CA1185654A - Liquid cooling system for electrical apparatus - Google Patents
Liquid cooling system for electrical apparatusInfo
- Publication number
- CA1185654A CA1185654A CA000411654A CA411654A CA1185654A CA 1185654 A CA1185654 A CA 1185654A CA 000411654 A CA000411654 A CA 000411654A CA 411654 A CA411654 A CA 411654A CA 1185654 A CA1185654 A CA 1185654A
- Authority
- CA
- Canada
- Prior art keywords
- reservoir
- liquid
- header
- cooling system
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Examining Or Testing Airtightness (AREA)
Abstract
LIQUID COOLING SYSTEM FOR ELECTRICAL APPARATUS
ABSTRACT OF THE DISCLOSURE
A liquid cooling system for electrical apparatus, particular semiconductor stacks, has a reservoir and a lower and an upper header communicating with the reservoir. A plurality of arms connect the lower and upper header and the arms communicate with the stacks to conduct heat away from the semiconductors. The lower header slopes upwardly in a direction away from the reservoir and the upper header slopes upwardly in a direction towards the reservoir to reduce the occurrrence of vapour locks.
A pump circulates a cooling liquid from the reservoir through the lower header, the arms and the upper header to the reservoir. A vacuum pump is connected to the upper part of the reservoir above the level of the cooling liquid to place the cooling system under reduced pressure so that any leaks which develop permit entry of air rather than outward leakage of liquid. An alarm is triggered with abnormal running of the vacuum pump indicating a leak. An alarm or shut down may also be triggered by a loss of the reduced pressure.
ABSTRACT OF THE DISCLOSURE
A liquid cooling system for electrical apparatus, particular semiconductor stacks, has a reservoir and a lower and an upper header communicating with the reservoir. A plurality of arms connect the lower and upper header and the arms communicate with the stacks to conduct heat away from the semiconductors. The lower header slopes upwardly in a direction away from the reservoir and the upper header slopes upwardly in a direction towards the reservoir to reduce the occurrrence of vapour locks.
A pump circulates a cooling liquid from the reservoir through the lower header, the arms and the upper header to the reservoir. A vacuum pump is connected to the upper part of the reservoir above the level of the cooling liquid to place the cooling system under reduced pressure so that any leaks which develop permit entry of air rather than outward leakage of liquid. An alarm is triggered with abnormal running of the vacuum pump indicating a leak. An alarm or shut down may also be triggered by a loss of the reduced pressure.
Description
5~
- 1 - Case 2747 IIQUID COOLING SYSTEM_FOR ELECTRICAL APPARATUS
This invention relates to a liquid c~oling system for electrical apparatus and in paxti~ular it relates to an improved system for preventing or minimizin~ problems involving leakage and including a syqtem mOnitGr-Apparatus is well known for liquid cooling ofthyristors or diodes. The following patents, referred to by way oE example only, are representative:
Canadian Patent NoO 732,688 - COLALACO - issued April 19, 1966; Canadian Patent Mo. 931,626 - BEASLEY
et al - issued August 7, 1973; Canadian Patent No.
950,96~ - NYFFELER et al - issued July 9, 1974; United States Patent ~o. 4,178,630 - OLSSON issued December llv 1979.
All the patents referred to above describe apparatus or systems for removing heat from arrays of thyristors, diodes, or similar semiconducting devices. They do not particularly direct the~selves to leakage of the cooling liquid, the occ~rrence of air locks in the circulating system, or cavitation.
The leakage of the cooling liquid in high voltage, high current converters or similar equipment could be disastrous, causing damage to the semiconducting devices and system failure. Air locks can affect the efficiency of cooling, and while not likely to cause .
~35i6~i~
Case 2747 ~ 2 --damage as abruptly as a leak, can damage the semiconducting devices. Cavitation can also affect the cooling efficiency~
The present invention prevents or reduces damage by leakage, air locks or cavitation and provides a monitor system which activates an alarm when conditions of cooling are affected.
It is therefore a feature of this invention to provide an improved system for the liquid cooling of semiconductive devices.
