JP2009543997A5 - - Google Patents

Download PDF

Info

Publication number
JP2009543997A5
JP2009543997A5 JP2009520011A JP2009520011A JP2009543997A5 JP 2009543997 A5 JP2009543997 A5 JP 2009543997A5 JP 2009520011 A JP2009520011 A JP 2009520011A JP 2009520011 A JP2009520011 A JP 2009520011A JP 2009543997 A5 JP2009543997 A5 JP 2009543997A5
Authority
JP
Japan
Prior art keywords
temperature part
low temperature
heat
thermal
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009520011A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009543997A (ja
Filing date
Publication date
Priority claimed from FR0653014A external-priority patent/FR2904102B1/fr
Application filed filed Critical
Publication of JP2009543997A publication Critical patent/JP2009543997A/ja
Publication of JP2009543997A5 publication Critical patent/JP2009543997A5/ja
Pending legal-status Critical Current

Links

JP2009520011A 2006-07-18 2007-07-17 排熱装置 Pending JP2009543997A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0653014A FR2904102B1 (fr) 2006-07-18 2006-07-18 Dispositif a ecoulement de chaleur
PCT/FR2007/001222 WO2008009811A1 (fr) 2006-07-18 2007-07-17 Dispositif a ecoulement de chaleur

Publications (2)

Publication Number Publication Date
JP2009543997A JP2009543997A (ja) 2009-12-10
JP2009543997A5 true JP2009543997A5 (enExample) 2010-12-09

Family

ID=37691785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009520011A Pending JP2009543997A (ja) 2006-07-18 2007-07-17 排熱装置

Country Status (9)

Country Link
US (1) US20090283251A1 (enExample)
EP (1) EP2044381B1 (enExample)
JP (1) JP2009543997A (enExample)
CN (1) CN101490496A (enExample)
BR (1) BRPI0713193A2 (enExample)
CA (1) CA2657777C (enExample)
FR (1) FR2904102B1 (enExample)
RU (1) RU2465531C2 (enExample)
WO (1) WO2008009811A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2904103B1 (fr) 2006-07-18 2015-05-15 Airbus France Dispositif a ecoulement de chaleur
WO2010133502A2 (en) * 2009-05-22 2010-11-25 Arcelik Anonim Sirketi A household appliance
FR2977121B1 (fr) * 2011-06-22 2014-04-25 Commissariat Energie Atomique Systeme de gestion thermique a materiau a volume variable
CN103376025A (zh) * 2012-04-24 2013-10-30 上海首太工业装备有限公司 一种可控热开关
RU2608053C1 (ru) * 2015-10-06 2017-01-13 Общество с ограниченной ответственностью "Уральская производственная компания" Модуль отведения и распределения тепловой энергии энергоустановки на твердооксидных топливных элементах
US10866036B1 (en) * 2020-05-18 2020-12-15 Envertic Thermal Systems, Llc Thermal switch

