JP2006337945A - Correction system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a correction system that reduces the installation space, and conduct correction operation of the whole face in a substrate. <P>SOLUTION: A correction part 30 is installed at a position where a defect included in either region obtained, by dividing a substrate 2 into two equal parts with a straight line in the Y-axis direction can be corrected. The slash parts of the substrate 2 are regions where defects can be corrected by the correction part 30, and also are regions capable of being photographed by an imaging part 50. The movement distance of moving the substrate 2 to the X-axis direction, i.e., the movement distance of an X-axis stage 13 is the distance obtained by adding the distance between the correction part 30 and the imaging part 50 and the distance that is half the length of the side in the substrate parallel to the X-axis direction. Namely, the movement distance of the X-axis stage 13 is reduced by the distance that is half the length of the side in the substrate parallel to the X-axis direction, as compared with the moving distance, in the case it is installed in the position at which all defects included in the regions of the substrate can be corrected. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a correction apparatus for correcting a defect such as a substrate, and more particularly, in manufacturing a semiconductor or a liquid crystal display, a movable stage on which a substrate such as a wafer having a defective portion or a glass substrate is mounted is moved. The present invention relates to a correction device that corrects a defect position of a substrate by positioning it at a position for correction.

  Conventionally, in the manufacture of semiconductors or liquid crystal displays, with the goal of improving yields, repairing defective parts of a substrate has been carried out in order to repair a repairable substrate such as a wafer or glass substrate in which a defect has been detected. We are trying to improve the yield rate by using correction equipment.

  As a conventional technique for correcting a defect such as a substrate, there is a defect correcting apparatus for correcting a color loss defect of a color filter for a liquid crystal display device. This defect correction apparatus detects a defect position of a defect correction object on an XY table by a CCD (Charge Coupled Device) camera, moves the XY table, and irradiates the detected defect position with a laser beam to detect a defect portion. Then, ink is applied to the removed portion to repair the defect (for example, see Patent Document 1).

JP 2001-166129 A

  In the field of liquid crystal, the glass substrate has been increased in size, and accordingly, the apparatus has to be increased in size, which has a great influence on the site area of the factory or the occupation ratio of the apparatus on the floor of the building. In particular, in the case of an apparatus configuration in which the imaging mechanism or the correction mechanism is fixed to the upper part of the apparatus and the target position is observed or corrected by moving the substrate mounted on the stage, the footprint of the apparatus, that is, the installation area is An area that is at least four times the size is required, and the device itself is considerably larger.

  The above-described prior art is an apparatus configuration in which an XY table on which a substrate is placed, that is, a stage is moved, and a defective portion of the substrate is corrected at a correction position where the correction mechanism corrects the substrate. As the size increases, it is necessary to increase the size of the correction device, and there is a problem that the correction device requires a larger installation area. In order to reduce the installation area of the correction device for such a device configuration, a device configuration in which the position of the substrate is fixed and the correction unit is moved is also conceivable, but when the correction mechanism moves on the substrate, Dust generated as a result of movement may be a factor causing defects, and is not considered to be an apparatus configuration that can be employed.

  An object of the present invention is to provide a correction device that can reduce the installation area and can perform correction work on the entire surface of the substrate.

The present invention includes a first moving stage on which a substrate is placed;
A second moving stage on which the first moving stage is movably mounted in the first direction;
A fixed stage on which the second moving stage is movably mounted in a second direction orthogonal to the first direction;
Driving means for moving the first moving stage in the first direction and the second moving stage in the second direction;
A correction means for correcting a defect of the substrate placed on the first moving stage, facing a correction surface having a defect among the surfaces of the substrate placed on the first moving stage, Correction means installed on a fixed member fixed to a fixed stage;
Storage means for storing defect position information representing the position of a defect on the substrate;
The defect position information is read from the storage means, the drive means is controlled, the substrate placed on the first moving stage is moved to the defect position indicated by the defect position information, and the defect on the substrate is corrected by the correction means. Control means,
The correction means is a rectangle including a correction surface of the substrate placed on the first moving stage, and one of the minimum rectangular areas whose one side is parallel to the second direction is the rectangle in the second direction. The correction apparatus is installed at a position where a defect included in one of the two regions divided by a straight line can be corrected.

