JP2006299306A - Electroplating method, and electroplating line - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electroplating method where the film thickness of an electroplating layer can be uniformized, and to provide an electroplating line. <P>SOLUTION: In the electroplating method, a process where an object to be plated is held to a holder, and a process where the object is dipped into a plating liquid are performed. Further, a negative voltage is applied to the object via the holder, positive voltage is applied to a positive electrode arranged inside the plating liquid, and, further, as the holder is rotated to a prescribed direction together with the object, an electroplating layer is formed on the surface of the object. By applying the electroplating treatment while the rotation is performed, the plating layer with a uniform film thickness can be formed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electrolytic plating method and an electrolytic plating line.

Conventionally, when performing electrolytic plating treatment, as shown in FIG. 11A, the object 101 is held in a holder 102 and immersed in a plating solution 103, and the object 101 is placed between two positive electrodes 104. (For example, the following patent document 1). By applying a voltage between the two positive electrodes 104 and the holder 102, an electrolytic plating layer is formed on the surface of the object 101 to be plated.
JP-A-6-88293

  However, when the above method is used, there is a problem that the thickness of the electrolytic plating layer becomes non-uniform. FIG. 11B shows an exaggerated view of the thickness of the electrolytic plating layer 105. As described above, when the above method is used, the film thickness tends to increase at a portion close to the positive electrode 104 and decrease at a distant portion. In this case, when trying to secure the minimum film thickness of the electrolytic plating layer 105, a thick portion is inevitably formed, and an extra plating material is required, resulting in an increase in cost. Therefore, a plating method capable of forming the electrolytic plating layer 105 having a uniform film thickness on the workpiece 101 has been desired.

  The present invention has been made in the background as described above. In particular, it is an object of the present invention to provide an electrolytic plating method and an electrolytic plating line capable of making the film thickness of the electrolytic plating layer uniform.

Means for Solving the Problems and Effects of the Invention

In order to solve the above problems, the electrolytic plating method of the first invention is
A step of holding an object to be plated in a holder;
A step of immersing an object to be plated in a plating solution;
A negative voltage is applied to the object to be plated through the holder, a positive voltage is applied to the positive electrode arranged in the plating solution, and the holder is rotated on the surface of the object to be plated together with the object to be plated. Forming an electroplating layer;
Separating and recovering the object to be plated on which the electrolytic plating layer is formed from the holder;
Is the main feature.

  The reason why the film thickness of the electrolytic plating layer is non-uniform is that the concentration of metal ions that are the raw material of the electroplating layer is non-uniform in the plating solution. In other words, since the metal ions are transported by dissolving the positive electrode, the metal ion concentration is high at a location close to the positive electrode and thin at a remote location. However, according to the first invention, since the object to be plated is rotated in the plating solution, the plating layer does not become thick at a specific place, and the film thickness can be made uniform.

The electrolytic plating line of the second invention is
A holder for holding an object to be plated and immersing it in a plating solution;
A transport line that transports the holder and applies a predetermined process to the object to be plated;
To-be-plated object supply part which makes a state which can hold a to-be-plated object in a holder, and can convey with a conveyance line,
A plating tank for storing a plating solution;
A positive electrode provided in the plating tank;
A power source that applies a negative voltage to the object to be plated through the holder, applies a positive voltage to the positive electrode, and forms an electrolytic plating layer on the surface of the object to be plated;
When forming the electrolytic plating layer, a rotating mechanism that rotates the holder together with the object to be plated in a predetermined direction;
A recovery unit for recovering an object to be plated on which an electrolytic plating layer is formed;
The main feature is to have

  Since the electrolytic plating line of the second invention includes a rotating mechanism for rotating the holder, the object to be plated can be rotated in the plating solution, and the film thickness distribution of the plating film can be made uniform. This rotating mechanism can be constituted by a rack and a pinion, for example.

