JP2006512781A - ボディの表面を粗面化する方法及びオプトエレクトロニクスデバイス - Google Patents
ボディの表面を粗面化する方法及びオプトエレクトロニクスデバイス Download PDFInfo
- Publication number
- JP2006512781A JP2006512781A JP2005506700A JP2005506700A JP2006512781A JP 2006512781 A JP2006512781 A JP 2006512781A JP 2005506700 A JP2005506700 A JP 2005506700A JP 2005506700 A JP2005506700 A JP 2005506700A JP 2006512781 A JP2006512781 A JP 2006512781A
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- Prior art keywords
- etching
- mask
- mask layer
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
- H01L21/3081—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their composition, e.g. multilayer masks, materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
- H01L21/3083—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/3086—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
Abstract
Description
第1の工程でボディの表面をマスク層で被覆する。
0.1< t/b <10。
0.25< t/b <5。
図1は、マスク層及びマスク成形体が設けられているエッチングすべきボディを示す。
0.25 < t/b < 5。
Claims (19)
- 次の工程:
a) ボディ(1)の表面をマスク層(2)で被覆する工程
b) 予め成形されたマスク成形体(3)を前記マスク層(2)上に設ける工程
c) 前記マスク成形体(3)により覆われていない位置の前記マスク層(2)を貫通エッチングする工程
d) 前記マスク層(2)から露出した箇所のボディ(1)の表面をエッチングする工程
を有する、ボディ(1)の表面を粗面化する方法。 - ボディ(1)がリン化アルミニウムガリウムインジウムを含有する、請求項1記載の方法。
- ボディ(1)が窒化アルミニウムガリウムインジウムを含有する、請求項1記載の方法。
- マスク層(2)が誘電体からなる、請求項1から3までのいずれか1項記載の方法。
- 予め成形されたマスク成形体(3)としてポリスチレンからなる球を使用する、請求項1から4までのいずれか1項記載の方法。
- エッチング工程を、ドライエッチング法を用いて実施する、請求項1から5までのいずれか1項記載の方法。
- 構造(4)の幅(b)のエッチング深さ(t)に対する比が次の条件:
0.1 < t/b < 10
に該当する構造(4)が、ボディ(1)の表面に残留するように方法を実施する、請求項1から6までのいずれか1項記載の方法。 - 構造(4)の幅(b)のエッチング深さ(t)に対する比が次の条件:
0.25 < t/b < 5
に該当する構造(4)が、ボディ(1)の表面に残留するように方法を実施する、請求項1から7までのいずれか1項記載の方法。 - 工程c)の直後に、マスク成形体(3)の残りをマスク層(2)から除去する、請求項1から8までのいずれか1項記載の方法。
- ボディ(1)中のエッチング深さ(t)が50〜100nmである、請求項1から9までのいずれか1項記載の方法。
- 10〜100nmの厚さ(d)を有するマスク層(2)を設ける、請求項1から10までのいずれか1項記載の方法。
- マスク成形体(3)はマスク層(2)上で150〜300nmの側方の大きさ(A)を有する、請求項1から11までのいずれか1項記載の方法。
- 第1のエッチング工程を、マスク成形体(3)がボディ(1)よりも著しくエッチングされるプロセス工程を用いて行う、請求項1から12までのいずれか1項記載の方法。
- マスク層(2)の貫通エッチングを、反応性イオンエッチング用の装置を用いて行う、請求項1から13までのいずれか1項記載の方法。
- エッチングガスとして、CHF3とArとからなる混合物を使用する、請求項14記載の方法。
- ボディ(1)のエッチングを、誘導結合高周波プラズマのために適した装置を用いて行う、請求項1から15までのいずれか1項記載の方法。
- エッチングガスとして、CH4とH2とからなる混合物を使用する、請求項16記載の方法。
- リン化アルミニウムガリウムインジウムを含有し、かつ表面が構造化されている半導体ボディを有し、その際、構造(4)の深さ(t)と比べた構造(4)の幅(b)について:
0.25 < t/b < 5
が該当する、オプトエレクトロニクスデバイス。 - 窒化アルミニウムガリウムインジウムを含有し、かつ表面が構造化されている半導体ボディを有し、その際、構造(4)の深さ(t)と比べた構造(4)の幅(b)について:
0.25 < t/b < 5
が該当する、オプトエレクトロニクスデバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10261426 | 2002-12-30 | ||
DE10306779A DE10306779A1 (de) | 2002-12-30 | 2003-02-18 | Verfahren zum Aufrauhen einer Oberfläche eines Körpers und optoelektronisches Bauelement |
PCT/DE2003/004197 WO2004061980A1 (de) | 2002-12-30 | 2003-12-18 | Verfahren zum aufrauhen einer oberfläche eines körpers und optoelektronisches bauelement |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006512781A true JP2006512781A (ja) | 2006-04-13 |