  According to the present invention, first, the substrate is placed by the first moving stage, the first moving stage is placed movably in the first direction by the second moving stage, and the fixed stage, The second moving stage is placed so as to be movable in a second direction orthogonal to the first direction, and defect position information indicating the position of the defect on the substrate is stored by the storage means.

  Next, it is a correction means for correcting the defect of the substrate placed on the first moving stage, and faces the correction surface having the defect out of the surfaces of the substrate placed on the first moving stage. The correction means installed on the fixing member fixed to the fixed stage is a rectangle including the correction surface of the substrate placed on the first moving stage, and one side is parallel to the second direction. Among the rectangular regions, the defect is included in one of the two regions divided by a straight line in the second direction so that a defect can be corrected.

  Further, the defect position information is read from the storage means by the control means, and the driving means for moving the first moving stage in the first direction and the second moving stage in the second direction is controlled. The substrate placed on the first moving stage is moved to the defect position indicated by the defect position information, and the defect of the substrate is corrected by the correcting means.

  As described above, the correction means is a rectangle including the correction surface of the substrate, and one side of the minimum rectangular area parallel to the second direction is divided into two equal parts by a straight line in the second direction. Since it is installed at a position where a defect included in one area can be corrected, the movement distance of the substrate may be a movement distance for correcting a defect in one area of the substrate, and the substrate is rotated 180 degrees. Thus, it is possible to correct a defect included in the other region obtained by dividing the rectangle into two equal parts.

The present invention is also a substrate transfer means capable of placing a substrate on a first moving stage, wherein the direction of the substrate can be rotated about a direction perpendicular to the correction surface as a rotation axis. Further comprising means,
The control means is a region of the correction surface of the substrate, and the substrate is predetermined on the first moving stage before placing the substrate on which the defect of the substrate has not been corrected yet on the first moving stage. It is determined whether or not there is a defect in the first region that enters the one of the two divided regions when placed in the direction. If there is a defect, the substrate is transferred to the substrate transfer means. When the substrate is placed on the first moving stage in a predetermined direction and there is no defect, the substrate carrying means is placed on the first moving stage in a direction rotated by 180 degrees with respect to the predetermined direction. It is characterized by that.

  According to the present invention, before the substrate that has not yet been corrected for defects on the substrate is placed on the first moving stage, it is an area on the correction surface of the substrate, and the substrate is previously placed on the first moving stage. It is determined whether or not there is a defect in the first region that enters one of the two regions divided when placed in a predetermined direction. If there is no defect, the substrate is transferred to the substrate transfer means in advance. Since the substrate is rotated 180 degrees with respect to the predetermined direction and placed on the first moving stage, it is possible to omit placing and removing the substrate in a direction in which there is no defect to be corrected.

In the present invention, the substrate transfer means can further remove the substrate placed on the first moving stage,
When the control unit corrects all the defects in the first region, the control unit causes the substrate transfer unit to remove the substrate from the first moving stage, and then removes the first region from the correction surface region of the substrate. It is determined whether or not there is a defect in the second region, and when there is a defect, the substrate transport unit rotates the removed substrate by 180 degrees and places it on the first moving stage, A defect existing in the second region is corrected by the correcting means.

  According to the present invention, after the correcting means corrects all the defects in the first region, the substrate transporting means is present when there is a defect in the second region other than the first region in the correction surface region of the substrate. In addition, the substrate is rotated 180 degrees and is re-mounted on the first moving stage, and the defect present in the second region is corrected by the correcting means. Therefore, the substrate transport means is rotated in the direction of the substrate. The defect in the area that has not been corrected can be corrected.

  Further, in the present invention, when the substrate is rotated 180 degrees on the substrate transfer means, the control means rotates the position indicated by the defect position information read from the storage means when the substrate is positioned at the correction position by 180 degrees. It is characterized by being positioned at a position converted into a position.

  According to the present invention, when the substrate is rotated 180 degrees, when the substrate is positioned at the correction position, the position indicated by the defect position information is positioned at the position converted into the position rotated 180 degrees, so that the position of the substrate is corrected correctly. Can be positioned.

Further, the present invention is an imaging means for photographing a predetermined area, and is fixed to the fixing member at a position separated from the correction means by a predetermined distance in a first direction so as to face the correction surface. Further comprising imaging means,
The imaging means is installed at a position on the straight line passing through a second direction that bisects the rectangle that has been moved to the maximum in the direction of the imaging means with respect to the correction means. It is characterized by.

