JP2006303139A - Structure and method for fixing electronic component - Google Patents

Structure and method for fixing electronic component Download PDF

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Publication number
JP2006303139A
JP2006303139A JP2005121952A JP2005121952A JP2006303139A JP 2006303139 A JP2006303139 A JP 2006303139A JP 2005121952 A JP2005121952 A JP 2005121952A JP 2005121952 A JP2005121952 A JP 2005121952A JP 2006303139 A JP2006303139 A JP 2006303139A
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electronic component
band
substrate
hole
fixing structure
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Naonori Matsumoto
尚能 松本
Migaku Mizushiro
琢 水城
Toshishige Fukatsu
利成 深津
Kazuyoshi Konya
一善 紺谷
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Toyota Industries Corp
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Toyota Industries Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a structure and a method for fixing an electronic component capable of easily and surely fixing the electronic component to a substrate. <P>SOLUTION: When the electronic component 1 is mounted on the substrate 2; holes 5 each having such a size that a band 3 can pass therethrough, and having a width at one portion less than the length of the cross-section of the band 3 in the longitudinal direction, are formed at the substrate 2 at both sides of the electronic component 1. The band 3 is extended over the electronic component 1 and each of both ends is passed through the hole 5, and each of both ends of the band 3 is twisted near the hole 5, and the band 3 and dummy lands 6 formed around the holes 5 on the surface of the substrate 2 having no electronic component 1 mounted thereon are connected with solder 8. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、基板に搭載される電子部品の固定構造及び固定方法に関する。   The present invention relates to a fixing structure and a fixing method for an electronic component mounted on a substrate.

アルミ電界コンデンサなどの大型の電子部品を基板に固定する方法として、例えば、基板上に「横置き（搭載後の電子部品がリード部分で折り曲げられ電子部品が倒された状態）」にされた電子部品のリードと、基板上の配線と接続されるリード接続用ランドとを半田により電気的に接続した後、電子部品の周りを樹脂などで覆う、いわゆる、ポッティングと呼ばれる固定方法がある。   As a method for fixing a large electronic component such as an aluminum electric field capacitor to a substrate, for example, an electron placed on the substrate in a “horizontal state (the electronic component after being mounted is folded at the lead portion and the electronic component is tilted)” There is a so-called potting fixing method in which a lead of a component and a lead connection land connected to a wiring on a substrate are electrically connected by soldering and then the periphery of the electronic component is covered with a resin or the like.

また、他の固定方法として、例えば、電子部品の一部を覆うようにして保持する保持部材と基板とを半田などを用いて接続し電子部品を基板に固定する方法がある（例えば、特許文献１または特許文献２参照）。
特開２００２−３４５２６２号 （第３〜４頁、第１〜７図） 特開２００４−１９３３８６号 （第４〜７頁、第１〜４図） As another fixing method, for example, there is a method in which a holding member that holds and covers a part of an electronic component and a substrate are connected using solder or the like and the electronic component is fixed to the substrate (for example, Patent Documents). 1 or Patent Document 2).
JP 2002-345262 (pages 3-4, FIGS. 1-7) JP 2004-193386 (pages 4-7, FIGS. 1-4)

しかしながら、ポッティングにより電子部品を基板に固定する方法では、リードとリード接続用ランドとを接続するために基板を半田槽に流すとき、電子部品を基板に完全に密着させることができず、電子部品が基板から浮き上がってしまうことがある。そのため、リードとリード接続用ランドとを接続する際に電子部品が浮き上がってしまった場合では、電子部品の周りを樹脂などで覆った後、再び電子部品が浮き上がってこないように樹脂などが乾くまで電子部品を押さえつけていなければならず電子部品の固定に手間がかかっていた。   However, in the method of fixing the electronic component to the substrate by potting, the electronic component cannot be completely adhered to the substrate when the substrate is passed through the solder bath to connect the lead and the lead connecting land. May float from the substrate. Therefore, if an electronic component is lifted when connecting the lead and the lead connection land, cover the periphery of the electronic component with resin, etc. until the resin is dry so that the electronic component does not lift again. The electronic parts had to be pressed down and it took time and effort to fix the electronic parts.