Furthermore, the electrolytic plating line of the third invention is
A holder for inserting the tip of the bag-like workpiece through the opening of the bag-like workpiece having a bag-like space to hold the bag-like workpiece and immersing the bag-like workpiece in the plating solution with the opening facing upward When,
A transport line that transports the holder and applies a predetermined process to the bag-like workpiece;
A bag-like workpiece supply unit that holds the bag-like workpiece in the holder and can be conveyed by the conveyance line;
A plating tank for storing a plating solution;
A positive electrode provided in the plating tank;
A power source that applies a negative voltage to the bag-shaped workpiece via the holder, applies a positive voltage to the positive electrode, and forms an electrolytic plating layer on the surface of the bag-shaped workpiece;
When forming the electrolytic plating layer, a rotation mechanism that rotates the holder together with the bag-like workpiece in a predetermined direction;
An inclination mechanism that tilts the bag-shaped workpiece so that the plating solution accumulated in the bag-shaped space can flow down naturally when the bag-shaped workpiece is pulled up from the plating tank;
A collection unit for collecting the bag-like workpiece on which the electrolytic plating layer is formed;
The main feature is to have

  The electrolytic plating line according to the third aspect of the invention is specialized for bag-like workpieces. In this electrolytic plating line, the tip of the holder is inserted from the opening of the bag-like workpiece, and the holder is held so as to contact the inner surface of the bag-like workpiece. That is, when the holder is in contact with the outer surface of the bag-like workpiece, the contacted portion is less likely to be plated, and is thus in contact from the inside. And a holder | retainer is put into a plating solution from the front end side, and a bag-like workpiece | work is immersed. That is, it immerses in the attitude | position with the opening of a bag-shaped workpiece | work facing up. And it becomes possible to form a plating layer with uniform thickness on the outer surface of a bag-shaped workpiece | work by rotating a holder and a bag-shaped workpiece | work in a plating solution with a rotation mechanism. On the other hand, when the bag-like workpiece is pulled up in this posture, the plating solution is accumulated in the bag-like space, and when the process proceeds to the next step (for example, a washing step), the plating solution enters the washing tank. In order to prevent this, in the third invention, the bag-like workpiece is tilted by the tilt mechanism, and the plating solution is allowed to flow into the plating tank.

The electrolytic plating line according to the fourth invention is the one according to the second or third invention,
The transport line transports the holder at a constant speed,
The holder moves in the plating solution by the transfer line,
The positive electrode is composed of a first positive electrode and a second positive electrode, and the first positive electrode and the second positive electrode are arranged at a position sandwiching a holder moving in the plating solution from the side surface in the traveling direction.

  According to the fourth aspect of the invention, since the holder is transported at a constant speed, the holder can be rotated at a constant speed using, for example, the rotation mechanism including the rack and the pinion described above. In addition, since the first and second positive electrodes are positioned so as to sandwich the object to be plated in the plating solution, it is easy to supply metal ions, which are raw materials for the electrolytic plating layer, to the object to be plated. Yes.

Moreover, the electrolytic plating line of the fifth invention is the one in the second to fourth inventions,
The rotation mechanism is composed of a pinion provided on the upper part of the holder, and a rack that meshes with the pinion.
The rack is provided only in the upper part of the plating tank, and is not provided in the upper part of other liquid tanks.

  According to the said 5th invention, since the rack is not provided in liquid tanks other than a plating tank, for example, a washing tank, the expense which installs a rack can be reduced.

Next, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows a bag-shaped workpiece (cap nut) as an example of an object to be plated. The bag-like workpiece 1 includes a main body 2 having an internal thread portion 4 and a cap portion 3 that closes a portion of the main body 2 opposite to the screwing side (opening portion 6) of the male screw member. A bag-like space (closed space) 5 is formed by the inner space (the portion into which the tip of the male screw member such as a bolt enters). Such a cap nut 1 is immersed in a predetermined liquid bath for cleaning, rust prevention, plating, etc. after forging, further threading by rolling or cutting, welding of the cap part 3 and heat treatment.

  At that time, a holder 7 as shown in FIG. 2A is used. The holder 7 includes a center pin 10 and left and right pins 8 and 9 arranged symmetrically with respect to the center pin 10, and the bag-like workpiece 1 is attached to the tip using these three pins (FIG. 2B). The left and right pins 8 and 9 can be elastically deformed to such an extent that the distance between them is changed, and the tip portion is bent outward. When the bag-like workpiece 1 is mounted, a force is applied to the left and right pins 8 and 9 to narrow the distance between the two, and the bag-like workpiece 1 is inserted into the opening 6 of the bag-like workpiece 1 to loosen the force. Then, a force that elastically deforms the left and right pins 8 and 9 is applied to the inner surface of the bag-shaped workpiece 1 and the tip end is caught and cannot be easily removed.