  According to the present invention, when the imaging unit is provided, the imaging unit has a straight line in the second direction that bisects the rectangle that is moved to the correction unit in the direction of the imaging unit to the maximum in the first direction. Since it is installed at the upper position, the movement distance of the substrate can be halved.

  According to the present invention, the moving distance of the first moving stage is a distance obtained by adding the distance between the correcting means and the imaging means and a distance that is half the length of the side parallel to the first direction. It is characterized by being.

  According to the present invention, the moving distance of the first moving stage is a distance obtained by adding the distance between the correcting unit and the imaging unit and the half of the length of the side parallel to the first direction. The length of the fixed stage in the first direction can be shortened by half the length of the rectangle including the substrate in the first direction.

  According to the present invention, the movement distance of the substrate may be a movement distance for correcting a defect in one region of the substrate, and is included in the other region obtained by dividing the rectangle into two equal parts by rotating the substrate by 180 degrees. Since defects can be corrected, the installation area can be reduced and the entire substrate can be corrected.

  Further, according to the present invention, it is possible to omit the placement and removal of the substrate in the direction in which there is no defect to be corrected, so that the working time can be shortened.

  Further, according to the present invention, since the substrate transport means can be rotated in the direction of the substrate to correct the defect in the uncorrected area, the correction work for the entire surface of the substrate can be automated.

  Further, according to the present invention, since the position of the substrate is correctly positioned at the correction position, it is possible to perform correction by rotating the substrate.

  Further, according to the present invention, since the movement distance of the substrate can be halved, the width of the apparatus can be reduced to a maximum of half the movement distance of the substrate.

  Further, according to the present invention, the length of the fixed stage in the first direction can be shortened by half the length in the first direction of the rectangle including the substrate. It can be reduced by half the width of the containing rectangle in the first direction.

  FIG. 1 is a diagram showing a configuration of a correction device 1 according to an embodiment of the present invention. The correction device 1 is a device for correcting a defect on the substrate. FIG. 1 shows the correction device 1 to which the defect inspection device 3 is connected. The defect inspection apparatus 3 detects a defect on the substrate, generates defect position information indicating the position of the defect on the substrate, and stores the generated defect position information in the storage unit of the correction apparatus 1 connected to the defect inspection apparatus 3. 80.

  The correction apparatus 1 includes a stage unit 10 to be described later, a control unit 20 to be described later, a correction unit 30 to correct a defective portion of the substrate, transport of the substrate, rotation of the direction of the substrate, placement of the substrate on the stage unit 10, and stage A substrate transport unit 40 configured by a substrate transport robot that takes out the substrate from the unit 10, an image capturing unit 50 that captures an image of the substrate to observe a defect state of the substrate, and an image captured by the image capturing unit 50 Connected to the image processing unit 60 that performs image processing on the display unit 70 and displays the image sent from the image processing unit 60, and the defect inspection apparatus 3. A storage unit 80 including a storage device such as a magnetic disk device that stores defect position information is included. The correction unit 30, the substrate transport unit 40, the imaging unit 50, the image processing unit 60, the display unit 70, and the storage unit 80 are based on conventional techniques, and detailed description thereof is omitted.

  The stage unit 10 moves the substrate so that the defect position of the substrate is positioned at the correction position of the correction unit 30 in order to correct the defect of the substrate by the correction unit 30, and details will be described later. The control unit 20 is configured by a memory unit such as a CPU (Central Processing Unit) and a semiconductor memory, for example, and by causing the CPU to execute a program stored in the memory unit, the stage unit 10, the correction unit 30, and the substrate transport unit 40. The image processing unit 60 is controlled, and the defect position information is read from the storage unit 80. The control unit 10 includes a correction unit control unit 21 that controls the correction unit 30, a stage movement control unit 22 that controls the stage unit 10, and a defect information reading unit 23 that reads defect position information from the storage unit 80. The correction unit control unit 21, the stage movement control unit 22, and the defect information reading unit 23 are functions realized by causing the CPU to execute a program stored in the memory unit.

  FIG. 2 is a diagram illustrating a configuration of the stage unit 110 according to the related art. The stage unit 110 includes a fixed stage 111 serving as a base of the stage unit 110, a Y-axis stage 112 mounted on the fixed stage 111 so as to be movable in the Y-axis direction illustrated in FIG. An X-axis stage 113 movably mounted in the X-axis direction shown in FIG. 2, a fixed member 114 fixed to the fixed stage 111, a motor (not shown) that moves the Y-axis stage 112 and the X-axis stage 113, etc. Including a drive unit.

