EA201100700A1 - Электронная система - Google Patents

Электронная система

Info

Publication number
EA201100700A1
EA201100700A1 EA201100700A EA201100700A EA201100700A1 EA 201100700 A1 EA201100700 A1 EA 201100700A1 EA 201100700 A EA201100700 A EA 201100700A EA 201100700 A EA201100700 A EA 201100700A EA 201100700 A1 EA201100700 A1 EA 201100700A1
Authority
EA
Eurasian Patent Office
Prior art keywords
pipeline
specified
fluid
electronic system
heat exchanger
Prior art date
Application number
EA201100700A
Other languages
English (en)
Other versions
EA019644B1 (ru
Inventor
Саймон Питер Дейвис
Original Assignee
Аква Кулинг Солушнз Лтд.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Аква Кулинг Солушнз Лтд. filed Critical Аква Кулинг Солушнз Лтд.
Publication of EA201100700A1 publication Critical patent/EA201100700A1/ru
Publication of EA019644B1 publication Critical patent/EA019644B1/ru

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Предложена электронная система, содержащая электронное устройство и теплообменник для теплообмена с указанным устройством. Теплообменник содержит трубопровод для приёма текучей среды, причём, по меньшей мере, участок трубопровода находится в тепловом контакте с устройством. Система также содержит средство для понижения давления текучей среды в указанном участке трубопровода до значения, меньшего, чем давление снаружи трубопровода, для минимизации протечки текучей среды на указанное устройство в случае повреждения указанного участка трубопровода.
EA201100700A 2008-10-30 2009-07-31 Теплообменник для охлаждения электронного устройства EA019644B1 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0819910A GB2465140B (en) 2008-10-30 2008-10-30 An electronic system
PCT/GB2009/050956 WO2010049710A1 (en) 2008-10-30 2009-07-31 An electronic system

Publications (2)

Publication Number Publication Date
EA201100700A1 true EA201100700A1 (ru) 2012-01-30
EA019644B1 EA019644B1 (ru) 2014-05-30

Family

ID=40138066

Family Applications (1)

Application Number Title Priority Date Filing Date
EA201100700A EA019644B1 (ru) 2008-10-30 2009-07-31 Теплообменник для охлаждения электронного устройства

Country Status (6)

Country Link
US (1) US8582295B2 (ru)
EP (1) EP2350767B1 (ru)
EA (1) EA019644B1 (ru)
ES (1) ES2583055T3 (ru)
GB (1) GB2465140B (ru)
WO (1) WO2010049710A1 (ru)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010028950B4 (de) * 2010-05-12 2020-04-09 Efficient Energy Gmbh Vorrichtung zum Kühlen und Rechner-Racks
US8711563B2 (en) * 2011-10-25 2014-04-29 International Business Machines Corporation Dry-cooling unit with gravity-assisted coolant flow
CN106455408A (zh) * 2015-08-05 2017-02-22 中兴通讯股份有限公司 一种散热装置
CN106358423B (zh) * 2016-10-14 2018-07-10 刁俊起 一种冷却介质绝缘隔离循环装置
US10459499B2 (en) * 2017-05-26 2019-10-29 Dell Products L.P. Systems and methods for management of liquid cooling upgrades with liquid cooling adapter card
CN107608407B (zh) 2017-09-06 2022-01-14 华为技术有限公司 一种负压液冷系统及其控制方法
US10739831B2 (en) 2018-04-24 2020-08-11 Dell Products L.P. Card-based extension cooling
EP3945760A1 (en) * 2020-07-27 2022-02-02 GE Energy Power Conversion Technology Ltd Negative relative pressure cooling systems