また、保持部材を用いて電子部品を基板に固定する方法では、半田などにより保持部材と基板とを接続する前に電子部品が基板から浮き上がらないように、保持部材に設けられる足部を基板に設けられる孔に通しさらに足部を折り曲げて基板に引っ掛けたり、足部を鉤状に形成しその足部を基板に引っ掛けたりしておくことが考えられる。しかしながら、足部を基板に引っ掛けておく場合では、保持部材と基板とを接続する前に保持部材と基板との間に多少の「あそび」が生じてしまうため、電子部品を基板にしっかりと固定できないという問題があった。   Further, in the method of fixing the electronic component to the substrate using the holding member, the foot provided on the holding member is attached to the substrate so that the electronic component does not float from the substrate before connecting the holding member and the substrate with solder or the like. It is conceivable that the foot is bent and hooked on the substrate through the hole provided, or the foot is formed in a hook shape and the foot is hooked on the substrate. However, if the feet are hooked on the board, there will be a slight “play” between the holding member and the board before connecting the holding member and the board. There was a problem that I could not.

そこで、本発明では、簡単かつ確実に電子部品を基板に固定することが可能な電子部品の固定構造及び固定方法を提供することを目的とする。   Accordingly, an object of the present invention is to provide an electronic component fixing structure and a fixing method capable of easily and reliably fixing an electronic component to a substrate.

上記の課題を解決するために本発明では、以下のような構成を採用した。
すなわち、本発明の電子部品の固定構造は、基板に搭載される電子部品の固定構造であって、短冊状に形成されたバンドと、前記基板の前記電子部品の両脇にそれぞれ設けられ、前記バンドが通る大きさで、かつ、一部の幅が前記バンドの断面の長手方向よりも短い孔とを備え、前記バンドが前記電子部品に架かりつつ前記バンドの一方端が前記各孔のうちの一方の孔に前記バンドの他方端が前記各孔のうちの他方の孔にそれぞれ通され、前記バンドの両端がそれぞれ前記孔付近でひねられていることを特徴とする。 In order to solve the above problems, the present invention adopts the following configuration.
That is, the electronic component fixing structure of the present invention is an electronic component fixing structure mounted on a substrate, and is provided on both sides of a band formed in a strip shape and the electronic component of the substrate, A band passing through the band and a part of which is shorter than the longitudinal direction of the cross section of the band, and the band spans the electronic component, and one end of the band is included in the holes. The other end of the band is passed through the other hole of each of the holes, and both ends of the band are respectively twisted in the vicinity of the hole.

これにより、バンドの両端をそれぞれ孔付近でひねるだけでバンドの両端をそれぞれ基板に引っ掛けバンドを孔から抜けなくすることができるので、簡単に電子部品を基板に固定することができる。また、バンドをひねった分バンドが縮むため、基板と電子部品との間に「あそび」が生じなくなるまでバンドをひねることにより確実に電子部品を基板に固定することができる。   Thus, by simply twisting both ends of the band in the vicinity of the hole, both ends of the band can be hooked on the substrate to prevent the band from coming out of the hole, so that the electronic component can be easily fixed to the substrate. Further, since the band shrinks by twisting the band, the electronic component can be securely fixed to the substrate by twisting the band until “play” does not occur between the substrate and the electronic component.

また、上記電子部品の固定構造は、前記基板の前記電子部品が搭載されない面の前記孔の周りにダミーランドが設けられ、前記バンドと前記ダミーランドとが半田により接続されていてもよい。   In the electronic component fixing structure, a dummy land may be provided around the hole on the surface of the substrate where the electronic component is not mounted, and the band and the dummy land may be connected by solder.

