JP2006527481A - シリコンウエハ用の反射防止サブ波長構造 - Google Patents

シリコンウエハ用の反射防止サブ波長構造 Download PDF

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Publication number
JP2006527481A
JP2006527481A JP2006513139A JP2006513139A JP2006527481A JP 2006527481 A JP2006527481 A JP 2006527481A JP 2006513139 A JP2006513139 A JP 2006513139A JP 2006513139 A JP2006513139 A JP 2006513139A JP 2006527481 A JP2006527481 A JP 2006527481A
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Japan
Prior art keywords
lid wafer
subwavelength structures
lid
wafer
structures
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2006513139A
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English (en)
Japanese (ja)
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JP2006527481A5 (enExample
Inventor
アサナシオス・ジェイ・シライオス
ローランド・ダブリュー・グーチ
トーマス・アール・シマート
エドワード・ジー・マイスナー
Original Assignee
エル−３ コミュニケーションズ コーポレーション
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Publication of JP2006527481A publication Critical patent/JP2006527481A/ja
Publication of JP2006527481A5 publication Critical patent/JP2006527481A5/ja
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G02B1/118—Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
JP2006513139A 2003-05-02 2004-04-19 シリコンウエハ用の反射防止サブ波長構造 Withdrawn JP2006527481A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/428,745 US6897469B2 (en) 2003-05-02 2003-05-02 Sub-wavelength structures for reduction of reflective properties
PCT/US2004/012088 WO2004099064A1 (en) 2003-05-02 2004-04-19 Anti-reflective sub-wavelengh structures for silicon wafers

Publications (2)

Publication Number Publication Date
JP2006527481A true JP2006527481A (ja) 2006-11-30
JP2006527481A5 JP2006527481A5 (enExample) 2007-05-24

Family

ID=33310488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006513139A Withdrawn JP2006527481A (ja) 2003-05-02 2004-04-19 シリコンウエハ用の反射防止サブ波長構造

Country Status (4)

Country Link
US (2) US6897469B2 (enExample)
EP (1) EP1620353A1 (enExample)
JP (1) JP2006527481A (enExample)
WO (1) WO2004099064A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007522648A (ja) * 2003-12-29 2007-08-09 ハネウェル・インターナショナル・インコーポレーテッド 一体型上側真空パッケージ
JP2010286706A (ja) * 2009-06-12 2010-12-24 Mitsubishi Electric Corp 光学フィルタおよびその製造方法
JP2011002546A (ja) * 2009-06-17 2011-01-06 Mitsubishi Electric Corp 光学フィルタ

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005321524A (ja) * 2004-05-07 2005-11-17 Seiko Epson Corp 光源装置およびプロジェクタ
KR100584972B1 (ko) * 2004-06-11 2006-05-29 삼성전기주식회사 밀봉용 스페이서가 형성된 ｍｅｍｓ 패키지 및 그 제조 방법
US7528061B2 (en) 2004-12-10 2009-05-05 L-3 Communications Corporation Systems and methods for solder bonding
US7262412B2 (en) * 2004-12-10 2007-08-28 L-3 Communications Corporation Optically blocked reference pixels for focal plane arrays
US7412441B2 (en) * 2005-05-31 2008-08-12 Microsoft Corporation Predictive phonetic data search
US7462831B2 (en) * 2006-01-26 2008-12-09 L-3 Communications Corporation Systems and methods for bonding
US7655909B2 (en) * 2006-01-26 2010-02-02 L-3 Communications Corporation Infrared detector elements and methods of forming same
US7459686B2 (en) * 2006-01-26 2008-12-02 L-3 Communications Corporation Systems and methods for integrating focal plane arrays
US7462931B2 (en) * 2006-05-15 2008-12-09 Innovative Micro Technology Indented structure for encapsulated devices and method of manufacture
US7718965B1 (en) * 2006-08-03 2010-05-18 L-3 Communications Corporation Microbolometer infrared detector elements and methods for forming same
US7687304B2 (en) * 2006-11-29 2010-03-30 Innovative Micro Technology Current-driven device using NiMn alloy and method of manufacture
US8153980B1 (en) 2006-11-30 2012-04-10 L-3 Communications Corp. Color correction for radiation detectors
US7968986B2 (en) * 2007-05-07 2011-06-28 Innovative Micro Technology Lid structure for microdevice and method of manufacture
FR2917910B1 (fr) * 2007-06-22 2010-06-11 Thales Sa Dispositif de lumiere optimisee par l'utilisation de materiaux artificiels et procede de fabrication associe
US8765514B1 (en) 2010-11-12 2014-07-01 L-3 Communications Corp. Transitioned film growth for conductive semiconductor materials
US8980676B2 (en) * 2012-06-25 2015-03-17 Raytheon Company Fabrication of window cavity cap structures in wafer level packaging
US12332408B2 (en) * 2022-08-23 2025-06-17 Apple Inc. Anti-reflective optical structures for optical systems

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6014251A (en) * 1997-04-08 2000-01-11 The United States Of America As Represented By The Secretary Of The Navy Optical filters based on uniform arrays of metallic waveguides
US6195478B1 (en) * 1998-02-04 2001-02-27 Agilent Technologies, Inc. Planar lightwave circuit-based optical switches using micromirrors in trenches
US6359333B1 (en) * 1998-03-31 2002-03-19 Honeywell International Inc. Wafer-pair having deposited layer sealed chambers
EP0951069A1 (en) * 1998-04-17 1999-10-20 Interuniversitair Microelektronica Centrum Vzw Method of fabrication of a microstructure having an inside cavity
US6791757B2 (en) * 1999-07-12 2004-09-14 Coho Holdings, Llc Optical device for filtering and sensing
US6707518B1 (en) * 1999-07-12 2004-03-16 Coho Holdings, Llc Electro-optic device allowing wavelength tuning
US6363183B1 (en) * 2000-01-04 2002-03-26 Seungug Koh Reconfigurable and scalable intergrated optic waveguide add/drop multiplexing element using micro-opto-electro-mechanical systems and methods of fabricating thereof
JP2003531475A (ja) 2000-02-02 2003-10-21 レイセオン・カンパニー 集積回路コンポーネントを備えたマイクロ電気機械システムデバイスの真空パッケージの製造
JP2002015565A (ja) * 2000-06-29 2002-01-18 Mitsubishi Electric Corp 半導体記憶装置
CA2396859A1 (en) * 2001-08-06 2003-02-06 Coho Holdings, Llc Optical device for filtering and sensing

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007522648A (ja) * 2003-12-29 2007-08-09 ハネウェル・インターナショナル・インコーポレーテッド 一体型上側真空パッケージ
JP2010286706A (ja) * 2009-06-12 2010-12-24 Mitsubishi Electric Corp 光学フィルタおよびその製造方法
JP2011002546A (ja) * 2009-06-17 2011-01-06 Mitsubishi Electric Corp 光学フィルタ

Also Published As

Publication number Publication date
US6897469B2 (en) 2005-05-24
WO2004099064A1 (en) 2004-11-18
US20050054212A1 (en) 2005-03-10
US20040219704A1 (en) 2004-11-04
US7220621B2 (en) 2007-05-22
EP1620353A1 (en) 2006-02-01

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