Family
ID=32714763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005506700A Pending JP2006512781A (ja) | 2002-12-30 | 2003-12-18 | ボディの表面を粗面化する方法及びオプトエレクトロニクスデバイス |
Country Status (4)
Country | Link |
---|---|
US (1) | US20060151428A1 (ja) |
EP (1) | EP1579511B1 (ja) |
JP (1) | JP2006512781A (ja) |
WO (1) | WO2004061980A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008091880A (ja) * | 2006-08-22 | 2008-04-17 | Agency For Science Technology & Research | マイクロおよびナノ構造の作製方法 |
JP2011146522A (ja) * | 2010-01-14 | 2011-07-28 | Panasonic Corp | 基板の加工方法 |
US8361339B2 (en) | 2008-01-04 | 2013-01-29 | Kabushiki Kaisha Toshiba | Antireflection structure formation method and antireflection structure |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5082504B2 (ja) * | 2006-03-31 | 2012-11-28 | 日亜化学工業株式会社 | 発光素子及び発光素子の製造方法 |
JP2008270416A (ja) * | 2007-04-18 | 2008-11-06 | Sanken Electric Co Ltd | 物体に粗面を形成する方法 |
WO2009084325A1 (ja) * | 2007-12-28 | 2009-07-09 | Mitsubishi Chemical Corporation | Led素子およびled素子の製造方法 |
DE102009023355A1 (de) | 2009-05-29 | 2010-12-02 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils |
WO2011062791A2 (en) * | 2009-11-17 | 2011-05-26 | 3M Innovative Properties Company | Texturing surface of light-absorbing substrate |
DE102011012608A1 (de) | 2011-02-28 | 2012-08-30 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung von Lichtauskoppelstrukturen in einem Halbleiterkörper und Licht emittierender Halbleiterkörper |
US8759127B2 (en) * | 2011-08-31 | 2014-06-24 | Toshiba Techno Center Inc. | Gold micromask for roughening to promote light extraction in an LED |
US9831361B2 (en) * | 2012-12-14 | 2017-11-28 | Robert Bosch Gmbh | Method of fabricating nanocone texture on glass and transparent conductors |
CN114613844B (zh) * | 2022-03-14 | 2023-09-15 | 中国工程物理研究院电子工程研究所 | 一种纳米空气沟道电子器件的小型化阵列化制备方法 |
Family Cites Families (20)
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US3739217A (en) * | 1969-06-23 | 1973-06-12 | Bell Telephone Labor Inc | Surface roughening of electroluminescent diodes |
US4407695A (en) * | 1981-12-31 | 1983-10-04 | Exxon Research And Engineering Co. | Natural lithographic fabrication of microstructures over large areas |
US5256587A (en) * | 1991-03-20 | 1993-10-26 | Goldstar Electron Co., Ltd. | Methods of patterning and manufacturing semiconductor devices |
US5753130A (en) * | 1992-05-15 | 1998-05-19 | Micron Technology, Inc. | Method for forming a substantially uniform array of sharp tips |
US5240558A (en) * | 1992-10-27 | 1993-08-31 | Motorola, Inc. | Method for forming a semiconductor device |
US5342453A (en) * | 1992-11-13 | 1994-08-30 | Midwest Research Institute | Heterojunction solar cell |
RU2074444C1 (ru) * | 1994-07-26 | 1997-02-27 | Евгений Инвиевич Гиваргизов | Матричный автоэлектронный катод и электронный прибор для оптического отображения информации |