これにより、より確実に電子部品を基板に固定することができる。
また、上記電子部品の固定構造は、前記基板の前記電子部品が搭載されない面の前記孔の周りにダミーランドが設けられ、前記基板の前記電子部品が搭載されない面の前記電子部品のリードが通る孔の周りにリード接続用ランドが設けられ、前記バンドと前記ダミーランドとが半田により接続されていると共に、前記リードと前記リード接続用ランドが半田により接続されていてもよい。 Thereby, an electronic component can be more reliably fixed to a board | substrate.
In the electronic component fixing structure, a dummy land is provided around the hole on the surface of the substrate on which the electronic component is not mounted, and the lead of the electronic component on the surface of the substrate on which the electronic component is not mounted passes. A lead connection land may be provided around the hole, the band and the dummy land may be connected by solder, and the lead and the lead connection land may be connected by solder.

このように、バンドとダミーランド、リードとリード接続用ランドがそれぞれ半田により基板の同じ面で接続されるため、半田槽などを使用して、バンドとダミーランド、リードとリード接続用ランドをそれぞれ同時に接続することができ、工程を増やすことなく電子部品を基板に固定することができる。   In this way, the band and dummy land, and the lead and lead connection land are connected to each other on the same surface of the substrate by soldering. Therefore, using a solder bath, the band and dummy land, and the lead and lead connection land are each connected. They can be connected simultaneously, and the electronic component can be fixed to the substrate without increasing the number of steps.

また、上記電子部品の固定構造は、前記バンドの断面の長手方向と前記孔の最も短い幅とが同じ方向になるように、前記バンドの両端がそれぞれ前記孔付近でひねられていてもよい。   Further, in the electronic component fixing structure, both ends of the band may be twisted in the vicinity of the hole so that the longitudinal direction of the cross section of the band and the shortest width of the hole are in the same direction.

これにより、バンドの両端をより確実に基板に引っ掛けることができるので、より確実に電子部品を基板に固定することができる。
また、上記電子部品の固定構造は、前記基板と前記電子部品との間にあそびが生じなくなるまでひねられた前記バンドの両端と、前記基板とが接触していてもよい。 As a result, both ends of the band can be more reliably hooked on the substrate, so that the electronic component can be more securely fixed to the substrate.
In the electronic component fixing structure, the substrate may be in contact with both ends of the band twisted until play does not occur between the substrate and the electronic component.

これにより、確実に電子部品を基板に固定することができる。
また、本発明の電子部品の固定方法は、基板に搭載される電子部品の固定方法であって、短冊状に形成されたバンドを前記電子部品に架けつつ前記バンドの一方端を前記基板の前記電子部品の両脇に設けられる各孔のうちの一方の孔に通すと共に前記バンドの他方端を前記各孔のうちの他方の孔に通し、前記バンドの両端をそれぞれ前記孔付近でひねることを特徴とする。 Thereby, an electronic component can be reliably fixed to a board | substrate.
The electronic component fixing method according to the present invention is a method for fixing an electronic component mounted on a substrate, wherein a band formed in a strip shape is hung on the electronic component, and one end of the band is connected to the substrate. Passing through one of the holes provided on both sides of the electronic component, passing the other end of the band through the other hole of the holes, and twisting both ends of the band near the hole. Features.

また、上記電子部品の固定方法は、前記バンドと前記孔の周りに設けられるダミーランドとを半田により接続するようにしてもよい。   In the electronic component fixing method, the band and a dummy land provided around the hole may be connected by solder.

本発明によれば、簡単かつ確実に電子部品を基板に固定することができる。   According to the present invention, an electronic component can be fixed to a substrate easily and reliably.

以下、本発明の実施形態を図面を用いて説明する。
図１（ａ）は、本発明の実施形態の電子部品の固定構造を横から見た図であり、図１（ｂ）は、本発明の実施形態の電子部品の固定構造を上から見た図である。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1A is a side view of an electronic component fixing structure according to an embodiment of the present invention, and FIG. 1B is an upper view of an electronic component fixing structure according to an embodiment of the present invention. FIG.