  In FIG. 3, the schematic of the electrolytic plating method of this invention is shown. Thus, the plating solution 11 is stored in the plating tank 14, and the first positive electrode 12 and the second positive electrode 13 are provided. After mounting the bag-like workpiece 1 on the holder 7, the holder 7 is put into the plating solution 11 from the tip side, and the bag-like workpiece 1 is positioned between the first positive electrode 12 and the second positive electrode 13. Then, a positive voltage is applied to the first and second positive electrodes 12 and 13, and a negative voltage is applied to the bag-shaped workpiece 1 via the holder 7, thereby forming an electrolytic plating layer on the bag-shaped workpiece 1. At this time, by rotating the holder 7 in a predetermined direction, a plating layer having a uniform film thickness can be formed on the bag-like workpiece 1. Further, since the bag-like workpiece 1 is held with the opening 6 facing upward, the plating solution 11 enters inside when immersed in the plating solution 11. Therefore, a predetermined process can be performed not only on the outer surface of the bag-like workpiece 1 but also on the inner surface.

  Next, a part of the electrolytic plating line 26 of the present invention is shown in FIG. As described above, a plurality of plating tanks 14 a and 14 b are arranged in the electrolytic plating line 26. A plurality of (three in the figure) holders 7a to 7c are rotatably attached to the plate-like base portion 22 so that a plurality of bag-like workpieces 1 can be processed at a time. More specifically, gears 17 to 19 are disposed on the upper surface of the base portion 22, and the holders 7 a to 7 c are respectively attached to the gears 17 to 19. The holders 7 a to 7 c are rotated with respect to the base portion 22. It is possible. A column 16 is attached to the central gear 18, and a pinion 24 that meshes with the rack 25 is attached to the column 16. A cam follower 23 (roller) is rotatably provided at the tip of the support column 16.

  On the other hand, the base portion 22 is swingably attached to the base support 20 by a swing member 21, and the upper end of the base support 20 is fixed to a chain (not shown). As the chain moves in the direction of the arrow F, the base portion 22 moves, and the rack 25 and the pinion 24 mesh with each other so that the support column 16 rotates. The rotational force is transmitted to the gears 17 and 19 through the gear 18, thereby rotating the holders 7a and 7c.

  Thus, in this embodiment, the bag-like nut 1 moves in the plating tank 14. And the 1st positive electrode 12 and the 2nd positive electrode 13 are arrange | positioned in the position which pinches | interposes the bag-shaped nut 1 from the advancing direction side surface.

  The chain is in an endless track and is circulated by a driving device such as a motor. The driving device, the chain, the base support 20, the base portion 22 and the like constitute a transfer line 39 which will be described later. The rack 25 and the pinion 24 constitute the rotation mechanism of the present invention.

  Next, the movement when the bag-like work 1 gets over the boundary between the plating tanks 14a and 14b will be described. A twisted rail-shaped cam member 15 is disposed above the plating tanks 14a and 14b. When the pinion 24 comes to the end E of the rack 25, the cam follower 23 enters the cam member 15 (FIG. 5). Thereafter, the cam follower 23 advances in the cam member 15 with the conveyance, and the cam follower 23 is forcibly rotated about the swing member 21 because the cam member 15 is twisted (FIG. 6). The bag-like workpiece 1 located on the opposite side of the cam follower 23 with respect to the swing member 21 is lifted upward. When the cam follower 23 advances, it is further rotated downward as shown in FIG. 7, and the bag-like workpiece 1 is lifted further upward. At this time, since the bag-like workpiece 1 is rotated by 90 ° or more, the plating solution 11 accumulated in the bag-like space 5 naturally flows down. Thereby, it does not move to the next plating tank 14b in a state where the plating solution is accumulated in the bag-like space 5.