It is a further feature of the invention to provide an improved liquid cooling system for semiconductive devices which provide an alarm or shutdown with unacceptable conditions in the system.
Accordingly there is provided a liquid cooling system for semiconductor apparatus comprising, a reservoir for containing a cooling liquid, a lower header communicating with said reservoir at a lower portion thereof, an upper header communicating with said reservoir at an upper portion thereof, said lower header sloping upwardly in a direction away from said reservoir, and said upper header sloping upwardly in a direction towards said reservoir to reduce the occurrence of vapour locks, a plurality of arms exterlding between and communicating with said lower and upper headers and having means for conducting heat from said semiconductor apparatus, a liquid pump for circulating cooling liquid from said reservoir through said lower header, said arms, and said upper header to said reservoir, and a vacuum pump connected with said rPservoir above the level of cooling liquid therein to reduce the pressure in sai.d reservoir, said headers and said arms, whereby any leaks will result in air entering rather than liquid escaping~
The invention will be described with ~5g~
Case 2747 reference to the single figure schematic diagram showing a sectional view of a cooling system according to the invention.
Referring to the drawing, a reservoir 10 which includes a heat exchanger 11 is connected with a lower header 12 and an upper header 14. Arms 15 interconnect ~he lower and upper headers 12 and 14~
These arms 15 are in heat conducting engagement with or in some form of cooling arrangement with electrical apparatus (not shown3 which is the source of heat.
The electrical apparatus could be semiconducting devices. A dielectric cooling liquid 16 fills the lower header 12, the arms 15, the upper header 14 and the reservoir 10 towards the tGp as shown. A pump 17 circulates the cooling liquid in the direction indicated by arrows 18 and 18A.
The lower header 12 is sloped upwardly in a direction away from reservoir 10, and the upper header ~; 14 is sloped upwardly towards reservoir 10. This is to prevent air locks which could affect the cooling.
- The slope shown in the dra~ing is exaggerated for ease of illustrationO It should be reali~ed that it is acceptable to have the headers perfectly level, that is with zero slope, and no air locks would occur. The important thing is that there should not be any portion sloping in the opposite direction to that shown, and this can be achieved using level headers.
In other words, the headers can slope in the directions shown over a range of zero degrees to whatever the design will convenientl~ accommodate~ As a precaution against errors shifting during construction or assembly, it is preferred to have a slight slope on the headers in the dir~ction shown.
; The heat exchanger 11 has an inlet 20 and an outlet 21 which are connected to a source of water and . . .
- -i6~i~
Case 2747 a waste or disposal for the water, respectively ~not shown).
A sigh-t glass 22 is connected to the wall of reservoir 10 to display the level of the cooling liquid~ A level sensor 23 is connected by a conductor 24 to a monitor 25~ The monitor 25 gives an alarm or shuts the equipment down, as desired, if the level sensed is beyond predetermined limitsO
; A vacuum pump 26 i 5 connected to the top of reservoir 10 above the level of the cooling liquid in the system. Preferably a check valve 27 is connected between the pump 26 and reservoir 10 to maintain a reduced pressure in the reservoir should a fault develop in the pump or when the pump is not running.
The vacuum pump 26 provides a reduced pressure in the system so that small leaks do not result in the escape of the cooling liquid, but rather permit the entry of air. As was previously mentioned, the eacape of liquids could be quite damaging in apparatus using large semiconductoxs.
The presence of a leak will permit air to be drawn into the system and this will call for increased running of the vacuum pump. A conductor 28 connects the vacuum pump 26 with monitor 25 and carries a signal representing the running time of vacuum pump 26r Monitor 25 monitors the running time and if it exceeds a predetermined level (prolonged running indicates a leak) then monitor 25 triggers an alarm or shuts down the system, or both.
A sight glass 30 is connected with reservoir 10 and the level of liquid in sight glass 30 indicates the degree or amount of reduced pressure. A level sensor 31 is mounted adjacent sight glass 30 and is connected to monitor 25 by a conductor 32. If the level departs from a predetermined level, indicating a "
5~
Case 2747 leak, then monitor 25 triggers an alarm or shuts down the system.