図１（ａ）及び図１（ｂ）に示す電子部品の固定構造は、アルミ電界コンデンサなどの大型の電子部品１と、基板２と、薄い銅板などを短冊状にして形成されたバンド３とを備えて構成されている。なお、電子部品１は、大電流用のトランジスタなどアルミ電界コンデンサに限定されない。また、バンド３の材質は、鉄など銅に限定されない。   The electronic component fixing structure shown in FIGS. 1 (a) and 1 (b) includes a large electronic component 1 such as an aluminum electric field capacitor, a substrate 2, and a band 3 formed by stripping a thin copper plate or the like. It is configured with. The electronic component 1 is not limited to an aluminum electric field capacitor such as a high current transistor. The material of the band 3 is not limited to copper such as iron.

電子部品１は、リード（電極）４を備え、基板２上に「横置き」で搭載されている。そして、リード４が基板２に設けられる配線と電気的に接続され所定の回路が構成される。
また、電子部品１が基板２に搭載されるときのその基板２の電子部品１の両脇には、それぞれ、楕円形の孔５が設けられている。また、基板２の電子部品１が搭載されない面の孔５の周りには、ダミーランド６が設けられ、基板２の電子部品１が搭載されない面のリード４が通る孔の周りには、リード接続用ランド７が設けられている。 The electronic component 1 includes leads (electrodes) 4 and is mounted “sideways” on the substrate 2. Then, the lead 4 is electrically connected to the wiring provided on the substrate 2 to form a predetermined circuit.
Further, when the electronic component 1 is mounted on the substrate 2, oval holes 5 are provided on both sides of the electronic component 1 of the substrate 2. A dummy land 6 is provided around the hole 5 on the surface of the substrate 2 where the electronic component 1 is not mounted, and lead connection is provided around the hole through which the lead 4 on the surface of the substrate 2 where the electronic component 1 is not mounted. A land 7 is provided.

本実施形態の電子部品の固定構造の特徴とする点は、バンド３を通す大きさで、かつ、孔５の一部の幅（本実施形態では、孔５の最も短い直径）がバンド３の断面の長手方向よりも短くなるように孔５が形成され、バンド３が電子部品１に架かりつつバンド３の一方端が一方の孔５にバンド３の他方端が他方の孔５にそれぞれ通され、バンド３の両端がそれぞれ孔５付近でひねられている点と、孔５付近のバンド３とダミーランド６とが半田８により接続されている点である。なお、孔５の形状は、少なくとも、バンド３が通る大きさで、かつ、一部の幅がバンド３の断面の長手方向よりも短くなるように形成されていれば、楕円形や長方形など特に限定されない。   The feature of the electronic component fixing structure of the present embodiment is that it is large enough to pass the band 3 and that the width of a part of the hole 5 (the shortest diameter of the hole 5 in this embodiment) is A hole 5 is formed so as to be shorter than the longitudinal direction of the cross section, and the band 3 extends over the electronic component 1, and one end of the band 3 passes through one hole 5 and the other end of the band 3 passes through the other hole 5. The both ends of the band 3 are twisted in the vicinity of the hole 5, and the band 3 near the hole 5 and the dummy land 6 are connected by solder 8. In addition, the shape of the hole 5 is at least a size through which the band 3 passes and a part of the width is shorter than the longitudinal direction of the cross section of the band 3. It is not limited.

これにより、バンド３の両端をそれぞれ孔５付近でひねるだけでバンド３の両端をそれぞれ基板２に引っ掛けバンド３を孔５から抜けなくすることができるので、簡単に電子部品１を基板２に固定することができる。また、バンド３をひねった分バンド３が縮むため、基板２と電子部品１との間に「あそび」が生じなくなるまでバンド３をひねることにより確実に電子部品１を基板２に固定することができる。   As a result, by simply twisting both ends of the band 3 in the vicinity of the hole 5, both ends of the band 3 can be hooked on the substrate 2 to prevent the band 3 from coming out of the hole 5, so that the electronic component 1 can be easily fixed to the substrate 2. can do. Further, since the band 3 contracts by twisting the band 3, it is possible to securely fix the electronic component 1 to the substrate 2 by twisting the band 3 until “play” does not occur between the substrate 2 and the electronic component 1. it can.

