JP2006332614A5 - - Google Patents
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- JP2006332614A5 JP2006332614A5 JP2006117481A JP2006117481A JP2006332614A5 JP 2006332614 A5 JP2006332614 A5 JP 2006332614A5 JP 2006117481 A JP2006117481 A JP 2006117481A JP 2006117481 A JP2006117481 A JP 2006117481A JP 2006332614 A5 JP2006332614 A5 JP 2006332614A5
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- Prior art keywords
- insulating film
- gate electrode
- organic transistor
- organic
- gate insulating
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- 239000004065 semiconductor Substances 0.000 claims 12
- 239000002131 composite material Substances 0.000 claims 7
- 238000004519 manufacturing process Methods 0.000 claims 6
- 239000000463 material Substances 0.000 claims 6
- 229910044991 metal oxide Inorganic materials 0.000 claims 5
- 150000004706 metal oxides Chemical class 0.000 claims 5
- 238000000034 method Methods 0.000 claims 5
- 150000002894 organic compounds Chemical class 0.000 claims 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 4
- 229910052750 molybdenum Inorganic materials 0.000 claims 4
- 239000011733 molybdenum Substances 0.000 claims 4
- 229910052758 niobium Inorganic materials 0.000 claims 4
- 239000010955 niobium Substances 0.000 claims 4
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims 4
- 238000009832 plasma treatment Methods 0.000 claims 4
- 229910052715 tantalum Inorganic materials 0.000 claims 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 4
- 239000010936 titanium Substances 0.000 claims 4
- 229910052719 titanium Inorganic materials 0.000 claims 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 150000004982 aromatic amines Chemical group 0.000 claims 2
- 229910052804 chromium Inorganic materials 0.000 claims 2
- 239000011651 chromium Substances 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 229910052735 hafnium Inorganic materials 0.000 claims 2
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims 2
- 229910052702 rhenium Inorganic materials 0.000 claims 2
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 2
- 229910052721 tungsten Inorganic materials 0.000 claims 2
- 239000010937 tungsten Substances 0.000 claims 2
- 229910052720 vanadium Inorganic materials 0.000 claims 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims 2
- 229910052726 zirconium Inorganic materials 0.000 claims 2
Claims (14)
前記ゲート電極表面を絶縁化して形成されたゲート絶縁膜と、
前記ゲート絶縁膜に接して形成された有機半導体材料を含む半導体層とを有することを特徴とする有機トランジスタ。 A gate electrode;
A gate insulating film formed by insulating the surface of the gate electrode ;
Organic transistor and having a semiconductor layer containing an organic semiconductor material formed in contact with the gate insulating film.
前記ゲート電極表面を絶縁化して形成されたゲート絶縁膜と、
前記ゲート絶縁膜に接して形成された有機半導体材料を含む半導体層と、
前記半導体層の少なくとも一部に接して形成された導電層と、前記導電層と前記半導体層との間に形成された有機化合物及び金属酸化物との複合層とを有するソース及びドレイン電極とを有することを特徴とする有機トランジスタ。 A gate electrode;
A gate insulating film formed by insulating the surface of the gate electrode ;
A semiconductor layer including an organic semiconductor material formed in contact with the gate insulating film ;
Said semiconductor layer at least partially in contact conductive formed layer, and the source and drain electrodes to have a composite layer of an organic compound and a metal oxide which is formed between the semiconductor layer and the conductive layer An organic transistor comprising:
前記ゲート絶縁膜は、前記ゲート電極表面に対し、電子密度電子密度が1011cm−3以上、かつ電子温度が0.2eV以上2.0eV以下の高密度プラズマ処理を行うことによって形成されることを特徴とする有機トランジスタ。 In claim 1 or claim 2,
The gate insulating film, with respect to the gate electrode surface, the electron density electron densities 10 11 cm -3 or more, and the electron temperature is formed by performing 2.0eV or less of a high-density plasma treatment or 0.2eV An organic transistor characterized by
前記ゲート絶縁膜は、前記ゲート電極表面に対し、電子密度電子密度が1011cm−3以上、かつ電子温度が0.5eV以上1.5eV以下の高密度プラズマ処理を行うことによって形成されることを特徴とする有機トランジスタ。 In claim 1 or claim 2,
The gate insulating film, with respect to the gate electrode surface, the electron density electron density of 10 11 cm -3 or more, and the electron temperature is formed by performing 1.5eV or less of a high-density plasma treatment or 0.5eV An organic transistor characterized by
前記ゲート電極は、タンタル、ニオブ、アルミニウム、モリブデン、チタン、銅から選ばれた一又は複数の材料を含むことを特徴とする有機トランジスタ。 Any one to Oite of claims 1 to 4,
The organic transistor, wherein the gate electrode includes one or more materials selected from tantalum, niobium, aluminum, molybdenum, titanium, and copper.