  As described above, even when the electrolytic plating process is performed with the opening 6 of the bag-shaped workpiece 1 facing upward, the inclination mechanism (the cam member 15 and the cam follower 23) of the present invention advances to the next plating tank 14b. It is possible to incline the bag-shaped workpiece 1 to allow the internal plating solution to flow down.

  Next, an example of the electrolytic plating process will be described. By performing steps 27 to 38 in FIG. 8 cyclically, electrolytic plating is applied to the bag-like workpiece 1. Now, in the load / unload process 38, the bag-like workpiece 1 that has been forged and then heat-treated is attached to the tip of the holder 7 shown in FIG. 2 and the like so that the opening 6 faces upward. The holder 7 to which the bag-like workpiece 1 is mounted in this manner is attached to the base portion 22 of the transfer line 39 and is transferred to the necessary liquid tank while being transferred by the transfer line 39 at a constant speed. Is immersed.

  As described above, the transport line 39 includes a chain that is circulated by a driving device such as a motor, and a base support 20 and a base portion 22 that are fixed to the chain. Each holder 7 is circulated by the transport line 39. To do. FIG. 9 shows a conceptual diagram thereof. Each base portion 22 circulates in the electrolytic plating line 26 with a certain interval, and a plurality of holders 7 are mounted on each base portion 22 as shown in FIG. The conveyance line 39 circulates the holder 7 at a constant speed, and continuously circulates without stopping at a specific place. For this reason, the length of the liquid tanks 14, 40 to 43 is changed in accordance with the processing time of each of the steps 27 to 38. That is, the length of the liquid tank is increased in the process with a long processing time, and the liquid tank is shortened in the process with a short processing time.

  One holding tool 7 is immersed in a degreasing tank 40 and a degreasing process is performed, another holding tool 7 is immersed in a cathodic acid electrolytic tank 41 and scale removal is performed, and yet another holding tool 7 is an anodic electrolytic cell 42. The bag-like workpiece 1 is activated by being immersed in the metal, and the other holder 7 is immersed in the plating tank 14 to perform the plating process, and the other holder 7 is immersed in the antirust oil tank 43. Anti-rust oil is attached. As a whole, processes such as degreasing, descaling, activation, plating, and rust prevention are performed in parallel.

  Here, paying attention to one holder 7, each step for the bag-like workpiece 1 held thereon will be described in order according to FIGS. First, in a load / unload station 38 (a plating object supply unit, a bag-shaped workpiece supply unit of the present invention), the holder 7 on which the bag-shaped workpiece 1 is mounted is attached to the base portion 22 of the transfer line 39, and the station. Then, the bag-shaped workpiece 1 is immersed in a predetermined alkaline solution (degreasing tank 40) in the alkaline degreasing step 27, and alkaline degreasing is performed. Next, the water-washing process 28 which is pulled up from here and immersed in a water-washing tank and wash | cleans an alkaline solution (degreasing liquid) is implemented. The lifting and dipping operations are performed by the cam member 15 and the cam follower 23 (FIGS. 5 to 7), and the alkaline solution contained in the bag-like space of the bag-like workpiece 1 is not brought into the washing tank. . After washing with water, the bag-like workpiece 1 is immersed in a sulfuric acid solution or the like, and the scale generated in the bag-like workpiece 1 is removed by heat treatment (scale skipping), and the cathodic acid electrolysis step 29 is performed.

  Then, after the sulfuric acid solution or the like is washed in the same water washing step 30 as described above, the bag-like workpiece 1 is immersed in a predetermined alkaline solution (anodic electrolytic degreasing bath 42), and the plating applied in the subsequent step is performed. In order to improve this, an anodic electrolytic degreasing step 31 for activating the surface is performed. Furthermore, it passes through the water washing process 32 similar to the above, and reaches the electrolytic plating process (plating 1) 33. Here, an electrolytic plating layer made of nickel or the like is formed on the outer surface of the bag-like workpiece 1. The electrolytic plating layer here is, for example, semi-bright nickel plating or bright nickel plating. Either one of them may be applied, or semi-gloss and gloss plating may be sequentially performed in separate plating tanks. You can also. When the electrolytic plating step 33 is performed, the bag-like workpiece 1 is rotated in the plating solution by the rotating mechanism (rack 25 and pinion 24) of the present invention, so that the outer surface of the bag-like workpiece 1 is evenly distributed. An electroplating layer having a sufficient thickness is formed. In addition, the rack 25 is attached only to the upper part of the plating tank 14, and is not attached to other liquid tanks (water washing tank, degreasing tank 40, cathodic acid electrolytic tank 41, etc.). This is because a desired effect can be obtained without rotating the bag-like workpiece 1 in a washing tank or the like.

