JP2007027507A5 - - Google Patents

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Publication number
JP2007027507A5
JP2007027507A5 JP2005209022A JP2005209022A JP2007027507A5 JP 2007027507 A5 JP2007027507 A5 JP 2007027507A5 JP 2005209022 A JP2005209022 A JP 2005209022A JP 2005209022 A JP2005209022 A JP 2005209022A JP 2007027507 A5 JP2007027507 A5 JP 2007027507A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2005209022A
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JP2007027507A (ja
JP5309416B2 (ja
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Publication date
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Priority to JP2005209022A priority Critical patent/JP5309416B2/ja
Priority claimed from JP2005209022A external-priority patent/JP5309416B2/ja
Priority to US11/456,730 priority patent/US7454104B2/en
Publication of JP2007027507A publication Critical patent/JP2007027507A/ja
Publication of JP2007027507A5 publication Critical patent/JP2007027507A5/ja
Application granted granted Critical
Publication of JP5309416B2 publication Critical patent/JP5309416B2/ja
Priority to US15/046,557 priority patent/USRE46633E1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2005209022A 2005-07-19 2005-07-19 光モジュール Active JP5309416B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005209022A JP5309416B2 (ja) 2005-07-19 2005-07-19 光モジュール
US11/456,730 US7454104B2 (en) 2005-07-19 2006-07-11 Optical module
US15/046,557 USRE46633E1 (en) 2005-07-19 2016-02-18 Optical module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005209022A JP5309416B2 (ja) 2005-07-19 2005-07-19 光モジュール

Publications (3)

Publication Number Publication Date
JP2007027507A JP2007027507A (ja) 2007-02-01
JP2007027507A5 true JP2007027507A5 (ja) 2008-06-26
JP5309416B2 JP5309416B2 (ja) 2013-10-09

Family

ID=37679108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005209022A Active JP5309416B2 (ja) 2005-07-19 2005-07-19 光モジュール

Country Status (2)

Country Link
US (2) US7454104B2 (ja)
JP (1) JP5309416B2 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009258341A (ja) * 2008-04-16 2009-11-05 Japan Aviation Electronics Industry Ltd 光モジュール、光電変換器
US7872325B2 (en) * 2009-02-24 2011-01-18 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Reduced-crosstalk wirebonding in an optical communication system
KR101872745B1 (ko) * 2010-04-28 2018-06-29 후아웨이 테크놀러지 컴퍼니 리미티드 양방향 광전자 소자의 누화 저감
US9570648B2 (en) * 2012-06-15 2017-02-14 Intersil Americas LLC Wafer level optical proximity sensors and systems including wafer level optical proximity sensors
JP6511776B2 (ja) * 2014-11-06 2019-05-15 住友電気工業株式会社 発光モジュール
JP6384285B2 (ja) * 2014-11-20 2018-09-05 住友電気工業株式会社 光受信モジュール
US9721837B2 (en) 2015-04-16 2017-08-01 Intersil Americas LLC Wafer level optoelectronic device packages with crosstalk barriers and methods for making the same
US10544344B2 (en) 2016-09-09 2020-01-28 Saudi Arabian Oil Company Methods and systems for neutralizing hydrogen sulfide during drilling
CN111193181B (zh) * 2020-01-08 2022-09-09 索尔思光电（成都）有限公司 To封装的tosa及光模块

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH067551B2 (ja) * 1985-04-10 1994-01-26 富士通株式会社 半導体装置
JPH04180401A (ja) * 1990-11-15 1992-06-26 Hitachi Ltd 高周波伝送線路
JP3343896B2 (ja) * 1993-04-09 2002-11-11 住友電気工業株式会社 光モジュール
JPH0730131A (ja) * 1993-06-25 1995-01-31 Fujitsu Ltd 受光素子アレイモジュール
KR0156334B1 (ko) * 1995-10-14 1998-10-15 김광호 차폐 본딩 와이어를 구비하는 고주파, 고밀도용 반도체 칩 패키지
JP3467174B2 (ja) * 1997-07-30 2003-11-17 シャープ株式会社 光結合素子
JP2001210841A (ja) * 2000-01-24 2001-08-03 Sumitomo Electric Ind Ltd 光通信装置
JP2001281478A (ja) * 2000-03-28 2001-10-10 Fujitsu Ltd 光集積回路
JP2001345475A (ja) * 2000-05-31 2001-12-14 Matsushita Electric Ind Co Ltd 双方向受発光一体化装置
JP3921940B2 (ja) * 2000-12-07 2007-05-30 住友電気工業株式会社 光送受信モジュール
US6712529B2 (en) * 2000-12-11 2004-03-30 Rohm Co., Ltd. Infrared data communication module and method of making the same
JP3722279B2 (ja) * 2001-01-26 2005-11-30 日本電気株式会社 光送受信モジュール
JP4550308B2 (ja) * 2001-03-29 2010-09-22 古河電気工業株式会社 光モジュールおよび光モジュール用リードフレーム
JP4036008B2 (ja) * 2002-02-13 2008-01-23 住友電気工業株式会社 パラレル送受信モジュール
KR100460840B1 (ko) * 2002-08-09 2004-12-09 한국전자통신연구원 광 및 전기 크로스톡을 동시에 억제할 수 있는 광모듈
JP2004128250A (ja) * 2002-10-03 2004-04-22 Toshiba Corp 光通信モジュールおよびそれに用いられる光素子キャリア
JP3804632B2 (ja) * 2003-05-21 2006-08-02 住友電気工業株式会社 光データリンク
JP2005039141A (ja) * 2003-07-18 2005-02-10 Hitachi Maxell Ltd 光学モジュール
TWI236120B (en) * 2003-10-16 2005-07-11 Via Tech Inc Chip package and electrical-connection structure between chip and substrate
US6933599B2 (en) * 2003-10-27 2005-08-23 Freescale Semiconductor, Inc. Electromagnetic noise shielding in semiconductor packages using caged interconnect structures
TWI229422B (en) * 2003-12-05 2005-03-11 Via Tech Inc A bonding-wire structure having desirable high-frequency characteristics for using in metal frame package
JP2005244038A (ja) * 2004-02-27 2005-09-08 Fujitsu Ltd 光送受信モジュール

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