JP2006264017A - Lamination method of laminate and laminator therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently laminate a laminate to a substrate by a simple process and a simple constitution while preventing the mixing with air bubbles to the utmost. <P>SOLUTION: This laminator 20 of the laminate is equipped with a pressing mechanism 42 for pressing a photosensitive resin layer, which is protruded by peeling a protective film 30 from a photosensitive web 22, to a glass substrate 24 and a hot press bonding mechanism 43 for bonding the photosensitive resin layer and the glass substrate 24 under heating and pressure. The pressing mechanism 42 is constituted so as to press the photosensitive web 22 to the glass substrate 24 under a temperature condition lower than the melting temperature of the photosensitive resin layer and softening a cushioning layer and the hot press bonding mechanism 43 performs the hot press bonding of the photosensitive web 22 and the glass substrate 24 under a melting temperature condition. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a laminate laminating method and laminating apparatus for joining a laminate in which at least a photosensitive resin layer and a thermoplastic resin layer are laminated to the substrate so that the photosensitive resin layer side faces the substrate.

  For example, in a liquid crystal panel substrate, a printed wiring substrate, and a PDP panel substrate, a photosensitive sheet (photosensitive web) having a photosensitive resin (coloring material) layer is attached to the substrate surface. In the photosensitive sheet body, a photosensitive resin layer and a protective film are sequentially laminated on a flexible plastic support.

  Therefore, a pasting apparatus used for pasting this type of photosensitive sheet body usually transports a substrate such as a glass substrate or a resin substrate spaced apart by a predetermined distance, and also protects the protective film from the photosensitive sheet body. After peeling off, a method of sticking a photosensitive resin layer to the substrate is employed.

  The above-mentioned sticking apparatus usually includes a pair of laminate rolls, and the laminate rolls are heated to a predetermined temperature by induction heating or the like. For this reason, the photosensitive sheet | seat body and board | substrate clamped by the lamination roll are thermocompression-bonded. However, since the heating of the photosensitive resin layer and the thermocompression bonding to the substrate are performed at the same time, there is a problem that wrinkles, slack, or air bubbles are mixed in the photosensitive sheet attached to the substrate. is there.

  Therefore, for example, in the film sticking device disclosed in Patent Document 1, a pair of preliminary films is disposed upstream of a pair of laminating rolls that sandwich and send the laminate film and the substrate and thermocompress them at the thermocompression bonding temperature. An adhesive roll is provided. This pre-adhesion roll has an elastic material laminated on the outer periphery, and presses and adheres these at a temperature lower than the thermocompression bonding temperature while sandwiching and feeding the laminate film and the substrate. At this time, the pre-adhesion roll is configured such that the range of elastic deformation in a planar shape by contacting the substrate via the film on the roll surface is 5 mm or less in the substrate transport direction.

JP 2000-85011 A (FIG. 1)

  By the way, the photosensitive sheet (laminate) film is formed by laminating a thermoplastic resin layer (hereinafter also referred to as a cushion layer) and a photosensitive resin layer on a base film (support layer). At that time, the photosensitive resin layer and the cushion layer are softened by decreasing the viscosity with an increase in temperature, and the photosensitive resin layer is thermocompression bonded to the substrate by being heated to the activation temperature (melting temperature). .

  For this reason, when preliminarily heating the photosensitive sheet body with the pre-adhesion roll, if the temperature of the pre-adhesion roll is low, the viscosity of the photosensitive resin layer and the viscosity of the cushion layer may increase. Thereby, the photosensitive resin layer and the cushion layer have a problem that flexibility is lowered, the photosensitive resin layer cannot follow the uneven shape of the substrate, and bubbles are mixed therein.

  And since the viscosity of the photosensitive resin layer is high, sufficient adhesiveness cannot be obtained, and adhesion | attachment with a board | substrate becomes incomplete. For this reason, for example, when the base film is peeled off, the base film cannot be reliably peeled off at the interface with the cushion layer, and a peeling failure tends to occur.

  The present invention solves this type of problem, and with a simple process and configuration, it is possible to prevent air bubbles from entering as much as possible, and the laminate can be efficiently and satisfactorily laminated on the substrate. An object of the present invention is to provide a laminating method and laminating apparatus for a laminate.

  The present invention is a laminate laminating method and laminating apparatus in which a laminate in which at least a photosensitive resin layer and a thermoplastic resin layer are laminated is thermocompression-bonded to the substrate so that the photosensitive resin layer side faces the substrate. .

  First, after the laminate and the substrate are pressed under a temperature condition that is equal to or lower than the melting temperature of the photosensitive resin layer and the thermoplastic resin layer is softened, under the melting temperature condition, the laminate and the The substrate is thermocompression bonded. Here, pressurization refers to a state in which a non-molten photosensitive resin layer is pressed against and in close contact with the substrate, and thermocompression bonding refers to the photosensitive state in a molten state (activated state). A state in which the resin layer is bonded to the substrate.

