JP2007019267A5 - - Google Patents
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- Publication number
- JP2007019267A5 JP2007019267A5 JP2005199151A JP2005199151A JP2007019267A5 JP 2007019267 A5 JP2007019267 A5 JP 2007019267A5 JP 2005199151 A JP2005199151 A JP 2005199151A JP 2005199151 A JP2005199151 A JP 2005199151A JP 2007019267 A5 JP2007019267 A5 JP 2007019267A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wiring board
- fiducial mark
- board according
- outside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 15
- 239000000463 material Substances 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000010030 laminating Methods 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005199151A JP2007019267A (ja) | 2005-07-07 | 2005-07-07 | 配線基板、およびこの配線基板を備えた電子機器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005199151A JP2007019267A (ja) | 2005-07-07 | 2005-07-07 | 配線基板、およびこの配線基板を備えた電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007019267A JP2007019267A (ja) | 2007-01-25 |
JP2007019267A5 true JP2007019267A5 (pt) | 2008-07-03 |
Family
ID=37756149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005199151A Pending JP2007019267A (ja) | 2005-07-07 | 2005-07-07 | 配線基板、およびこの配線基板を備えた電子機器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2007019267A (pt) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5032870B2 (ja) * | 2007-03-27 | 2012-09-26 | パナソニック株式会社 | 凹凸回路基板の製造方法 |
US7935893B2 (en) | 2008-02-14 | 2011-05-03 | Ibiden Co., Ltd. | Method of manufacturing printed wiring board with built-in electronic component |
US8024858B2 (en) | 2008-02-14 | 2011-09-27 | Ibiden Co., Ltd. | Method of manufacturing printed wiring board with built-in electronic component |
JP2009218545A (ja) | 2008-03-12 | 2009-09-24 | Ibiden Co Ltd | 多層プリント配線板及びその製造方法 |
JP2009231818A (ja) | 2008-03-21 | 2009-10-08 | Ibiden Co Ltd | 多層プリント配線板及びその製造方法 |
JP2009239247A (ja) * | 2008-03-27 | 2009-10-15 | Ibiden Co Ltd | 多層プリント配線板の製造方法 |
WO2009147936A1 (ja) * | 2008-06-02 | 2009-12-10 | イビデン株式会社 | 多層プリント配線板の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3482826B2 (ja) * | 1997-08-01 | 2004-01-06 | セイコーエプソン株式会社 | Ic実装方法、液晶表示装置および電子機器並びに液晶表示装置の製造装置 |
JP4854846B2 (ja) * | 2000-02-25 | 2012-01-18 | イビデン株式会社 | 多層プリント配線板の製造方法 |
JP3870018B2 (ja) * | 2000-10-12 | 2007-01-17 | 日本アビオニクス株式会社 | 多層プリント配線板およびその製造方法 |
JP4392157B2 (ja) * | 2001-10-26 | 2009-12-24 | パナソニック電工株式会社 | 配線板用シート材及びその製造方法、並びに多層板及びその製造方法 |
JP4137451B2 (ja) * | 2002-01-15 | 2008-08-20 | ソニー株式会社 | 多層基板製造方法 |
JP2004343021A (ja) * | 2003-03-17 | 2004-12-02 | Matsushita Electric Ind Co Ltd | 部品内蔵モジュールの製造方法及び製造装置 |
JP2004296562A (ja) * | 2003-03-26 | 2004-10-21 | Sharp Corp | 電子部品内蔵基板及びその製造方法 |
FI20031201A (fi) * | 2003-08-26 | 2005-02-27 | Imbera Electronics Oy | Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli |
-
2005
- 2005-07-07 JP JP2005199151A patent/JP2007019267A/ja active Pending
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