A level sensor 33 may, if desired, be mounted adjacent sight glass 30 to sense the level of liquid indicati~g a large 105s of vacuuril, that is indicating a large increase in pressure. Sensor 33 is connected by a conductor 34 to monitor 25. If the level rises in sight glass 30 to level sensor 33 indicating an abrupt loss of vacuum, then monitor 25 triggers an alarm or shuts down the system. It will be apparent that sight glass 30 could be replaced by other pressure indicating devices which can trigger an alarm at a preset level.
In summary, the monitor gives an alarm or shuts down the system when a leak is indicated by increased running time of the vacuum pump, an abrupt loss of vacuum or departure from a normal liquid level. Outward leakage of liquid is prevented except in unusual circumstances by the reduced pressure, and the design including sloping passageways avoids air locks and reduces cavitation.
In another form of the invention thexe is no requirement for vacuum pumps 26. It is necessary to provide a reduced pressure or a negative pressure only ~5 in the circulating &ystem, that is in the lower and upper headers 12 and 14 and in arms 15. This is the region where outward leakage of liquid is dangerous.
The reservoir need not have a reduced or negative pressure in it~ If a circulating pump 17 is used which has sufficient capacity, it can provide the required reduced pressure in the circulating system.
For example, a circulating pump 17 may have a drop across it which is of the order of 7 psi. The reservoir 11 may be assumed to be at atmospheric pressure, or a relative standard or zero pressure.
35~
Case 2747 The upper header 14 on the other side of the pump 17 would have a reduced pressure of 7 psi compared to the reservoir. l'his reduced pressure of 7 psi would rise in the circulating system at points upstream until it becomes zero again at the reservoirO This has been found to be adequate and is a less expensive arrangement. The sight glass 30 or equivalent pressure gauge would, of course, have to be moved from the reservoir 11 where it is shown in the drawings to a point in the circulating system, for example in header 14.
It is believed the operation of the equipment will be understood from the preceding description.
- 1 - Case 2747 IIQUID COOLING SYSTEM_FOR ELECTRICAL APPARATUS
This invention relates to a liquid c~oling system for electrical apparatus and in paxti~ular it relates to an improved system for preventing or minimizin~ problems involving leakage and including a syqtem mOnitGr-Apparatus is well known for liquid cooling ofthyristors or diodes. The following patents, referred to by way oE example only, are representative:
Canadian Patent NoO 732,688 - COLALACO - issued April 19, 1966; Canadian Patent Mo. 931,626 - BEASLEY
et al - issued August 7, 1973; Canadian Patent No.
950,96~ - NYFFELER et al - issued July 9, 1974; United States Patent ~o. 4,178,630 - OLSSON issued December llv 1979.
All the patents referred to above describe apparatus or systems for removing heat from arrays of thyristors, diodes, or similar semiconducting devices. They do not particularly direct the~selves to leakage of the cooling liquid, the occ~rrence of air locks in the circulating system, or cavitation.
The leakage of the cooling liquid in high voltage, high current converters or similar equipment could be disastrous, causing damage to the semiconducting devices and system failure. Air locks can affect the efficiency of cooling, and while not likely to cause .
~35i6~i~
Case 2747 ~ 2 --damage as abruptly as a leak, can damage the semiconducting devices. Cavitation can also affect the cooling efficiency~
The present invention prevents or reduces damage by leakage, air locks or cavitation and provides a monitor system which activates an alarm when conditions of cooling are affected.
It is therefore a feature of this invention to provide an improved system for the liquid cooling of semiconductive devices.
It is a further feature of the invention to provide an improved liquid cooling system for semiconductive devices which provide an alarm or shutdown with unacceptable conditions in the system.
