JP2007003528A5 - - Google Patents

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Publication number
JP2007003528A5
JP2007003528A5 JP2006173043A JP2006173043A JP2007003528A5 JP 2007003528 A5 JP2007003528 A5 JP 2007003528A5 JP 2006173043 A JP2006173043 A JP 2006173043A JP 2006173043 A JP2006173043 A JP 2006173043A JP 2007003528 A5 JP2007003528 A5 JP 2007003528A5
Authority
JP
Japan
Prior art keywords
error
recipe
recipes
tool
measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006173043A
Other languages
English (en)
Japanese (ja)
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JP2007003528A (ja
JP4398441B2 (ja
Filing date
Publication date
Priority claimed from US11/160,404 external-priority patent/US7065425B1/en
Application filed filed Critical
Publication of JP2007003528A publication Critical patent/JP2007003528A/ja
Publication of JP2007003528A5 publication Critical patent/JP2007003528A5/ja
Application granted granted Critical
Publication of JP4398441B2 publication Critical patent/JP4398441B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006173043A 2005-06-22 2006-06-22 超小型電子機構の所望寸法を測定するのに用いられる計測ツールにおける障害を識別する方法、及びそのコンピュータプログラム Expired - Fee Related JP4398441B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/160,404 US7065425B1 (en) 2005-06-22 2005-06-22 Metrology tool error log analysis methodology and system

Publications (3)

Publication Number Publication Date
JP2007003528A JP2007003528A (ja) 2007-01-11
JP2007003528A5 true JP2007003528A5 (enExample) 2009-08-06
JP4398441B2 JP4398441B2 (ja) 2010-01-13

Family

ID=36586511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006173043A Expired - Fee Related JP4398441B2 (ja) 2005-06-22 2006-06-22 超小型電子機構の所望寸法を測定するのに用いられる計測ツールにおける障害を識別する方法、及びそのコンピュータプログラム

Country Status (4)

Country Link
US (2) US7065425B1 (enExample)
JP (1) JP4398441B2 (enExample)
CN (1) CN100523839C (enExample)
TW (1) TW200715160A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7363098B2 (en) * 2005-12-19 2008-04-22 Tech Semiconductor Singapore Pte Ltd Method to identify machines causing excursion in semiconductor manufacturing
US7631286B2 (en) * 2005-12-30 2009-12-08 Wafertech Llc Automated metrology recipe generation
US7305320B2 (en) * 2006-02-15 2007-12-04 International Business Machines Corporation Metrology tool recipe validator using best known methods
CN101536002B (zh) 2006-11-03 2015-02-04 气体产品与化学公司 用于工艺监控的系统和方法
US7953511B1 (en) * 2007-09-21 2011-05-31 National Semiconductor Corporation System and method for reducing processing errors during wafer fabrication employing a 2D wafer scribe and monitoring system
JP5002395B2 (ja) * 2007-09-28 2012-08-15 株式会社日立ハイテクノロジーズ 荷電粒子線装置の制御装置
WO2016117103A1 (ja) * 2015-01-23 2016-07-28 株式会社 日立ハイテクノロジーズ 半導体測定装置、或いは半導体検査装置に用いられるレシピ作成装置
JP6339956B2 (ja) * 2015-03-19 2018-06-06 アズビル株式会社 不具合要因特定支援装置および不具合要因特定支援方法
US10372114B2 (en) * 2016-10-21 2019-08-06 Kla-Tencor Corporation Quantifying and reducing total measurement uncertainty
CN114245933B (zh) 2019-09-06 2025-11-18 株式会社日立高新技术 制程信息提示系统、制程错误推定系统
WO2021199227A1 (ja) 2020-03-31 2021-10-07 株式会社日立ハイテク エラー要因の推定装置及び推定方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914879A (en) * 1997-03-04 1999-06-22 Advanced Micro Devices System and method for calculating cluster tool performance metrics using a weighted configuration matrix
US6470227B1 (en) 1997-12-02 2002-10-22 Murali D. Rangachari Method and apparatus for automating a microelectric manufacturing process
US6456894B1 (en) 1999-06-01 2002-09-24 Applied Materials, Inc. Semiconductor processing techniques
US6303395B1 (en) * 1999-06-01 2001-10-16 Applied Materials, Inc. Semiconductor processing techniques
US6671570B2 (en) 2000-10-17 2003-12-30 Brooks Automation, Inc. System and method for automated monitoring and assessment of fabrication facility
US6727106B1 (en) * 2001-07-12 2004-04-27 Advanced Micro Devices, Inc. System and software for statistical process control in semiconductor manufacturing and method thereof
US6842659B2 (en) 2001-08-24 2005-01-11 Applied Materials Inc. Method and apparatus for providing intra-tool monitoring and control
US6708075B2 (en) * 2001-11-16 2004-03-16 Advanced Micro Devices Method and apparatus for utilizing integrated metrology data as feed-forward data
DE10240115B4 (de) 2002-08-30 2004-10-28 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Handhaben von Substraten in einer Produktionslinie mit einer Cluster-Anlage und einer Messanlage
US7684887B2 (en) 2003-04-30 2010-03-23 Infineon Technologies Ag Advanced process control method and advanced process control system for acquiring production data in a chip production installation
US20050010319A1 (en) 2003-07-09 2005-01-13 Sukesh Patel System and method for validating and visualizing APC assisted semiconductor manufacturing processes
US20050052197A1 (en) 2003-07-14 2005-03-10 Cory Watkins Multi-tool manager
US7257454B2 (en) * 2003-11-21 2007-08-14 Taiwan Semiconductor Manufacturing Company, Ltd. Dynamically adjusting the distribution for dispatching lot between current and downstream tool by using expertise weighting mechanism
US6999848B2 (en) 2003-12-19 2006-02-14 Intel Corporation Process control apparatus, systems, and methods
TWI236044B (en) * 2004-05-12 2005-07-11 Powerchip Semiconductor Corp System and method for real-time dispatching batch in manufacturing process

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