CN100523839C - 计量工具的误差记录分析方法和系统 - Google Patents

计量工具的误差记录分析方法和系统 Download PDF

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Publication number
CN100523839C
CN100523839C CNB2006100946057A CN200610094605A CN100523839C CN 100523839 C CN100523839 C CN 100523839C CN B2006100946057 A CNB2006100946057 A CN B2006100946057A CN 200610094605 A CN200610094605 A CN 200610094605A CN 100523839 C CN100523839 C CN 100523839C
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China
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error
prescription
errors
inefficacy
metering outfit
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Expired - Fee Related
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CNB2006100946057A
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English (en)
Chinese (zh)
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CN1885049A (zh
Inventor
埃里克·P·索莱基
周麟
萨拉赫·凯伊
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Core Usa Second LLC
GlobalFoundries Inc
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International Business Machines Corp
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32222—Fault, defect detection of origin of fault, defect of product
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
CNB2006100946057A 2005-06-22 2006-06-21 计量工具的误差记录分析方法和系统 Expired - Fee Related CN100523839C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/160,404 2005-06-22
US11/160,404 US7065425B1 (en) 2005-06-22 2005-06-22 Metrology tool error log analysis methodology and system

Publications (2)

Publication Number Publication Date
CN1885049A CN1885049A (zh) 2006-12-27
CN100523839C true CN100523839C (zh) 2009-08-05

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Family Applications (1)

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CNB2006100946057A Expired - Fee Related CN100523839C (zh) 2005-06-22 2006-06-21 计量工具的误差记录分析方法和系统

Country Status (4)

Country Link
US (2) US7065425B1 (enExample)
JP (1) JP4398441B2 (enExample)
CN (1) CN100523839C (enExample)
TW (1) TW200715160A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7363098B2 (en) * 2005-12-19 2008-04-22 Tech Semiconductor Singapore Pte Ltd Method to identify machines causing excursion in semiconductor manufacturing
US7631286B2 (en) * 2005-12-30 2009-12-08 Wafertech Llc Automated metrology recipe generation
US7305320B2 (en) * 2006-02-15 2007-12-04 International Business Machines Corporation Metrology tool recipe validator using best known methods
CN101536002B (zh) 2006-11-03 2015-02-04 气体产品与化学公司 用于工艺监控的系统和方法
US7953511B1 (en) * 2007-09-21 2011-05-31 National Semiconductor Corporation System and method for reducing processing errors during wafer fabrication employing a 2D wafer scribe and monitoring system
JP5002395B2 (ja) * 2007-09-28 2012-08-15 株式会社日立ハイテクノロジーズ 荷電粒子線装置の制御装置
WO2016117103A1 (ja) * 2015-01-23 2016-07-28 株式会社 日立ハイテクノロジーズ 半導体測定装置、或いは半導体検査装置に用いられるレシピ作成装置
JP6339956B2 (ja) * 2015-03-19 2018-06-06 アズビル株式会社 不具合要因特定支援装置および不具合要因特定支援方法
US10372114B2 (en) * 2016-10-21 2019-08-06 Kla-Tencor Corporation Quantifying and reducing total measurement uncertainty
CN114245933B (zh) 2019-09-06 2025-11-18 株式会社日立高新技术 制程信息提示系统、制程错误推定系统
WO2021199227A1 (ja) 2020-03-31 2021-10-07 株式会社日立ハイテク エラー要因の推定装置及び推定方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6303395B1 (en) * 1999-06-01 2001-10-16 Applied Materials, Inc. Semiconductor processing techniques
US20030176940A1 (en) * 1997-12-02 2003-09-18 Rangachari Murali D. Method and apparatus for automating a microelectronic manufacturing process
US6671570B2 (en) * 2000-10-17 2003-12-30 Brooks Automation, Inc. System and method for automated monitoring and assessment of fabrication facility
US20040044435A1 (en) * 2002-08-30 2004-03-04 Kay Hellig Method and system for handling substrates in a production line including a cluster tool and a metrology tool
US6727106B1 (en) * 2001-07-12 2004-04-27 Advanced Micro Devices, Inc. System and software for statistical process control in semiconductor manufacturing and method thereof
US20040173464A1 (en) * 2001-08-24 2004-09-09 Applied Materials, Inc. Method and apparatus for providing intra-tool monitoring and control
US20040220688A1 (en) * 2003-04-30 2004-11-04 Almuth Behrisch Advanced process control method and advanced process control system for acquiring production data in a chip production installation
US20050010319A1 (en) * 2003-07-09 2005-01-13 Sukesh Patel System and method for validating and visualizing APC assisted semiconductor manufacturing processes
CN1589494A (zh) * 2001-11-16 2005-03-02 先进微装置公司 使用集成度量数据作为前馈数据的方法与装置
US20050052197A1 (en) * 2003-07-14 2005-03-10 Cory Watkins Multi-tool manager