  When this plating process is completed, the bag-like workpiece 1 is pulled up together with the holder 7 and is immersed in a water-washing tank and washed with water (34). Here, when the 2nd plating process 35 (different material) is implemented further, the bag-shaped workpiece | work 1 is immersed in the plating tank for chromium plating, for example with the holder 7, after the said water washing. When the plating step 35 is completed, the bag-like workpiece 1 after plating is pulled up from the plating tank and reaches a water washing step 36 where the plating solution is washed in the same manner as described above.

  When the bag-like workpiece 1 is lifted from the degreasing tank 40, water tank, anodic electrolytic degreasing tank 42, and plating tank 14 and transferred to the next liquid tank, it is lifted and immersed by an inclined mechanism composed of the cam member 15 and the cam follower 23. Thus, the solution accumulated in the bag-like workpiece is not brought into the next liquid tank.

  After the water washing step 36, the rust prevention step 37 is continued. That is, the holder 7 holding the bag-like workpiece 1 is pulled up from the washing tank by the tilting mechanism and immersed in the rust prevention oil tank. In the course of this immersion, the bag-like work 1 is immersed with the opening 6 facing upward, so that the rust-proof oil smoothly enters the bag-like space, and the rust-proof oil reaches the inside of the bag-like work 1. Can be attached. Thereafter, if the holder 7 is pulled up by the tilt mechanism (the cam member 15 and the cam follower 23), the rust preventive oil entering the bag-like space of the bag-like workpiece 1 flows down from the opening 6 of the bag-like workpiece 1, The bag-like workpiece can be pulled up without leaving excess rust preventive oil inside.

  When such a rust prevention process 37 is completed, the bag-like workpiece 1 on which plating and rust prevention oil adhesion have been completed is held by the holder 7 while the above-described load / unload station 38 (recovery unit of the present invention is used). ), The holder 7 is removed from the transfer line 39, and the bag-like workpiece 1 held by the holder 7 is further detached from the holder 7, completing a series of steps, shipping, etc. It becomes.

  In the conventional holder 102, as shown in FIG. 11, the object to be plated 101 is held with the opening facing downward, so that air is trapped inside, and water, plating solution, rust prevention oil, etc. Could not enter. Therefore, a plating layer was not formed inside, or rust preventive oil was not attached, and it was easy to rust from here. On the other hand, in the present invention, the bag-like workpiece 1 is held with the opening 6 facing upward and immersed in various solutions (water, plating solution, rust preventive oil, etc.). The solution enters smoothly, and a plating layer can be formed inside or rust preventive oil can be attached.

  In the embodiment described above, the transport line 39 transports the holder 7 and the bag-like workpiece 1 at a constant speed. However, the present invention may adopt other forms. For example, as shown in FIG. 10, a plurality of coupling tools 45 may be provided on the chain 44, and the holder 7 on which the bag-like workpiece 1 is mounted may be attached to the coupling tool 45. The holders 7 are transported together with the bag-like workpiece 1 by the chain 44, and the holders 7 are individually raised and lowered by an unillustrated raising / lowering mechanism and immersed in the plating solution. Then, the holder 7 is rotated stationary in the plating solution by a rotation mechanism (not shown).

  As another embodiment, for example, as shown in FIG. 4, the bag-like workpiece 1 may be rotated by having a rotation mechanism including a rack 25 and a pinion 24 and reciprocating in the plating tank 14. If it does in this way, even if it is a case where the length of a plating tank is short, the bag-shaped workpiece | work 1 can be processed, rotating for a desired time.

