JPS62120499A - Plating method and its device - Google Patents

Plating method and its device

Info

Publication number
JPS62120499A
JPS62120499A JP26034785A JP26034785A JPS62120499A JP S62120499 A JPS62120499 A JP S62120499A JP 26034785 A JP26034785 A JP 26034785A JP 26034785 A JP26034785 A JP 26034785A JP S62120499 A JPS62120499 A JP S62120499A
Authority
JP
Japan
Prior art keywords
plating
article
plated
cylindrical body
rotating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26034785A
Other languages
Japanese (ja)
Inventor
Yoshinori Takakura
高倉 義憲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP26034785A priority Critical patent/JPS62120499A/en
Publication of JPS62120499A publication Critical patent/JPS62120499A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To simply and easily form the plated film of a uniform thickness on a cylindrical body by supplying electric current while rotating the body at prescribed rotational frequency. CONSTITUTION:A cylindrical body 8 to be plated is hung from a hanger 7 and immersed in a plating soln. 9 in a plating tank 10 and the rotation of a variable motor 1 is propagated to a shaft 5 attached to the hanger 7 through a belt 3 to rotate the body 8 in the plating soln. 9. Electric current is supplied between the anode 11 placed in the plating tank 10 and the rotating cylindrical body 8 as the cathode to electrodeposit metallic cations on the surface of the body 8. By this electrodeposition, the plated film of a uniform thickness is easily formed on the surface of the cylindrical body 8.

Description

【発明の詳細な説明】 し、虻業上の利用分野〕 この発明はめつき方法とその装置1て係り枦さらに詳1
−7<はt円筒形状の′物品にめっきする際に通′醒し
ながら所定の回転数で物品に回転させながら行なうめつ
き方法とイの装置に関−I−るもの′ごある。
[Detailed Description of the Invention] Field of Industrial Use] The present invention relates to a plating method and apparatus 1, and further details 1.
-7< relates to a plating method in which a cylindrical article is plated while the article is rotated at a predetermined number of rotations, and an apparatus in (a).

〔従来の方法J 従来において1円筒形状の物品にめっきするに際して、
めっきj!厚の均−電着等を考慮に入れて種々の方法が
行なわれている。
[Conventional Method J] Conventionally, when plating a cylindrical article,
Plating j! Various methods have been carried out taking into consideration the uniformity of the thickness and the like.

かがる方法と]−て9例えば(2)めつき槽内の陽称全
増やしたり、ビ)めっき途中に物品の方向を変えたりす
る方法等が挙げられる。
For example, methods include (2) increasing the total number of objects in the plating tank, and (b) changing the direction of the article during plating.

〔発明が解決[2工うとする問題点〕 上記のようなめつき方法でげ次に述べるような問題点が
挙げられる。
[Problems to be Solved by the Invention (2)] The following problems can be raised with the above-mentioned plating method.

即ち、上記(7)の方法にInげ、めりき槽内の陽極を
物品と対極だけでなく、4隅に設けるものであるが H
流分布等の問題を考慮すると、陽極の形状を変えたり、
配置を等に工夫が必要であり、即時できるものではなく
、長年の経沃と熟練が必要である。
That is, in addition to the method (7) above, the anodes in the in-plating tank are provided not only at the opposite electrodes of the article but also at the four corners.
Considering issues such as flow distribution, changing the shape of the anode,
It requires some thought in terms of arrangement, etc., and it is not something that can be done instantly, but requires years of experience and skill.

」二記づ)の方法(((″よれば、めっき途中に一定の
時間間隔で・物品の方向を変えてやるものであるが。
According to the method (2), the direction of the article is changed at regular intervals during plating.

・物品の6つきが完了する迄のlii′jt ’吻品全
監睨する必要があり、長時間のめつきであtlば非常に
労ヵが必要である。
・It is necessary to supervise the whole product until the plating is completed, and if the plating is done for a long time, it is extremely labor-intensive.

という改善すべき技術的諸問題があった。There were various technical problems that needed to be improved.