  Moreover, it is preferable that at least one of the first step (pressure mechanism) or the second step (thermocompression bonding mechanism) is set in multiple stages.

  Furthermore, it is preferable to preheat at least either the laminate or the substrate under a temperature condition lower than the melting temperature between the first step (pressure mechanism) and the second step (thermocompression mechanism).

  In the present invention, when the laminate and the substrate are pressed, the photosensitive resin layer has a predetermined rigidity because it is below the melting temperature, while the thermoplastic resin layer is softened. Therefore, the thermoplastic resin layer is improved in flexibility (flexibility), and the photosensitive resin layer is reliably attached to the substrate following the shape of the substrate surface (uneven pattern) under the deformation action of the thermoplastic resin layer. It is possible to satisfactorily prevent bubbles from remaining.

  Next, when the laminate and the substrate are thermocompression bonded, the photosensitive resin layer is activated under the melting temperature condition, and the viscosity is reduced. For this reason, the photosensitive resin layer has desired adhesiveness and can be reliably bonded to the substrate.

  As a result, the laminate and the substrate are reliably prevented from remaining bubbles and are subjected to high-quality laminating processing, and the production efficiency is improved to facilitate the speeding up of the laminating operation.

  FIG. 1 is a schematic configuration diagram of a photosensitive laminate manufacturing apparatus (laminating apparatus) 20 according to the first embodiment of the present invention. The manufacturing apparatus 20 thermally transfers a photosensitive resin layer 29 (described later) of a long photosensitive web 22 to a glass substrate 24 in a manufacturing process of a printed wiring board, a liquid crystal, a PDP, an organic EL color filter, or the like. Lamination).

  FIG. 2 is a cross-sectional view of the photosensitive web 22 used in the manufacturing apparatus 20. This photosensitive web 22 is formed by laminating a flexible base film (support layer) 26, a cushion layer (thermoplastic resin layer) 27, an intermediate layer (oxygen barrier film) 28, a photosensitive resin layer 29, and a protective film 30. Composed.

  The base film 26 is formed of polyethylene terephthalate (PET), the cushion layer 27 is formed of ethylene and vinyl oxide copolymer, the intermediate layer 28 is formed of polyvinyl alcohol, and the photosensitive resin layer 29 is alkali-soluble. It is formed of a colored photosensitive resin composition containing a binder, a monomer, a photopolymerization initiator, and a colorant, and the protective film 30 is formed of polypropylene.

  As shown in FIG. 1, the manufacturing apparatus 20 accommodates a photosensitive web roll 22a in which a photosensitive web 22 is wound in a roll shape, and a web feed mechanism 32 that feeds the photosensitive web 22 from the photosensitive web roll 22a. And a peeling mechanism 34 for continuously peeling the protective film 30 from the photosensitive web 22 and a photosensitive resin layer 29 exposed on the surface of the photosensitive web 22 at a predetermined interval in the delivery direction (arrow A direction). A masking tape attaching mechanism 38 for attaching the masking tape 36 at a distance from each other, a substrate transport mechanism 40 for transporting the glass substrate 24 to a bonding position while being heated to a predetermined temperature, and a photosensitive film exposed by peeling off the protective film 30. A pressure mechanism 42 that pressurizes the photosensitive resin layer 29 and the glass substrate 24, and heats the photosensitive resin layer 29 to the glass substrate 24. And a thermocompression bonding mechanism 43 to be deposited.

  A detection mechanism 44 that directly detects the masking tape 36 that is the boundary position of the photosensitive web 22 is disposed in the vicinity of the joining position in the pressurizing mechanism 42. An inter-substrate web cutting mechanism 48 for cutting the photosensitive web 22 between the glass substrates 24 is provided. Upstream of the inter-substrate web cutting mechanism 48 is provided a web tip cutting mechanism 48a used at the start of operation, when trouble occurs or when defective products are discharged.

  In the vicinity of the downstream side of the web feed mechanism 32, a joining table 47 is provided for joining the rear end of the substantially used photosensitive web 22 and the front end of the newly used photosensitive web 22. A film end position detector 49 is disposed downstream of the joining base 47 in order to control the deviation in the width direction due to the winding deviation of the photosensitive web roll 22a. Here, the film end position adjustment is performed by moving the web feed mechanism 32 in the width direction, but may be performed by attaching a position adjustment mechanism combined with a roller. Note that the web feed mechanism 32 may be configured so that the feeding shaft for loading the photosensitive web roll 22a and feeding the photosensitive web 22 is multi-axis such as two axes or three axes.