US5624529A (en) * | 1995-05-10 | 1997-04-29 | Sandia Corporation | Dry etching method for compound semiconductors |
US5676853A (en) * | 1996-05-21 | 1997-10-14 | Micron Display Technology, Inc. | Mask for forming features on a semiconductor substrate and a method for forming the mask |
US5949182A (en) * | 1996-06-03 | 1999-09-07 | Cornell Research Foundation, Inc. | Light-emitting, nanometer scale, micromachined silicon tips |
US5717226A (en) * | 1996-09-18 | 1998-02-10 | Industrial Technology Research Institute | Light-emitting diodes and method of manufacturing the same |
US6201342B1 (en) * | 1997-06-30 | 2001-03-13 | The United States Of America As Represented By The Secretary Of The Navy | Automatically sharp field emission cathodes |
US6228538B1 (en) * | 1998-08-28 | 2001-05-08 | Micron Technology, Inc. | Mask forming methods and field emission display emitter mask forming methods |
US6350388B1 (en) * | 1999-08-19 | 2002-02-26 | Micron Technology, Inc. | Method for patterning high density field emitter tips |
US6410942B1 (en) * | 1999-12-03 | 2002-06-25 | Cree Lighting Company | Enhanced light extraction through the use of micro-LED arrays |
CH696179A5 (de) * | 2000-06-08 | 2007-01-31 | Satis Vacuum Ind Vertriebs Ag | Plasma-Verdampfungsquelle für eine Vakuum Beschichtungsanordnung zum Aufbringen von Vergütungsschichten auf optische Substrate. |
JP3704030B2 (ja) * | 2000-07-24 | 2005-10-05 | シャープ株式会社 | 半導体装置の製造方法 |
JP3466144B2 (ja) * | 2000-09-22 | 2003-11-10 | 士郎 酒井 | 半導体の表面を荒くする方法 |
US6782021B2 (en) * | 2001-03-02 | 2004-08-24 | Xiaodong Huang | Quantum dot vertical cavity surface emitting laser |
US6541317B2 (en) * | 2001-05-03 | 2003-04-01 | International Business Machines Corporation | Polysilicon doped transistor |
-
2003
- 2003-12-18 EP EP03795768A patent/EP1579511B1/de not_active Expired - Fee Related
- 2003-12-18 US US10/541,298 patent/US20060151428A1/en not_active Abandoned
- 2003-12-18 WO PCT/DE2003/004197 patent/WO2004061980A1/de active Application Filing
- 2003-12-18 JP JP2005506700A patent/JP2006512781A/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008091880A (ja) * | 2006-08-22 | 2008-04-17 | Agency For Science Technology & Research | マイクロおよびナノ構造の作製方法 |
US8361339B2 (en) | 2008-01-04 | 2013-01-29 | Kabushiki Kaisha Toshiba | Antireflection structure formation method and antireflection structure |
US8840258B2 (en) | 2008-01-04 | 2014-09-23 | Kabushiki Kaisha Toshiba | Antireflection structure formation method and antireflection structure |
JP2011146522A (ja) * | 2010-01-14 | 2011-07-28 | Panasonic Corp | 基板の加工方法 |
Also Published As
Publication number | Publication date |
---|---|
US20060151428A1 (en) | 2006-07-13 |
EP1579511B1 (de) | 2012-03-28 |
WO2004061980A1 (de) | 2004-07-22 |
EP1579511A1 (de) | 2005-09-28 |
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