  The substrate 2 is placed on the X-axis stage 113 by the substrate transport unit 40. The correction unit 115 that corrects a defective portion of the substrate 2 and the imaging unit 116 that captures an image of the substrate 2 in order to observe the defect state of the substrate 2, etc. are among the surfaces of the substrate 2 placed on the X-axis stage 113. The fixing member 114 is placed so as to face the correction surface having a defect. The correction unit 115 and the imaging unit 116 are installed on the same line in the X-axis direction.

  The placement direction of the substrate 2 on the X-axis stage 113 is always the same direction. In order for the correction unit 115 to correct all defects on the substrate, the X-axis stage shown in FIG. It is necessary to move 113 to the both sides centering on the position of the correction unit 115 at least in the range of the length in the X-axis direction of the substrate. Similarly, in the Y-axis direction shown in FIG. 2, it is necessary to move the Y-axis stage 112 to both sides centering on the position of the correction unit 115 at least within the range of the length in the Y-axis direction of the substrate. Furthermore, considering the imaging unit 116 that is installed away from the correction unit 115 in the X-axis direction, the X-axis direction has a moving range that is further moved by the distance between the correction unit 115 and the imaging unit 116. It needs to be bigger. The four rectangles of the two-dot chain line shown in FIG. 2, that is, the four rectangles at the upper right and lower right of the correction unit 115 and the upper left and lower left of the imaging unit 116 are the four rectangles that must move the substrate 2 to the minimum. Indicates the position.

  Specifically, for example, if the length of the substrate 2 in the X-axis direction is B and the distance between the correction unit 115 and the imaging unit 116 is A, the movement distance of the substrate 2 moving in the X-axis direction is the X-axis stage. The movement distance of 113 is A + B, and the movement range of the X-axis stage 113 is A + 2B. If the minimum required length other than the movement range of the X-axis stage 113 to configure the stage unit 110 is C, the stage unit 110 needs to have a length of at least A + 2B + C in the X-axis direction.

  FIG. 3 is a diagram showing a configuration of the stage unit 10 shown in FIG. The stage unit 10 includes a fixed stage 11 serving as a base of the stage unit 10, a Y-axis stage 12 mounted on the fixed stage 11 so as to be movable in the Y-axis direction illustrated in FIG. 3 is a driving means for moving the X-axis stage 13 movably mounted in the X-axis direction shown in FIG. 3, the fixed member 14 fixed to the fixed stage 11, the Y-axis stage 12 and the X-axis stage 13. And a drive unit including a motor (not shown).

  The substrate 2 is placed on the X-axis stage 13 by the substrate transport unit 40. The correction unit 30 and the imaging unit 50 are installed on the fixing member 14 so as to face a correction surface having a defect among the surfaces of the substrate 2 placed on the X-axis stage 13. The correction unit 30 and the imaging unit 50 are installed on the same line in the X-axis direction.

  The stage unit 10 is different from the stage unit 110 illustrated in FIG. 2 in the length in the X-axis direction and the installation positions of the correction unit 115 and the imaging unit 116. The correction unit 30 is installed at a position where a defect included in one region obtained by dividing the substrate 2 into two equal parts by a straight line in the Y-axis direction can be corrected. For example, the correction unit 30 and the imaging unit 50 illustrated in FIG. 3 are installed at a position where a defect existing in the left half of the substrate 2 can be photographed and corrected. That is, the imaging unit 50 is installed at a position on a straight line in the Y-axis direction that bisects the substrate 2 at a position that is moved to the maximum in the direction of the imaging unit 50 with respect to the correction unit 30 in the X-axis direction. The The hatched portion of the substrate 2 shown in FIG. 3 is a region where the defect can be corrected by the correction unit 30 and a region which can be imaged by the imaging unit 60. Hereinafter, the shaded area is referred to as a correctable area.

  The movement distance for moving the substrate 2 in the X-axis direction, that is, the movement distance of the X-axis stage 13 is a distance that is half the distance between the correction unit 30 and the imaging unit 50 and the side length of the substrate parallel to the X-axis direction. It is the distance which added and. That is, the moving distance of the X-axis stage 13 is the length of the side of the substrate parallel to the X-axis direction, compared to the moving distance when the X-axis stage 13 is installed at a position where all defects included in the substrate area can be corrected. Less than half the distance.