  The peeling mechanism 34 includes a suction drum 46 for reducing fluctuations in tension on the delivery side of the photosensitive web 22 and stabilizing the tension during lamination. In the vicinity of the suction drum 46, a peeling roller 46a is disposed, and the protective film 30 peeled off from the photosensitive web 22 at an acute peeling angle via the peeling roller 46a continues to the protective film take-up unit 50. Rolled up.

  A tension control mechanism 52 that can apply tension to the photosensitive web 22 is disposed on the downstream side of the peeling mechanism 34. The tension control mechanism 52 includes a cylinder 54, and the tension dancer 56 swings and displaces under the driving action of the cylinder 54, whereby the tension of the photosensitive web 22 with which the tension dancer 56 is in sliding contact can be adjusted. The tension control mechanism 52 may be used as necessary, and can be deleted.

  As shown in FIG. 3, the masking tape sticking mechanism 38 sticks the masking tape 36 across the substrate interval T to the photosensitive resin layer 29 from which the protective film 30 has been peeled off. The masking tape 36 is, for example, an acrylic, silicone, acrylic and silicone or rubber adhesive on one surface (adhesive surface with the photosensitive resin layer 29) side of a polyethylene terephthalate (PET) substrate. 58 is provided. The other surface of the masking tape 36 is not provided with an adhesive, and is preferably subjected to non-sticking surface treatment such as fluorine resin coating.

  As shown in FIG. 1, the masking tape attaching mechanism 38 adsorbs the masking tape 36 by the adsorbing member 60, and the masking tape 36 is attached to the photosensitive resin layer 29 under the action of the adsorbing member 60 and the attaching table 62. Affix in place.

  The detection mechanism 44 includes a photoelectric sensor 82 such as a laser sensor or a photo sensor, and the photoelectric sensor 82 directly detects a change caused by the masking tape 36 blocking transmitted light, and this detection signal is used as a boundary position signal. And The photoelectric sensor 82 is disposed to face the backup roller 83.

  Instead of the photoelectric sensor 82, a tape thickness step may be detected with a non-contact displacement meter, or an image inspection means such as a CCD camera may be used.

  The substrate transport mechanism 40 includes a plurality of sets of substrate heating units (for example, heaters) 84 disposed so as to sandwich the glass substrate 24 and a transport unit 86 that transports the glass substrate 24 in the direction of arrow C. The substrate heating unit 84 constantly monitors the temperature of the glass substrate 24. When an abnormality occurs, the conveyance unit 86 is stopped or alarmed, and abnormal information is transmitted to cause the abnormal glass substrate 24 to be NG discharged in the subsequent process. It can be used for management or production management. An air levitation plate (not shown) is disposed in the conveyance unit 86, and the glass substrate 24 is levitated and conveyed in the direction of arrow C. The glass substrate 24 can be transported by a roller conveyor.

  The temperature measurement of the glass substrate 24 is preferably performed in the substrate heating unit 84 and immediately before the bonding position. The measuring method may be a contact type (for example, thermocouple) or a non-contact type.

  Downstream of the substrate heating unit 84, a stopper 87 that contacts the tip of the glass substrate 24 and holds the glass substrate 24, and a position sensor 88 that detects the tip position of the glass substrate 24 are disposed. The position sensor 88 is for detecting the front end of the glass substrate while the glass substrate 24 is heading toward the bonding position, and sending the fixed amount therefrom to position it at a predetermined position between the pressure rollers 90a and 90b. Here, it is preferable that a plurality of position sensors 88 are provided to monitor the arrival timing of the glass substrate 24 at each position, and to check a delay due to slip or the like at the start of substrate conveyance. The glass substrate 24 may be heated by a robot using a batch type oven in addition to the above-described transfer heating.

  The pressure mechanism 42 includes pressure rollers 90a and 90b that are arranged vertically and heated or cooled to a predetermined temperature. The backup rollers 92a and 92b are slidably contacted with the pressure rollers 90a and 90b, and the backup roller 92b is pressed toward the pressure roller 90b via the roller clamp portion 93. The backup rollers 92a and 92b are provided as necessary and can be deleted.

  In the vicinity of the pressure roller 90a, a contact prevention roller 96 for preventing the photosensitive web 22 from contacting the pressure roller 90a is movably disposed. In the vicinity of the upstream side of the pressurizing mechanism 42, a preheating unit 97 for preheating the photosensitive web 22 to a predetermined temperature is disposed. The preheating unit 97 includes, for example, an infrared bar heater such as a coil, carbon, and halogen, a ceramic type IR heater, various contact heating rollers, and the like.

  Similar to the pressurizing mechanism 42, the thermocompression bonding mechanism 43 includes thermocompression rollers 90c and 90d that are arranged above and below and are heated to a predetermined temperature. The thermocompression rollers 90c and 90d are in sliding contact with the backup rollers 92c and 92d, and the backup roller 92d is pressed toward the thermocompression roller 90d via the roller clamp portion 93. The backup rollers 92c and 92d are provided as necessary.