また、バンド３とダミーランド６とが半田８により接続されているため、より確実に電子部品１を基板２に固定することができる。
次に、電子部品１の固定方法について説明する。 Further, since the band 3 and the dummy land 6 are connected by the solder 8, the electronic component 1 can be more securely fixed to the substrate 2.
Next, a method for fixing the electronic component 1 will be described.

まず、バンド３を電子部品１に架けつつバンド３の両端それぞれを基板２の各孔５に通す。
次に、基板２の電子部品１が搭載されない面に出ているバンド３をそれぞれ孔５付近でひねる。 First, both ends of the band 3 are passed through the holes 5 of the substrate 2 while the band 3 is hung on the electronic component 1.
Next, the bands 3 protruding on the surface of the substrate 2 where the electronic component 1 is not mounted are respectively twisted in the vicinity of the holes 5.

そして、基板２を半田槽に流し、バンド３とダミーランド６とを半田８により接続すると共に、リード４とリード接続用ランド７とを半田８により接続する。
このように、バンド３とダミーランド６、リード４とリード接続用ランド７をそれぞれ半田８により基板２の同じ面で接続しているため、バンド３とダミーランド６、リード４とリード接続用ランド７をそれぞれ同時に接続することができ、工程を増やすことなく電子部品１を基板２に固定することができる。 Then, the substrate 2 is poured into the solder bath, the band 3 and the dummy land 6 are connected by the solder 8, and the lead 4 and the lead connection land 7 are connected by the solder 8.
In this way, since the band 3 and the dummy land 6, and the lead 4 and the lead connection land 7 are connected on the same surface of the substrate 2 by the solder 8, the band 3 and the dummy land 6, the lead 4 and the lead connection land, respectively. 7 can be connected simultaneously, and the electronic component 1 can be fixed to the substrate 2 without increasing the number of steps.

また、本実施形態の電子部品の固定構造の特徴とする他の点は、バンド３の断面の長手方向と孔５の最も短い幅（本実施形態では、孔５の最も短い直径）とが同じ方向になるようにバンド３の両端がそれぞれ孔５付近でひねられている点である。   Another feature of the electronic component fixing structure of the present embodiment is that the longitudinal direction of the cross section of the band 3 and the shortest width of the hole 5 (the shortest diameter of the hole 5 in the present embodiment) are the same. Both ends of the band 3 are twisted in the vicinity of the holes 5 so as to be in the direction.

これにより、バンド３の両端をより確実に基板２に引っ掛けることができるので、より確実に電子部品１を基板２に固定することができる。
図２（ａ）は、図１（ａ）に示す基板２とバンド３との接続部分の拡大図であり、図２（ｂ）は、図１（ａ）の矢印Ａ方向から見たときの基板２とバンド３との接続部分の拡大図である。 Thereby, both ends of the band 3 can be more reliably hooked to the substrate 2, so that the electronic component 1 can be more securely fixed to the substrate 2.
2A is an enlarged view of a connection portion between the substrate 2 and the band 3 shown in FIG. 1A, and FIG. 2B is a view when viewed from the direction of arrow A in FIG. 3 is an enlarged view of a connection portion between a substrate 2 and a band 3. FIG.

図２（ａ）及び図２（ｂ）に示すように、本実施形態では、バンド３の端を孔５に挿入した後、バンド３の端を９０度ひねっている。
本実施形態では孔５が楕円形に形成されているため、バンド３の端を孔５に挿入した後、バンド３の端を９０度ひねると、図１（ｂ）に示すように、バンド３の断面の長手方向と孔５の長手方向とが十字状となり、バンド３の断面の長手方向と孔５の最も短い幅とを同じ方向にさせることができる。 As shown in FIGS. 2A and 2B, in this embodiment, after the end of the band 3 is inserted into the hole 5, the end of the band 3 is twisted 90 degrees.
In the present embodiment, since the hole 5 is formed in an elliptical shape, when the end of the band 3 is inserted into the hole 5 and then the end of the band 3 is twisted by 90 degrees, as shown in FIG. The longitudinal direction of the cross section and the longitudinal direction of the hole 5 have a cross shape, and the longitudinal direction of the cross section of the band 3 and the shortest width of the hole 5 can be made the same direction.