  Specifically, for example, if the length of the substrate 2 in the X-axis direction is B and the distance between the correction unit 30 and the imaging unit 50 is A, the movement distance of the X-axis stage 13 is A + 0.5B, and the X-axis The moving range of the stage 13 is A + 1.5B. If the minimum necessary length other than the movement range of the X axis stage 13 is C in order to configure the stage unit 10, the stage unit 10 needs to have a length of at least A + 1.5B + C in the X axis direction. Therefore, the length of the stage unit 10 in the X-axis direction is half the length of the substrate 2 in the X-axis direction, that is, a length of 0. 0, compared to the length of the stage unit 110 shown in FIG. 5B can be shortened, and the region of the two-dot chain line portion at the left end shown in FIG. 3 can be reduced.

  The substrate 2 shown in FIG. 3 has been described with respect to a case where one side of the substrate 2 is a rectangle parallel to the X-axis direction. However, the present invention can also be applied to a case where the substrate 2 is not rectangular. In this case, it is a rectangle including the correction surface of the substrate 2 and a minimum rectangle in which one side of the rectangle is parallel to the X-axis direction is assumed, and the assumed rectangle is the rectangle of the two-dot chain line portion shown in FIG. I think that. For example, the length of the substrate 2 in the X-axis direction may be replaced with the assumed rectangular length in the X-axis direction. When one side of the substrate 2 is parallel to the X-axis, one side of the assumed rectangle is the X-axis. Can be considered to be parallel.

  In this way, considering the minimum rectangle including the correction surface of the substrate 2, the correction unit 30 as the correction means is a rectangle including the correction surface of the substrate, and one side is the Y-axis direction that is the second direction. Of the smallest parallel rectangular areas, the rectangle is divided into two equal parts by a straight line in the second direction, so that the defect included in one of the areas can be corrected. The moving distance for correcting the defect in one of the two regions may be sufficient, and by rotating the substrate by 180 degrees, the defect included in the other region obtained by dividing the rectangle into two equal parts can also be corrected. Therefore, the installation area can be reduced, and the entire substrate can be corrected.

  Further, the imaging unit 50 that is the imaging unit bisects the rectangle that has been moved in the direction of the imaging unit to the maximum with respect to the correction unit 30 that is the correction unit in the X-axis direction that is the first direction. Since it is installed at a position on a straight line passing in the Y-axis direction which is the second direction, the movement distance of the substrate can be halved. Therefore, the width of the apparatus can be reduced to a half of the movement distance of the substrate at the maximum.

  Furthermore, the moving distance of the X-axis stage 13 that is the first moving stage is parallel to the distance between the correcting unit 30 that is the correcting unit and the imaging unit 50 that is the imaging unit, and the X-axis direction that is the first direction. Therefore, the length of the fixed stage in the first direction is shortened by half the length of the rectangle including the substrate in the first direction. be able to. Accordingly, the installation area can be reduced by a width that is half the length of the rectangle including the substrate in the first direction.

  FIG. 4 is a flowchart illustrating a processing procedure performed by the control unit 20 illustrated in FIG. When the defect position information of the substrate is stored in the storage unit 80 and the substrate 2 is set in the substrate transfer unit 40, the process proceeds to step S1.

  In step S <b> 1, the defect information reading unit 23 reads defect position information from the storage unit 80. When the substrate 2 is placed on the X-axis stage 13 in a predetermined direction (hereinafter, referred to as a positive direction) among the regions of the correction surface of the substrate 2, the controller 20 has a defect in the region that enters the correctable region. Whether or not to do so is confirmed based on the read defect position information, and the mounting direction of the substrate 2 is determined. When there is a defect, the direction is the forward direction, and when there is no defect, the direction of the substrate 2 is the direction rotated 180 degrees with respect to the forward direction (hereinafter referred to as the reverse direction).