  The pressurizing mechanism 42 pressurizes the photosensitive web 22 against the glass substrate 24 under a temperature condition that is equal to or lower than the melting temperature of the photosensitive resin layer 29 and the cushion layer 27 is softened. Under the conditions, the photosensitive web 22 is thermocompression bonded to the glass substrate 24. The pressure rollers 90a and 90b are set to have a smaller diameter and higher hardness than the thermocompression rollers 90c and 90d.

  The pressure rollers 90a and 90b and the thermocompression-bonding rollers 90c and 90d may be constituted by, for example, crown rollers. Similarly, the backup rollers 92a to 92d may be constituted by crown rollers. Further, the pressurizing mechanism 42 and the thermocompression bonding mechanism 43 may be arranged in a plurality of stages in the arrow C direction.

  A preheating mechanism 45 is disposed between the pressurizing mechanism 42 and the thermocompression bonding mechanism 43 as necessary. The preheating mechanism 45 includes an infrared bar heater such as a coil, carbon, and halogen, a ceramic type IR heater, various contact heating rollers, and the like.

  The glass substrate 24 is transported in the arrow C direction from the pressurizing mechanism 42 through the inter-substrate web cutting mechanism 48 and further through the transport path 98 extending in the arrow C direction. In this conveyance path 98, a film conveyance roller 100 and a substrate conveyance roller 102 are disposed via a web tip cutting mechanism 48a. The distance between the thermocompression rollers 90 c and 90 d and the substrate transport roller 102 is preferably set to be equal to or less than the length of one glass substrate 24.

  In the manufacturing apparatus 20, the web feed mechanism 32, the peeling mechanism 34, the tension control mechanism 52, the masking tape attaching mechanism 38 and the detection mechanism 44 are disposed above the pressurizing mechanism 42 and the thermocompression bonding mechanism 43. Conversely, the detection mechanism 44 from the web delivery mechanism 32 is disposed below the pressurization mechanism 42 and the thermocompression bonding mechanism 43 so that the photosensitive web 22 is turned upside down so that the photosensitive resin layer 29 is made of glass. It may be bonded to the lower side of the substrate 24, and the entire manufacturing apparatus 20 may be configured on a straight line.

  The manufacturing apparatus 20 is cooled on the downstream side of the inter-substrate web cutting mechanism 48, the cooling mechanism 110 for cooling the bonded substrate 24a in which the photosensitive web 22 from which the protective film 30 has been peeled off and the glass substrate 24 are bonded. A heating mechanism 112 that heats the bonding substrate 24 a and a peeling mechanism (not shown) that peels the base film 26 from the bonding substrate 24 a that is sucked and held by the suction pad 113 to obtain the photosensitive laminate 114. .

  The cooling mechanism 110 supplies cooling air to the bonding substrate 24a to perform a cooling process. Specifically, the cooling air temperature is set to 10 ° C. and the air speed is set to 0.5 to 2.0 m / min. The heating mechanism 112 includes a heating roller 118 disposed on the base film 26 side of the bonding substrate 24 a and a receiving roller 120 disposed on the glass substrate 24 side facing the heating roller 118.

  The inside of the manufacturing apparatus 20 is partitioned into a first clean room 152a and a second clean room 152b through a partition wall 150. The first clean room 152a accommodates the web feed mechanism 32 to the masking tape attaching mechanism 38, and the second clean room 152b accommodates the detection mechanism 44 and the subsequent elements. The first clean room 152a and the second clean room 152b communicate with each other through the penetrating portion 154.

  The operation of the manufacturing apparatus 20 configured as described above will be described below in relation to the manufacturing method according to the present invention.

  First, at the start of initial (cueing), the photosensitive web 22 is fed out from the photosensitive web roll 22a attached to the web feed mechanism 32. The leading end of the photosensitive web 22 is sandwiched between the film transport roller 100 through the peeling mechanism 34, the masking tape attaching mechanism 38, the pressurizing mechanism 42, and the thermocompression bonding mechanism 43.

  Next, when the masking tape 36 is detected by the photoelectric sensor 82, the film transport roller 100 is rotationally driven based on this detection signal, and the photosensitive web 22 is transported quantitatively toward the laminating position. For this reason, the masking tape 36 is positioned corresponding to a predetermined laminating position. Note that the masking tape 36 may be detected downstream of the laminating position, and the photosensitive web 22 may be stopped at a predetermined position.

  At that time, the contact prevention roller 96 is lowered to prevent the photosensitive web 22 from contacting the pressure roller 90a. Further, the glass substrate 24 stands by immediately before the joining position. Thereby, an initial start state is obtained.

  Next, the operation of each functional unit constituting the manufacturing apparatus 20 during the laminating operation will be described.