Accordingly there is provided a liquid cooling system for semiconductor apparatus comprising, a reservoir for containing a cooling liquid, a lower header communicating with said reservoir at a lower portion thereof, an upper header communicating with said reservoir at an upper portion thereof, said lower header sloping upwardly in a direction away from said reservoir, and said upper header sloping upwardly in a direction towards said reservoir to reduce the occurrence of vapour locks, a plurality of arms exterlding between and communicating with said lower and upper headers and having means for conducting heat from said semiconductor apparatus, a liquid pump for circulating cooling liquid from said reservoir through said lower header, said arms, and said upper header to said reservoir, and a vacuum pump connected with said rPservoir above the level of cooling liquid therein to reduce the pressure in sai.d reservoir, said headers and said arms, whereby any leaks will result in air entering rather than liquid escaping~
The invention will be described with ~5g~
Case 2747 reference to the single figure schematic diagram showing a sectional view of a cooling system according to the invention.
Referring to the drawing, a reservoir 10 which includes a heat exchanger 11 is connected with a lower header 12 and an upper header 14. Arms 15 interconnect ~he lower and upper headers 12 and 14~
These arms 15 are in heat conducting engagement with or in some form of cooling arrangement with electrical apparatus (not shown3 which is the source of heat.
The electrical apparatus could be semiconducting devices. A dielectric cooling liquid 16 fills the lower header 12, the arms 15, the upper header 14 and the reservoir 10 towards the tGp as shown. A pump 17 circulates the cooling liquid in the direction indicated by arrows 18 and 18A.
The lower header 12 is sloped upwardly in a direction away from reservoir 10, and the upper header ~; 14 is sloped upwardly towards reservoir 10. This is to prevent air locks which could affect the cooling.
- The slope shown in the dra~ing is exaggerated for ease of illustrationO It should be reali~ed that it is acceptable to have the headers perfectly level, that is with zero slope, and no air locks would occur. The important thing is that there should not be any portion sloping in the opposite direction to that shown, and this can be achieved using level headers.
In other words, the headers can slope in the directions shown over a range of zero degrees to whatever the design will convenientl~ accommodate~ As a precaution against errors shifting during construction or assembly, it is preferred to have a slight slope on the headers in the dir~ction shown.
; The heat exchanger 11 has an inlet 20 and an outlet 21 which are connected to a source of water and . . .
- -i6~i~
Case 2747 a waste or disposal for the water, respectively ~not shown).
A sigh-t glass 22 is connected to the wall of reservoir 10 to display the level of the cooling liquid~ A level sensor 23 is connected by a conductor 24 to a monitor 25~ The monitor 25 gives an alarm or shuts the equipment down, as desired, if the level sensed is beyond predetermined limitsO
; A vacuum pump 26 i 5 connected to the top of reservoir 10 above the level of the cooling liquid in the system. Preferably a check valve 27 is connected between the pump 26 and reservoir 10 to maintain a reduced pressure in the reservoir should a fault develop in the pump or when the pump is not running.
The vacuum pump 26 provides a reduced pressure in the system so that small leaks do not result in the escape of the cooling liquid, but rather permit the entry of air. As was previously mentioned, the eacape of liquids could be quite damaging in apparatus using large semiconductoxs.
The presence of a leak will permit air to be drawn into the system and this will call for increased running of the vacuum pump. A conductor 28 connects the vacuum pump 26 with monitor 25 and carries a signal representing the running time of vacuum pump 26r Monitor 25 monitors the running time and if it exceeds a predetermined level (prolonged running indicates a leak) then monitor 25 triggers an alarm or shuts down the system, or both.
A sight glass 30 is connected with reservoir 10 and the level of liquid in sight glass 30 indicates the degree or amount of reduced pressure. A level sensor 31 is mounted adjacent sight glass 30 and is connected to monitor 25 by a conductor 32. If the level departs from a predetermined level, indicating a "
5~
Case 2747 leak, then monitor 25 triggers an alarm or shuts down the system.
A level sensor 33 may, if desired, be mounted adjacent sight glass 30 to sense the level of liquid indicati~g a large 105s of vacuuril, that is indicating a large increase in pressure. Sensor 33 is connected by a conductor 34 to monitor 25. If the level rises in sight glass 30 to level sensor 33 indicating an abrupt loss of vacuum, then monitor 25 triggers an alarm or shuts down the system. It will be apparent that sight glass 30 could be replaced by other pressure indicating devices which can trigger an alarm at a preset level.