  FIG. 5 is a diagram illustrating an example of defect position information read from the storage unit 80 illustrated in FIG. 1. The defect position information is created for each substrate, “substrate ID (Identification)” for identifying the substrate, “No.” indicating the number assigned to each defect, “size” indicating the size of the defect by rank, And information such as “coordinates” representing the position of the defect. FIG. 5 shows defect position information and “substrate orientation” information indicating the direction in which the substrate 2 should be placed on the X-axis stage 13 when correcting each defect. The rank of the defect size is represented by, for example, S, M, L, and O in ascending order. The coordinates represent the position of the defect on the substrate detected by the defect inspection apparatus 3 by XY coordinates in the substrate coordinate system. For example, “40, 50” indicates that the X coordinate is 40 and the Y coordinate is 50. ing.

  In the position defect information shown in FIG. 5, “substrate ID: ABC0123456” indicating that the substrate ID is ABC0123456 is shown, and below that, a “No.” column, a “size” column, and a “coordinate”. Columns are shown with specific examples for six defects. Each No. The size and coordinates for No. No. 1 defect has size “S” and coordinates “10, 10”, no. No. 2 defect has size “S” and coordinates “40, 50”, no. 3 defects are size “L” and coordinates “90, 80”, no. No. 4 defect has size “O” and coordinates “100, 90”, No. 4 The defect No. 5 has a size “M” and coordinates “200, 250”, No. 5 Six defects are size “L” and coordinates “220, 40”.

  The “substrate orientation” information is information generated by the control unit 20 by determining, for each defect, the direction in which the substrate 2 should be placed on the X-axis stage 13 based on the defect position information. The substrate orientation information shown in FIG. 1-No. The defect of No. 4 is “correct”. 5 and no. The defect of 6 is indicated as “reverse”. “Normal” indicates the forward direction, and “Reverse” indicates the reverse direction. The “substrate orientation” information is generated in step S1 of the flowchart shown in FIG.

  Referring to FIG. 4, in step S <b> 2, control unit 20 determines whether or not there is a defect that should be placed and corrected in the forward direction. When there is a defect to be corrected by being mounted in the forward direction, the substrate 2 is transferred to the X-axis stage 13 in the forward direction, that is, transferred and placed in the substrate transfer unit 40 constituted by a substrate transfer robot or the like. To instruct. When there is no defect to be corrected in the forward direction, an instruction is given to place the substrate 2 on the X-axis stage 13 in the reverse direction. Further, when the orientation of the substrate 2 is reversed in step S9 described later, an instruction is given to place the substrate 2 on the X-axis stage 13 in the opposite direction. The substrate transport unit 40 transports the substrate 2 and places it on the X-axis stage 13 in the designated direction.

  In this way, it is determined whether or not there is a defect to be corrected by placing in the forward direction. If there is no defect to be corrected in the forward direction, the substrate 2 is placed on the X-axis stage 13 in the reverse direction. Therefore, mounting and removal in the positive direction can be omitted.

  That is, before placing the substrate on which the defect of the substrate has not been corrected yet on the X-axis stage 13 that is the first moving stage, the substrate is a region of the correction surface of the substrate and the substrate is moved to the first moving stage. It is determined whether or not there is a defect in the first region that falls into one of the two divided areas when placed in the positive direction which is a predetermined direction on the substrate. Since the substrate is rotated 180 degrees with respect to a predetermined direction and placed on the first moving stage in the substrate transport unit 40 as a means, the placement and removal of the substrate in the direction without the defect to be corrected is omitted. can do. Therefore, the working time can be shortened.

  Since the substrate shown in FIG. 5 has a defect that is placed and corrected in the forward direction and a defect that is placed and corrected in the reverse direction, the control unit 20 places the substrate 2 in the X direction in the forward direction. The substrate transfer unit 40 is instructed to be placed on the stage 13. If there is no defect that is mounted and corrected in the forward direction and no defect that is mounted and corrected in the reverse direction, the process is terminated without performing the correction operation on the substrate. Thus, since the board | substrate which does not need correction is sorted, the correction apparatus 1 can be used also when the board | substrate which does not need correction is contained.

  In step S <b> 3, the stage movement control unit 22 positions the defect position of the defect to be corrected at the correction position of the correction unit 30. When the operator selects a defect to be corrected, it is positioned at the position of the defect designated by the operator. The stage movement control means 22 controls the drive unit so that the coordinate position on the correction surface of the substrate 2 and indicated by the coordinates of the defect position information matches the correction position of the correction unit 30. The Y-axis stage 12 and the X-axis stage 13 are moved. When the substrate 2 is placed on the X-axis stage 13 in the reverse direction, the stage movement control unit 22 converts the coordinate position indicated by the defect position information into a position obtained by rotating the correction surface of the substrate 2 by 180 degrees, The converted coordinate position is positioned at the correction position of the correction unit 30. When the imaging unit 50 is used, the operator confirms the defect position based on the image captured by the imaging unit 50 and displayed on the display unit 70. When the position is shifted, the operator corrects the position. be able to.