  As shown in FIG. 1, the photosensitive web 22 is fed from a web feed mechanism 32 and continuously conveyed to a peeling mechanism 34. In the peeling mechanism 34, the base film 26 of the photosensitive web 22 is adsorbed and held by the suction drum 46, and the protective film 30 is continuously peeled from the photosensitive web 22. The protective film 30 is peeled off at a sharp peeling angle via the peeling roller 46 a and wound around the protective film winding unit 50.

  After the protective film 30 is continuously peeled from the base film 26 under the action of the peeling mechanism 34, the tension of the photosensitive web 22 is adjusted by the tension control mechanism 52 and further sent to the masking tape applying mechanism 38. .

  In the masking tape attaching mechanism 38, after the adsorbing member 60 adsorbs the masking tape 36, the adsorbing member 60 and the attaching pedestal 62 hold the photosensitive web 22 while moving in synchronization with the photosensitive web 22, A masking tape 36 is affixed to the photosensitive resin layer 29 (see FIG. 3).

  As described above, the photosensitive web 22 on which the masking tape 36 of a predetermined portion of the photosensitive resin layer 29 is attached is sent to the detection mechanism 44. As shown in FIG. 1, in this detection mechanism 44, the photoelectric sensor 82 detects the boundary portion of the masking tape 36. The photosensitive web 22 is quantitatively conveyed to the pressure mechanism 42 under the rotational action of the film conveying roller 100 based on the position detection information of the masking tape 36. At that time, the contact prevention roller 96 waits upward, and the pressure roller 90b is disposed below.

  As shown in FIG. 4, the glass substrate 24 is transported to the pressurization position in a preheated state under the action of the substrate transport mechanism 40. The glass substrate 24 is temporarily disposed between the pressure rollers 90 a and 90 b corresponding to the joint portion between the photosensitive resin layer 29 of the photosensitive web 22 and the masking tape 36.

  In this state, the glass substrate 24 is sandwiched between the pressure rollers 90 a and 90 b with a predetermined pressing pressure under the action of the roller clamp portion 93. Further, the photosensitive resin layer 29 is polymerized on the glass substrate 24 under the rotating action of the pressure roller 90a.

  Here, as lamination conditions, the speed is 1.0 m / min to 10 m / min, the temperature of the pressure rollers 90 a and 90 b is 80 ° C., and the rubber hardness of the pressure rollers 90 a and 90 b is 40 degrees to 90 degrees, preferably Is 70 degrees, and the pressing pressure (linear pressure) of the pressure rollers 90a and 90b is 1 MPa / cm.

  After the photosensitive resin layer 29 is polymerized on the glass substrate 24, the glass substrate 24 is conveyed to the thermocompression bonding mechanism 43. In the thermocompression bonding mechanism 43, the temperature of the thermocompression rollers 90c and 90d is set to 110 ° C. to 150 ° C., the rubber hardness of the thermocompression rollers 90c and 90d is set to 55 degrees, and the press pressure (linear pressure) is set to 0.7 MPa / cm. ing. For this reason, the photosensitive resin layer 29 is heated and melted and bonded to the glass substrate 24.

  In this case, the temperature and viscosity of the photosensitive resin layer 29 and the cushion layer 27 have the relationship shown in FIG. In addition, as a viscoelasticity measuring apparatus, the viscosity was measured, for example using the rheometer (DER-100) by a rheological company.

  Therefore, in the first embodiment, in the pressure mechanism 42, the photosensitive resin layer 29 is in a high viscosity state (below the melting temperature) so as to have a predetermined rigidity, while the cushion layer 27 has a low viscosity. Thus, the temperature range is set so as to be softened. Specifically, the cushion layer 27 has a viscosity too high at a low temperature and lacks flexibility (flexibility). For example, the cushion layer 27 is set to a temperature of about 70 ° C., so that the viscosity of the cushion layer 27 decreases. And the cushion layer 27 is softened well. Here, the temperature condition at which the cushion layer 27 softens refers to a temperature at which the viscosity of the cushion layer 27 becomes 0.05 MPa or less.

  Accordingly, in the pressure mechanism 42, the glass substrate 24 and the photosensitive resin layer 29 are heated while the temperature of the photosensitive web 22 is adjusted to approximately 70 ° C. by heating or cooling the pressure rollers 90a and 90b. Pressed. At this time, the softness (flexibility) of the cushion layer 27 is improved, and the photosensitive resin layer 29 is securely attached to the glass substrate 24 following the shape of the surface of the glass substrate 24 under the deformation action of the cushion layer 27. It is possible to satisfactorily prevent bubbles from remaining.

  Next, in the thermocompression bonding mechanism 43, the photosensitive resin layer is activated by being heated to a melting temperature condition (110 ° C. to 150 ° C.), and the viscosity is reduced. For this reason, the photosensitive resin layer 29 has desired adhesiveness and can be reliably bonded to the glass substrate 24.