  As mentioned above, although mainly demonstrated about the method of performing the electrolytic plating process to the bag-shaped workpiece | work 1, you may perform this electrolytic plating with respect to to-be-plated objects other than the bag-shaped workpiece | work 1. FIG. For example, even when electrolytic plating is applied to a bolt or the like, a uniform electrolytic plating layer is formed on the surface of the bolt by holding it in a predetermined holder and rotating it in a predetermined direction in a plating solution. Can do.

(A) Surface view (B) Cross section of a bag-shaped workpiece that is an object to be plated An example of a holder Conceptual diagram of the electrolytic plating method of the present invention Part of the electrolytic plating line of the present invention Diagram explaining the movement of the tilt mechanism Figure following Figure 5 Figure following Figure 6 Process drawing showing an example of the process of the present invention The top view which shows the installation which implements this invention notionally Other embodiments Illustration of conventional example

Explanation of symbols

1 Bag-shaped work (plating object)
6 Opening of Bag-shaped Work 7 Holder 11 Plating Solution 12 First Positive Electrode 13 Second Positive Electrode 14 Plating Tank 15 Cam Member 23 Cam Follower (Roller)
24 Pinion 25 Rack 26 Electrolytic plating line 38 Load / unload station (Substance to be plated supply part, bag-like work supply part, recovery part)
39 Conveyance line

Claims (5)

A step of holding an object to be plated in a holder;
Immersing the object to be plated in the plating solution;
A negative voltage is applied to the object to be plated through the holder, a positive voltage is applied to the positive electrode disposed in the plating solution, and the holder is rotated in a predetermined direction together with the object to be plated. Forming an electrolytic plating layer on the surface of the object to be plated;
Separating and recovering the object to be plated on which the electrolytic plating layer has been formed from the holder;
Electrolytic plating method characterized by including. A holder for holding an object to be plated and immersing it in a plating solution;
A transport line that transports the holder and applies a predetermined process to the object to be plated;
To-be-plated object supply part which makes the state which can hold the above-mentioned to-be-plated object in the above-mentioned holder, and can convey with the above-mentioned conveyance line,
A plating tank for storing the plating solution;
A positive electrode provided in the plating tank;
A negative voltage is applied to the object to be plated through the holder, a positive voltage is applied to the positive electrode, and a power source for forming an electrolytic plating layer on the surface of the object to be plated;
A rotation mechanism for rotating the holder together with the object to be plated in a predetermined direction when forming the electrolytic plating layer;
A collection unit for collecting the object to be plated on which the electrolytic plating layer is formed;
An electrolytic plating line comprising: In order to immerse the bag-shaped workpiece in the plating solution in a posture in which the opening portion of the bag-shaped workpiece having a bag-shaped space is inserted to hold the bag-shaped workpiece and the opening portion faces upward. A holding tool,
A transport line for transporting the holder and applying a predetermined process to the bag-like workpiece;
A bag-shaped workpiece supply unit configured to hold the bag-shaped workpiece in the holder and to be transported by the transport line;
A plating tank for storing the plating solution;
A positive electrode provided in the plating tank;
Applying a negative voltage to the bag-shaped workpiece via the holder, applying a positive voltage to the positive electrode, and forming a electrolytic plating layer on the surface of the bag-shaped workpiece;
A rotation mechanism for rotating the holder together with the bag-like workpiece in a predetermined direction when forming the electrolytic plating layer;
An inclination mechanism for inclining the bag-shaped workpiece so that the plating solution accumulated in the bag-shaped space can naturally flow when pulling up the bag-shaped workpiece from the plating tank;
A collection unit for collecting the bag-like workpiece on which the electrolytic plating layer is formed;
An electrolytic plating line comprising: The transport line transports the holder at a constant speed,
The holder moves in the plating solution by the transport line,
The said positive electrode consists of a 1st and 2nd positive electrode, and these 1st and 2nd positive electrodes are arrange | positioned in the position which pinches | interposes the said holder which moves the inside of the said plating solution from the advancing direction side surface. The electrolytic plating line described. The rotating mechanism is composed of a pinion provided on the upper part of the holder, and a rack that meshes with the pinion.
5. The electrolytic plating line according to claim 2, wherein the rack is provided only on an upper part of the plating tank and is not provided on an upper part of another liquid tank. 6.

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