja) * 2008-07-09 2010-01-28 Miyazono Seisakusho:Kk 瓦及び瓦の製造方法
JP2016516924A (ja) * 2013-03-12 2016-06-09 レイノルズ・プレスト・プロダクツ・インコーポレイテッド マット、可搬型建設用多孔マットシステム、工具および方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090100781A1 (en) * 2007-10-23 2009-04-23 Mehdi Hatamian Modular building system
US8997933B2 (en) * 2010-10-04 2015-04-07 Ardisam, Inc. Load-bearing platform
US8794383B2 (en) 2012-01-09 2014-08-05 Rivers Edge Tree Stands, Inc. Ladder stand
KR101866481B1 (ko) * 2016-06-09 2018-06-12 주식회사 서호 이중 마루시스템용 바닥패널
KR101871821B1 (ko) 2017-02-20 2018-06-27 주식회사 에스비테크 클린룸용 이중바닥 패널
KR101871818B1 (ko) 2017-02-20 2018-06-27 주식회사 에스비테크 클린룸용 이중바닥 패널
KR102584041B1 (ko) 2023-06-02 2023-10-05 주식회사 에스앤와이시스템 이중바닥재용 패널

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4825603A (en) * 1987-03-23 1989-05-02 Farley, Inc. Elevated floor plate
US5138807A (en) * 1990-02-01 1992-08-18 Daw Technologies, Inc. Floor panel for industrial cleanroom
JPH0967922A (ja) * 1995-08-30 1997-03-11 Meiji Rubber & Chem Co Ltd 床パネル
WO1999005372A1 (en) * 1997-07-28 1999-02-04 Interface, Inc. Perforated raised flooring panel
JP3565692B2 (ja) * 1997-09-19 2004-09-15 近代都市開発株式会社 孔明床パネルの製法
KR200198844Y1 (ko) * 1998-09-23 2000-10-02 김재원 크린룸용 바닥재
US6519902B1 (en) * 2001-10-05 2003-02-18 Maxcess Technologies, Inc. Heavy-duty floor panel for a raised access floor system
KR100603887B1 (ko) * 2003-07-28 2006-07-24 주식회사 맥시 토와 프리 액세스 바닥용 기본 패널

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010018970A (ja) * 2008-07-09 2010-01-28 Miyazono Seisakusho:Kk 瓦及び瓦の製造方法
JP2016516924A (ja) * 2013-03-12 2016-06-09 レイノルズ・プレスト・プロダクツ・インコーポレイテッド マット、可搬型建設用多孔マットシステム、工具および方法

Also Published As

Publication number Publication date
MY144859A (en) 2011-11-30
US20070022696A1 (en) 2007-02-01
KR20050088050A (ko) 2005-09-01
TW200704857A (en) 2007-02-01
KR100649140B1 (ko) 2006-11-27
SG129346A1 (en) 2007-02-26

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