  As a result, in the first embodiment, the photosensitive web 22 and the glass substrate 24 perform a high-quality laminating process by reliably preventing bubbles from remaining, and improving the production efficiency. It is possible to obtain an effect that the speeding up of the apparatus can be easily performed.

  In addition, as shown in FIG. 5, it can replace with the cushion layer 27 and the cushion layer 27a by which the viscosity characteristic was changed can be used. The cushion layer 27 a has a lower viscosity than the cushion layer 27, and the temperature at the pressurizing mechanism 42 can be lowered to, for example, around 60 ° C.

  Further, in the thermocompression bonding mechanism 43, the heating of the thermocompression bonding rollers 90c and 90d can employ an electromagnetic induction heating method, a sheathed heater heating method, a coil heater heating method, a heating liquid method, or a combination thereof, or The activation energy may be applied by ultraviolet irradiation.

  Next, when the tip of the glass substrate 24 reaches the vicinity of the film transport roller 100, the film transport roller 100 moves in a direction away from the glass substrate 24. Further, when the front end of the photosensitive web 22 protruding forward (in the direction of arrow C) from the glass substrate 24 reaches a predetermined position with respect to the web front end cutting mechanism 48a, the web front end cutting mechanism 48a is driven to perform the photosensitive operation. The tip of the web 22 is cut. The web tip cutting mechanism 48a returns to the base standby position after cutting the tip of the photosensitive web 22, and is not used during normal operation.

  As shown in FIG. 6, when the lamination of one photosensitive web 22 on the glass substrate 24 is completed via the thermocompression rollers 90c and 90d, the thermocompression roller 90c stops rotating, while the photosensitive web 22 is stopped. The bonded substrate 24 a in which the web 22 is laminated on the glass substrate 24 is clamped by the substrate transport roller 102.

  Then, the thermocompression roller 90d is retracted in a direction away from the thermocompression roller 90c, and the clamp is released. In this state, the rotation of the substrate conveying roller 102 is started, the bonded substrate 24a is quantitatively conveyed in the direction of arrow C, and the inter-substrate position 22b of the photosensitive web 22 moves to a predetermined position near the lower side of the pressure roller 90a. . The pressure rollers 90a and 90b operate similarly.

  On the other hand, the next glass substrate 24 is conveyed toward the laminating position via the substrate conveying mechanism 40. When the leading edge of the next glass substrate 24 is disposed between the pressure rollers 90a and 90b, the pressure roller 90b is raised, and the next glass substrate 24 and the photosensitive web are moved by the pressure rollers 90a and 90b. 22 is clamped. At the same time, the substrate transport roller 102 clamps the bonded substrate 24a. Then, laminating is started under the rotating action of the pressure rollers 90a and 90b and the substrate transport roller 102, and the bonded substrate 24a is transported in the direction of arrow C.

  At that time, as shown in FIG. 7, the bonding substrate 24 a is covered with a masking tape 36 at each end. Therefore, when the photosensitive resin layer 29 is transferred to the glass substrate 24, the transfer can be performed in a frame shape.

  As shown in FIG. 8, when the substrate transport roller 102 reaches the rear end of the first bonded substrate 24a in the transport direction, the upper roller constituting the substrate transport roller 102 rises to release the clamp and The rotation of the rollers and the conveyance path 98 is continued and the bonding substrate 24a is conveyed. Further, when the rear end portion of the second bonded substrate 24a reaches the vicinity of the thermocompression rollers 90c, 90d, the rotation of the thermocompression rollers 90c, 90d and the substrate transport roller 102 is stopped.

  Then, the upper roller of the substrate transport roller 102 is lowered to clamp the second bonded substrate 24a, while the thermocompression roller 90d is lowered to release the clamp. Next, the second bonded substrate 24a is nipped and conveyed under the rotating action of the substrate conveying roller 102, the inter-substrate position 22b moves to a predetermined position near the lower side of the pressure roller 90a, and the third and subsequent laminating processes are performed. Is repeated.

  As shown in FIG. 9, when the distance between the bonding substrates 24a reaches a position corresponding to the inter-substrate web cutting mechanism 48, the inter-substrate web cutting mechanism 48 moves in the direction of arrow C at the same transport speed as the bonding substrate 24a. However, the photosensitive web 22 is cut between the bonding substrates 24 a, that is, in the middle of the masking tape 36. After this cutting, the inter-substrate web cutting mechanism 48 is returned to a predetermined standby position, while the bonded substrate 24a is conveyed in the direction of arrow C.

