JP2006505936A - 位置決め装置の少なくとも2つの要素を動かす方法、及び、かかる位置決め装置 - Google Patents
位置決め装置の少なくとも2つの要素を動かす方法、及び、かかる位置決め装置 Download PDFInfo
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- JP2006505936A JP2006505936A JP2004549478A JP2004549478A JP2006505936A JP 2006505936 A JP2006505936 A JP 2006505936A JP 2004549478 A JP2004549478 A JP 2004549478A JP 2004549478 A JP2004549478 A JP 2004549478A JP 2006505936 A JP2006505936 A JP 2006505936A
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- moved
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Abstract
Description
Claims (10)
- 位置決め装置の少なくとも2つの要素を、所定の方向及びその反対の方向に動かし、第1の要素を用いて第2の要素が動かされる方法であって、
前記第1の要素が前記所定の方向に動かされるのと同時に、前記第2の要素が、前記所定の方向に対して反対の方向に前記第1の要素に対して動かされることを特徴とする、方法。 - 前記第1の要素は、前記第2の要素が前記反対の方向に動かされる距離と略等しい距離を、前記所定の方向に動かされることを特徴とする、請求項1記載の方法。
- 前記第1の要素は、前記第2の要素が前記反対の方向に動かされる速度と略等しい速度で、前記所定の方向に動かされることを特徴とする、請求項1又は2記載の方法。
- 前記第2の要素は、また、前記所定の方向に対して横断して延びる横断方向に動かされることを特徴とする、請求項1乃至3のうちいずれか一項記載の方法。
- 前記第2の要素は、前記所定の方向に対して横断して延びる位置決めの方向で前記第2の要素に対して動かされる、構成部品位置決め要素を有することを特徴とする、請求項1乃至4のうちいずれか一項記載の方法。
- 前記第2の要素は、画像を生成し得る画像センサを有することを特徴とする、請求項1乃至5のうちいずれか一項記載の方法。
- 所定の方向及びその反対の方向に動かされ得る2つの可動な要素を有し、
第1の要素を用いて第2の要素が動かされる、
請求項1乃至6のうちいずれか一項記載の方法を実行するのに好適な位置決め装置であって、
前記第1の要素及び前記第2の要素は、前記所定の方向及びその反対の方向に互いに対して動かされ得ることを特徴とする、装置。 - 前記第2の要素は、前記所定の方向に対して横断して延びる横断方向に動かされ得ることを特徴とする、請求項7記載の位置決め装置。
- 前記第2の要素は、前記所定の方向に対して横断して延びる位置決めの方向で前記第2の要素に対して動かされ得る、構成部品位置決め要素を有することを特徴とする、請求項7又は8記載の位置決め装置。
- 前記第2の要素は、画像センサを有することを特徴とする、請求項7乃至9のうちいずれか一項記載の位置決め装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02079684 | 2002-11-08 | ||
PCT/IB2003/004928 WO2004043126A1 (en) | 2002-11-08 | 2003-11-04 | Method for moving at least two elements of a placement machine as well as such a placement machine |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006505936A true JP2006505936A (ja) | 2006-02-16 |
JP4326474B2 JP4326474B2 (ja) | 2009-09-09 |
Family
ID=32309423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004549478A Expired - Fee Related JP4326474B2 (ja) | 2002-11-08 | 2003-11-04 | 位置決め装置の少なくとも2つの要素を動かす方法、及び、かかる位置決め装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7716822B2 (ja) |
EP (1) | EP1559302A1 (ja) |
JP (1) | JP4326474B2 (ja) |
AU (1) | AU2003274570A1 (ja) |
WO (1) | WO2004043126A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060075631A1 (en) * | 2004-10-05 | 2006-04-13 | Case Steven K | Pick and place machine with improved component pick up inspection |
EP2009979B1 (de) * | 2007-06-26 | 2012-11-28 | ASM Assembly Systems GmbH & Co. KG | Vorrichtung und Verfahren zum Bestücken von Substraten mit Bauelementen |
EP2343165A1 (en) * | 2010-01-07 | 2011-07-13 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | System and method for picking and placement of chip dies |
WO2018060765A1 (en) * | 2016-09-29 | 2018-04-05 | Assembleon B.V. | Component placement device and method of driving the same |
Family Cites Families (28)
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US1467504A (en) * | 1922-06-12 | 1923-09-11 | Sabarros Louis | Apparatus for the mechanical handling of goods |
US3822801A (en) * | 1972-11-17 | 1974-07-09 | W Morgan | Vehicle rack |
JPS60171799A (ja) * | 1984-02-17 | 1985-09-05 | 松下電器産業株式会社 | 電子部品自動装着装置 |