この発明は上記した技術的諸問題を解決するためになさ
れたものであり、−f:の目的は比軟的簡便な方法にエ
リを円筒形状の物品のめつき膜厚を均一化させ、かつ労
力をあまり必要としないめっき方法とその装置全提供す
るにある。
This invention was made to solve the above-mentioned technical problems, and the purpose of -f: is to uniformize the plating film thickness of a cylindrical article by a relatively simple method, and The purpose of the present invention is to provide a plating method and equipment that requires little labor.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係るめっき方法とその装置は・鋭意倹討金重
ねた結果を物品と所要の間隔を保って陽極全対面させす
かつ物品を回転させながら上記目的が達成できることを
みい出し2本発明全完成するに到った。
The plating method and device according to the present invention are based on the following: After much effort and effort, it was discovered that the above objects can be achieved by keeping the anode fully facing the article while maintaining a required distance, and rotating the article. It has been completed.

即ちt本発明の円筒形状の物品のぬつき方法とその装置
は2円筒形状の物品を引掛けに縦吊りにしてめつき槽内
に浸漬させ9円筒形状の物品Vこ通電させながら回転さ
せ?めっき−fるCとを特徴とする1、 〔作用J この発明において(グ・円筒形状の物品に通電しlがら
iG1転させ−Cめつき2行つのでtめつき#淳の均一
・化がfき、しかへ物品の回転は回転装置に1って行う
ので労力を省くことができる。
That is, the method and apparatus for gluing a cylindrical article of the present invention involves hanging the cylindrical article vertically on a hook, immersing it in a plating bath, and rotating the cylindrical article while applying electricity. 1. [Action J] In this invention (G), a cylindrical article is energized and rotated while IG1 is plated in two rows, so that the plating is uniform and uniform. However, since the article is rotated by a rotating device, labor can be saved.

〔実施例〕〔Example〕

以下においてI実h11例を%げこの発明を史に詳しく
説明する。
In the following, this invention will be explained in detail using 11 actual examples.

第1ν1は本発明のめつき物品の回転装置を示す図で、
(11は可変モーター、(2)は可変モーター全固定す
る架台、(31は被めっき物品に回転金与えるために可
変モーターfi+とシャフト(5)との間をつなぐベル
)、+41は可変モーターを支えるサボー)+(51は
シャフト、(6)は図示し、ていないが整流器の陰極と
を結ぶリード線である。
No. 1 ν1 is a diagram showing a rotating device for a plated article of the present invention,
(11 is the variable motor, (2) is the mount that fully fixes the variable motor, (31 is the bell that connects the variable motor fi+ and the shaft (5) to give rotation to the article to be plated), +41 is the variable motor. Supporting sabot) + (51 is a shaft, (6) is not shown but is a lead wire connecting it to the cathode of the rectifier.

第2図はめつき液中で回転装置を作動j〜でいる図で・
(7)は回転装置のシャフト(5)に取付けた引掛け、
(81は円筒形状の被めっき物品、+91tよ、−)つ
き液でQlのめつき中凸に入れられている。
Figure 2 shows the rotating device operating in the plating solution.
(7) is a hook attached to the shaft (5) of the rotating device;
(81 is a cylindrical article to be plated, +91t, -) A plating liquid is placed in the convex part of the plating part Ql.

αυμ′屯極で、α擾のリード線に1つで図示を省略し
た整流器のIQ!極とつながっている。
The IQ of the rectifier, which is not shown in the illustration, is one for the αυμ′ lead wire at the αυμ′ ton pole! connected to the pole.

次にこの発明による装置を用いた彼めつき物品のめつき
方法について説明する。
Next, a method for plating a plated article using the apparatus according to the present invention will be explained.

第1図のシャフト(5;に引掛け(7)及び円筒形状の
破めっき物品(8)金取り付け、所定の前処理、下地め
っき、上層めっきを被めっき物品(81Vこ通電しなθ
jI−)I シャフト(5)と可変モーター(1)とを
つなぐベルト(3:全媒介として、被めっき物品全所定
の回転数で回転さぞながら行うのである。
Hooked on the shaft (5; in Fig. 1) (7) and the cylindrical broken-plated article (8), the plated article covered with gold attachment, prescribed pretreatment, base plating, and upper layer plating (81V should not be energized.
jI-)I The belt (3) connecting the shaft (5) and the variable motor (1) is used as a total medium, and the plating is performed while all the objects to be plated are rotated at a predetermined number of rotations.