  The inter-substrate web cutting mechanism 48 and the web tip cutting mechanism 48a move in the direction of the arrow C in synchronization with the photosensitive web 22 when cutting the photosensitive web 22, but are not limited thereto. It is not a thing. For example, when the web is stopped, the photosensitive web 22 may be cut by running only in the web width direction. Also, a cutting method using a Thomson blade while the web is stopped and a cutting method using a rotary cut while the web is moving are possible.

  As shown in FIG. 1, each bonded substrate 24a separated by the inter-substrate web cutting mechanism 48 is transported to the cooling mechanism 110 and forcibly cooled to, for example, room temperature (approximately 20 ° C.) under the action of supplying cold air. Then, it is conveyed to the heating mechanism 112. In the heating mechanism 112, the bonding substrate 24a is sandwiched between the heating roller 118 and the receiving roller 120, and heat is directly transferred from the heating roller 118 to the base film 26 of the bonding substrate 24a.

  Thereby, after the cushion layer 27 is heated to a predetermined temperature from the base film 26, the bonding substrate 24a is sent to a peeling mechanism (not shown). In this peeling mechanism, the photosensitive laminate 114 is obtained by peeling the base film 26 from the bonding substrate 24a in a state where the glass substrate 24 side of the bonding substrate 24a is held under the suction action of the suction pad 113. .

  FIG. 10 is a schematic configuration diagram of a manufacturing apparatus 200 according to the second embodiment of the present invention.

  The manufacturing apparatus 200 normally does not use the inter-substrate web cutting mechanism 48 except for operations such as web cutting when trouble stops and separation for discharging defective products, and is downstream of the cooling mechanism 110 and the heating mechanism 112. In addition, a continuous peeling mechanism 202 is provided. The continuous peeling mechanism 202 continuously peels the long base film 26 to which the glass substrates 24 are bonded at a predetermined interval together with the masking tape 36. A small-diameter peeling roller 206, a winding shaft 208, and an automatic joining machine 210 are provided. The peeling roller 206 has a suction cup (not shown) that performs suction only at the beginning of winding.

  The pre-peeling unit 204 includes nip rollers 212 and 214 that can advance and retreat in the transport direction, and a peeling bar 216 that can move up and down. The nip rollers 212 and 214 sandwich the glass substrate 24, while the peeling bar 216 can be moved up and down between the glass substrates 24.

  A measuring instrument 218 that measures the area position of the photosensitive resin layer 29 actually bonded to the glass substrate 24 is disposed downstream of the continuous peeling mechanism 202. The measuring device 218 includes, for example, a camera 220 such as a CCD, and four measuring devices 218 are provided for photographing the four corners of the glass substrate 24 to which the photosensitive resin layer 29 is bonded.

  Note that the measuring device 218 employs a configuration in which image processing is performed by the camera 220, but an end face position may be detected by a color sensor or a laser sensor, or an LED sensor, a photo array, a line sensor, or the like may be combined. At that time, it is desirable to arrange at least two units on each end face and detect the linearity of the end faces.

  In addition, by energizing a surface inspection device (not shown), unevenness due to the photosensitive web 22 itself, unevenness in the density of the laminate due to equipment, wrinkles, streaks, and surface conditions such as dust and foreign matter While detecting a defect and giving an alarm, it can utilize for the management of NG discharge | emission and a post process.

  In the second embodiment configured as described above, the bonding substrate 24 a laminated by the pressurizing mechanism 42 and the thermocompression bonding mechanism 43 is pre-peeled by the pre-peeling unit 204 and then sent to the continuous peeling mechanism 202. In the continuous peeling mechanism 202, the base film 26 and the masking tape 36 are continuously wound from the bonding substrate 24 a under the rotating action of the winding shaft 208. Further, after separation at trouble stop or separation at the time of defective product separation, the tip of the base film 26 of the bonded substrate 24a which has been newly laminated and the base film 26 wound around the winding shaft 208 are obtained. The rear end is automatically joined via an automatic joining machine 210.

  The photosensitive laminate 114 from which the base film 26 and the masking tape 36 have been peeled is placed at an inspection station corresponding to the measuring device 218. In this inspection station, images of the glass substrate 24 and the photosensitive resin layer 29 are captured by the four cameras 220 with the photosensitive laminate 114 positioned and fixed. Then, by applying image processing, the pasting position is calculated.

  In the inspection station, the photosensitive laminate 114 is transported without stopping, and in the width direction, the position of the end face is detected by a camera or scan, while in the traveling direction, the position of the photosensitive laminate 114 is detected by a timing sensor or the like. Then, measurement by image capture or sensor detection may be performed.

  Thus, in the second embodiment, the photosensitive web 22 between the bonded substrates 24a is not cut after lamination, and the base film 26 and the masking tape are removed from the bonded substrate 24a under the rotating action of the winding shaft 208. 36 can be wound up continuously. Further, the processing of the peeled base film 26 and masking tape 36 is easy. Here, the masking tape 36 and the base film 26 are made of the same material, thereby further simplifying the processing.