なお、上記実施形態では、バンド３により電子部品１の端を固定する構成であるが、バンド３による電子部品１の固定個所は特に限定されない。
また、上記実施形態では、１本のバンド３により電子部品１を基板２に固定する構成であるが、２本以上のバンド３を使用して電子部品１を基板２に固定してもよい。 In addition, in the said embodiment, although it is the structure which fixes the edge of the electronic component 1 with the band 3, the fixing location of the electronic component 1 by the band 3 is not specifically limited.
In the above embodiment, the electronic component 1 is fixed to the substrate 2 by one band 3. However, the electronic component 1 may be fixed to the substrate 2 by using two or more bands 3.

また、上記実施形態では、バンド３の両端それぞれを各孔５に挿入した後、バンド３の両端をそれぞれ孔５付近でひねる構成であるが、バンド３の両端それぞれを各孔５に挿入した後、バンド３の両端を合わせて一緒にひねるようにしてもよい。   In the above embodiment, both ends of the band 3 are inserted into the holes 5, and then both ends of the band 3 are twisted in the vicinity of the holes 5, but after both ends of the band 3 are inserted into the holes 5, respectively. The ends of the band 3 may be matched and twisted together.

また、バンド３の一方の先端の断面を一方の孔５よりも大きく形成し、そのバンド３の他方の先端を一方の孔５に通し、さらにバンド３を電子部品１に架けつつバンド３の他方の先端を他方の孔５に通し、バンド３の他方の端部を他方の孔５付近でひねり電子部品１を基板２に固定してもよい。   Further, the cross-section of one end of the band 3 is formed larger than the one hole 5, the other end of the band 3 is passed through the one hole 5, and the band 3 is laid on the electronic component 1 while the other end of the band 3 is The other end portion of the band 3 may be twisted in the vicinity of the other hole 5 to fix the electronic component 1 to the substrate 2.

また、上記実施形態の電子部品の固定構造は、大型の電子部品に限らず、浮き上がりが懸念される電子部品に有効である。   In addition, the electronic component fixing structure of the above embodiment is effective not only for large electronic components but also for electronic components that are likely to be lifted.

本発明の実施形態の電子部品の固定構造を示す図である。It is a figure which shows the fixation structure of the electronic component of embodiment of this invention. 基板とバンドとの接続部分の拡大図である。It is an enlarged view of the connection part of a board | substrate and a band.

符号の説明Explanation of symbols

１ 電子部品
２ 基板
３ バンド
４ リード
５ 孔
６ ダミーランド
７ リード接続用ランド
８ 半田

1 Electronic Component 2 Substrate 3 Band 4 Lead 5 Hole 6 Dummy Land 7 Lead Connection Land 8 Solder

Claims (7)