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3463224A (en) * 1966-10-24 1969-08-26 Trw Inc Thermal heat switch
US3519067A (en) * 1967-12-28 1970-07-07 Honeywell Inc Variable thermal conductance devices
US4384610A (en) * 1981-10-19 1983-05-24 Mcdonnell Douglas Corporation Simple thermal joint
US4402358A (en) * 1982-10-15 1983-09-06 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Heat pipe thermal switch
US4742867A (en) * 1986-12-01 1988-05-10 Cape Cod Research, Inc. Method and apparatuses for heat transfer
JPS63161388A (ja) * 1986-12-23 1988-07-05 Ishikawajima Harima Heavy Ind Co Ltd ヒ−トパイプ
JPH01110245A (ja) * 1987-10-23 1989-04-26 Iwatani Internatl Corp 極低温試験装置
US6435454B1 (en) * 1987-12-14 2002-08-20 Northrop Grumman Corporation Heat pipe cooling of aircraft skins for infrared radiation matching
JPH0645177Y2 (ja) * 1988-07-11 1994-11-16 三菱重工業株式会社 ヒートパイプ
US5188909A (en) * 1991-09-12 1993-02-23 Eveready Battery Co., Inc. Electrochemical cell with circuit disconnect device
AT399951B (de) * 1991-11-05 1995-08-25 Grabner Werner Verfahren und vorrichtung zur begrenzung der temperatur
US5216580A (en) * 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US5379601A (en) * 1993-09-15 1995-01-10 International Business Machines Corporation Temperature actuated switch for cryo-coolers
RU2110902C1 (ru) * 1996-11-13 1998-05-10 Российский Федеральный Ядерный Центр - Всероссийский Научно-Исследовательский Институт Экспериментальной Физики Способ охлаждения электрорадиоэлементов
US6047766A (en) * 1998-08-03 2000-04-11 Hewlett-Packard Company Multi-mode heat transfer using a thermal heat pipe valve
RU2161384C1 (ru) * 1999-05-13 2000-12-27 Фонд Сертификации "Энергия" Устройство для температурной стабилизации электронного оборудования
US6940716B1 (en) * 2000-07-13 2005-09-06 Intel Corporation Method and apparatus for dissipating heat from an electronic device
RU2183310C1 (ru) * 2000-10-31 2002-06-10 Центр КОРТЭС Устройство термостабилизации
DE10123473A1 (de) * 2001-05-15 2002-11-21 Volkswagen Ag Vorrichtung zur Wärmeeinbringung in eine Flüssigkeit
US20030196787A1 (en) * 2002-04-19 2003-10-23 Mahoney William G. Passive thermal regulator for temperature sensitive components
US6768781B1 (en) * 2003-03-31 2004-07-27 The Boeing Company Methods and apparatuses for removing thermal energy from a nuclear reactor
DE10342425A1 (de) * 2003-09-13 2005-01-05 Daimlerchrysler Ag Steuerbare Wärmeisolationsschicht
US20060037589A1 (en) * 2004-08-17 2006-02-23 Ramesh Gupta Heat pipe for heating of gasoline for on-board octane segregation
US7268292B2 (en) * 2004-09-20 2007-09-11 International Business Machines Corporation Multi-dimensional compliant thermal cap for an electronic device
US20060141308A1 (en) * 2004-12-23 2006-06-29 Becerra Juan J Apparatus and method for variable conductance temperature control

Similar Documents

Publication Publication Date Title
RU2009105501A (ru) Устройство с перетеканием тепловой энергии
JP2009543997A5 (enExample)
CN103002722B (zh) 一种功率设备的热控制装置
WO2008133210A1 (ja) 半導体装置
WO2006042190A3 (en) Air-conditioning and heating system utilizing thermo-electric solid state devices
ATE475791T1 (de) Vorrichtung zum befördern fluider medien bei tiefen temperaturen
WO2008142769A1 (ja) 半導体装置の試験装置及び試験方法
DK2080244T3 (da) Fast-oxid-brændselscelle omfattende en varmeveksler
RU2018118545A (ru) Локальный теплопотребляющий блок и локальный теплогенерирующий блок для районной системы распределения тепловой энергии
MX359037B (es) Generador de sistema de absorcion co-caldeado.
CA2914777C (en) Device for signature adaptation and object provided with device for signature adaptation
JP2016533955A5 (enExample)
WO2012120097A3 (en) Thermal energy system and method of operation
TR201818852T4 (tr) Isı eşanjörüne yönelik tabaka düzeneği.
EP2674594A3 (en) Thermally actuated assembly for a gas turbine system and method of controlling a cooling airflow path
FR2984008B1 (fr) Dispositif electronique
TW200620330A (en) Super-conducting cable circuit
EA201100700A1 (ru) Электронная система
WO2014025955A3 (en) Closed-loop system for cryosurgery
WO2012110916A3 (en) Overheat protection mechanism for solar thermal collector
CN201897577U (zh) 热导管测试装置
WO2010057017A3 (en) Downhole thermal component temperature management system and method
RU2009105499A (ru) Устройство для теплоотвода
CN203101160U (zh) 半导体病理石蜡包埋冷台
CN109442128A (zh) 一种可加热管道