前記ゲート絶縁膜は、8以上の誘電率を有することを特徴とする有機トランジスタ。 Any one to Oite of claims 1 to 5,
The organic transistor , wherein the gate insulating film has a dielectric constant of 8 or more.
前記有機化合物は、芳香族アミン骨格を有することを特徴とする有機トランジスタ。 It claims 2 to Oite to any one of claims 6,
2. The organic transistor according to claim 1, wherein the organic compound has an aromatic amine skeleton.
前記金属酸化物は、チタン、バナジウム、クロム、ジルコニウム、ニオブ、モリブデン、ハフニウム、タンタル、タングステン、レニウムの酸化物から選ばれた一又は複数であることを特徴とする有機トランジスタ。 Any one to Oite of claims 2 to 7,
2. The organic transistor according to claim 1, wherein the metal oxide is one or more selected from oxides of titanium, vanadium, chromium, zirconium, niobium, molybdenum, hafnium, tantalum, tungsten, and rhenium.
前記ゲート電極表面を、電子密度が1011cm−3以上かつ電子温度が0.2eV以上2.0eV以下の高密度プラズマ処理により絶縁化してゲート絶縁膜を形成し、
前記ゲート絶縁膜上に有機半導体材料を含む半導体層を形成し、
前記半導体層上に、有機化合物及び金属酸化物が混合された複合層を形成し、前記複合層上に導電層を形成して、前記複合層と前記導電層を有するソース及びドレイン電極を形成することを特徴とする有機トランジスタの作製方法。 Forming a gate electrode on the substrate;
Insulating the surface of the gate electrode by high density plasma treatment with an electron density of 10 11 cm −3 or more and an electron temperature of 0.2 eV or more and 2.0 eV or less to form a gate insulating film ;
Forming a semiconductor layer containing an organic semiconductor material on the gate insulating film;
On the semiconductor layer, forming a composite layer in which an organic compound and metal oxide are mixed, forming a conductive layer on the composite layer, forming source and drain electrodes having the conductive layer and the composite layer A method for manufacturing an organic transistor.
前記ゲート電極表面を、電子密度が1011cm−3以上かつ電子温度が0.5eV以上1.5eV以下の高密度プラズマ処理により絶縁化してゲート絶縁膜を形成し、
前記ゲート絶縁膜上に有機半導体材料を含む半導体層を形成し、
前記半導体層上に、有機化合物及び金属酸化物が混合された複合層を形成し、前記複合層上に導電層を形成して、前記複合層と前記導電層を有するソース及びドレイン電極を形成することを特徴とする有機トランジスタの作製方法。 Forming a gate electrode on the substrate;
Insulating the surface of the gate electrode by high-density plasma treatment with an electron density of 10 11 cm −3 or more and an electron temperature of 0.5 eV or more and 1.5 eV or less to form a gate insulating film ;
Forming a semiconductor layer containing an organic semiconductor material on the gate insulating film;
On the semiconductor layer, forming a composite layer in which an organic compound and metal oxide are mixed, forming a conductive layer on the composite layer, forming source and drain electrodes having the conductive layer and the composite layer A method for manufacturing an organic transistor.
前記ゲート電極として、タンタル、ニオブ、アルミニウム、モリブデン、チタン、銅から選ばれた一又は複数の材料を用いることを特徴とする有機トランジスタの作製方法。 In claim 9 or claim 10,
Wherein the gate electrode, tantalum, niobium, aluminum, molybdenum, a manufacturing method of an organic transistor, characterized in Rukoto using titanium, one or more materials selected from copper.
前記ゲート絶縁膜は、8以上の誘電率を有することを特徴とする有機トランジスタの作製方法。 In any one of Claims 9 to 11 ,
The gate insulating film, a method for manufacturing an organic transistor, characterized in that it comprises eight or more dielectric constant.
前記有機化合物は、芳香族アミン骨格を有することを特徴とする有機トランジスタの作製方法。 Any one to Oite of claims 9 to 12,
The method for manufacturing an organic transistor, wherein the organic compound has an aromatic amine skeleton.