JPS62114289A (ja) * | 1985-11-14 | 1987-05-26 | 松下電器産業株式会社 | 電子部品の装着方法および装置 |
JPS62292328A (ja) * | 1986-06-12 | 1987-12-19 | Matsushita Electric Ind Co Ltd | 部品装着方法 |
JP2503082B2 (ja) * | 1989-09-05 | 1996-06-05 | 富士機械製造株式会社 | 電子部品装着装置 |
JPH0821790B2 (ja) * | 1990-02-15 | 1996-03-04 | 松下電器産業株式会社 | ロータリーヘッド式電子部品実装装置 |
US5224636A (en) * | 1992-03-13 | 1993-07-06 | Bounds Dayne L | Utility rack |
US5645292A (en) * | 1995-08-29 | 1997-07-08 | Mcwilliams; James Scott | ATV trailer |
JP3196626B2 (ja) * | 1995-12-26 | 2001-08-06 | ソニー株式会社 | 部品実装方法 |
SG52900A1 (en) * | 1996-01-08 | 1998-09-28 | Matsushita Electric Ind Co Ltd | Mounting apparatus of electronic components and mounting methods of the same |
US5662451A (en) * | 1996-03-25 | 1997-09-02 | Pa-Paw's, Llc | Game hoist |
SE9603750D0 (sv) * | 1996-10-14 | 1996-10-14 | Mydata Automation Ab | Plockhuvud för komponentmonteringsmaskin |
JPH10229298A (ja) | 1997-02-17 | 1998-08-25 | Matsushita Electric Ind Co Ltd | 電子部品装着装置 |
US5911556A (en) * | 1997-07-31 | 1999-06-15 | Caldwell; Thomas Marion | All-terrain vehicle deer caddy |
US5964565A (en) * | 1998-04-23 | 1999-10-12 | Skotzky; Harvey Steven | Deer lifting device for all terrain vehicles |
JP4108840B2 (ja) | 1998-09-22 | 2008-06-25 | 松下電器産業株式会社 | 電子部品実装装置の動作制御方法 |
JP3983394B2 (ja) * | 1998-11-09 | 2007-09-26 | 株式会社ルネサステクノロジ | 幾何学処理プロセッサ |
JP4480840B2 (ja) * | 2000-03-23 | 2010-06-16 | パナソニック株式会社 | 部品実装装置、及び部品実装方法 |
US6461095B1 (en) * | 2000-08-11 | 2002-10-08 | David P. Puska | ATV lift and carry apparatus |
US6869265B2 (en) * | 2000-11-06 | 2005-03-22 | Jack L. Smith | Lift device |
DE10064108A1 (de) * | 2000-12-21 | 2002-07-18 | Siemens Production & Logistics | Bestückkopf und Bestücksystem für eine Bestückvorrichtung zum Bestücken von Bauelementen |
US6589004B2 (en) * | 2001-05-01 | 2003-07-08 | Dennis W. Reed | All terrain vehicle lift |
US7239399B2 (en) * | 2001-11-13 | 2007-07-03 | Cyberoptics Corporation | Pick and place machine with component placement inspection |
US6638001B1 (en) * | 2002-02-11 | 2003-10-28 | Mckinley Perry A. | Game lifting apparatus |
US6769858B1 (en) * | 2002-05-09 | 2004-08-03 | Adron E. Butler | Method and apparatus for loading cargo on an ATV |
DE10228555B4 (de) * | 2002-06-26 | 2004-07-15 | Siemens Ag | Vorrichtung zum Abholen von IC's von einem Wafer |
TW200419640A (en) * | 2003-02-25 | 2004-10-01 | Matsushita Electric Ind Co Ltd | Electronic component placement machine and electronic component placement method |
-
2003
- 2003-11-04 AU AU2003274570A patent/AU2003274570A1/en not_active Abandoned
- 2003-11-04 WO PCT/IB2003/004928 patent/WO2004043126A1/en active Application Filing
- 2003-11-04 JP JP2004549478A patent/JP4326474B2/ja not_active Expired - Fee Related
- 2003-11-04 US US10/534,109 patent/US7716822B2/en not_active Expired - Fee Related
- 2003-11-04 EP EP03758545A patent/EP1559302A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO2004043126A1 (en) | 2004-05-21 |
EP1559302A1 (en) | 2005-08-03 |
AU2003274570A1 (en) | 2004-06-07 |
US7716822B2 (en) | 2010-05-18 |
JP4326474B2 (ja) | 2009-09-09 |
US20060123627A1 (en) | 2006-06-15 |
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