JP2006287233A5 - - Google Patents

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Publication number
JP2006287233A5
JP2006287233A5 JP2006102013A JP2006102013A JP2006287233A5 JP 2006287233 A5 JP2006287233 A5 JP 2006287233A5 JP 2006102013 A JP2006102013 A JP 2006102013A JP 2006102013 A JP2006102013 A JP 2006102013A JP 2006287233 A5 JP2006287233 A5 JP 2006287233A5
Authority
JP
Japan
Prior art keywords
film
semiconductor device
metal
barrier film
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006102013A
Other languages
English (en)
Japanese (ja)
Other versions
JP5063913B2 (ja
JP2006287233A (ja
Filing date
Publication date
Priority claimed from US11/214,680 external-priority patent/US7501673B2/en
Priority claimed from KR1020050134428A external-priority patent/KR100725369B1/ko
Application filed filed Critical
Publication of JP2006287233A publication Critical patent/JP2006287233A/ja
Publication of JP2006287233A5 publication Critical patent/JP2006287233A5/ja
Application granted granted Critical
Publication of JP5063913B2 publication Critical patent/JP5063913B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006102013A 2005-04-04 2006-04-03 多層ゲート構造を備える半導体素子及びそれの製造方法 Active JP5063913B2 (ja)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR10-2005-0028245 2005-04-04
KR20050028245 2005-04-04
US11/214,680 US7501673B2 (en) 2005-04-04 2005-08-29 Semiconductor device multilayer structure, fabrication method for the same, semiconductor device having the same, and semiconductor device fabrication method
US11/214,680 2005-08-29
KR10-2005-0134428 2005-12-29
KR1020050134428A KR100725369B1 (ko) 2005-04-04 2005-12-29 다층 게이트 구조를 구비하는 반도체 소자 및 그 제조 방법

Publications (3)

Publication Number Publication Date
JP2006287233A JP2006287233A (ja) 2006-10-19
JP2006287233A5 true JP2006287233A5 (zh) 2009-05-21
JP5063913B2 JP5063913B2 (ja) 2012-10-31

Family

ID=37408723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006102013A Active JP5063913B2 (ja) 2005-04-04 2006-04-03 多層ゲート構造を備える半導体素子及びそれの製造方法

Country Status (1)

Country Link
JP (1) JP5063913B2 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4690120B2 (ja) * 2005-06-21 2011-06-01 エルピーダメモリ株式会社 半導体装置及びその製造方法
US7781333B2 (en) * 2006-12-27 2010-08-24 Hynix Semiconductor Inc. Semiconductor device with gate structure and method for fabricating the semiconductor device
KR20130116099A (ko) * 2012-04-13 2013-10-23 삼성전자주식회사 반도체 장치 및 그 제조 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831931A (ja) * 1994-07-11 1996-02-02 Nippon Telegr & Teleph Corp <Ntt> 半導体装置およびその製造方法
JP3892588B2 (ja) * 1997-12-26 2007-03-14 株式会社東芝 半導体装置およびその製造方法
JPH11297988A (ja) * 1998-04-01 1999-10-29 Nanya Sci & Technol Co Ltd 金属シリサイドのスパイキング効果を防止するゲート電極製造方法
JP2002373944A (ja) * 2001-06-15 2002-12-26 Hitachi Ltd 半導体集積回路装置およびその製造方法
JP3781666B2 (ja) * 2001-11-29 2006-05-31 エルピーダメモリ株式会社 ゲート電極の形成方法及びゲート電極構造
US6902993B2 (en) * 2003-03-28 2005-06-07 Cypress Semiconductor Corporation Gate electrode for MOS transistors
JP2004319722A (ja) * 2003-04-16 2004-11-11 Hitachi Ltd 半導体集積回路装置およびその製造方法

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