In summary, the monitor gives an alarm or shuts down the system when a leak is indicated by increased running time of the vacuum pump, an abrupt loss of vacuum or departure from a normal liquid level. Outward leakage of liquid is prevented except in unusual circumstances by the reduced pressure, and the design including sloping passageways avoids air locks and reduces cavitation.
In another form of the invention thexe is no requirement for vacuum pumps 26. It is necessary to provide a reduced pressure or a negative pressure only ~5 in the circulating &ystem, that is in the lower and upper headers 12 and 14 and in arms 15. This is the region where outward leakage of liquid is dangerous.
The reservoir need not have a reduced or negative pressure in it~ If a circulating pump 17 is used which has sufficient capacity, it can provide the required reduced pressure in the circulating system.
For example, a circulating pump 17 may have a drop across it which is of the order of 7 psi. The reservoir 11 may be assumed to be at atmospheric pressure, or a relative standard or zero pressure.
35~
Case 2747 The upper header 14 on the other side of the pump 17 would have a reduced pressure of 7 psi compared to the reservoir. l'his reduced pressure of 7 psi would rise in the circulating system at points upstream until it becomes zero again at the reservoirO This has been found to be adequate and is a less expensive arrangement. The sight glass 30 or equivalent pressure gauge would, of course, have to be moved from the reservoir 11 where it is shown in the drawings to a point in the circulating system, for example in header 14.
It is believed the operation of the equipment will be understood from the preceding description.
Claims (7)
1. A liquid cooling system for semiconductor apparatus comprising, a reservoir for containing a cooling liquid, a lower header communicating with said reservoir at a lower portion thereof, an upper header communicating with said reservoir at an upper portion thereof, a plurality of arms extending between and communicating with said lower and upper headers and having means for conducting heat from said semiconductor apparatus, means for circulating said cooling liquid and providing a reduced pressure in said system, said cooling liquid being circulated from said reservoir through said lower header, said arms, and said upper header to said reservoir, and said reduced pressure being provided in the circulating system comprising said headers and said arms, whereby any leaks will result in air entering rather than liquid escaping.
2. A liquid cooling system as defined in claim 1 in which said means for circulating said cooling liquid and providing a reduced pressure is a pump in said upper header adjacent said reservoir.
3. A liquid cooling system for semiconductor apparatus comprising, a reservoir for containing a cooling liquid, a lower header communicating with said reservoir at a lower portion thereof, an upper header communicating with said reservoir at an upper portion thereof, said lower header sloping upwardly in a direction away from said reservoir, and said upper header sloping upwardly in a direction towards said reservoir to reduce the occurrence of vapour locks, a plurality of arms extending between sand communicating with said lower and upper headers and having means for conducting heat from said semiconductor apparatus, a liquid pump for circulating cooling liquid from said reservoir through said lower header, said arms, and said upper header to said reservoir, and a vacuum pump connected with said reservoir above the level of cooling liquid therein to reduce the pressure in said reservoir, said headers and said arms, whereby any leaks will result in air entering rather than liquid escaping.
4. A liquid cooling system as defined in claim 3 and further comprising monitor means connected to said vacuum pump to monitor the running time of said vacuum pump for successive predetermined time periods for providing a first signal when said running time in a respective time period exceeds a predetermined value indicative of a leak, and alarm means responsive to said first signal.
5. A liquid cooling system as defined in claim 1 and further comprising a liquid level sensor means for sensing the level of cooling liquid in said reservoir and for providing a second signal when said liquid level is outside predetermined limits, and alarm means responsive to said second signal.
6. A liquid cooling system as defined in claim 3 and further comprising a pressure sensor means for sensing the degree of reduced pressure provided by said vacuum pump and for providing a third signal when said reduced pressure rises towards atmospheric pressure by a predeter-mined amount, and said alarm means being responsive to said third signal.