〔発明の効果」 以上説明した工うに穿この発明によれば2円筒形状の被
めっき物品に回転金与えてめっきを行うノテ+めつき膜
厚の均一化が可能であり、太めつき物品の回転も回転装
置V′c工っで行うので労力も省げ−めつきコストも安
価なものとなる。
[Effects of the Invention] According to the invention described above, it is possible to perform plating by applying a rotating metal to a cylindrical article to be plated, and to make the thickness of the plating film uniform. Since the process is also carried out using the rotating device V'c, labor is saved and the plating cost is also low.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の回転装置を示す図、第2図はめつき液
中で回転装置と作動している図である。 図において字(11は可変モーター、(21は架台、(
3Iはベルトi41はサポート+ +51はシャフト、
(力は引掛け、(81は破めっき物品?(9)はめつ1
酊[11)ijめつき槽、(Iυは電極1 t6+、 
fi3はリード線である。 ia;i!!1 112図
FIG. 1 is a diagram showing the rotating device of the present invention, and FIG. 2 is a diagram showing the rotating device in operation in a plating solution. In the figure, (11 is a variable motor, (21 is a stand, (
3I is belt i41 is support + +51 is shaft,
(The force is hooked, (81 is a broken plating item? (9) Eye 1
[11] ij plating tank, (Iυ is electrode 1 t6+,
fi3 is a lead wire. ia;i! ! 1 112 figure

Claims (2)

【特許請求の範囲】[Claims] (1)円筒形状の物品にめっきするにおいて、通電しな
がらモーターにより上記物品に所定の回転を与えた状態
で上記物品にめっきを施すようにしたことを特徴とする
めっき方法。
(1) A plating method for plating a cylindrical article, characterized in that the article is plated while the article is given a predetermined rotation by a motor while being energized.
(2)めっきすべき物品を収容するためのめっき槽と、
上記物品を回転させるためのモーターと、モーターを支
える架台と、上記物品を取付けるシャフト部と、モータ
ーの回転をシャフト部に伝えるベルトと、シャフト部と
モーターを支える架台とを連結する支柱と、を特徴とす
るめっき装置。
(2) a plating tank for accommodating articles to be plated;
A motor for rotating the article, a pedestal for supporting the motor, a shaft portion for attaching the article, a belt for transmitting the rotation of the motor to the shaft portion, and a support for connecting the shaft portion and the pedestal for supporting the motor. Characteristic plating equipment.
JP26034785A 1985-11-20 1985-11-20 Plating method and its device Pending JPS62120499A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26034785A JPS62120499A (en) 1985-11-20 1985-11-20 Plating method and its device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26034785A JPS62120499A (en) 1985-11-20 1985-11-20 Plating method and its device

Publications (1)

Publication Number Publication Date
JPS62120499A true JPS62120499A (en) 1987-06-01

Family

ID=17346706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26034785A Pending JPS62120499A (en) 1985-11-20 1985-11-20 Plating method and its device

Country Status (1)

Country Link
JP (1) JPS62120499A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006299306A (en) * 2005-04-15 2006-11-02 Kida Seiko Kk Electroplating method, and electroplating line
JP2008101243A (en) * 2006-10-19 2008-05-01 Honda Motor Co Ltd Plating apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006299306A (en) * 2005-04-15 2006-11-02 Kida Seiko Kk Electroplating method, and electroplating line
JP4719497B2 (en) * 2005-04-15 2011-07-06 木田精工株式会社 Electrolytic plating method and electrolytic plating line
JP2008101243A (en) * 2006-10-19 2008-05-01 Honda Motor Co Ltd Plating apparatus
JP4684979B2 (en) * 2006-10-19 2011-05-18 本田技研工業株式会社 Plating equipment
US7966897B2 (en) 2006-10-19 2011-06-28 Honda Motor Co., Ltd. Plating apparatus

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