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914879A (en) * 1997-03-04 1999-06-22 Advanced Micro Devices System and method for calculating cluster tool performance metrics using a weighted configuration matrix
US6456894B1 (en) 1999-06-01 2002-09-24 Applied Materials, Inc. Semiconductor processing techniques
US7257454B2 (en) * 2003-11-21 2007-08-14 Taiwan Semiconductor Manufacturing Company, Ltd. Dynamically adjusting the distribution for dispatching lot between current and downstream tool by using expertise weighting mechanism
US6999848B2 (en) 2003-12-19 2006-02-14 Intel Corporation Process control apparatus, systems, and methods
TWI236044B (en) * 2004-05-12 2005-07-11 Powerchip Semiconductor Corp System and method for real-time dispatching batch in manufacturing process

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030176940A1 (en) * 1997-12-02 2003-09-18 Rangachari Murali D. Method and apparatus for automating a microelectronic manufacturing process
US6303395B1 (en) * 1999-06-01 2001-10-16 Applied Materials, Inc. Semiconductor processing techniques
US6671570B2 (en) * 2000-10-17 2003-12-30 Brooks Automation, Inc. System and method for automated monitoring and assessment of fabrication facility
US6727106B1 (en) * 2001-07-12 2004-04-27 Advanced Micro Devices, Inc. System and software for statistical process control in semiconductor manufacturing and method thereof
US20040173464A1 (en) * 2001-08-24 2004-09-09 Applied Materials, Inc. Method and apparatus for providing intra-tool monitoring and control
CN1589494A (zh) * 2001-11-16 2005-03-02 先进微装置公司 使用集成度量数据作为前馈数据的方法与装置
US20040044435A1 (en) * 2002-08-30 2004-03-04 Kay Hellig Method and system for handling substrates in a production line including a cluster tool and a metrology tool
US20040220688A1 (en) * 2003-04-30 2004-11-04 Almuth Behrisch Advanced process control method and advanced process control system for acquiring production data in a chip production installation
US20050010319A1 (en) * 2003-07-09 2005-01-13 Sukesh Patel System and method for validating and visualizing APC assisted semiconductor manufacturing processes
US20050052197A1 (en) * 2003-07-14 2005-03-10 Cory Watkins Multi-tool manager

Also Published As

Publication number Publication date
US20060293778A1 (en) 2006-12-28
JP2007003528A (ja) 2007-01-11
TW200715160A (en) 2007-04-16
CN1885049A (zh) 2006-12-27
US7187993B2 (en) 2007-03-06
JP4398441B2 (ja) 2010-01-13
US7065425B1 (en) 2006-06-20

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Effective date of registration: 20171116

Address after: Grand Cayman, Cayman Islands

Patentee after: GLOBALFOUNDRIES INC.

Address before: American New York

Patentee before: Core USA second LLC

Effective date of registration: 20171116

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Patentee after: Core USA second LLC

Address before: American New York

Patentee before: International Business Machines Corp.

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Granted publication date: 20090805

Termination date: 20190621

CF01 Termination of patent right due to non-payment of annual fee