7. A liquid cooling system as defined in claim 5 in which said liquid level sensor means is a sight glass showing the level of reduced pressure and a liquid level sensor responsive to the liquid level in said sight glass to provide said second signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA000411654A CA1185654A (en) | 1982-09-17 | 1982-09-17 | Liquid cooling system for electrical apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA000411654A CA1185654A (en) | 1982-09-17 | 1982-09-17 | Liquid cooling system for electrical apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1185654A true CA1185654A (en) | 1985-04-16 |
Family
ID=4123610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000411654A Expired CA1185654A (en) | 1982-09-17 | 1982-09-17 | Liquid cooling system for electrical apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA1185654A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2465140A (en) * | 2008-10-30 | 2010-05-12 | Aqua Cooling Solutions Ltd | Heat exchange apparatus for an electronic or computer system |
| DE102009006924B3 (en) * | 2009-02-02 | 2010-08-05 | Knürr AG | Operating method and arrangement for cooling electrical and electronic components and modular units in equipment cabinets |
| EP2561235A1 (en) * | 2010-04-19 | 2013-02-27 | Steve Harrington | Vacuum pumped liquid cooling system for computers |
| US9010141B2 (en) | 2010-04-19 | 2015-04-21 | Chilldyne, Inc. | Computer cooling system and method of use |
| EP3668291A4 (en) * | 2017-09-06 | 2020-08-26 | Huawei Technologies Co., Ltd. | Negative pressure liquid cooling system and control method therefor |
| EP3945760A1 (en) * | 2020-07-27 | 2022-02-02 | GE Energy Power Conversion Technology Ltd | Negative relative pressure cooling systems |
| US11317535B2 (en) * | 2012-02-07 | 2022-04-26 | Chilldyne, Inc. | Computer cooling system and method of use |
| CN116294301A (en) * | 2022-12-05 | 2023-06-23 | 大连理工大学 | Pump-assisted capillary force driven two-phase fluid heat management system |
-
1982
- 1982-09-17 CA CA000411654A patent/CA1185654A/en not_active Expired
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8582295B2 (en) | 2008-10-30 | 2013-11-12 | Aqua Cooling Solutions Ltd. | Electronic system |
| GB2465140B (en) * | 2008-10-30 | 2011-04-13 | Aqua Cooling Solutions Ltd | An electronic system |
| GB2465140A (en) * | 2008-10-30 | 2010-05-12 | Aqua Cooling Solutions Ltd | Heat exchange apparatus for an electronic or computer system |
| DE102009006924B3 (en) * | 2009-02-02 | 2010-08-05 | Knürr AG | Operating method and arrangement for cooling electrical and electronic components and modular units in equipment cabinets |
| US9010141B2 (en) | 2010-04-19 | 2015-04-21 | Chilldyne, Inc. | Computer cooling system and method of use |
| EP2561235A4 (en) * | 2010-04-19 | 2014-10-29 | Steve Harrington | Vacuum pumped liquid cooling system for computers |
| EP2561235A1 (en) * | 2010-04-19 | 2013-02-27 | Steve Harrington | Vacuum pumped liquid cooling system for computers |
| US20150223367A1 (en) * | 2010-04-19 | 2015-08-06 | Steve Harrington | Computer Cooling System And Method of Use |
| US11317535B2 (en) * | 2012-02-07 | 2022-04-26 | Chilldyne, Inc. | Computer cooling system and method of use |
| EP3668291A4 (en) * | 2017-09-06 | 2020-08-26 | Huawei Technologies Co., Ltd. | Negative pressure liquid cooling system and control method therefor |
| US11419242B2 (en) | 2017-09-06 | 2022-08-16 | Huawei Technologies Co., Ltd. | Negative pressure liquid cooling system and control method for controlling negative pressure liquid cooling system |
| EP3945760A1 (en) * | 2020-07-27 | 2022-02-02 | GE Energy Power Conversion Technology Ltd | Negative relative pressure cooling systems |
| CN116294301A (en) * | 2022-12-05 | 2023-06-23 | 大连理工大学 | Pump-assisted capillary force driven two-phase fluid heat management system |
| CN116294301B (en) * | 2022-12-05 | 2024-05-03 | 大连理工大学 | Pump-assisted capillary force driven two-phase fluid heat management system |
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