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4471907A (en) * 1979-06-01 1984-09-18 Amtrol Inc. Venturi pressurizer for incompressible-liquid circulating systems
CA1185654A (en) * 1982-09-17 1985-04-16 George E. Murison Liquid cooling system for electrical apparatus
FR2602035B1 (fr) * 1986-04-23 1990-05-25 Michel Bosteels Procede et installation de transfert de chaleur entre un fluide et un organe a refroidir ou rechauffer, par mise en depression du fluide par rapport a la pression atmospherique
US4698728A (en) * 1986-10-14 1987-10-06 Unisys Corporation Leak tolerant liquid cooling system
EP0411119A4 (en) * 1988-04-08 1991-05-22 Hitachi, Ltd. Semiconductor module, its cooling system and computer using the cooling system
US4967832A (en) * 1989-12-27 1990-11-06 Nrc Corporation Cooling method and apparatus for integrated circuit chips
US5226471A (en) * 1991-09-23 1993-07-13 General Electric Company Leak isolating apparatus for liquid cooled electronic units in a coolant circulation system
JP2852152B2 (ja) * 1992-02-06 1999-01-27 甲府日本電気株式会社 電子装置の冷却装置
JP2801998B2 (ja) * 1992-10-12 1998-09-21 富士通株式会社 電子機器の冷却装置
GB9325591D0 (en) 1993-12-14 1994-02-16 Somerset Technical Lab Ltd Leakage detection
US5676198A (en) * 1994-11-15 1997-10-14 Sundstrand Corporation Cooling apparatus for an electronic component
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation
SE513064C2 (sv) * 1999-04-27 2000-06-26 Abb Ab Anordning vid elektriska apparater med en kylinrättning samt förfarande för undvikande av förlust av kylmedium
US6154363A (en) * 1999-12-29 2000-11-28 Chang; Neng Chao Electronic device cooling arrangement
AU2001229759A1 (en) * 2000-01-31 2001-08-07 Thermal Corp. Leak detector for a liquid cooling circuit
US6371157B1 (en) * 2000-09-29 2002-04-16 Thales Broadcast & Multimedia, Inc. Method, system and computer program product for self-draining plumbing for liquid-cooled devices
WO2002046677A1 (en) * 2000-12-04 2002-06-13 Fujitsu Limited Cooling system and heat absorbing device
US7484888B2 (en) * 2000-12-21 2009-02-03 Tark, Inc. Method and system for cooling heat-generating component in a closed-loop system
US6623160B2 (en) * 2000-12-21 2003-09-23 Mccarthy, Jr. Joseph H. Method and system for cooling heat-generating component in a closed-loop system
US6711017B2 (en) * 2001-07-17 2004-03-23 Hitachi Kokusai Electric Inc. Cooling apparatus for electronic unit
WO2005023200A2 (en) * 2003-09-09 2005-03-17 Seacost Technologies, Inc. System and method for cooling internal tissue
US7011143B2 (en) * 2004-05-04 2006-03-14 International Business Machines Corporation Method and apparatus for cooling electronic components
TWM284950U (en) * 2005-09-21 2006-01-01 Yen Sun Technology Corp Heat dissipating device for an electronic device
US20070209782A1 (en) * 2006-03-08 2007-09-13 Raytheon Company System and method for cooling a server-based data center with sub-ambient cooling
US7908874B2 (en) * 2006-05-02 2011-03-22 Raytheon Company Method and apparatus for cooling electronics with a coolant at a subambient pressure
DE102006033030A1 (de) * 2006-07-14 2008-01-24 Janz Informationssysteme Ag Kühlvorrichtung
US20090014156A1 (en) * 2007-06-20 2009-01-15 Jan Vetrovec Thermal management system
KR101555365B1 (ko) * 2008-06-27 2015-09-23 엘지전자 주식회사 전자기기의 냉각장치

Also Published As

Publication number Publication date
GB2465140B (en) 2011-04-13
US20110226446A1 (en) 2011-09-22
GB2465140A (en) 2010-05-12
US8582295B2 (en) 2013-11-12
EA019644B1 (ru) 2014-05-30
GB0819910D0 (en) 2008-12-10
ES2583055T3 (es) 2016-09-16
EP2350767B1 (en) 2016-04-20
WO2010049710A1 (en) 2010-05-06
EP2350767A1 (en) 2011-08-03

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Legal Events

Date Code Title Description
MM4A Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s)

Designated state(s): AM AZ BY KZ KG MD TJ TM