  Thereby, in 2nd Embodiment, the effect that the whole manufacturing operation of the photosensitive laminated body 114 is performed automatically and efficiently is acquired.

  In the first and second embodiments, a dust removal air blowing mechanism (not shown) may be provided in the peeling mechanism 116 and the continuous peeling mechanism 202. Further, although the contact type heating mechanism 112 that performs heating by directly contacting the base film 26 of the bonding substrate 24a is used, the present invention is not limited to this, and various non-contact type heating mechanisms can be employed. .

  In the first and second embodiments, as shown in FIG. 2, a photosensitive web 22 in which a base film 26, a cushion layer 27, an intermediate layer 28, and a photosensitive resin layer 29 are laminated is used as a laminate. However, it is not limited to this. For example, the same effect can be obtained if it is a laminate in which a support layer (base film 26) and at least one resin layer (cushion layer 27 or photosensitive resin layer 29) are laminated.

It is a schematic block diagram of the manufacturing apparatus which concerns on the 1st Embodiment of this invention. It is sectional drawing of the elongate photosensitive web used for the said manufacturing apparatus. It is explanatory drawing of the state by which the masking tape was adhere | attached on the said elongate photosensitive web. It is a partial explanatory view of the manufacturing apparatus showing a state in which a glass substrate enters between rubber rollers. It is a temperature-viscosity relationship figure of the photosensitive resin layer and a cushion layer. It is a partial explanatory view of the manufacturing apparatus showing the operation at the end of lamination of the first sheet. It is explanatory drawing of the state by which the photosensitive resin layer was transcribe | transferred to the said glass substrate. It is a partial explanatory view of the manufacturing apparatus showing an operation in which the substrate transport roller moves away from the end of the bonded substrate. It is a partial explanatory view of the manufacturing apparatus showing an operation of cutting the photosensitive web between the bonded substrates. It is a schematic block diagram of the manufacturing apparatus which concerns on the 2nd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 20,200 ... Manufacturing apparatus 22 ... Photosensitive web 24 ... Glass substrate 26 ... Base film 27 ... Cushion layer 28 ... Intermediate layer 29 ... Photosensitive resin layer 30 ... Protective film 32 ... Web delivery mechanism 34 ... Peeling mechanism 36 ... Masking tape DESCRIPTION OF SYMBOLS 38 ... Masking tape sticking mechanism 40 ... Substrate conveyance mechanism 42 ... Pressurization mechanism 43 ... Thermocompression bonding mechanism 44 ... Detection mechanism 46 ... Suction drum 48 ... Inter-substrate web cutting mechanism 52 ... Tension control mechanism 84 ... Substrate heating unit 86 ... Conveyance unit 90a, 90b ... pressure rollers 90c, 90d ... thermo-compression roller 93 ... roller clamp part 96 ... contact prevention roller 98 ... transport path 100 ... film transport roller 102 ... substrate transport roller 110 ... cooling mechanism 112 ... heating mechanism 113 ... suction pad 114 ... photosensitive laminate 202 ... continuous peeling mechanism 204 ... pre-peeling Part

Claims (6)

A laminate in which a laminate in which at least a photosensitive resin layer and a thermoplastic resin layer are laminated is thermocompression-bonded to the substrate such that the photosensitive resin layer side faces the substrate,
A first step of pressurizing the laminate and the substrate under a temperature condition equal to or lower than a melting temperature of the photosensitive resin layer and the thermoplastic resin layer softening;
A second step of thermocompression bonding the laminate and the substrate under the melting temperature condition;
A method for laminating a laminate, comprising:   The laminating method according to claim 1, wherein at least one of the first step and the second step is set in multiple stages.   3. The laminating method according to claim 1, wherein, between the first step and the second step, at least one of the laminate and the substrate is preheated under a temperature condition lower than the melting temperature. A method for laminating a laminate, comprising: A laminate laminating apparatus for thermocompression bonding a laminate in which at least a photosensitive resin layer and a thermoplastic resin layer are laminated to the substrate such that the photosensitive resin layer side faces the substrate,
A pressure mechanism that pressurizes the laminate and the substrate under a temperature condition that is equal to or lower than the melting temperature of the photosensitive resin layer and the thermoplastic resin layer softens;
A thermocompression bonding mechanism for thermocompression bonding the laminate and the substrate under the melting temperature condition;
A laminate laminating apparatus comprising:   The laminating apparatus according to claim 4, wherein at least one of the pressurizing mechanism and the thermocompression bonding mechanism is configured in multiple stages.   6. The laminating apparatus according to claim 4, wherein at least either the laminate or the substrate is preheated between the pressurizing mechanism and the thermocompression bonding mechanism under a temperature condition lower than the melting temperature. A laminate laminating apparatus, wherein a preheating mechanism is provided.

Images