前記金属酸化物として、チタン、バナジウム、クロム、ジルコニウム、ニオブ、モリブデン、ハフニウム、タンタル、タングステン、レニウムの酸化物から選ばれた一又は複数を用いることを特徴とする有機トランジスタの作製方法。 Any one to Oite of claims 9 to 13,
The metal oxide, titanium, vanadium, chromium, zirconium, niobium, molybdenum, hafnium, tantalum, tungsten, a method for manufacturing an organic transistor, characterized in Rukoto using one or more selected from oxides of rhenium.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2006117481A JP2006332614A (en) | 2005-04-25 | 2006-04-21 | Semiconductor device, organic transistor and manufacturing method thereof |
Applications Claiming Priority (2)
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JP2005125930 | 2005-04-25 | ||
JP2006117481A JP2006332614A (en) | 2005-04-25 | 2006-04-21 | Semiconductor device, organic transistor and manufacturing method thereof |
Publications (2)
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JP2006332614A JP2006332614A (en) | 2006-12-07 |
JP2006332614A5 true JP2006332614A5 (en) | 2009-05-28 |
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JP2006117481A Withdrawn JP2006332614A (en) | 2005-04-25 | 2006-04-21 | Semiconductor device, organic transistor and manufacturing method thereof |
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Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2006126363A1 (en) | 2005-04-22 | 2006-11-30 | Semiconductor Energy Laboratory Co., Ltd. | Electrode for organic transistor, organic transistor, and semiconductor device |
WO2007086534A1 (en) * | 2006-01-26 | 2007-08-02 | Semiconductor Energy Laboratory Co., Ltd. | Organic field effect transistor and semiconductor device |
JP2007250715A (en) * | 2006-03-15 | 2007-09-27 | Konica Minolta Holdings Inc | Process for fabricating semiconductor device |
GB2455096B (en) * | 2007-11-27 | 2011-11-02 | Cambridge Display Tech Ltd | Organic thin film transistors and methods of making the same |
JP5477841B2 (en) * | 2009-05-11 | 2014-04-23 | 健一 中山 | Transistor element |
KR101587097B1 (en) * | 2009-09-30 | 2016-01-21 | 엘지디스플레이 주식회사 | Method of fabricating for dual panel type organic electro-luminescent device |
CN102656690B (en) | 2009-12-25 | 2016-04-20 | 株式会社半导体能源研究所 | Semiconductor device |
JP2011165778A (en) * | 2010-02-08 | 2011-08-25 | Nippon Hoso Kyokai <Nhk> | P-type organic thin film transistor, method of manufacturing the same, and coating solution |
KR101830170B1 (en) | 2011-05-17 | 2018-02-21 | 삼성디스플레이 주식회사 | Oxide semiconductor device, method of forming an oxide semiconductor device, and display device having an oxide semiconductor device, method of manufacturing a display device having an oxide semiconductor device |
CN113196457B (en) * | 2018-12-12 | 2023-06-13 | 夏普株式会社 | Scanning antenna and method for manufacturing scanning antenna |
JP7206887B2 (en) * | 2018-12-19 | 2023-01-18 | 凸版印刷株式会社 | Organic thin film transistors and electronic devices |
Family Cites Families (10)
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JPH06338492A (en) * | 1993-05-31 | 1994-12-06 | Matsushita Electric Ind Co Ltd | Method of forming insulation film and method of manufacturing gate insulation film for thin film transistor |
JP4184686B2 (en) * | 2001-03-28 | 2008-11-19 | 株式会社東芝 | Manufacturing method of semiconductor device |
JP2003133550A (en) * | 2001-07-18 | 2003-05-09 | Matsushita Electric Ind Co Ltd | Semiconductor device and manufacturing method therefor |
WO2003015151A1 (en) * | 2001-08-02 | 2003-02-20 | Tokyo Electron Limited | Base material treating method and electron device-use material |
JP3823312B2 (en) * | 2001-10-18 | 2006-09-20 | 日本電気株式会社 | Organic thin film transistor |
JP2004107651A (en) * | 2002-08-26 | 2004-04-08 | Sharp Corp | Dendritic polymer and electronic device element using the same |
JP4471571B2 (en) * | 2003-01-28 | 2010-06-02 | 大日本印刷株式会社 | Organic semiconductor device, organic semiconductor device, organic electroluminescence device, and organic electroluminescence device |
JP3742906B2 (en) * | 2003-05-08 | 2006-02-08 | シャープ株式会社 | Manufacturing method of semiconductor device |
JP4358563B2 (en) * | 2003-07-02 | 2009-11-04 | 東京エレクトロン株式会社 | Method for forming low dielectric constant insulating film of semiconductor device |
JP4586345B2 (en) * | 2003-09-17 | 2010-11-24 | ソニー株式会社 | Field effect transistor |
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2006
- 2006-04-21 JP JP2006117481A patent/JP2006332614A/en not_active Withdrawn
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