JP2007010651A5 - - Google Patents

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Publication number
JP2007010651A5
JP2007010651A5 JP2006169714A JP2006169714A JP2007010651A5 JP 2007010651 A5 JP2007010651 A5 JP 2007010651A5 JP 2006169714 A JP2006169714 A JP 2006169714A JP 2006169714 A JP2006169714 A JP 2006169714A JP 2007010651 A5 JP2007010651 A5 JP 2007010651A5
Authority
JP
Japan
Prior art keywords
thermally conductive
support layer
thermometer element
thermal
conductive structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006169714A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007010651A (ja
JP5000204B2 (ja
Filing date
Publication date
Priority claimed from US11/167,746 external-priority patent/US7473030B2/en
Application filed filed Critical
Publication of JP2007010651A publication Critical patent/JP2007010651A/ja
Publication of JP2007010651A5 publication Critical patent/JP2007010651A5/ja
Application granted granted Critical
Publication of JP5000204B2 publication Critical patent/JP5000204B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006169714A 2005-06-27 2006-06-20 熱感知 Expired - Fee Related JP5000204B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/167,746 US7473030B2 (en) 2002-04-01 2005-06-27 Thermal sensing
US11/167,746 2005-06-27

Publications (3)

Publication Number Publication Date
JP2007010651A JP2007010651A (ja) 2007-01-18
JP2007010651A5 true JP2007010651A5 (enExample) 2009-02-12
JP5000204B2 JP5000204B2 (ja) 2012-08-15

Family

ID=36933550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006169714A Expired - Fee Related JP5000204B2 (ja) 2005-06-27 2006-06-20 熱感知

Country Status (3)

Country Link
US (1) US7473030B2 (enExample)
EP (1) EP1739399B1 (enExample)
JP (1) JP5000204B2 (enExample)

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CN106645274B (zh) * 2016-09-19 2019-03-08 中国计量大学 一种应用于绝热反应量热的样品动态热容测算方法
CN109798993B (zh) * 2017-11-17 2024-09-27 泰科电子(上海)有限公司 导热组件及测温装置
CN109238475A (zh) * 2018-08-20 2019-01-18 中国科学院上海技术物理研究所 有弯曲支撑腿微桥结构的锰钴镍氧热敏电阻探测器及方法
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JP2022533495A (ja) * 2019-05-23 2022-07-25 ユルディズ テクニク ユニベルシテシ 体温監視システム
CN113993624B (zh) * 2019-06-21 2024-02-09 亚德诺半导体国际无限责任公司 热平台和制造热平台的方法
EP3951339B1 (en) * 2020-08-06 2022-10-05 Qnami AG Nanoscale thermometry
FR3118198B1 (fr) * 2020-12-21 2023-08-18 Commissariat Energie Atomique Noyau de mesure pour la mesure d'échauffement nucléaire en réacteur nucléaire et capteur calorimétrique intégrant un tel noyau de mesure
CN116242499B (zh) * 2023-03-14 2025-11-25 中国科学院大学 一种微弱热电偶信号扰动监测装置

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