基板に搭載される電子部品の固定構造であって、
短冊状に形成されたバンドと、
前記基板の前記電子部品の両脇にそれぞれ設けられ、前記バンドが通る大きさで、かつ、一部の幅が前記バンドの断面の長手方向よりも短い孔と、
を備え、
前記バンドが前記電子部品に架かりつつ前記バンドの一方端が前記各孔のうちの一方の孔に前記バンドの他方端が前記各孔のうちの他方の孔にそれぞれ通され、前記バンドの両端がそれぞれ前記孔付近でひねられている、
ことを特徴とする電子部品の固定構造。 A structure for fixing electronic components mounted on a substrate,
A band formed in a strip shape;
A hole provided on both sides of the electronic component of the substrate, a size through which the band passes, and a partial width shorter than the longitudinal direction of the cross section of the band;
With
While the band hangs over the electronic component, one end of the band is passed through one of the holes, and the other end of the band is passed through the other hole of the holes. Are each twisted near the hole,
An electronic component fixing structure characterized by that. 請求項１に記載の電子部品の固定構造であって、
前記基板の前記電子部品が搭載されない面の前記孔の周りにダミーランドが設けられ、
前記バンドと前記ダミーランドとが半田により接続されている、
ことを特徴とする電子部品の固定構造。 The electronic component fixing structure according to claim 1,
A dummy land is provided around the hole on the surface of the substrate on which the electronic component is not mounted,
The band and the dummy land are connected by solder,
An electronic component fixing structure characterized by that. 請求項１に記載の電子部品の固定構造であって、
前記基板の前記電子部品が搭載されない面の前記孔の周りにダミーランドが設けられ、
前記基板の前記電子部品が搭載されない面の前記電子部品のリードが通る孔の周りにリード接続用ランドが設けられ、
前記バンドと前記ダミーランドとが半田により接続されていると共に、前記リードと前記リード接続用ランドが半田により接続されている、
ことを特徴とする電子部品の固定構造。 The electronic component fixing structure according to claim 1,
A dummy land is provided around the hole on the surface of the substrate on which the electronic component is not mounted,
A lead connection land is provided around a hole through which the lead of the electronic component on the surface of the substrate on which the electronic component is not mounted,
The band and the dummy land are connected by solder, and the lead and the lead connection land are connected by solder,
An electronic component fixing structure characterized by that. 請求項１に記載の電子部品の固定構造であって、
前記バンドの断面の長手方向と前記孔の最も短い幅とが同じ方向になるように、前記バンドの両端がそれぞれ前記孔付近でひねられている、
ことを特徴とする電子部品の固定構造。 The electronic component fixing structure according to claim 1,
Both ends of the band are twisted near the hole so that the longitudinal direction of the cross section of the band and the shortest width of the hole are in the same direction,
An electronic component fixing structure characterized by that. 請求項１に記載の電子部品の固定構造であって、
前記基板と前記電子部品との間にあそびが生じなくなるまでひねられた前記バンドの両端と、前記基板とが接触している、
ことを特徴とする電子部品の固定構造。 The electronic component fixing structure according to claim 1,
The substrate is in contact with both ends of the band twisted until play does not occur between the substrate and the electronic component,
An electronic component fixing structure characterized by that. 基板に搭載される電子部品の固定方法であって、
短冊状に形成されたバンドを前記電子部品に架けつつ前記バンドの一方端を前記基板の前記電子部品の両脇に設けられる各孔のうちの一方の孔に通すと共に前記バンドの他方端を前記各孔のうちの他方の孔に通し、
前記バンドの両端をそれぞれ前記孔付近でひねる、
ことを特徴とする電子部品の固定方法。 A method for fixing an electronic component mounted on a board,
A band formed in a strip shape is hung on the electronic component, and one end of the band is passed through one of the holes provided on both sides of the electronic component of the substrate, and the other end of the band is connected to the electronic component. Through the other hole of each hole,
Twist both ends of the band near the hole,
An electronic component fixing method characterized by the above. 請求項６に記載の電子部品の固定方法であって、
前記バンドと前記孔の周りに設けられるダミーランドとを半田により接続する、
ことを特徴とする電子部品の固定方法。

The electronic component fixing method according to claim 6,
Connecting the band and a dummy land provided around the hole by solder;
An electronic component fixing method characterized by the above.

JP2005121952A 2005-04-20 2005-04-20 Structure and method for fixing electronic component Pending JP2006303139A (en)

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Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014191335A (en) * 2013-03-28 2014-10-06 Mitsubishi Electric Corp Manufacturing method of electronic component unit, electronic component unit and a heating cooker including electronic component unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014191335A (en) * 2013-03-28 2014-10-06 Mitsubishi Electric Corp Manufacturing method of electronic component unit, electronic component unit and a heating cooker including electronic component unit

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