  As described above, when the substrate 2 is placed on the X-axis stage 13 in the reverse direction, that is, when the substrate is rotated 180 degrees, the position indicated by the defect position information is 180 when the substrate is positioned at the correction position. Therefore, the position of the substrate can be correctly positioned at the correction position. Therefore, it is possible to perform correction by rotating the substrate.

  In step S4, the correction unit control means 21 instructs the correction unit 30 to correct the defective part. When receiving the correction instruction, the correction unit 30 corrects the defective portion located at the correction position. The correction unit 30 depends on the type of substrate to be corrected and the type of defect to be corrected. For example, the correction unit 30 performs laser processing on pixel defects of the color filter, and applies an ink jet coating apparatus to the processed portion. A device for performing defect correction by means of the above, or a device for performing laser cutting in order to correct a defective portion of wiring.

  In step S <b> 5, the control unit 20 determines, based on the defect position information, whether or not a defect that has not yet been corrected exists in the correctable region for the substrate 2 placed on the X-axis stage 13. . If there is a defect that has not been corrected in the correctable area, the process returns to step S3. When all the defects existing in the correctable area have been corrected, the process proceeds to step S6. The substrate shown in FIG. 2-No. Since the defect No. 4 is a defect to be corrected in a state where it is placed in the positive direction, the process returns to Step S3. No. When four defects are corrected, the process proceeds to step S6. After the substrate 2 is placed in the reverse direction, in this step S5, No. It is determined whether or not 6 defects have been corrected. No. If the defects up to 6 have not been corrected, the process returns to step S3, and When it is corrected to 6, the process proceeds to step S6.

  In step S6, the control unit 20 confirms the direction in which the substrate 2 is placed. If the substrate 2 is placed in the forward direction, the process proceeds to step S7, and if placed in the reverse direction, the process proceeds to step S10. In step S <b> 7, the control unit 20 determines whether there is a defect to be corrected by placing the substrate 2 in the reverse direction based on the defect position information. When there is a defect to be corrected by placing in the reverse direction, the process proceeds to step S8, and when there is no defect to be corrected by placing in the reverse direction, the process proceeds to step S10.

  In step S <b> 8, the control unit 20 instructs the substrate transfer unit 40 to carry out, that is, take out, the substrate 2 placed on the stage unit 10. The substrate transport unit 40 removes the substrate 2 from the X-axis stage 13. In step S9, the control unit 20 instructs the substrate transport unit 40 to turn the substrate 2 in the forward direction in the reverse direction. The substrate transport unit 40 rotates the substrate 2 180 degrees from the normal direction to reverse the direction, and returns to step S2. In step S <b> 10, the control unit 20 instructs the substrate transport unit 40 to carry out, that is, remove the substrate 2 placed on the X-axis stage 13. The substrate transport unit 40 removes the substrate from the X-axis stage 13 and ends the process.

  In the flowchart shown in FIG. 4, in step S6, the direction in which the substrate is placed is confirmed. Only when the substrate 2 is placed in the forward direction, in step S7, the substrate is placed in the reverse direction and corrected. Whether or not there is a defect to be determined is determined based on the defect position information, but step S6 and step S7 are combined into one, and the direction of the substrate on which the substrate is placed is rotated 180 degrees. Whether or not there is a defect to be corrected is determined based on the defect position information. If there is a defect to be corrected, the process proceeds to step S8. If there is no defect to be corrected, the process proceeds to step S10. Good.

  As described above, after the correction unit 30 as the correction unit corrects all the defects that can be corrected in the state where the substrate is placed, that is, the defect in the first region, the first of the regions on the correction surface of the substrate. When there is a defect in the second region excluding the region, the substrate transport unit rotates the substrate 180 degrees and re-mounts the substrate on the first moving stage, and the defect present in the second region is Since the correction means corrects the defect, it is possible to correct the defect in the uncorrected region by rotating the direction of the substrate to the substrate transport means. Therefore, the correction work for the entire surface of the substrate can be automated.

