JP2006527481A5 - - Google Patents
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- Publication number
- JP2006527481A5 JP2006527481A5 JP2006513139A JP2006513139A JP2006527481A5 JP 2006527481 A5 JP2006527481 A5 JP 2006527481A5 JP 2006513139 A JP2006513139 A JP 2006513139A JP 2006513139 A JP2006513139 A JP 2006513139A JP 2006527481 A5 JP2006527481 A5 JP 2006527481A5
- Authority
- JP
- Japan
- Prior art keywords
- lid wafer
- subwavelength structures
- structures
- wafer
- refractive index
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 claims 24
- 238000005530 etching Methods 0.000 claims 12
- 239000000463 material Substances 0.000 claims 12
- 239000000945 filler Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims 1
- 230000003667 anti-reflective effect Effects 0.000 claims 1
- 238000002329 infrared spectrum Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/428,745 US6897469B2 (en) | 2003-05-02 | 2003-05-02 | Sub-wavelength structures for reduction of reflective properties |
| PCT/US2004/012088 WO2004099064A1 (en) | 2003-05-02 | 2004-04-19 | Anti-reflective sub-wavelengh structures for silicon wafers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006527481A JP2006527481A (ja) | 2006-11-30 |
| JP2006527481A5 true JP2006527481A5 (enExample) | 2007-05-24 |
Family
ID=33310488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006513139A Withdrawn JP2006527481A (ja) | 2003-05-02 | 2004-04-19 | シリコンウエハ用の反射防止サブ波長構造 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6897469B2 (enExample) |
| EP (1) | EP1620353A1 (enExample) |
| JP (1) | JP2006527481A (enExample) |
| WO (1) | WO2004099064A1 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7276798B2 (en) * | 2002-05-23 | 2007-10-02 | Honeywell International Inc. | Integral topside vacuum package |
| JP2005321524A (ja) * | 2004-05-07 | 2005-11-17 | Seiko Epson Corp | 光源装置およびプロジェクタ |
| KR100584972B1 (ko) * | 2004-06-11 | 2006-05-29 | 삼성전기주식회사 | 밀봉용 스페이서가 형성된 mems 패키지 및 그 제조 방법 |
| US7262412B2 (en) * | 2004-12-10 | 2007-08-28 | L-3 Communications Corporation | Optically blocked reference pixels for focal plane arrays |
| US7528061B2 (en) | 2004-12-10 | 2009-05-05 | L-3 Communications Corporation | Systems and methods for solder bonding |
| US7412441B2 (en) * | 2005-05-31 | 2008-08-12 | Microsoft Corporation | Predictive phonetic data search |
| US7655909B2 (en) * | 2006-01-26 | 2010-02-02 | L-3 Communications Corporation | Infrared detector elements and methods of forming same |
| US7459686B2 (en) * | 2006-01-26 | 2008-12-02 | L-3 Communications Corporation | Systems and methods for integrating focal plane arrays |
| US7462831B2 (en) * | 2006-01-26 | 2008-12-09 | L-3 Communications Corporation | Systems and methods for bonding |
| US7462931B2 (en) * | 2006-05-15 | 2008-12-09 | Innovative Micro Technology | Indented structure for encapsulated devices and method of manufacture |
| US7718965B1 (en) * | 2006-08-03 | 2010-05-18 | L-3 Communications Corporation | Microbolometer infrared detector elements and methods for forming same |
| US7687304B2 (en) * | 2006-11-29 | 2010-03-30 | Innovative Micro Technology | Current-driven device using NiMn alloy and method of manufacture |
| US8153980B1 (en) | 2006-11-30 | 2012-04-10 | L-3 Communications Corp. | Color correction for radiation detectors |
| US7968986B2 (en) * | 2007-05-07 | 2011-06-28 | Innovative Micro Technology | Lid structure for microdevice and method of manufacture |
| FR2917910B1 (fr) * | 2007-06-22 | 2010-06-11 | Thales Sa | Dispositif de lumiere optimisee par l'utilisation de materiaux artificiels et procede de fabrication associe |
| JP5424730B2 (ja) * | 2009-06-12 | 2014-02-26 | 三菱電機株式会社 | 光学フィルタの製造方法 |
| JP2011002546A (ja) * | 2009-06-17 | 2011-01-06 | Mitsubishi Electric Corp | 光学フィルタ |
| US8765514B1 (en) | 2010-11-12 | 2014-07-01 | L-3 Communications Corp. | Transitioned film growth for conductive semiconductor materials |
| US8980676B2 (en) | 2012-06-25 | 2015-03-17 | Raytheon Company | Fabrication of window cavity cap structures in wafer level packaging |
| US12332408B2 (en) * | 2022-08-23 | 2025-06-17 | Apple Inc. | Anti-reflective optical structures for optical systems |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6014251A (en) * | 1997-04-08 | 2000-01-11 | The United States Of America As Represented By The Secretary Of The Navy | Optical filters based on uniform arrays of metallic waveguides |
| US6195478B1 (en) * | 1998-02-04 | 2001-02-27 | Agilent Technologies, Inc. | Planar lightwave circuit-based optical switches using micromirrors in trenches |
| US6359333B1 (en) * | 1998-03-31 | 2002-03-19 | Honeywell International Inc. | Wafer-pair having deposited layer sealed chambers |
| EP0951069A1 (en) * | 1998-04-17 | 1999-10-20 | Interuniversitair Microelektronica Centrum Vzw | Method of fabrication of a microstructure having an inside cavity |
| US6791757B2 (en) | 1999-07-12 | 2004-09-14 | Coho Holdings, Llc | Optical device for filtering and sensing |
| US6707518B1 (en) | 1999-07-12 | 2004-03-16 | Coho Holdings, Llc | Electro-optic device allowing wavelength tuning |
| US6363183B1 (en) * | 2000-01-04 | 2002-03-26 | Seungug Koh | Reconfigurable and scalable intergrated optic waveguide add/drop multiplexing element using micro-opto-electro-mechanical systems and methods of fabricating thereof |
| WO2001056921A2 (en) | 2000-02-02 | 2001-08-09 | Raytheon Company | Vacuum package fabrication of microelectromechanical system devices with integrated circuit components |
| JP2002015565A (ja) * | 2000-06-29 | 2002-01-18 | Mitsubishi Electric Corp | 半導体記憶装置 |
| EP1286187A3 (en) * | 2001-08-06 | 2004-08-11 | Coho Holdings, LLC | Optical device for filtering and sensing |
-
2003
- 2003-05-02 US US10/428,745 patent/US6897469B2/en not_active Expired - Lifetime
-
2004
- 2004-04-19 WO PCT/US2004/012088 patent/WO2004099064A1/en not_active Ceased
- 2004-04-19 JP JP2006513139A patent/JP2006527481A/ja not_active Withdrawn
- 2004-04-19 EP EP04760558A patent/EP1620353A1/en not_active Withdrawn
- 2004-10-19 US US10/968,588 patent/US7220621B2/en not_active Expired - Fee Related
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