  In the above-described embodiment, the substrate 2 is transported, placed, rotated, and taken out by the substrate transport unit 40 configured by a substrate transport robot or the like. May be performed. In this case, the correction device 1 displays the direction in which the substrate is placed on, for example, the display unit 70, and the operator places the substrate on the X-axis stage 13 in the direction displayed on the display unit 70.

It is a figure which shows the structure of the correction apparatus 1 which is one Embodiment of this invention. It is a figure which shows the structure of the stage part 110 by a prior art. It is a figure which shows the structure of the stage part 10 shown in FIG. It is a flowchart which shows the process sequence which the control part 20 shown in FIG. 1 processes. It is a figure which shows an example of the defect position information read from the memory | storage part 80 shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Correction apparatus 2 Board | substrate 3 Defect inspection apparatus 10,110 Stage part 11,111 Fixed stage 12,112 Y-axis stage 13,113 X-axis stage 14,114 Fixed member 20 Control part 21 Correction part control means 22 Stage movement control means 23 Defect information reading means 30, 115 Correction unit 40 Substrate transport unit 50, 116 Imaging unit 60 Image processing unit 70 Display unit 80 Storage unit

Claims (6)

A first moving stage on which a substrate is placed;
A second moving stage on which the first moving stage is movably mounted in the first direction;
A fixed stage on which the second moving stage is movably mounted in a second direction orthogonal to the first direction;
Driving means for moving the first moving stage in the first direction and the second moving stage in the second direction;
A correction means for correcting a defect of the substrate placed on the first moving stage, facing a correction surface having a defect among the surfaces of the substrate placed on the first moving stage, Correction means installed on a fixed member fixed to a fixed stage;
Storage means for storing defect position information representing the position of a defect on the substrate;
The defect position information is read from the storage means, the drive means is controlled, the substrate placed on the first moving stage is moved to the defect position indicated by the defect position information, and the defect on the substrate is corrected by the correction means. Control means,
The correction means is a rectangle including a correction surface of the substrate placed on the first moving stage, and one of the minimum rectangular areas whose one side is parallel to the second direction is the rectangle in the second direction. A correction apparatus, wherein the correction apparatus is installed at a position where a defect included in one of the two regions divided by a straight line can be corrected. A substrate transfer means capable of placing the substrate on the first moving stage, further comprising a substrate transfer means capable of rotating the direction of the substrate with a direction perpendicular to the correction surface as a rotation axis;
The control means is a region of the correction surface of the substrate, and the substrate is predetermined on the first moving stage before placing the substrate on which the defect of the substrate has not been corrected yet on the first moving stage. It is determined whether or not there is a defect in the first region that enters the one of the two divided regions when placed in the direction. If there is a defect, the substrate is transferred to the substrate transfer means. When the substrate is placed on the first moving stage in a predetermined direction and there is no defect, the substrate carrying means is placed on the first moving stage in a direction rotated by 180 degrees with respect to the predetermined direction. The correction device according to claim 1. The substrate transfer means can further remove the substrate placed on the first moving stage,
When the control unit corrects all the defects in the first region, the control unit causes the substrate transfer unit to remove the substrate from the first moving stage, and then removes the first region from the correction surface region of the substrate. It is determined whether or not there is a defect in the second region, and when there is a defect, the substrate transport unit rotates the removed substrate by 180 degrees and places it on the first moving stage, The correction apparatus according to claim 2, wherein the correction unit corrects a defect existing in the second region.   When the substrate is rotated 180 degrees on the substrate transfer means, the control means converts the position indicated by the defect position information read from the storage means into a position rotated 180 degrees when positioning the substrate at the correction position. The correction device according to claim 2, wherein the correction device is positioned at a position. Imaging means for photographing a predetermined region, further comprising: an imaging means fixed to the fixing member so as to face the correction surface at a predetermined distance from the correction means in a first direction. Including
The imaging means is installed at a position on the straight line passing through a second direction that bisects the rectangle that has been moved to the maximum in the direction of the imaging means with respect to the correction means. The correction device according to any one of claims 1 to 4.   The moving distance of the first moving stage is a distance obtained by adding a distance between the correcting means and the imaging means and a distance that is half the length of a side parallel to the first direction. The correction device according to claim 5.

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